Asahi Kasei Corporation Electronic Materials Division
Contact Us: https://asahi-kasei-pimel.com
Confidential
Application- Conventional package
PIMEL™ has been applied to various conventional packages in the semiconductor market for decades.
Buffer Coating Flip Chip (Cu pillar)
WLCSP Fan-Out(Single Die)
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Confidential
Application- Advanced package
PIMEL™ has increased its adoption records in advanced packages that require cutting-edge technology.
Fan-out(Heterogeneous) Fan-out(Heterogeneous with Si Bridge)
Fan-Out(AiP)
RDL interposer
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PIMEL™ Product Lineup Confidential
BL LV BM MA AM
Series Series Series Series Series
Polymer type Polyimide Phenolic PBO
Development Solvent*1 Aqueous*2
Patterning Negative Positive
Representative grade BL-301 BL-401 LV-105 BM-408 BM-302H MA-1001 AM-271
non NMP solvent 〇 〇 〇 〇
Wafer(Spin coat) 〇 ○ 〇 〇 〇 〇
Substrate
Panel (Slit coat) 〇
Buffer Coating 〇 〇 〇 〇 〇 〇
Recommended Flip Chip BGA 〇 〇
Package RDL+WB 〇
Application WLCSP 〇 ○
Fan-out 〇 ○ 〇
Low temp. cure >200deg.C 〇 ○ 〇 〇 〇
High elongation >60% 〇 ○ 〇 〇
High Cu Compatibility bHAST >500h 〇 〇 〇 〇
Features
High Tg >280deg.C 〇 〇
High Young’s Modulus >5GPa 〇
Low stress <25MPa 〇 〇 〇 〇 〇 〇
1* Developer: Cyclopentanone, Rinser: PGMEA; 2*2.38%TMAH 4
PIMEL™ BL-series (Negative tone)
Confidential
BL-301 : De facto standard for low temperature cure WLCSP and Fan-out.
BL-401 : non-NMP solvent version of BL-301
LV-105 : Dilute from BL-301 for PLP-FO by slit coating
<Recommended application> <Cross section SEM>
Grade : BL-301
- WLCSP - Fan-out Cure temp. : 230deg.C
Thickness after cure : 5.0um
<Film property>
Cure Condition Thermal Mechanical
Residual
CTE
Grade 5% weight Elon Young’s stress
Temp. Time Tg [ppm/K] Strength
loss -gation modulus
[deg.C] [min] [deg.C] (50-100 [MPa] [MPa]
[deg.C] [%] [GPa]
deg.C)
BL-301 200 120 335 200 50-60 60 150 3.4 19
BL-401 200 120 335 200 50-60 60 150 3.4 19
LV-105 200 120 335 200 50-60 60 150 3.4 19
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PIMEL™ BM-series (Negative tone)
Confidential
BM-408 : High Young’s modulus for Flip Chip ELK protection
BM-302H : High Young’s modulus with low temp. cure
<Recommended application> <Cross section SEM>
- Flip Chip(BM-408) - WB-RDL(BM-302H) Grade : BM-302H Grade : BM-408
Cure temp. : 230deg.C Cure temp. : 280deg.C
Thickness after cure : 6.0um Thickness after cure : 7.5um
Wire bond
Cu pillar
PIMELTM PIMELTM
ELK layer Si chip Si chip
<Film property>
Cure Condition Thermal Mechanical
Residual
CTE
Grade 5% weight Elon Young’s stress
Temp. Time Tg [ppm/K] Strength
loss -gation modulus
[deg.C] [min] [deg.C] (50-100 [MPa] [MPa]
[deg.C] [%] [GPa]
deg.C)
BM-408 280 120 385 290 40 35 255 6.0 21
BM-302H 200 120 315 220 50 55 170 4.5 19
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PIMEL™ AM/MA series(Positive tone)
Confidential
MA-1001 : High resolution and low residual stress for memory device
AM-271 : High breakdown voltage with high temp. cure.
<Recommended application> <SEM image> <Breakdown voltage>
- Buffer coating Grade : MA-1001 Grade : AM-271 Grade. : AM-271
Cure temp. : 220deg.C Cure temp. : 350deg.C Thickness after cure : 7.0um
Thickness after cure
Breakdown voltage [kV/mm]
: 5.5um Thickness after cure : 7.0um
3um via open
Cure temp. [deg.C]
<Film property>
Cure Condition Thermal Mechanical
Residual
CTE
Grade 5% weight Elon Young’s stress
Temp. Time Tg [ppm/K] Strength
loss -gation modulus
[deg.C] [min] [deg.C] (50-100 [MPa] [MPa]
[deg.C] [%] [GPa]
deg.C)
MA-1001 220 60 330 240 35 65 135 3.6 15
AM-271 320 60 465 300 55 35 130 2.7 35
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Attention
Any and all technical information relating PIMEL™ disclosed by Asahi Kasei
Corporation (“PIMEL™ Technical Information”) may be subject to applicable
export control laws and regulations and transfer of PIMEL™ Technical
Information may require license or approval from any governmental authority of
Japan or any other country .
Recipients shall not transfer PIMEL™ Technical Information to any third party
without a prior written consent of Asahi Kasei Corporation .
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To do all that we can in every era to help the people of the world
make the most of life and attain fulfillment in living.
Since our founding, we have always been deeply committed
to contributing to the development of society,
boldly anticipating the emergence of new needs.
This is what we mean by “Creating for Tomorrow.”
