Syfer Technology Limited, Old Stoke Road,
Arminghall, Norwich, Norfolk, NR14 8SQ,
United Kingdom
Tel: +44 (0) 1603 723300.
Tel. (Sales): 01603 723310
Fax: +44 (0) 1603 723301
Email: sales@syfer.co.uk
Web: www.syfer.com
Automotive Electronics Council-Q200
Stress Test Qualification for Passive Components
Syfer AEC-Q200-Rev C Qualification
Contents
1. Introduction
2. Syfer Product Reliability Guide
3. AEC-Q200 Stress-Test Qualification
3.1
AEC-Q200 Temperature Range Grades
3.2
Qualification Families
4. AEC-Q200 Stress Test Qualification Requirements
5. Batch Tests (Standard & Optional Tests Available)
6. AEC-Q200 Qualified Component Ranges
7. Ordering Information
AN0009 Issue 9
CN# P105244
1.
Introduction
The Automotive Electronics Council (AEC) Component Technical Committee is the standardization
body for establishing standards for reliable, high quality electronic components. Components meeting
these specifications are suitable for use in the harsh automotive environment without additional
component-level qualification testing.
The Component Technical Committee established AEC-Q200 Stress Test Qualification for Passive
Components to define the minimum stress test driven qualification requirements for passive electrical
devices including ceramic capacitors.
This application note provides information on tests performed by Syfer in accordance with the AECQ200 specification.
For further information regarding the Automotive Electronics Council and AEC-Q200, refer to
website www.aecouncil.com.
Note: Supply of AEC-Q200 qualified components is not limited to the automotive industry. Other
industries are also recognising the benefits of AEC-Q200 qualified components.
2.
Syfer Product Reliability Guide
Space
Grade
High Reliability
(Space Quality)
ESCC 3009(1)
IECQ-CECC(2)
AEC-Q200(3)
MIL Grade(4)
Standard Components
Standard Reliability
Notes:
(1) Space Grade tested in accordance with ESCC 3009. Refer to Syfer specification S02A 0100.
(2) IECQ-CECC. The International Electrotechnical Commission (IEC) Quality Assessment System for
Electronic Components. This is an internationally recognised product quality certification. View Syfers
IECQ-CECC approvals at http://www.iecq.org/certificates or at www.syfer.com
(3) AEC-Q200. Automotive Electronics Council Stress Test Qualification For Passive Components.
(4) MIL Grade. Released in accordance with US MIL standards available on request.
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3. AEC-Q200 Stress-Test Qualification
Qualification is defined as successful completion of the test requirements defined in AEC-Q200.
Approval is defined as user approval for use of the component within the customers application and,
as such, is beyond the scope of AEC-Q200.
3.1
AEC-Q200 Temperature Range Grades
Temperature range grades defined in AEC-Q200:
Grade
Temperature Range
PASSIVE COMPONENT TYPE
MINIMUM
MAXIMUM
Maximum capability
-50C
+150 C
-40C
+125 C
-40C
+105 C
Flat chip ceramic resistors, X8R
ceramic capacitors
Capacitor Networks, Resistors,
Inductors, Transformers,
Thermistors, Resonators, Crystals
and Varistors, all other ceramic
and tantalum capacitors
Aluminium Electrolytic capacitors
-40C
+85 C
0C
+70 C
Film capacitors, Ferrites, R/R-C
Networks and Trimmer capacitors
TYPICAL/ EXAMPLE
APPLICATION
All automotive
Most underhood
Passenger compartment
hot spots
Most passenger
compartment
Non-automotive
Syfer AEC-Q200 qualified components are rated from -55 C to +125 C. Corresponding AEC-Q200
qualified grades are 1, 2, 3 and 4.
3.2
Qualification Families
Syfer AEC-Q200 qualification has been conducted in accordance with AEC-Q200 qualification family
guidelines. AEC-Q200 defines a qualification family as a group of components that share the same
major process and material elements. All components categorized in the same family are qualified by
association when one family member successfully completes qualification.
Qualification test summary is available on request.
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4.
AEC-Q200 Stress Test Qualification Requirements
Stress
Pre- and Post Stress
Electrical Test
Test Not Used
High Temperature
Exposure (Storage)
Temperature
Cycling
Destructive
Physical Analysis
Moisture
Resistance
Test
#
Test Method
User Spec.
MIL-STD-202
Method 108
JESD22 Method
JA-104
3
4
5
6
Biased Humidity
Operational Life
External Visual
Physical
Dimension
10
Terminal Strength
(Leaded)
11
EIA-469
MIL-STD-202
Method 106
MIL-STD-202
Method 103
MIL-STD-202
Method 108
MIL-STD-883
Method 2009
JESD22 Method
JB-100
Not applicable for
surface mount
capacitors
Resistance to
Solvents
12
MIL-STD-202
Method 215
Mechanical Shock
13
MIL-STD-202
Method 213
Vibration
14
MIL-STD-202
Method 204
Resistance to
Soldering Heat
15
Thermal Shock
16
ESD
17
Solderability
18
Sample size
per lot
All
qualification
parts submitted
for testing
-
Accept on
number failed
Additional Requirements
0
-
Unpowered
1000 hours @ 150C
77
77
1000 cycles (-55C to 125C)
10
10ea x 3 lots
77
77
77
Rated Voltage @ 125C
All
qualification
parts submitted
for testing
Inspect device construction
and workmanship. Electrical
test not required.
