VNP10N07

”OMNIFET”:
FULLY AUTOPROTECTED POWER MOSFET
TYPE V clamp R DS(on) I l im
VNP10N07 70 V 0.1 Ω 10 A

■ LINEAR CURRENT LIMITATION

■ THERMAL SHUT DOWN
■ SHORT CIRCUIT PROTECTION
■ INTEGRATED CLAMP
■ LOW CURRENT DRAWN FROM INPUT PIN
■ DIAGNOSTIC FEEDBACK THROUGH INPUT 3
PIN 2
1
■ ESD PROTECTION
■ DIRECT ACCESS TO THE GATE OF THE
TO-220
POWER MOSFET (ANALOG DRIVING)
■ COMPATIBLE WITH STANDARD POWER
MOSFET
■ STANDARD TO-220 PACKAGE

DESCRIPTION
The VNP10N07 is a monolithic device made current limitation and overvoltage clamp protect
using SGS-THOMSON Vertical Intelligent Power the chip in harsh enviroments.
M0 Technology, intended for replacement of Fault feedback can be detected by monitoring the
standard power MOSFETS in DC to 50 KHz voltage at the input pin.
applications. Built-in thermal shut-down, linear

BLOCK DIAGRAM

April 1996 1/11

VNP10N07

ABSOLUTE MAXIMUM RATING

Symbol Parameter Value Unit
V DS Drain-source Voltage (V in = 0) Internally Clamped V
V in Input Voltage 18 V
ID Drain Current Internally Limited A
IR Reverse DC O utput Current -14 A
V esd Electrostatic Discharge (C= 100 pF , R=1.5 KΩ) 2000 V
P to t Total Dissipation at T c = 25 o C 50 W
o
Tj Operating Junction T emperature Internally Limited C
o
Tc Case Operating T emperature Internally Limited C
o
T st g Storage Temperature -55 to 150 C

THERMAL DATA
o
R t hj-ca se Thermal Resistance Junction-case Max 2.5 C/W
o
R t hj- amb Thermal Resistance Junction-ambient Max 62.5 C/W

ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)

OFF
Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
V CLAMP Drain-source Clamp I D = 200 mA V in = 0 60 70 80 V
Voltage
V CL TH Drain-source Clamp I D = 2 mA V in = 0 55 V
Threshold Voltage
V I NCL Input-Source Reverse I in = -1 mA -1 -0.3 V
Clamp Voltage
I DSS Zero Input Voltage V DS = 13 V V in = 0 50 µA
Drain Current (V in = 0) V DS = 25 V V in = 0 200 µA
I I SS Supply Current from V DS = 0 V Vin = 10 V 250 500 µA
Input Pin

ON (∗)
Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
V IN(th) Input Threshold V DS = Vin ID + Ii n = 1 mA 0.8 3 V
Voltage
R DS( on) Static Drain-source On V i n = 10 V ID = 5 A 0.1 Ω
Resistance Vi n = 5 V ID = 5 A 0.14 Ω

DYNAMIC
Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
g fs (∗) Forward V DS = 13 V ID = 5 A 6 8 S
Transconductance
C oss Output Capacitance V DS = 13 V f = 1 MHz Vin = 0 350 500 pF

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 VNP10N07

ELECTRICAL CHARACTERISTICS (continued)

SWITCHING (∗∗)
Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
t d(on) Turn-on Delay Time V DD = 15 V Id = 5 A 50 100 ns
tr Rise Time V gen = 10 V R gen = 10 Ω 80 160 ns
t d(of f) Turn-off Delay Time (see figure 3) 230 400 ns
tf Fall T ime 100 180 ns
t d(on) Turn-on Delay Time V DD = 15 V Id = 5 A 600 900 ns
tr Rise Time V gen = 10 V R gen = 1000 Ω 0.9 2 µs
t d(of f) Turn-off Delay Time (see figure 3) 3.8 6 µs
tf Fall T ime 1.7 2.5 µs
(di/dt) on Turn-on Current Slope V DD = 15 V ID = 5 A 60 A/µs
V i n = 10 V R gen = 10 Ω
Qi Total Input Charge V DD = 12 V ID = 5 A V in = 10 V 30 nC

SOURCE DRAIN DIODE

Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
V SD (∗) Forward O n Voltage I SD = 5 A V in = 0 1.6 V
t r r (∗∗) Reverse Recovery I SD = 5 A di/dt = 100 A/µs 125 ns
Time V DD = 30 V Tj = 25 oC
Q r r (∗∗) Reverse Recovery (see test circuit, figure 5) 0.3 µC
Charge
I RRM (∗∗) Reverse Recovery 4.8 A
Current

