AU2003270392A1 - Assemblies having stacked semiconductor chips - Google Patents

Assemblies having stacked semiconductor chips

Info

Publication number
AU2003270392A1
AU2003270392A1 AU2003270392A AU2003270392A AU2003270392A1 AU 2003270392 A1 AU2003270392 A1 AU 2003270392A1 AU 2003270392 A AU2003270392 A AU 2003270392A AU 2003270392 A AU2003270392 A AU 2003270392A AU 2003270392 A1 AU2003270392 A1 AU 2003270392A1
Authority
AU
Australia
Prior art keywords
assemblies
semiconductor chips
stacked semiconductor
stacked
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003270392A
Other versions
AU2003270392A8 (en
Inventor
Teck-Gyu Kang
Yoichi Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeia Semiconductor Solutions LLC
Original Assignee
Tessera LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera LLC filed Critical Tessera LLC
Publication of AU2003270392A1 publication Critical patent/AU2003270392A1/en
Publication of AU2003270392A8 publication Critical patent/AU2003270392A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/297—Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
AU2003270392A 2002-09-11 2003-09-08 Assemblies having stacked semiconductor chips Abandoned AU2003270392A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9888002P 2002-09-11 2002-09-11
US60/4098,880 2002-09-11
PCT/US2003/028041 WO2004025699A2 (en) 2002-09-11 2003-09-08 Assemblies having stacked semiconductor chips

Publications (2)

Publication Number Publication Date
AU2003270392A1 true AU2003270392A1 (en) 2004-04-30
AU2003270392A8 AU2003270392A8 (en) 2004-04-30

Family

ID=31990051

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003270392A Abandoned AU2003270392A1 (en) 2002-09-11 2003-09-08 Assemblies having stacked semiconductor chips

Country Status (2)

Country Link
AU (1) AU2003270392A1 (en)
WO (1) WO2004025699A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6856007B2 (en) 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
JP2007528120A (en) 2003-07-03 2007-10-04 テッセラ テクノロジーズ ハンガリー コルラートルト フェレロェセーギュー タールシャシャーグ Method and apparatus for packaging integrated circuit devices
WO2005031862A1 (en) 2003-09-26 2005-04-07 Tessera, Inc. Structure and method of making sealed capped chips
US7157309B2 (en) 2004-04-09 2007-01-02 Tessera, Inc. Manufacture of microelectronic fold packages
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US7755457B2 (en) 2006-02-07 2010-07-13 Harris Corporation Stacked stripline circuits
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
JP7141877B2 (en) * 2018-07-18 2022-09-26 キオクシア株式会社 semiconductor storage device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117282A (en) * 1990-10-29 1992-05-26 Harris Corporation Stacked configuration for integrated circuit devices
US5448511A (en) * 1994-06-01 1995-09-05 Storage Technology Corporation Memory stack with an integrated interconnect and mounting structure
US5646446A (en) * 1995-12-22 1997-07-08 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
US6225688B1 (en) * 1997-12-11 2001-05-01 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6351029B1 (en) * 1999-05-05 2002-02-26 Harlan R. Isaak Stackable flex circuit chip package and method of making same

Also Published As

Publication number Publication date
AU2003270392A8 (en) 2004-04-30
WO2004025699A3 (en) 2004-06-17
WO2004025699A2 (en) 2004-03-25

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase