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"Electrothermal coupling analysis of current crowding and Joule heating in ..."

Yi-Shao Lai, Chin-Li Kao (2006)

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DOI: 10.1016/J.MICROREL.2005.08.009

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yi-Shao Lai, Chin-Li Kao:
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectron. Reliab. 46(8): 1357-1368 (2006)

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