30
Verify physical dimensions to
the device specification
30
MIL-STD-202
Method 210
30
MIL-STD-202
Method 107
30
AEC-Q200-002
J-STD-002
(JESD22-B102(2))
15
15 each
condition
t = 24 hours/cycle.
Unpowered.
1000 hrs 85C/ 85%RH.
1.5Vdc and Rated Voltage(1)
Note: Add Aqueous wash
chemical OKEM or
equivalent. No banned
substances.
Figure 1 of Method 213
SMD: Condition F.
5 gs for 20 min., 12 cycles
each of 3 orientations. Test
from 10-2000Hz.
Condition B No pre-heat of
samples.
-55C/+125C. 300 cycles.
Max transfer time: 20s. Dwell
time: 15minutes. Air-Air.
Notes:
1 Biased Humidity test conducted by Syfer with rated voltage or 200Vdc (whichever is the least) applied.
2 JESD22-B102 150C dry bake preconditioning applied.
AN0009 Issue 9
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Test
#
Stress
Electrical
Characterization
Test not used
Test Method
Sample size
per lot
Accept on
Number failed
30
20
User
specification
-
Board flex
21
AEC-Q200-005
30
Terminal strength
Beam Load Test
22
23
AEC-Q200-006
AEC-Q200-003
30
30
0
0
19
Additional Requirements
Parametrically test per lot at
room temp & min, max temps
2mm (min) for all except
3mm for Class 1.
Force of 1.8kg for 60s.
Table 1 Stress Test Qualification Requirements
5. Batch Tests (Standard & Optional Tests Available)
Test
Standard tests
Test
Optional tests
Solderability
100% Burn-In. (2xRV @125 for
168hours).
Resistance to soldering heat
Load sample test @ 125C
Humidity sample test.
85 C/85%RH
Hot IR sample test
Axial Pull sample test (MILSTD-123)
Insulation Resistance
Breakdown Voltage sample test
Capacitance Test
Deflection (Bend) sample test
Dissipation Factor Test
SAM (Scanning Acoustic
Microscopy)
100% Visual Inspection
Plating thickness verification
(if plated)
DPA (Destructive Physical
Analysis)
Voltage Proof Test (DWV &
Flash)
For further details, optional test quotations please contact Syfer Sales department.
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6. AEC-Q200 Qualified Component Ranges
Surface Mount Capacitors
Max
Cap
0603
50V
n/a
n/a
n/a
n/a
n/a
n/a
n/a
8.2nF
n/a
n/a
6.8nF 2.2nF 1.5nF
1nF
470pF
33nF
10nF
4.7nF
1210
4.7nF 3.9nF
1.8nF
1nF
680nF 680nF 470nF 220nF 100nF
27nF
15nF
5.6nF
3.3nF
470nF 270nF 150nF
56nF
150nF 150nF
C0G/
NP0
10nF
5.6nF
10nF
C0G/
NP0
18nF
C0G/
NP0
X7R
10nF
47nF
27nF
330nF 330nF 150nF 100nF
X7R
1812
33nF
C0G/
2.7nF 2.7nF 1.8nF 680pF 330pF
NP0
X7R
39nF
18nF
39nF
1.5F 1.5F
12nF
27nF
1F
12nF
10nF
Balanced Line EMI Chip Ranges (E03)
0805
630V 1.0KV
n/a
33nF
X7R
1206
100V 200V 500V
C0G/
470pF 470pF 330pF 100pF
NP0
X7R
0805
63V
Max
Cap
50V
100V
C0G/
NP0
470pF
330pF
X7R
33nF
15nF
1.5nF
1nF
150nF
47nF
5.6nF
3.9nF
330nF
150nF
10nF
6.8nF
560nF
330nF
C0G/
1206 NP0
X7R
C0G/
1410 NP0
X7R
C0G/
1812 NP0
X7R
AN0009 Issue 9
3 Terminal EMI Chips (E01)
0805
1206
1806
Max
Cap
50V
100V
C0G/
NP0
820pF
560pF
X7R
47nF
15nF
C0G/
NP0
1.0nF
1.0nF
X7R
100nF
15nF
C0G/
NP0
2.2nF
2.2nF
X7R
200nF
68nF
Page 6 of 7
7. Ordering Information
Part Number Construction:
Example: ..
1210
Y 100 0103
T___
Type No/Size ref
Termination
Y:
termination base
with Ni Barrier (100% matte tin
plating). RoHS compliant.
J: Silver base with Nickel Barrier
(100% Matte Tin Plating). RoHS
compliant. (J termination not
available with X7R products.)
Suffix code. Used for specific
customer requirements.
Packaging
T: 178mm (7) reel
R: 330mm (13) reel
B: Bulk pack - tubs
Voltage Rating d.c.
Dielectric/ Release codes(1)
A: C0G (1B)
E: X7R (2R1)
Capacitance Value
Capacitance Tolerance code
For questions or quotation please contact Syfer Sales department.
AN0009 Issue 9
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