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Microelectronics Reliability, Volume 82
Volume 82, March 2018
- Christian Schlünder, Katja Puschkarsky
, Gunnar Andreas Rott, Wolfgang Gustin, Hans Reisinger:
NBTI: Experimental investigation, physical modelling, circuit aging simulations and verification. 1-10 - S. Nilamani, P. Chitra, V. N. Ramakrishnan:
Topological variation on sub-20 nm double-gate inversion and Junctionless-FinFET based 6T-SRAM circuits and its SEU radiation performance. 11-19 - Kazuki Watanabe
Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via. 20-27 - Danijel Dankovic
A review of pulsed NBTI in P-channel power VDMOSFETs. 28-36 - Yunpeng Jia, Zhenhua Lin, Dongqing Hu, Yu Wu, Peng Li, Guanghai Liu:
Micro-Raman spectroscopy applied in crystal structure analysis on the ESD failure mechanism of SiC JBS diodes. 37-41 - Stephen M. Ramey, Chetan Prasad, A. Rahman:
Technology scaling implications for BTI reliability. 42-50 - Bing Gao, Fan Yang, Minyou Chen, Yigao Chen, Wei Lai
Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop. 51-61 - Clemens Ostermaier, Peter Lagger, M. Reiner, Dionyz Pogany:
Review of bias-temperature instabilities at the III-N/dielectric interface. 62-83 - Julien Magnien
Parameter driven monitoring for a flip-chip LED module under power cycling condition. 84-89 - Longjun Wang, Jiayou Xu
Lifetime estimation of IGBT modules for MMC-HVDC application. 90-99 - Marko S. Andjelkovic
Study of the operation and SET robustness of a CMOS pulse stretching circuit. 100-112 - Jing Wang
Experimental study on optical-thermal associated characteristics of LED car lamps under the action of ionic wind. 113-123 - Jianqun Yang, Xingji Li, Chaoming Liu, Daniel M. Fleetwood:
The effect of ionization and displacement damage on minority carrier lifetime. 124-129 - Xingji Li, Jianqun Yang, Chaoming Liu, Gang Bai, Wenbo Luo, Pengwei Li:
Synergistic effects of NPN transistors caused by combined proton irradiations with different energies. 130-135 - H. Conseil-Gudla
Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction. 136-146 - Rongsheng Zhang
A fast fault injection platform of multiple SEUs for SRAM-based FPGAs. 147-152 - Mehran Gholipour Shahraki
The temperature and oxygen vacancy effects on the diffusion coefficient and ionic conductivity in ferroelectric BaTiO3 nanowires; A molecular dynamics study. 153-158 - Olarewaju Mubashiru Lawal, Shuhuan Liu, Zhuoqi Li, Aqil Hussain:
60Co gamma radiation total ionizing dose combined with conducted electromagnetic interference studies in BJTs. 159-164 - Piotr Zachariasz
Mössbauer studies of β → α phase transition in Sn-rich solder alloys. 165-170 - Bakhtiar Ali
Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. 171-178 - Darong Huang
Fault diagnosis for the motor drive system of urban transit based on improved Hidden Markov Model. 179-189 - K. A. Karthigeyan
Study and analysis of DR-VCO for rad-hardness in type II third order CPLL. 190-196 - Yue Zhao, Guoyi Xu
A portable high-density absolute-measure NIRS imager for detecting prefrontal lobe activity under fatigue driving. 197-203 - Chin-Li Kao, Tei-Chen Chen:
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes. 204-212 - Carmen Martin
Importance of test parameters, specimen type and use configuration on the identification of Sn/Ag solder behaviour laws. 213-223
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