Direct-to-Chip Liquid Cooling
Data Centers
AI Compute
Semiconductors
Reliable, Scalable Performance
Transform Thermal Management in Your High-Power Electronics
Our modules are easily integrable and can handle the market’s highest power density devices.
What can better cooling do for my application?
01
Safely Run Devices Harder
Defense-grade cooling solutions help guard devices against downtime and network latency.
02
Increase Device Efficiency
Microconvective cooling® technology cools devices to maintain optimal operational temperatures, improving device efficiency and lifetime.
03
Future-Proof Design
Our customers future-proof system design by reliably cooling the next three generations of processors, including those that exceed 2,000W per chip.
04
Minimize Cooling Costs
With microconvective cooling®, customers achieve 18% power savings, use higher coolant temperatures over 60°C, and eliminate water consumption.
Loved by Engineers. Trusted by Enterprises.
Data Centers
As AI increases rack density, data centers are grappling with strict power limitations. Discover how JetCool’s liquid cooling solutions are helping data centers reduce power consumption while maximizing compute per rack, enhancing both efficiency and performance.
High-Performance Computing
Whether deploying high density servers with eight GPUs or developing an AI factory, engineers choose JetCool’s direct-to-chip liquid cooling. Customers cool the highest power processors on the market while using very warm inlet coolant temperatures, over 50°C.
Semiconductors
Design high-performance devices with enhanced power density and improved device efficiency ahead of your competition with JetCool’s liquid-to-die approaches: SmartLid (fluid-to-die) and SmartSilicon (embedded in silicon substrate).