PROTECTION
Symb ol Parameter Test Cond ition s Min. Typ . Max. Un it
I lim Drain Current Limit V i n = 10 V VDS = 13 V 7 10 14 A
Vi n = 5 V V DS = 13 V 7 10 14 A
t dl im (∗∗) Step Response V i n = 10 V 20 30 µs
Current Limit Vi n = 5 V 50 80 µs
o
T jsh (∗∗) Overtemperature 150 C
Shutdown
o
T j rs (∗∗) Overtemperature Reset 135 C
I gf (∗∗) Fault Sink Current V i n = 10 V VDS = 13 V 50 mA
Vi n = 5 V V DS = 13 V 20 mA
E as (∗∗) Single Pulse starting T j = 25 o C V DD = 20 V 0.4 J
Avalanche Energy V i n = 10 V R gen = 1 KΩ L = 10 mH
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(∗∗) Parameters guaranteed by design/characterization

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VNP10N07

PROTECTION FEATURES

During normal operation, the Input pin is - OVERTEMPERATURE AND SHORT CIRCUIT
electrically connected to the gate of the internal PROTECTION: these are based on sensing
power MOSFET. The device then behaves like a the chip temperature and are not dependent on
standard power MOSFET and can be used as a the input voltage. The location of the sensing
switch from DC to 50 KHz. The only difference element on the chip in the power stage area
from the user’s standpoint is that a small DC ensures fast, accurate detection of the junction
current (Iiss) flows into the Input pin in order to temperature. Overtemperature cutout occurs at
supply the internal circuitry. minimum 150oC. The device is automatically
The device integrates: restarted when the chip temperature falls
- OVERVOLTAGE CLAMP PROTECTION: below 135oC.
internally set at 70V, along with the rugged - STATUS FEEDBACK: In the case of an
avalanche characteristics of the Power overtemperature fault condition, a Status
MOSFET stage give this device unrivalled Feedback is provided through the Input pin.
ruggedness and energy handling capability. The internal protection circuit disconnects the
This feature is mainly important when driving input from the gate and connects it instead to
inductive loads. ground via an equivalent resistance of 100 Ω.
- LINEAR CURRENT LIMITER CIRCUIT: limits The failure can be detected by monitoring the
the drain current Id to Ilim whatever the Input voltage at the Input pin, which will be close to
pin voltage. When the current limiter is active, ground potential.
the device operates in the linear region, so Additional features of this device are ESD
power dissipation may exceed the capability of protection according to the Human Body model
the heatsink. Both case and junction and the ability to be driven from a TTL Logic
temperatures increase, and if this phase lasts circuit (with a small increase in RDS(on)).
long enough, junction temperature may reach
the overtemperature threshold Tjsh.

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 VNP10N07

Thermal Impedance Derating Curve

Output Characteristics Transconductance

Static Drain-Source On Resistance vs Input Static Drain-Source On Resistance

Voltage

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VNP10N07

Static Drain-Source On Resistance Input Charge vs Input Voltage

Capacitance Variations Normalized Input Threshold Voltage vs

Temperature

Normalized On Resistance vs Temperature Normalized On Resistance vs Temperature

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 VNP10N07

Turn-on Current Slope Turn-on Current Slope

Turn-off Drain-Source Voltage Slope Turn-off Drain-Source Voltage Slope

Switching Time Resistive Load Switching Time Resistive Load

7/11
VNP10N07

Switching Time Resistive Load Current Limit vs Junction Temperature

Step Response Current Limit Source Drain Diode Forward Characteristics

8/11
 VNP10N07

Fig. 1: Unclamped Inductive Load Test Circuits Fig. 2: Unclamped Inductive Waveforms

Fig. 3: Switching Times Test Circuits For Fig. 4: Input Charge Test Circuit
Resistive Load

Fig. 5: Test Circuit For Inductive Load Switching Fig. 6: Waveforms

And Diode Recovery Times

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VNP10N07

TO-220 MECHANICAL DATA

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.067
F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409
L2 16.4 0.645
L4 13.0 14.0 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.2 6.6 0.244 0.260
L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
E
A

D
C

D1

L2
F1

G1

H2
G

Dia.
F
F2

L5
L9
L7

L6 L4
P011C

10/11
 VNP10N07

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.

 1996 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved

SGS-THOMSON Microelectronics GROUP OF COMPANIES

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.

11/11
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