Tin (Sn) General Specifica on
Chemical Composi on (Commercially Pure Tin)
Tin (Sn): ≥ 99.8% (depending on grade, ASTM B339, ISO 209)
Lead (Pb): ≤ 0.05%
An mony (Sb): ≤ 0.02%
Copper (Cu): ≤ 0.01%
Iron (Fe): ≤ 0.01%
Other impuri es (Bi, As, etc.): ≤ 0.01% each
Mechanical Proper es
Tensile Strength: 20 – 40 MPa (so metal)
Yield Strength: ~ 10 – 15 MPa
Elonga on: 40 – 50%
Hardness: ~ 5 – 10 HB (very so )
Modulus of Elas city (E): ~ 50 GPa
Physical Proper es
Density: 7.29 g/cm³
Mel ng Point: 231.9 °C (low mel ng)
Boiling Point: 2,602 °C
Thermal Conduc vity: 67 W/m·K
Electrical Conduc vity: ~ 15% IACS
Crystal Structure: Tetragonal
Key Characteris cs
So , malleable, duc le
Excellent corrosion resistance in air & water (forms protec ve oxide film)
Non-toxic (important for food industry applica ons)
Good soldering proper es (low mel ng point)
Applica ons
1. Solders (Sn–Pb, Sn–Ag, Sn–Cu alloys) for electronics & plumbing
2. Coa ng (Tin Pla ng) for steel cans (food industry) – corrosion protec on
3. Alloys
o Bronze (Cu–Sn)
o Babbi metal (bearing alloys, Sn–Sb–Cu)
o Pewter (Sn–Sb–Cu)
4. Glass industry – float glass process (molten glass floats on molten n)
5. Chemicals – Tin salts & organo n compounds (stabilizers, catalysts)