Ijaerv12n18 56 2
Ijaerv12n18 56 2
7516-7523
                                 © Research India Publications. http://www.ripublication.com
                     1
                      Department of Industrial Technical Education, University of Nigeria, Nsukka. Nigeria.
                                              (*Corresponding Author: Bakare J)
                                               1
                                                 Orcid iD: 0000-0002-1656-0147
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     International Journal of Applied Engineering Research ISSN 0973-4562 Volume 12, Number 18 (2017) pp. 7516-7523
                                 © Research India Publications. http://www.ripublication.com
endangered. Farlex (2005) maintained that transmitter of                 adopt radio broadcast as means of electronic media. The
larger power requires large current flow with high voltage up            private individual and organizations lack resources to
to 20kv. The transmitting plants are also exposed to increased           purchase and maintain complex transmitting plant whose price
over voltage risk due to the usually exposed radio tower.                is exorbitant and requires critical maintenance. The solution to
                                                                         this dilemma is the design and construction of FM transmitter
Olaitan (1996) remarked that Nigeria has not contributed
                                                                         where power supply is derived from low voltage system
significantly to technological development. Against this
                                                                         which is inherently safe to handle. The present project is
background, the researchers feels that, engineers and others in
                                                                         design to make use of 12VDC supply, yet produce the range
electronics field in particular take up the challenge to design
                                                                         as required for local broadcast. If effort is not made to
and construct engineering equipment and gadget that are fee
                                                                         produce an FM transmitter that is cheap in price, simple in
from such technical problems as afflict radio transmitters.
                                                                         maintenance, efficient in use and yet operate on low power,
Design as a process can take many forms depending on the                 individual and private organization may not achieve their
object being designed and the individual participating. Farlex           desire in radio broadcast.
(2005) described design as the process of originating and
developing a plan for an aesthetic and functional object,
which usually requires considerable research through                     METHOD
modeling, interactive adjustment and re-design. Design is also
                                                                         Design of the study
used both for final plan of action or the result of following
that plan of action (the object produced). According to                  The design of this study is research and development (R&D).
Longman (1995) design is to make drawing or plan of                      According to Nworgu (1991) R & D is a process whereby
something that would be built. It is also to develop or plan             educational products such as textbooks, equipment, or
something for scientific purpose. The essence of any design is           curricular are developed and trial tested in the field to ensure
to build or construct something. Longman further stated that             effectiveness. The approach of the design is purely
construction is the process or method of building or making              constructional, depicting step-by-step procedure for the
something using many parts.                                              planning and fabrication of products and gadgets.
This study is a design and construction project conceived to
                                                                         Materials and tools
produce an FM transmitter free from the major technical
problems highlighted, but of appreciable range for practical             The materials and tools that were used for the design and
application. The design of this FM transmitter will                      construction of FM transmitter include: copper laminate plate
incorporate, at the output stage, the very high frequency                Gross paint (Resis), Nitric acid menthylene chloride,
(VHF) power transistor no 2c 1971 (NTE343) which has                     detergently electric technician knife, soldering iron (40-watts)
produced excellent results in other circuits.                            alloy lead, file halksaw pliers, etc.
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      International Journal of Applied Engineering Research ISSN 0973-4562 Volume 12, Number 18 (2017) pp. 7516-7523
                                  © Research India Publications. http://www.ripublication.com
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     International Journal of Applied Engineering Research ISSN 0973-4562 Volume 12, Number 18 (2017) pp. 7516-7523
                                 © Research India Publications. http://www.ripublication.com
    until it vanishes and reappeared at the initial side. The            Drilling of Holes
    process of turning and rubbing stopped when the mixture
                                                                         Holes were drilled to produce openings through the printed
    was completely absorbed and could not significantly
                                                                         circuit board in order to form electric connections between
    appear on either side.
                                                                         conducting pathways. The holes were drilled in such ways
When the mixture disappeared from either side, the silk was              than only one conductor’s lead or wire passes through.
   allowed to dry thoroughly for about 30 minutes. The
                                                                         Reference designation: Components generally were inserted
   terms coating and curling are used to describe the
                                                                         opposite copper side so that their terminals would not bridge
   vanishing and reappearing of the mixture at both sides of
                                                                         or short circuit. To show the position each component enters;
   the mesh. It was done under a shade so that light rays did
                                                                         reference designation was drawn opposite copper surface to
   it fall on it.
