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Improved diagnosis of realistic interconnect shorts

Published: 17 March 1997 Publication History

Abstract

Original diagnostic schemes for wire interconnect shorts are proposed. The idea is to use layout extracted realistic shorts and a broader range of short behaviour assumptions to derive the schemes. Results on real examples clearly show the superiority of the new schemes, both in terms of test size and diagnostic resolution.

References

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[1] William H. Kautz. "Testing for Faults in Wiring Networks". IEEE Transactions on Computers, C-23(4):358-353, April 1974.
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[2] P. Goel and M.T. McMahon. "Electronic Chip in Place Test". In Proc. Int. Test Conference (ITC), pages 83-90, 1982.
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[3] P.T. Wagner. "Interconect Testing with Boundary Scan". In Proc. Int. Test Conference (ITC), pages 52-57, 1987.
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[4] A. Hassan, J. Rajski, and V.K. Agarwal. "Testing and Diagnosis of Interconnects using Boundary Scan Architecture". In Proc. Int. Test Conference (ITC), pages 126-137, 1988.
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[5] N. Jarwala and C.W. Yau. "A New Framework for Analyzing Test Generation and Diagnosis Algorithms for Wiring Interconnects". In Proc. Int. Test Conference (ITC), pages 63-70, 1989.
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[6] C.W. Yau and N. Jarwala. "A Unified Theory for Designing Optimal Test Generation and Diagnosis Algorithms for Board Interconnects". In Proc. Int. Test Conference (ITC), pages 71-77, 1989.
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[7] W.T. Cheng, J.L. Lewandowski, and E. Wu. "Diagnosis for Wiring Interconnects". In Proc. Int. Test Conference (ITC), pages 565-571, 1990.
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[8] M.R. Garey, D.S. Stifler, and H.C. So. "An Application of Graph Coloring to Printed Circuit Testing". IEEE Trans. on Circuits and Systems, CAS-23(10):591-599, Oct. 1976.
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[9] J.L. Lewandowski and V.J. Velasco. "Short Circuit Testing". Technical Report CC8559, AT&T, October 1986.
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[10] J.T. Sousa, T. Shen, and P.Y.K. Cheung. "Realistic Fault Extraction for Boards". In Proc. European Design and Test Conference (ED&TC), 1996.
[11]
[11] D. McBean and W.R. Moore. "Testing Interconnects: A Pin Adjacency Approach". In Proc. European Test Conference (ETC), pages 484-490, 1993.
[12]
[12] Mick M.V. Tegethoff. "Defects, Fault Coverage, Yield and Cost in Board Manufacturing". In Proc. Int. Test Conference (ITC), pages 539-547, 1994.

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Published In

EDTC '97: Proceedings of the 1997 European conference on Design and Test
March 1997
596 pages
ISBN:0818677864

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IEEE Computer Society

United States

Publication History

Published: 17 March 1997

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Author Tags

  1. diagnosis
  2. fault diagnosis
  3. layout extraction
  4. testing
  5. wire interconnect short

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