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Alicja Lesniewska
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2020 – today
- 2024
- [c13]Y. Fang, Alicja Lesniewska, Ivan Ciofi, Philippe Roussel, Chen Wu, Victor Vega-Gonzalez, Ingrid De Wolf, Kris Croes:
BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure. IRPS 2024: 1-7 - [c12]D. Tiernc, Antonio Arreghini, Alicja Lesniewska, Y. Jeong, Marleen H. van der Veen, J. Stiers, N. Bazzazian, Ivan Ciofi, Geert Van den Bosch, Maarten Rosmeulen:
Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND. IRPS 2024: 1-5 - 2023
- [c11]Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei:
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS 2023: 1-7 - 2022
- [c10]Artemisia Tsiara, Alicja Lesniewska, Philippe Roussel, Srinivasan Ashwyn Srinivasan, Mathias Berciano, Marko Simicic, Marianna Pantouvaki, Joris Van Campenhout, Kristof Croes:
Degradation mechanisms in Germanium Electro-Absorption Modulators. IRPS 2022: 9 - [c9]Gayle Murdoch, Matin O'Toole, Giulio Marti, Ankit Pokhrel, Diana Tsvetanova, Stefan Decoster, Shreya Kundu, Yusuke Oniki, Arame Thiam, Quoc Toan Le, Olalla Varela Pedreira, Alicja Lesniewska, Gerardo Martinez-Alanis, Seongho Park, Zsolt Tokei:
First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. VLSI Technology and Circuits 2022: 1-2 - 2021
- [c8]Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes:
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS 2021: 1-6 - 2020
- [c7]Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes:
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. IRPS 2020: 1-6
2010 – 2019
- 2019
- [c6]Alicja Lesniewska, S. A. Srinivasan, Joris Van Campenhout, Barry J. O'Sullivan, Kris Croes:
Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors. IRPS 2019: 1-7 - [c5]Chen Wu, Adrian Vaisman Chasin, Andrea Padovani, Alicja Lesniewska, Steven Demuynck, Kris Croes:
Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects. IRPS 2019: 1-6 - 2018
- [c4]Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tökei, Kris Croes:
Insights into metal drift induced failure in MOL and BEOL. IRPS 2018: 3 - [c3]Deniz Kocaay, Philippe Roussel, Kristof Croes, Ivan Ciofi, Alicja Lesniewska, Ingrid De Wolf:
Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing. IRPS 2018: 10-1 - [c2]Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil:
Silicon Photonics for 56G NRZ Optical Interconnects. OFC 2018: 1-3 - 2015
- [c1]Kris Croes, Alicja Lesniewska, Chen Wu, Ivan Ciofi, Agnieszka Banczerowska, B. Briggs, S. Demuynck, Zsolt Tökei, Jürgen Bömmels, Yves Saad, W. Gao:
Intrinsic reliability of local interconnects for N7 and beyond. IRPS 2015: 2
Coauthor Index
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last updated on 2024-12-08 02:26 CET by the dblp team
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