default search action

combined dblp search
author search
venue search
publication search

ask others

Chin-Li Kao

> Home > Persons

Person information

Refine list

refinements active!

zoomed in on ?? of ?? records

view refined list in

export refined list as

showing all ?? records

2010 – 2019

see FAQ

What is the meaning of the colors in the publication lists?

2018
[j8]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/KaoC18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/KaoC18
Chin-Li Kao, Tei-Chen Chen:
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes. Microelectron. Reliab. 82: 204-212 (2018)
2016
[j7]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/KimPKSBP16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/KimPKSBP16
Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park:
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. Microelectron. Reliab. 65: 234-242 (2016)
2014
[j6]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/KaoCLC14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/KaoCLC14
Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu:
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. Microelectron. Reliab. 54(11): 2471-2478 (2014)
2010
[j5]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/SzePSLMGTKG10
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/SzePSLMGTKG10
Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere:
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. Microelectron. Reliab. 50(4): 498-506 (2010)

2000 – 2009

see FAQ

What is the meaning of the colors in the publication lists?

2007
[j4]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/LaiCKLC07
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/LaiCKLC07
Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu:
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectron. Reliab. 47(8): 1273-1279 (2007)
2006
[j3]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/LaiK06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/LaiK06
Yi-Shao Lai, Chin-Li Kao:
Characteristics of current crowding in flip-chip solder bumps. Microelectron. Reliab. 46(5-6): 915-922 (2006)
[j2]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/YehLK06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/YehLK06
Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao:
Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectron. Reliab. 46(7): 1172-1182 (2006)
[j1]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/LaiK06a
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/LaiK06a
Yi-Shao Lai, Chin-Li Kao:
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectron. Reliab. 46(8): 1357-1368 (2006)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.