eUTRAN Introduction This data sheet provides a high level description of the key aspects of the

Alcatel-Lucent Long Term Evolution (LTE) 9412 Compact eNode B. LTE is a pure packet system, with
no support for legacy circuit switched voice/data. This shift allows a significant simplification of the
network, reducing the number of nodes and improving operational efficiencies. This network
simplification also removes the bottlenecks from the system, ensuring the network permanently
runs closer to peak efficiency. The two logical entities in the LTE network are the eUTRAN (evolved
UTRAN) on the access side, and the enhanced Packet Core (ePC). The eUTRAN follows a flat
architecture; for example the eNodeB concentrates most of the access functions that were split into
the RNC and Base Station in 3G CDMA. Architecture The 9412 eNodeB Compact is a high capacity
integrated baseband and RF cabinet solution, housing the Alcatel-Lucent 9926 Digital d2u LTE
Module as well as up to 3 integrated Radio Modules (TRDUs). Some of the key features of the 9412
eNodeB Compact and its equipment provisions: • Sub compact sized cabinet – cabinets are stackable
for growth. • Small Foot print, allowing simple transport, movement and easy installation. •
Mounting Flexibility – Floor or wall mountable. • Base Band Unit support – either the Digital d2u or
the LTE Module with up to 3 modems each. Each baseband unit has 6 CPRI based optical ports for RF
unit connection. • RF support – each unit can support up to 3 TRDUs. A stacked configuration can
support 6 sectors of LTE in a single ETSI compliant footprint. • Rack mountable assets: All the major
assets are 19 inches for rack mount versatility. • User Space : when deployed with the LTE Module
the 9412 eNodeB cabinet supports an additional 2U of user space. • Stackable – Capacity expansion
without footprint growth • NEBS, FCC and UL compliance • ROHS support for Cabinet and PDP • All
modules/interfaces are front access. • Antenna jumper cable pass through or bulkhead mounting •
Antenna Sharing with co-located CDMA systems. LTE deployment scenarios Alcatel-Lucent intend to
cover both Greenfield, standalone networks in new spectrum bands as well as offering a smooth
evolution path for currently deployed GSM, WCDMA/HSPA and CDMA/EV-DO networks. To this end,
our LTE solution is designed to integrate into existing product offerings to support a graceful
evolution to an LTE eNode B: The solution is modular and is composed of the digital or baseband
unit (9926 Digital 2U), which may be deployed in a distributed architecture with Remote Radio
Heads (RRHs) or in classical Macro configurations with integrated Radio Modules (i.e. TRDUs) as in
the 9412 eNodeB Compact. Figure 1 – Alcatel-Lucent 9412 eNode B Compact The 9412 eNodeB
Compact offers wireless operators an easy way to support LTE either greenfield or co-located indoor
site deployments where existing equipment may require sharing of antenna resources. The eNodeB
Compact can be wall mounted if site constraints exist, and where growth into additional sectors is
expected the eNodeB Compact can be stacked to support that future growth in the same ESTI
compliant footprint as the primary frame. Spectrum considerations The Alcatel-Lucent 9412 eNodeB
Compact can used to deploy LTE in recently auctioned spectrum bands (such as the 700mhz
spectrum in North-America) or in an existing spectrum band (such as AWS or PCS) shared with a
different RAT. Initial deployment is planned with 700MHz. Additional frequencies will be rolled out
based on customer demand. Flexible spectrum use maximizes flexibility in the network, with
Bandwidth options of 1.4, 3, 5, 10, 15, or 20 MHz supported.
Alcatel-Lucent LTE 700MHz
TRDU 2x40W Transmit Receive
Duplexer Unit (TRDU) Design
Analysis
DUBLIN, April 7, 2014 /PRNewswire/ --

Research and
Markets (http://www.researchandmarkets.com/research/3lpqb4/alcatellucent) has
announced the addition of EJL Wireless Research's new report "Alcatel-Lucent LTE
700MHz TRDU 2x40W Transmit Receive Duplexer Unit (TRDU) Design Analysis" to
their offering.

(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

This report covers the design analysis of an Alcatel-Lucent LTE 700MHz TRDU
2x40W unit. This unit is part of the LTE eNodeB platform for Alcatel-Lucent. The unit
was manufactured in Q2 2009.

Key Findings:

 The RF duplexer filters are integrated into the TRDU housing.