                                                                         correspond with the circuitry opposite.
(2) Screening: The film (the bold black master print pattern)
                                                                         Component layout: The design of electronic circuit wiring
    was be placed on the silk. The transparent glass,
                                                                         takes into account, most importantly, component placement,
    rectangular in shape, was placed under the silk directly
                                                                         wiring density and the functional performance of the entire
    opposite the film. The entire arrangement constitutes the
                                                                         system the parts and component of this design were carefully
    assembly. The assembly was brought to reach the degree
                                                                         spaced to provide even diagram balance between blank spaces
    of polymerization was dependent on the light intensity.
                                                                         and lines. Enough spaces were left in the area near symbol to
(3) Dispatch: After the thirty seconds count to the sun was              avoid crowding of reference information.
    certified, the assembly was carefully returned to the shade
                                                                         Resistor diodes, transistors and capacitor were inserted into
    and dispatched (de coupled).
                                                                         their reference designation using terminal and polarity
(4) Developing: After de-coupling the assembly, a foam was               identification techniques. All components were mounted
    dipped into clean water and squeezed into the mesh                   approximately 5mm above the panel and excess leads of wires
    repeatedly for three minutes. The foam was gently rubbed             were cut to about 2mm above the copper side surface. The
    on the silk so that a bright white line of the pattern               cutting or trimming of the excess leads was done after
    showed up.                                                           soldering has been completed.
(5) Having ascertain the appearance of the film (on the silk)            The researcher must take certain precautions when inserting
    water was poured continuously on both sides of the silk.             components into holes. These precautions according to Cole
    After a while the foam was rubbed on the wetted side,                (1988) include:
    and the appearance of the pattern increased. This
                                                                            1) Mastery of resistors colour codes to ensure that the
    recycling event continued until the entire printed circuit
                                                                               desired values of resistors will be fitted to their correct
    diagrammatic pattern was fully cured the silk was
                                                                               reference designation.
    allowed to dry completely.
                                                                            2) Mastery of non-electrolytic colour coded capacitors in
(6) When the mesh had completely dried, a proportionate
                                                                               order to be able to interpret the decimal numbers.
    amount of ink called sticker ink was poured on the coated
    side of the mesh. The resist coated copper surface was                  3) Ensure that transistors are fitted correctly.
    placed opposite directly under the coated csilk on a flat
                                                                            4) Mount the power transistors on heat sink. The function
    surface. The ink was run evenly along the silk with
                                                                               of the heat sink is to remove dissipated heat from the
    plastic materials, then the diagrammatic pattern appeared
                                                                               transistors to avoid thermal run away.
    unto the resist copper side and the silk was removed to
    dry the board completely. Initially the copper side surface             5) Note the position of the pins and sign for the ICS.
    was coated with a gray coloured resist material. An                  Soldering procedure: Every component inserted on the
    electricians knife was used to remove to the resist                  printed circuit board PCB were carefully and neatly soldered
    material from areas not covered with the conductor                   to avoid being pulled out. The soldering iron was allowed to
    routing imaged pattern.                                              heat properly to ensure quick melting of the alloy (60/40)
(7) Finally, the board was thoroughly washed with detergent              lead. A 40 watt soldering iron was used to avid overheating
    and rinsed with much water then allowed to dry                       the components. Soft soldering was used because it is more
    completely. It was then ready for etching.                           suitable for light points in steel, copper, brass and electronics
                                                                         works. It is not used were much strength is required or in
Removing resist: The purpose of the resist coating is to
                                                                         cases where the point will be subjected to vibrations or heat,
prevent the circuit pattern on the board from being removed
                                                                         as the solder is comparatively weak and has low melting point
by the nitric acid. The resist will be completely removed from
                                                                         (Chapman, 1988).
the surface easily and quickly by applying methylence
chloride solution.
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                                    © Research India Publications. http://www.ripublication.com
Casing (Cabinet) Construction                                              used to mark out the layout tracks unto the surface of the
                                                                           board. The result is neat and precise artwork which, when
Several materials can be used for constructing the case of an
                                                                           etched gives very professional finish.
FM transmitter both for commercial and instructional
purposes, but sheet metal was adopted for this project.                    The first step in process of etch-resist transfer is
                                                                           screening/firming. The following materials were used at this
Technical and aesthetic consideration guided the choice of
                                                                           stage, - seteier, emulsion, transparent glass, hard book, foam
material for the cabinet. Since the production of electronic
                                                                           water, mesh silk and sunlight. The following sequence was
systems demand the application of different kinds of primary
                                                                           carefully applied to assure quality transfer of the master
inputs a skilled sheet metal technicians at Government to
                                                                           printed circuit pattern to the copper surface. Seteizer and
science technical college Abuja produced the cabinet. The
                                                                           emulsion were mixed and poured on the silk. A smooth flat
researchers however, submitted the specification (250 x 200 x
                                                                           piece of plastic was used to rub the mixture repeatedly on the
150).
                                                                           silk until the mixture had vanished from this side.
Testing techniques                                                         The mixture reappeared on the opposite side and turning that
                                                                           side and using the material, the mixture was run gently along
Every new assembly requires testing before it can be
                                                                           this side until it vanished and reappeared at the initial side.
connected to the power supply in order to ensure that it will
                                                                           The process of turning and rubbing was stopped when the
function correctly and safely (IEE Regulation, 1988).
                                                                           mixture was completely absorbed and could not significantly
   1.    The following tests were carried out on this device.              appear on either side. After coating and curling (vanishing and
   2.    Continuity test is required to detect all section that            reappearing of the mixture) the silk was allowed to dry
         have open circuits.                                               thoroughly for thirty (30) minutes.
   3.    Polarity test is required to ensure that every live               In the screening, the film was placed on the silk. The
         terminals are done in such a way that there is no                 transparent glass, rectangular in shape was placed over the
         bridge between the terminals.                                     film, and the hard book was placed under the silk directly
In this chapter, the required tools and materials have been                opposite the film. The entire arrangement known as assembly
presented. The components have been listed with the design                 was then brought under sun light for the film exposure. The
calculations of some of these component carried out to                     exposure time required to reach the degree of polymerization
ascertain their performances in the circuit. The fabrication ahs           was dependent on the light intensity.
been explained with emphasis on printed circuit board and                  After the exposure the assembly was decoupled ready for
soldering techniques.                                                      developing. In developing, a foam was dipped into clean
                                                                           water and squeezed unto the mesh repeatedly for three
Fabrication and testing                                                    seconds. The foam was gently rubbed on the silk so that a
In this chapter, the description of the procedures leading to the          bright white line of the pattern shown up. Having ascertained
construction of an FM transmitter is given. Brief explanation              the appearance of the film, water, was poured continuously on
on the manufacture of printed circuit board starting from                  both sides of the silk. After a while the foam was rubbed on
circuit diagrammatic pattern (artwork) to etching has been                 the wet side to increase the appearance of the pattern. This
presented. Many testing procedures required for effective                  recycling event continued until the entire printed circuit
operation of this project beginning from continuity test to                diagrammatic pattern was fully cured. The silk was allowed to
transmitter range test have been outlined.                                 dry completely.
                                                                           When the mesh had completely dried, a proportionate amount
Printed circuit board                                                      of ink called sticker ink was poured on the coated side of the
Of all the construction steps that this project demand, printed            mesh. The resist copper surface was placed opposite directly
circuit board required the greatest amount of thinking and skill           under the coated skill on flat surface. The ink was ran evenly
in its preparation. Small-scale production can be achieved by              along the silk with the plastic material, then the diagrammatic
following the procedures outlined.                                         pattern appeared unto the resist copper side. Then the silk was
                                                                           removed and the copper side surface was dried completely.
To produce the layout diagram and the pcb artwork is perhaps               Copper resist was removed from surplus copper with
the most difficult of this method of construction. The                     electrician knives. Finally, the board was thoroughly washed
development of the template for the printed bard was achieved              with detergent and dried ready for etching. Etching is the
through series of careful design of electrical circuit.                    process of removing excess copper from the board. Nitric acid
Several methods are used to transfer the artwork onto the                  was used because it dissolves copper quickly.
surface of the board for example etch-resist pen, etch resist
transfers and photographic method. Etch resist transfers is
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     International Journal of Applied Engineering Research ISSN 0973-4562 Volume 12, Number 18 (2017) pp. 7516-7523
                                 © Research India Publications. http://www.ripublication.com
Component designation fault                                               that it did not fall. Soldering is one important factor in
                                                                          electronics systems design which if poorly done can
Component designation fault existed on the circuit as shown
                                                                          undermine the operation of the system. Therefore, the
in the diagram and thus lead to wrong positioning of the
                                                                          soldering processing was carried carefully to ensure good
component.
                                                                          system performance.
Component designation
                                                                          Transistor Testing
Component designation faults with respect to transistor Q 2
                                                                          When constructing this FM transmitter testing was carried out
and Q2 existed on the circuit as shown in fig 4 and this lead to
                                                                          on the transistors before, they were soldered on the printed
wrong positioning of the two transistors on the printed circuit
                                                                          circuit board. The conditions of the transistors needed to be
board. According to this component designation fault, the
                                                                          verified because brand transistor like any other semi-
population process swapped the collector and emitter
                                                                          conductor device could be faulty from the shelf. Many
terminals of these transistors. As a result, these transistors
                                                                          techniques technologist and engineers have complained that
were wrongly biased in such a way that their emitters were at
                                                                          the new ic or transistor that they had fitted into a circuit was
the highest potential followed by their base with the collectors
                                                                          faulty. With the transistor out of the circuit, the two-diode
at the lowest potentials. The emitter/base junctions were
                                                                          junctions of the transistors were checked with digital
reverse biased while collector/base functions were forward
                                                                          multimeter. For an NPN transistor, the test was as follows:
biased causing very poor system performance. This was
                                                                          the positive lead of the ohmmeter was connected to the base
against the conventional biasing mode which is emitter/base
                                                                          and the negative (common) lead was connected to the emitter.
junction forward biased, and collector based junction reverse
                                                                          This forward biased the base/emitter junction, and the
biased for NPN transistor.
                                                                          ohmmeter recorded low reading. The negative terminal was
                                                                          then connected to the collector. This forward biased the
Soldering
                                                                          base/collector junction and the ohmmeter recorded low
Soldering exercise carried out with 40watt soldering iron was             reading. Then the ohmmeter reverse biased the two junction
performed with due regard to safety. Before starting to solder            and both junctions read high. If one of the junctions read low
the bit of the soldering iron was cleaned when hot by wiping it           in both conditions the junctions was shorted. If ohmmeter
across a wet sponge or fine abrasive paper. Melting some                  recorded high reading in both reverse and forward bias
solder onto the bit (known as tinning) and wiping that off in             condition then the junction was open circuit and the transistor
the sponge helps this cleaning process as solder contains cores           was bad.
of flux, which is a cleaning agent.
                                                                          Next, reading was made between the collector and emitter, the
For a successful result, all parts of the board to be soldered            meter leads were reverse to make a second reading. Both of
were dry and free from dirt and grease. A hot soldering iron              these readings should be high. If not, the transistor had a
was used to produce good solder joints. The joints were made              collector emitter junction short circuit short and was replaced.
hot but not too hot to overheat it as overheating can cause               If the terminals were unknown, the base terminal was found
damage. The soldering iron was placed so that it was touching             by identifying which had a low reading in relation to the other
both the lead to be soldered and the copper track to which it             two terminals. This terminal was the base. If the low readings
was to be joined. After a few-seconds the solder was applied              were caused by the base being positive, the transistor was
to the track to melt and flow up around the base of lead                  NPN. If the low readings were caused by base being negative,
forming a wedge. Solder flow cold to hot and therefore if                 the transistor was PNP.
either the lead or track was cold, solder would not flow and
dry which would result. According to Kavacs (1989), a dry                 Continuity Test
joint is one which has failed to bond sufficiently strongly with
                                                                          When all the components had been soldered on the printed
the copper track and as a result it provides a poor conducting
                                                                          circuit board (PCB) continuity test was carried out before the
path for current. The dry joints were put right by applying a
                                                                          connecting the system to power supply. The test revealed
clean soldering iron to the joint and leaving it long enough for
                                                                          open circuit faults, which could be due to:
it to melt the solder so that it flows properly.
                                                                              1.   A break in the circuit.
Apart from dry joints another problem encountered in the
soldering was solder bridges linking tracks. This happened                    2.   The failure of a component leading to it having an
when too much solder was applied to the joint and an adjacent                      unusually high resistance or.
track was heated at the same time as the joint, perhaps by
                                                                              3.   An increase in the insulation at certain points caused
using a soldering iron bit which was too large. The situation
                                                                                   by dirt, grease or corrosion.
was dealt with immediately as it occurred. Solder sucker was
used to remove the hot solder. Any component that has been                    4.   It also revealed that short circuit faults which were
picked and placed in the hole was soldered immediately so                          due to;
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                                  © Research India Publications. http://www.ripublication.com
     5.   The failure of a component leading to it having an                However, with the microphone feed resistor R1 removed the
          abnormally low resistance.                                        circuit has been operating efficiently with omni-directional
                                                                            dynamic microphone without any damage. The circuit in this
     6.   The touching of uninsulated parts of the component
                                                                            condition neither worked nor burnt the unidirectional
          terminal
                                                                            microphone.
     7.   The effects of moisture lying between conducting
          paths which create links of lower resistance than the             Transmitter Range Testing
          component or.
                                                                            Transmitter range testing involved the process required to
     8.   Solder bridges between the terminals.                             determine the distance from transmitter its signal will be
                                                                            received. This test required a radio receiver with FM band, a
Static test
                                                                            cassette player or an assistant producing direct audio that will
As soon as this project was connected to power supply, the                  be feed into the microphone. The test also requires an antenna
static test involving transistor terminal voltage readings was              installation described below. The transmitter, cassette player
carried out before AC signal was injected into the circuit. A               and radio receiver were switched on simultaneously. The
tpical static test for transistor Q1 was as follows.                        radio receiver set to FM band was tuned gradually to capture
                                                                            the main frequency then moved away from the transmitter to
VC        Collector voltage with respect to region = 8v
                                                                            the farthest point signal could be received.
VB        base voltage with respect to ground = 1.7v
                                                                            Ballun
VE        emitter voltage with respect to ground = 1.0
                                                                            Balanced and unbalanced transformer is necessary because the
In addition to the biasing conditions, the static test also
                                                                            output of this FM transmitter is an unbalanced impendence of
revealed faults such as open circuit and short circuits in
transistors and other semi-conductor components.                            75 which is to be coupled to an antenna of 300 impendence
                                                                             (Patric 2003). The BALLUN a 1:4 balanced and
Power supply                                                                unbalanced transformer, is therefore required for efficient
                                                                            coupling. All the coaxial cable joints to the transmitter and
The process of construction and testing of this project showed              BALLUN were carefully made to avoid short circuit or open
that the most suitable power supply for the efficient operation             circuit faults that will undermine the performance of this
of this transmitter is the 12 volt lead acid battery. This source           transmitter.
of power supply is completely free from AC ripples that cause
electrical noise especially in oscillation circuits. An
alternative source of power supply is the highly regulated and              CONCLUSION
efficiently filtered power pack circuit which is costly.
                                                                            So, far the test result of this project which is the outcome of
The circuit for this project consists of track-etched inductor              construction procedures has revealed the successful
whose reactance is determined by voltage level. Any change                  achievement of the primary objective; the design and
in this voltage level as a result of ripples or fluctuations                construction of an FM transmitter of appreciable range
existing in the power supply is converted to equipment                      operating on 12v power supply. Because of the impressive
change in the inductive reactance. This change in inductive                 good result, obtained from the usability test, the FM
reactance is converted by the circuit to variation or drift in              transmitter is now ready for either instructional or
oscillation frequency of the transmitter. In the initial test,              entrepreneur purposes. The successful completion of this
when the transmitter was connected to ordinary 12v power                    study has indicated that practical FM transmitter requiring low
supply consisting of transformer rectifier and filter circuit, its          power input can be designed and constructed.
output was seriously affected by frequency drift and electrical
noise.
                                                                            RECOMMENDATIONS
Microphone connection
                                                                            In view of the handicap suffered by the researchers in effort to
Microphone converts sound energy to electrical energy for                   conduct this project successfully, and the general findings, the
further processing by the circuit. In this project, the                     following recommendations are hereby made.
microphone is connected to coupling compactor C1 to feed
modulating signal to the base of the transistor Q1. With the                    1.   Students of Industrial Technical Educational and
microphone feed resistor R1 retained, the circuit worked with                        other related technical programs should be
only undirectional microphones many of which were burnt                              encouraged to undertake design and construction
each within a few hours of usage. The circuit only burnt but                         projects to enhance the technological development of
did not work with omni-directional dynamic microphone.                               Nigeria.
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                                    © Research India Publications. http://www.ripublication.com
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