DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, halfpage

M3D119

1N4001ID to 1N4007ID
Rectifiers
Product specification 1996 Jun 10
Supersedes data of April 1992
File under Discrete Semiconductors, SC01
Philips Semiconductors Product specification

Rectifiers 1N4001ID to 1N4007ID

FEATURES DESCRIPTION This package is hermetically sealed

and fatigue free as coefficients of
• Glass passivated Cavity free cylindrical glass package
expansion of all used parts are
• High maximum operating through Implotec(1) technology.
matched.
temperature
(1) Implotec is a trademark of Philips.
• Low leakage current
• Excellent stability
• Available in ammo-pack. handbook, 4 columns k a

MAM123

Fig.1 Simplified outline (SOD81) and symbol.

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRRM repetitive peak reverse voltage
1N4001ID − 50 V
1N4002ID − 100 V
1N4003ID − 200 V
1N4004ID − 400 V
1N4005ID − 600 V
1N4006ID − 800 V
1N4007ID − 1000 V
VR continuous reverse voltage
1N4001ID − 50 V
1N4002ID − 100 V
1N4003ID − 200 V
1N4004ID − 400 V
1N4005ID − 600 V
1N4006ID − 800 V
1N4007ID − 1000 V
IF(AV) average forward current averaged over any 20 ms − 1.00 A
period; Tamb = 75 °C; see Fig.2
averaged over any 20 ms − 0.75 A
period; Tamb = 100 °C; see Fig.2
IFRM repetitive peak forward current − 10 A
IFSM non-repetitive peak forward current half sinewave; 60 Hz − 20 A
Tstg storage temperature −65 +175 °C
Tj junction temperature −65 +175 °C

1996 Jun 10 2
Philips Semiconductors Product specification

Rectifiers 1N4001ID to 1N4007ID

ELECTRICAL CHARACTERISTICS
Tj = 25 °C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MAX. UNIT

VF forward voltage IF = 1 A; see see Fig.3 1.1 V
VF(AV) full-cycle average forward voltage IF(AV) = 1 A 0.8 V
IR reverse current VR = VRmax 10 µA
VR = VRmax; Tamb = 100 °C 50 µA
IR(AV) full-cycle average reverse current VR = VRRMmax; Tamb = 75 °C 30 µA

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 60 K/W
Rth j-a thermal resistance from junction to ambient note 1 120 K/W
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.4.
For more information please refer to the “General Part of Handbook SC01”.

1996 Jun 10 3
Philips Semiconductors Product specification

Rectifiers 1N4001ID to 1N4007ID

GRAPHICAL DATA

MBH386 MBH385
1.5 10
handbook, halfpage handbook, halfpage

IF
(A) IF
(A)
1

0.5

(1) (2) (3)

0 10−1
0 100 Tamb (°C) 200 0 0.5 1 VF (V) 1.5

(1) Tamb = 100 °C.

(2) Tamb = 20 °C.
(3) Tamb = −50 °C.

Fig.2 Maximum forward current as a function of Fig.3 Forward current as a function of forward
ambient temperature. voltage; typical values.

50
handbook, halfpage
25

7
50

MGA200

Dimensions in mm.

Fig.4 Device mounted on a printed-circuit board.

1996 Jun 10 4
Philips Semiconductors Product specification

Rectifiers 1N4001ID to 1N4007ID

PACKAGE OUTLINE

handbook, full pagewidth

5 max

0.81
max

2.15 MBC051
max 28 min 3.8 max 28 min

Dimensions in mm.

Fig.5 SOD81.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Jun 10 5