 The unit is designed and manufactured by CommScope for Alcatel-Lucent.
 TRDU is a comprised of two sub-systems (power amplifier & radio
transceiver) that are mechanically and electrically connected

Component and semiconductor suppliers mentioned in this report include: Analog

Devices, Anaren Microwave, AVX, Coilcraft, Cypress Semiconductor, , Fairchild
Semiconductor, Freescale Semiconductor, Hittite Microwave, International Rectifier,
Integrated Device Technology, Linear Technology, Maxim Integrated Products,
Micron, National Semiconductor, NXP Semiconductors, ON Semiconductor, s,
STMicroelectronics, TDK-Epcos AG Texas Instruments, TriQuint Semiconductors
and Vishay.

Features

 Complete Part Number/Marking

 Component Manufacturer Identification
 Function Component Description

Important Note: There is NO component pricing contained within the report.

Key Topics Covered:

EXECUTIVE SUMMARY

CHAPTER 1: ALCATEL-LUCENT LTE BBU/RRU SYSTEM

 Overview of BBU/RRU Product Offering

CHAPTER 2: TRDU MECHANICAL ANALYSIS

 Mechanical Analysis
 TRDU DC and RF Cables

CHAPTER 3: TRDU TRX HOUSING

CHAPTER 4: DIGITAL PROCESSOR AND TRX PCB

 Area A: Processor/CPRI Interface/DUC-DDC/CFR/DPD

 Area B: Radio Transmitter
 Area C: Receiver A/D Conversion
 Area D: Receiver
 Area E: System Timing
 Area F: Tx Sampling Circuit
 Area G: Transceiver Support Circuitry

CHAPTER 5: LNA SUBSYSTEM

CHAPTER 6: TRDU RF DUPLEXER FILTER SUBSYSTEM

CHAPTER 7: TRDU POWER AMPLIFIER HOUSING

 Power Amplifier RF Shield

CHAPTER 8: TRDU POWER AMPLIFIER SUBSYSTEM

CHAPTER 9: TRDU POWER SUPPLY SUBSYSTEM

  Power Supply Area A
 Power Supply Area B
 Power Supply Area C
 Power Supply Area D

APPENDIX A - PASSIVE COMPONENT MARKET SHARE/CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

Companies Mentioned:

 Analog Devices
 Anaren Microwave
 AVX
 Coilcraft
 Cypress Semiconductor
 Fairchild Semiconductor
  Freescale Semiconductor
 Hittite Microwave
 International Rectifier
 Integrated Device Technology
 Linear Technology
 Maxim Integrated Products
 Micron
 National Semiconductor
 NXP Semiconductors
 ON Semiconductors
 STMicroelectronics
 TDK-Epcos AG Texas Instruments
 TriQuint Semiconductors
 Vishay

For more information

visit http://www.researchandmarkets.com/research/3lpqb4/alcatellucent

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets

his report covers the design analysis of an Alcatel-Lucent LTE 700MHz TRDU 2x40W unit. This
unit is part of the LTE eNodeB platform for Alcatel-Lucent. The unit was manufactured in Q2
2009.

Key Findings:

- The RF duplexer filters are integrated into the TRDU housing.

- The unit is designed and manufactured by CommScope for Alcatel-Lucent.
- TRDU is a comprised of two sub-systems (power amplifier & radio transceiver) that are
mechanically and electrically connected

Component and semiconductor suppliers mentioned in this report include: Analog Devices,
Anaren Microwave, AVX, Coilcraft, Cypress Semiconductor, , Fairchild Semiconductor,
Freescale Semiconductor, Hittite Microwave, International Rectifier, Integrated Device
Technology, Linear Technology, Maxim Integrated Products, Micron, National Semiconductor,
NXP Semiconductors, ON Semiconductor, s, STMicroelectronics, TDK-Epcos AG Texas
 Instruments, TriQuint Semiconductors and Vishay.

Features

- Complete Part Number/Marking

- Component Manufacturer Identification
- Function Component Description

Important Note: There is NO component pricing contained within the report.

Note: Product cover images may vary from those shown

FEATURED COMPANIES
 Analog Devices
 Coilcraft
 Freescale Semiconductor
 Linear Technology
 National Semiconductor
 STMicroelectronics
 MORE
 PRINTER FRIENDLY

 SEND TO A FRIEND
EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note

CHAPTER 1: ALCATEL-LUCENT LTE BBU/RRU SYSTEM

Overview of BBU/RRU Product Offering

CHAPTER 2: TRDU MECHANICAL ANALYSIS

Mechanical Analysis
TRDU DC and RF Cables

CHAPTER 3: TRDU TRX HOUSING

CHAPTER 4: DIGITAL PROCESSOR AND TRX PCB

Area A: Processor/CPRI Interface/DUC-DDC/CFR/DPD
Area B: Radio Transmitter
Area C: Receiver A/D Conversion
Area D: Receiver
Area E: System Timing
Area F: Tx Sampling Circuit
Area G: Transceiver Support Circuitry
CHAPTER 5: LNA SUBSYSTEM

