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MODEL
No.
SPEC No.
BS2F7VZ0164
DOC.
RECORDS OF
DATE
REVISION
REF. PAGE
PARAGRAPH
DRAWING No.
REVISED
No.
FIRST
IDENT.
DATA
ISSUE
EC-06X02
PAGE
2 / 19
11.OCT.2006
No.
SUMMARY
CHECK
APPROVAL
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MODEL No.
SPEC
BS2F7VZ0164
EC-06X02
No.
PAGE
3/19
DESCRIPTION:
This specification covers DBS tuner intended for use in Digital Broadcasting Satellites. This
tuner incorporates "LINK" section that is composed of 8bit ADC, multistandard DVB-S/DVB-S2
demodulator and multistandard FEC. This tuner has DVB common interface compliant transport
stream output.
[1] GENERAL SPECIFICATIONS
1-1. Receiving frequency range
950MHz to 2150MHz
1-2. Input level
-65dBm to -25dBm
1-3. Input structure
F type Female
1-4. Nominal input impedance
75 ohm
1-5. Channel selection system
PLL synthesizer built in tuner IC IX2470VA
(Address:C0h)
(Reference clock: Internal 4.0MHz crystal oscillation)
1-6. Tuning step frequency
1MHz
1-7. Cutoff frequency
of Baseband(=I/Q out) LPF
Variable from 10MHz to 34MHz by 2MHz step
1-8. LINK IC
STB0899 (Address: D0h)
(Reference clock: 4MHz supplied from IX2470VA)
1-9. System clock specification
Fsampling=FM_CLK=99MHz
1-10. Multistandard demodulation
and decoding
[DVB-S]
>Channel symbol rate up to QPSK 45MSps
>Inner Viterbi and Outer Reed-solomon decoding
>Punctured rates 1/2, 2/3, 3/4, 5/6, 6/7, 7/8
[DVB-S2]
>Channel symbol rates up to QPSK 36MSps,
and 8PSK 30MSps
>Inner LDPC and outer BCH decoding
>Punctured rates 1/2, 3/5, 2/3, 3/4, 4/5, 5/6, 8/9, 9/10
1-11. Operating voltage
(B2, B3 and B4) 3.3V +/- 0.165V DC
(VDD)
1.8V +/- 0.090V DC
1-12. Storage condition
Temperature
Humidity
Period
1-13. Environmental characteristics
RoHS compliant
(RoHS refers to the "DIRECTIVE 2002/95/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL of
27 January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic
equipment.")
15 deg.C to 35 deg.C
25 %RH to 75 %RH
6 months
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1-14. Attention items:
1) This unit contains components that can be damaged by electro-static discharge.
Before handling this unit, ground your hands, tools, working desks and equipment to protect
the unit from Electronic Static Destroy.
2) Avoid following actions;
a) to store this unit in the place of the high temperature and humidity.
b) to expose this unit to corrosive gases.
[2] MECHANICAL SPECIFICATION
2-1. Dimension and mounting details
see section [14]
2-2. Mass
44g (typical)
2-3. Strength of F-connector
No severe transform or distortion at bending moment,
0.98Nm. To be connected electrically.
2-4. Clamp Torque of F-connector
No severe transform or distortion on the connection with
F-connector at bending moment, 0.98Nm.
To be connected electrically.
[3] ENVIRONMENTAL SPECIFICATION
(ELECTRICAL FUNCTIONAL OPERATION GUARANTEE)
3-1. Operating
Temperature
0deg.C to +50deg.C
Humidity
Less than 85
No condensation
3-2. Storage
Temperature
Humidity
-20deg.C to +85deg.C
Less than 95
Water vapor pressure 6643Pa max, without condensation
<Notice>
Please be careful that sudden temperature changes may cause condensation during storage,
and such condensation may cause corrosion.
[4] ABSOLUTE MAXIMUM VOLTAGE
Pin name
Pin No.
B1B
1
B1A
2
B4
3
B2
4
B3
11
VDD
13
SDA, SCL, RESETB
8, 9, 26
MIN.
-0.3
-0.3
-0.25
-0.1
-0.3
MAX
25
25
3.63
4.0
3.63
2.0
B3+0.3
UNIT
V
V
V
V
V
V
V
Note
400mA max.
400mA max.
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[5] TESTING CONDITION
5-1. Supply voltage
Pin name
Pin No.
B4
3
B2
4
B3
11
VDD
13
MIN.
3.25
3.25
3.25
1.77
MODEL No.
SPEC
BS2F7VZ0164
EC-06X02
TYP.
3.30
3.30
3.30
1.80
MAX.
3.35
3.35
3.35
1.83
5-2. Ambient temperature
25deg.C +/- 5deg.C
5-3. Ambient humidity
65%
[6] ELECTRICAL SPECIFICATION
No.
6-4
6-5
6-6
6-7
6-8
6-9
6-10
RF input VSWR
Noise figure(at max. gain)
rd
3 order Intermodulation
Undesired signal (2 signals)
(FD+29.5MHz, FD+59MHz) or
(FD -29.5MHz, FD -59MHz)
L.O. leak at input terminal
PLL synthesizer tuning time
PLL phase noise
PLL reference leak
RF output VSWR
RF output gain
Current
B2
consumption B3
B4
VDD
[7] ERROR RATE PERFORMANCE
Es/No performance at Quasi Error Free
Mode
ETSI Ideal
QPSK 1/2
QPSK 3/5
QPSK 2/3
QPSK 3/4
QPSK 4/5
QPSK 5/6
QPSK 8/9
QPSK 9/10
8PSK 3/5
8PSK 2/3
8PSK 3/4
8PSK 5/6
8PSK 8/9
8PSK 9/10
1.00
2.23
3.10
4.03
4.68
5.18
6.20
6.42
5.50
6.62
7.91
9.35
10.69
10.98
PAGE
5/19
Note
+/- 10%
Unless otherwise stated testing condition 5-15-3.
Item
MIN.
6-1
6-2
6-3
UNIT
V
V
V
V
No.
40
-5
Specification
TYP.
MAX.
UNIT
2.0
2.5
8
12 dB
60
dB
-68
10
-80
-91
-40
2.0
0
90
70
25
1200
Performance
(Typical)
1.2
2.4
3.2
4.2
4.8
5.3
6.4
6.6
5.8
6.8
8.1
9.6
10.9
11.3
-63
50
-70
-86
-30
2.5
+5
135
130
40
1800
Unit
dBm
ms
dBc/Hz
dBc/Hz
dBc
dB
mA
mA
mA
mA
Condition
950MHz to 2150MHz
950MHz to 2150MHz
Input level: -25dBm
I/Q amplitude: 0.6VP-P
BBLPF Fc=30MHz
950MHz to 2150MHz
limited to IX2470VA
10kHz offset
100kHz offset
1MHz
950MHz to 2150MHz
measured at RF out
3.3V
3.3V
3.3V
1.8V
Note
>DVB-S2
>Pilot: ON
>BW = Synbol_rate
>BERTester: SFU
dB
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MODEL No.
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EC-06X02
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[8] I2C INTERFACE
8-1. Internal circuits
The interface of this tuner is as following figure. It is using the I2C private repeater of STB0899 for
tuner isolation.
8-2. I2C bus characteristic (conforms to the specification of STB0899)
Item
Input high voltage
Input low voltage
SCL clock rate
Bus free time between a stop
and start condition
Hold time (repeated) start
condition
Low period of the SCL
High period of the SCL
Rise time for SDA and SCL
Fall time for SDA and SCL
Setup time for a repeated start
condition
Setup time for stop condition
Data setup time
Pulse width of spikes to be
suppressed by input filter
Synbol
vih
vil
fscl
tbuf
MIN.
2.0
-0.5
MAX.
3.6
0.8
400
1.3
Unit
V
V
kHz
us
thd, sta
0.6
us
tlow
thigh
tr
tf
tsu, sta
1.3
0.6
us
us
ns
ns
us
tsu, sto
tsu, dat
tsp
0.6
100
300
300
0.6
50
us
ns
ns
Note
Normal mode
After this period, the first
clock pulse is generated.
Fast mode
Fast mode
Fast mode
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[9] IX2470VA FUNCTIONAL DESCRIPTION
PLL and VCO are promptly set up without fail when the user correctly program the data with the
prompt I2C access sequence as long as the following are also applied;
a) Follow the I2C standard specification
b) Leave RTS to 0
9-1. I2C-BUS DATA FORMATS
Table 1 ; Write data format (MSB is transmitted first)
MSB
LSB
0(MA1)
0(MA0)
Byte1
1(BG1)
0(BG0)
N8
N7
N6
N5
N4
Byte2
N3
N2
N1
A5
A4
A3
A2
A1
Byte3
1(C1)
1(C0)
PD5
PD4
TM
0(RTS)
REF
Byte4
BA2
BA1
BA0
PSC
PD3
PD2/TS2
DIV/TS1
PD0/TS0
Byte5
*A
* N8 to N1
* A5 to A1
* REF
* PSC
* MA1, MA0
* PD0
* BA2, BA1, BA0
* DIV
* PD5 to PD2
* RTS
* TS2, TS1, TS0
* C1, C0
* BG1, BG0
* TM
; Acknowledge bit
; Programmable division ratio control bits
; Swallow division ratio setting bits
; Reference division ratio setting bits
; Prescaler division ratio setting bits
; Address setting bits
; PO control bit
; Local oscillator select
; Local oscillator divided ratio setting
; BB LPF cut-off frequency setting
; Test mode control bit
; Test mode setting bits (when RTS = '1')
; Charge pump current setting bits
; BB AMP gain setting bits
; VCO/LPF adjustment mode setting bits
(see Table 3)
(see Table 4)
(see Table 5)
(see Table 6)
(see Table 7)
(see Table 8)
(see Table 9)
(see Table 10)
(see Table 11)
(see Table 12)
(see Table 13)
(see section 9-3)
Write PLL register data to set one among the following I C access sequence as #a) to h).
It is available to skip the bytes which does not require for renewal or change the sequence of the bytes to
choose one of the following.
2
st
nd
rd
th
th
I C start->1 byte->2 byte->3 byte->4 byte->5 byte
2
2
a)
I C start -> byte1 -> byte2 -> byte3 -> byte4 -> byte5 *
byte1: I C address byte
2
b)
I C start -> byte1 -> byte4 -> byte5 -> byte2 -> byte3 *
2
2
c)
I C start -> byte1 -> byte2 -> byte3 -> byte4 -> either I C stop or (another) start
2
2
d)
I C start -> byte1 -> byte4 -> byte5 -> byte2 -> either I C stop or (another) start
2
2
e)
I C start -> byte1 -> byte2 -> byte3 -> either I C stop or (another) start
2
2
f)
I C start -> byte1 -> byte4 -> byte5 -> either I C stop or (another) start
2
2
g)
I C start -> byte1 -> byte2 -> either I C stop or (another) start
2
2
h)
I C start -> byte1 -> byte4 -> either I C stop or (another) start
2
th
*: Either I C stop or (another) start is available to follow after the 5 byte, but not mandatory
2
CAUTION: During receiving signals, dont access I C bus to satisfy the phase noise character
specification.
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NOTE: PLL set up rules
2
The following conditions are required to program the I C access sequence.
According to a required renewal data on each byte, one of the access sequence shown above as
a) to h) should be chosen.
st
1) Write byte1 on the 1 byte after I C start.
nd
2) Write either byte2 or byte4 on the 2 byte.
nd
nd
When the MSB header is 0 on the 2 byte, the 2 byte is recognized as byte2.
nd
nd
When the MSB header is 1 on the 2 byte, the 2 byte is recognized as byte4.
3) The following byte after byte2 or byte4 should be the sequent # of the last byte as;
The byte3 should be followed after byte2.
The byte5 should be followed after byte4.
4) The number of byte to write in one access sequence as from a start to a stop (or another start)
state should be two bytes at least. Review #g) and #h). Maximum bytes are five as write all byte1
to byte5 data in one access sequence. Review #a) and #b)
2
5) The renewal of the register data is only available when it becomes an I C stop or another start
state after all the bytes to write in case of #c) to h). Only in the case when the renewal of the
register data all from byte2 to byte5 in one access sequence as #a) and #b), a stop state or
another start state is not mandatory required for data renewal.
6) The data already registered and not to write for renewal has kept as it is as the last state.
7) Every time when the power is on, write all the register data on byte2 to byte5 in one sequence for
the purpose of the initial default set up to follow either #a) or #b). Because the initial values on
byte2 to byte5 are not fixed before the initialization.
8) As for POR (POWER ON RESET) of this tuner, the rise of the power-supply voltage might not
operate normally when it is not linear, and the noise enters while the power-supply voltage is rising.
For this case, the tuner might not accept the data input (Ack is not returned). Please input data
again (re-try) for this case.
Table 2; Read data format
MSB
1
POR
1
FL
0
RD2
0
RD1
0
RD1
MA1
X
MA0
X
LSB
1
X
A
A
Byte1
Byte2
* POR
; Power on reset indicator
(see table 14)
* FL
; Phase lock detect flag
(see table 15)
* RD2  RD0 ; Reserved (These bit values change under the condition of ICs.)
*X
; dont care
* All data of byte2 will be H, when Power on reset operates under the condition of a pulled up SDA.
* Read mode will change to Write mode after completing to output the byte2.
9-2. PROGRAMING
9-2-1 Programmable divider bits data
Please set P, N, A, R as follows.
fvco = [(P * N) + A] * fosc / R
fvco : Receiving frequency
P : Dividing factor of prescaler (16 or 32)
N : Programmable division ratio (5 to 255)
A : Swallow division ratio (0 to 31 and A < N)
fosc : Reference oscillation frequency (4 MHz)
R : Reference division ratio (see table 5)
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EC-06X02
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PAGE
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9-2-2 Data setting
Table 3; Programmable division ratio control
(Binary: 8 bits)
Table 4; Swallow division ratio setting
(Binary: 5 bits)
Bit data
Bit data
Dividing
Dividing
factor (N) N8 N7 N6 N5 N4 N3 N2 N1
factor (A) A5 A4 A3 A2 A1
5
0
0
0
0
0
1
0
1
0
0
0
0
0
0
6
0
0
0
0
0
1
1
0
1
0
0
0
0
1
255
1
1
1
1
1
1
1
1
31
1
1
1
1
1
* The using of 4 or smaller dividing factors is inhibited.
2
* The dividing factor is set by the data of N8 to N1 and A5 to A1 in byte2, 3 on I C write data. (table 1)
Table 5; Reference division ratio setting (Binary: 1 bit)
REF
Dividing factor (R)
Compare frequency
fvco(MHz)
Caution:
0
4
1 MHz
1024  2150 MHz*
Only use REF=0
1
8
500 KHz
950  2150 MHz
* When the reference division ratio set to 4(REF = '0'), the fvco's minimum frequency must be higher
than 1024 MHz (including 1024 MHz). If the frequency is lower than 1023 MHz, the condition
mentioned in section 6-2-1 "A < N" is not satisfied. But all receiving ranges can be covered with
combination with PSC setting. (see Table 6)
Table 6; Prescaler division ratio setting (Binary: 1 bit)
The dividing factor is set by t
PSC
Dividing factor (P)
fvco
2
PSC in byte 4 on I C write data.
0
32
950  2150 MHz
1
16
950  1375 MHz*
* When the prescaler division ratio of the prescaler is set to 16(PSC = '1'), the fvco's maximum
frequency must be lower than 1375 MHz (including 1375 MHz). This fvco's maximum frequency
limitation is depended on the operation frequency of the internal programmable counter. Refer to Table
9 about PSC detailed setting.
Table 7; Address selection (Binary: 2 bits)
Bit
Table 8; PO control (Binary: 1 bit)
Bit
MA1
MA0
0V  0.1VCC
open
0.4VCC  0.6VCC
0.9VCC  VCC
ADR input voltage
Output of PO
PD0
Normal
Power on
Power on
Hi-Z
Hi-Z
0
Hi-Z
* Hi-Z : High impedance
Hi-Z
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Table 9; Local oscillator select (Binary: 4 bits)
Byte 4
Byte 5
BAND
PSC
div.ratio
DIV
BA2
BA1
BA0
div.ratio
Local frequency
(Receiving frequency)
1/16
1/4
950 ~ 986 MHz
1/16
1/4
986 ~ 1073 MHz
1/32
1/4
1073 ~ 1154 MHz
1/32
1/2
1154 ~ 1291 MHz
1/32
1/2
1291 ~ 1447 MHz
1/32
1/2
1447 ~ 1615 MHz
1/32
1/2
1615 ~ 1791 MHz
1/32
1/2
1791 ~ 1972 MHz
1/32
1/2
1972 ~ 2150 MHz
1/32
0/1
VCO disable
PSC
VCO
Table 10; Baseband LPF cut-off frequency setting
Register Bit
PD2
PD3
PD4
PD5
LPF cut-off
Frequency
10 MHz
12 MHz
14 MHz
16 MHz
18 MHz
20 MHz
22 MHz
24 MHz
26 MHz
28 MHz
30 MHz
32 MHz
34 MHz
Table 11; Test mode setting
RTS
0
Register Bit
TS2
TS1
X
TS0
X
Test mode
Normal operation
X: dont care
1
Don't use
Reserved (Test Mode)
2
* When RTS=1 on I C write data (table 1), it changes to test mode.
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Table 12; Charge pump output current selection
Bit
Charge pump output current [A]
min
typ
max
C1
C0
78
120
150
169
260
325
360
555
694
780
1200
1500
Table 13; Baseband AMP gain control (Depend on PLL register setting)
BG1
BG0
ATTENUATION (Typ.)
0/1
2 dB
4 dB
* Set BG1,BG0 as 1,0.
Table 14; POR bit polarity
VCC > 2.2V
POR bit
L
* SDA has to be pulled up.
Table 15; FL bit polarity
VCC < 2.2V
H
FL bit
lock
H
unlock
L
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9-3. Tuner control procedure
VCO and LPF adjustment mode setting sequence after power on
START
2
I C Start
Byte1
Set the MA1, MA0 bits
(Slave address setting)
Wait for 10msec
Hardware adjustment
mode running
Byte2
Set MSB header bit to '0'
(Byte2 header bit data)
Set BG1, BG0 bit
(BB AMP gain setting)
Set the N8-N4 bits
(Programmable division ratio control)
I C Start
Byte1
Set the MA1, MA0 bits
(Slave address setting)
Byte4
Byte3
Set MSB header bit to '1'
(Byte4 header bit data)
Set the PD5 and PD4 bits
(BB LPF cut-off frequency setting)
Leave the TM bit to '1'
(VCO/LPF adjustment mode setting)
Leave the latest data
(C1, C0, RTS, REF)
Set the N3-N1 bits
(Programmable division ratio control)
Set the A5-A1 bits
(Swallow division ratio setting)
Byte4
Set MSB header bit to '1'
(Byte4 header bit data)
Set the PD5 and PD4 bits to '0'
(BB LPF cut-off frequency setting)
Set the TM bit to '0'
(VCO/LPF adjustment mode clear)
Leave the latest data
(C1, C0, RTS, REF)
Byte5
Set the BA2-BA0 bits
(Local oscillator select)
Byte5
Set the PD3 and PD2 bits
(BB LPF cut-off frequency setting)
Leave the latest data
(BA2-BA0, PSC, DIV, PD0)
2
I C Stop
END
Set the PD3 and PD2 bits to '0'
(BB LPF cut-off frequency setting)
Set the DIV bit
(Local oscillator divided ratio setting)
Leave the latest data
(PSC, PD0)
2
(I C Stop)
2
I C Start
Byte1
Set the MA1, MA0 bits
(Slave address setting)
Byte4
Set MSB header bit to '1'
(Byte4 header bit data)
Set the TM bit to '1'
(VCO/LPF adjustment mode setting)
Leave the latest data
(C1, C0, PD5, PD4, RTS, REF)
2
I C Stop
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[10] Reliability
10-1. High temperature high humidity load (40deg.C, 90% RH, 500h)
1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial
value.
2) After cycling DUT in the constant chamber at 40deg.C/90-95% RH in on state, for total 500h,
leave the DUT at room temperature and humidity for 2h and then measure value after test.
3) Must meet the specifications of Table 17.
4) The contact resistance of F-connector must be less than 0.02 ohm. (*)
10-2. High temperature load (70deg.C, 40% RH, 500h)
1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial
value.
2) After leaving DUT in the constant chamber at 70+/-2deg.C/40% RH for total 500h, leave the
DUT at room temperature and humidity for 2h and then measure value after test.
3) Must meet the specifications of Table 17.
10-3. Cold test (-25deg.C, 500h)
1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial
value.
2) After leaving DUT in the constant temperature chamber at -25deg.C for 500h, leave the DUT
at room temperature and humidity for 2h and then measure the values after test.
3) Must meet the specifications of Table 17.
10-4. Shock (686 m/s2, 6 planes, 3 times)
1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial
values.
2) Using the shock tester, apply shock of 686 m/s2 three times to each of 6 planes and then
measure the values.
3) Must meet the specifications of Table 17.
4) This test is to be conducted using a single tuner.
10-5. Vibration (10-55 Hz, 1.5 mm, in each of three mutually perpendicular directions, each 2 times)
1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial
values.
2) Using the vibration tester, apply motion having an amplitude of 1.5 mm (constant), the
frequency being varied uniformly between 10 and 55 Hz, to DUT, for 2h in each of three
mutually perpendicular directions (X, Y and Z, total of 6h). After the test, measure the values.
3) Must meet the specifications of Table 17.
4) This test is to be conducted using a single tuner.
10-6. Heat shock test (1 cycle=1h (-20deg.C; 0.5h, 70deg.C;0.5h), 50 cycles))
1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial value.
2) Using the heat shock tester, apply heat shock to DUT. After the test, measure the values.
3) Must meet the specifications of Table 17.
4) The contact resistance of F-connector must be less than 0.02 ohm. (*)
10-7. Solderability of terminal
Pretreatment of heating terminal at 150deg.C for 1h is performed and leave it at room
temperature for 2h or longer. Immerse 1.9 mm length of terminal (from the tip) to be soldered into
rosin (JIS-K-5902), isopropyl alcohol (JIS-K-8839 or JIS-K-1522, rosin concentration (10-35%
range) approx. 25% by weight unless otherwise specified) or equivalent solution for 35s, and then
immerse the length of the terminal into a pool of molten solder (Sn/3.0Ag/0.5Cu, or equivalent) at
240 +/-2deg.C for 3s.Dipped terminal portion shall be wetted by more than 95%. (Excluding the
cutting plane of the chassis)
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10-8. Soldering heat resistance
Immerse the terminal mounted on a PCB (1.6t thick) into solder at 3505deg.C for 3.0-3.5
seconds or at 260 +/-5deg.C for 10 +/-1 seconds. Remove the PCB from the solder and leave it for
1 hour at room temperature. The test sample shall show no degradation in appearance and
electrical characteristics.
10-9. ESD protection
Table 16; ESD Test Condition (IEC61000-4-2 Compliant)
Terminal
Limits
Condition
RF_IN
+/-6kV DC
150pF/330ohm
(coaxial center)
each 5 times
Others
+/-200V DC
150pF/330ohm
each 5 times
Table 17
No.
Item
10-1 Noise figure(at max. gain)
10-2 PLL phase noise
10-3
10-4
Current
B2
consumption B3
B4
VDD
Es/No at QEF
8PSK 3/4
Spec.
< 12
< -70
< -86
< 135
< 130
< 40
< 1800
< 8.2
UNIT
dB
dBc/Hz
dBc/Hz
mA
mA
mA
mA
dB
Condition
950MHz to 2150MHz
10kHz offset
100kHz offset
3.3V
3.3V
3.3V
1.8V
DVB-S2, Pilot: ON
(*)Method of measuring contact resistance
Center-contact
Insert the gauge pin(0.8mm) to F-connector.
Measure the resistance between the gauge and the center-contact of F-connector.
Outer-shell
Connect the plug(3/8-32 UNEF-2B) to F-connector at 29.4Ncm of the clamping torque.
Measure the resistance between the plug and chassis.
(Measuring device: Milliohm meter)
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2.5V
Reg.
4MHz
SDA
LPF
RF OUT
RF IN
HPF
B1A
B1B
B4
(LNB A)(LNB B) 3.3V
B2
3.3V
AGC
CONTROL
AGC Amp.
90deg
SHIFTER
(DIVIDER)
VCO
IX2470VA
PLL
2
IC
LPF
SCL
B3
3.3V
STB0899
Reg.
1.2V
LPF
VDD
1.8V
SCL
SDA
DISEQC_OUT
RESETB
ERROR
DO-D7
CLK_OUT
D/PN
STROUT
[11] BLOCK DIAGRAM
Fig 1. BLOCK DIAGRAM
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[12] PIN LIST
No.
1
NAME
B1B
B1A
3
4
B4
B2
5,6,7,10
8
9
11
12
NC
SDA
SCL
B3
DISEQC_
OUT
VDD
D0,...,D7
CLK_OUT
D/PN
STROUT
ERROR
RESETB
13
14,...,21
22
23
24
25
26
LOGIC
3.3V
PIN DESCRIPTION
Voltage supply of LNB B. Please ground it with a 1000pF ceramic
capacitor.
Voltage supply of LNB A. Please ground it with a 1000pF ceramic
capacitor.
3.3V supply for RF Booster Amp of tuner.
3.3V supply for the Front-end section. Please keep a ripple at the Power
Supply less than 10mVp-p.
It is not connected inside the unit. We advice to ground it.
2
I C Bus. Please connect a pull-up resistor which is more than 2k ohm
outside of the tuner.
3.3V supply for demodulator IC. It is internally converted into 2.5V.
Digital satellite equipment control output.
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
1.8V digital core supply. It is internally converted into 1.2V.
Transport stream parallel data.
Transport stream byte or bit clock.
Transport stream data valid signal.
Transport stream sync bit.
Transport stream packet error signal.
Reset signal active low.
3.3V
3.3V
[13] CONECTION DIAGRAM
Fig 2. CONNECTION DIAGRAM
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[14] DIMENSION DIAGRAM
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[15] MOUNTING DETALIS
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[16] PACKAGEING DETAILS
pad 3
partition_B x12
partition_C x12
partition_A x42
frame x2
outer_box x1
1948
antistatic_sheet x1
41
0
45
Unitmm
Quantity200pcs
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