CHAPTER 6: TRDU RF DUPLEXER FILTER SUBSYSTEM

CHAPTER 7: TRDU POWER AMPLIFIER HOUSING

Power Amplifier RF Shield

CHAPTER 8: TRDU POWER AMPLIFIER SUBSYSTEM

CHAPTER 9: TRDU POWER SUPPLY SUBSYSTEM

Power Supply Area A
Power Supply Area B
Power Supply Area C
Power Supply Area D

APPENDIX A - PASSIVE COMPONENT MARKET SHARE/CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

Table 1: TRDU Cables/Connectors Bill of Materials

Table 2: Area A Bill of Materials
Table 3: Area B Bill of Materials
Table 4: Area E Bill of Materials
Table 5: Area F1 Bill of Materials
Table 6: Area F2 Bill of Materials
Table 7: Area G Bill of Materials
Table 8: LNA Area A Bill of Materials
Table 9: LNA Area B Bill of Materials
Table 10: Power Amplifier Bill of Materials
Table 11: Power Amplifier Output Stage Bill of Materials
Table 12: Power Amplifier Drive Stage Bill of Materials
Table 13: Power Supply Area A Bill of Materials
Table 14: Power Supply Area B Bill of Materials
Table 15: Power Supply Area C Bill of Materials
Table 16: Power Supply Area D Bill of Materials
Table 17: Passive Component Case Size Distribution by System Subsection
Table 18: Identified Passive Component Supplier Distribution by System Subsection
Table 19: Active/Passive Component Distribution by System Subsection
Table 20: Active Semiconductor/Component Vendor Distribution by System Subsection
EXHIBITS

Exhibit 1: Alcatel-Lucent 9914 LTE eNodeB System

Exhibit 2: Alcatel-Lucent TRDU System Block Diagram
Exhibit 3: Alcatel-Lucent 9926 V2 d2U
Exhibit 4: TRDU Connection Interfaces
Exhibit 5: TRDU Front View
Exhibit 6: TRDU Back View
Exhibit 7: TRDU, Side View
Exhibit 8: TRDU, Top View
Exhibit 9: TRDU, Bottom View
Exhibit 10: Faceplate, External View
Exhibit 11: Faceplate, Internal View
Exhibit 12: Backplate, External View
Exhibit 13: Backplate, Internal View
Exhibit 14: TRDU Housing, TRx (L) and Power Amplifier (R)
Exhibit 15: RF Coaxial Cable, RF Power Amplifier/RF Receiver to Transceiver
Exhibit 16: RF Coaxial Cable, RF Power Amplifier to Duplexer Filter
Exhibit 17: Ribbon Cables
Exhibit 18: DC Power Cables
Exhibit 19: TRDU Cables/Connectors Location Diagram, Transceiver
Exhibit 20: TRDU Cables/Connectors Location Diagram, Power Amplifier
Exhibit 21: TRDU Cables/Connectors System Block Diagram
Exhibit 22: TRDU TRx Housing, Top
Exhibit 23: TRDU TRx Housing, Bottom
Exhibit 24: TRx RF Shield, External View
Exhibit 25: TRx RF Shield, Internal View
Exhibit 26: TRDU Digital Processor/TRX PCB, Top View
Exhibit 27: TRDU Digital Processor/TRX PCB, Bottom View
Exhibit 28: Area A Component Diagram
Exhibit 29: Area B Component Diagram
Exhibit 30: Area B Block Diagram
Exhibit 31: Area C Component Diagram
Exhibit 32: Area D1 & Area D2
Exhibit 33: Area D Component Diagram
Exhibit 34: Area D2 Block Diagram
Exhibit 35: Area E Component Diagram
Exhibit 36: Area F1 Component Diagram
Exhibit 37: Area F2 Component Diagram
Exhibit 38: Area F1 & F2 Block Diagram
Exhibit 39: Area G Component Diagram
Exhibit 40: LNA Subsystem Location
Exhibit 41: LNA Subsystem Location with TRx PCB Removed
Exhibit 42: LNA RF Shield, External View
Exhibit 43: RF Shield, External View
Exhibit 44: LNA PCB Location
Exhibit 45: LNA PCB/RF Shield Location with LNA PCB Removed
Exhibit 46: LNA PCB Dimensions
Exhibit 47: LNA Port RF Paths
Exhibit 48: LNA Areas A & B
Exhibit 49: LNA Area A Component Diagram
Exhibit 50: LNA Area A Block Diagram
Exhibit 51: LNA Area B Component Diagram
Exhibit 52: LNA Area B Block Diagram
Exhibit 53: TRDU RF Duplexer Filters
Exhibit 54: RF Duplexer Shield Dimensions
Exhibit 55: RF Duplexer Shield, Top View
Exhibit 56: RF Duplexer Shield, Bottom View
Exhibit 57: RF Duplexer Filters, Tx and Rx Filters
Exhibit 58: RF Duplexer Filter Tx and Rx Paths
Exhibit 59: RF Duplexer Filter Resonator Types
Exhibit 60: Rx Filter Resonator Coupler Locations
Exhibit 61: Rx Filter Coupler Location, Close Up View
Exhibit 62: Resonator Type A & B, Top and Bottom Views
Exhibit 63: Resonator Type A & B, Side View
Exhibit 64: Power Amplifier Housing, Top View
Exhibit 65: Power Amplifier Housing, Bottom View
Exhibit 66: Power Amplifier Housing without PCBs, Top View
Exhibit 67: Power Amplifier RF Shield, External View
Exhibit 68: Power Amplifier RF Shield, Internal View
Exhibit 69: RF Power Amplifier Block Diagram
Exhibit 70: RF Power Amplifier Exploded, Side View
Exhibit 71: TRDU Power Amplifiers
Exhibit 72: TRDU RF Power Amplifier Component Diagram
Exhibit 73: TRDU RF Power Amplifier Component Diagram 2
Exhibit 74: TRDU RF Power Amplifier PCB, Top View
Exhibit 75: TRDU RF Power Amplifier PCB, Bottom View
Exhibit 76: TRDU Driver Stage Amplifier Pallet, Top View
Exhibit 77: TRDU Driver Stage Amplifier Pallet, Bottom View
Exhibit 78: TRDU Output Stage Amplifier Pallet, Top View
Exhibit 79: TRDU Output Stage Amplifier Pallet, Bottom View
Exhibit 80: TRDU Power Supply Location
Exhibit 81: TRDU Power Supply Dimensions
Exhibit 82: Power Supply PCB, Top View
 Exhibit 83: Power Supply PCB, Bottom View
Exhibit 84: Power Supply Area A Component Diagram
Exhibit 85: Power Supply Area B Component Diagram
Exhibit 86: Power Supply Area C Component Diagram
Exhibit 87: Power Supply Area D Component Diagram
Exhibit 88: Passive Component Case Size Distribution
Exhibit 89: Identified Passive Component Market Share by Vendor
Exhibit 90: Active Semiconductor Component Share
Exhibit 91: High Pin Count IC vs. Discretes
Exhibit 92: Active Semiconductor Market Share by Vendor
Exhibit 93: High Pin Count (64+) Active Semiconductor Market Share by Vendor
Note: Product cover images may vary from those shown

LOADING...
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 SEND TO A FRIEND
- Analog Devices
- Anaren Microwave
- AVX
- Coilcraft
- Cypress Semiconductor
- Fairchild Semiconductor
- Freescale Semiconductor
- Hittite Microwave
- International Rectifier
- Integrated Device Technology
- Linear Technology
- Maxim Integrated Products
- Micron
- National Semiconductor
- NXP Semiconductors
- ON Semiconductors
- STMicroelectronics
- TDK-Epcos AG Texas Instruments
- TriQuint Semiconductors
- Vishay
Note: Product cover images may vary from those shown

FORMAT PROPERTIES
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SINGLE USER Electronic (PDF) The report will be emailed to you. The report is sent in PDF format. one specific use
product.

Note: Product cover images may vary from those shown

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MS Excel: How to concatenate strings together (WS, VBA)

This Excel tutorial explains how to use the Excel & operator with syntax and
examples.

Description
To concatenate multiple strings into a single string in Microsoft Excel, you can use
the & operator to separate the string values.
The & operator can be used as a worksheet function (WS) and a VBA function (VBA)
in Excel. As a worksheet function, the & operator can be entered as part of a formula
in a cell of a worksheet. As a VBA function, you can use this operator in macro
code that is entered through the Microsoft Visual Basic Editor.

Syntax
The syntax for the & operator is:

string1 & string2 [& string3 & string_n]

Parameters or Arguments
string1, string2, string3, ... string_n
The string values to concatenate together.

Returns
The & operator returns a string/text value.

Applies To
 Excel 2016, Excel 2013, Excel 2011 for Mac, Excel 2010, Excel 2007, Excel 2003,
Excel XP, Excel 2000

Type of Function
 Worksheet function (WS)
 VBA function (VBA)

Example (as Worksheet Function)

Let's look at some Excel & operator examples and explore hwo you would use
the & operator as a worksheet function in Microsoft Excel: