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Semiconductor Basics Guide

The document discusses semiconductor devices and diodes. It explains that semiconductors have electrical properties between conductors and insulators. A PN junction is formed when a P-type and N-type semiconductor are joined, creating a depletion region. When forward biased, current can flow through the junction, while reverse bias prevents current. The maximum reverse voltage a diode can withstand before breakdown is the breakdown voltage.

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0% found this document useful (0 votes)
10 views32 pages

Semiconductor Basics Guide

The document discusses semiconductor devices and diodes. It explains that semiconductors have electrical properties between conductors and insulators. A PN junction is formed when a P-type and N-type semiconductor are joined, creating a depletion region. When forward biased, current can flow through the junction, while reverse bias prevents current. The maximum reverse voltage a diode can withstand before breakdown is the breakdown voltage.

Uploaded by

vj hernandez
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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1

We always ask if there’s still


hope left or if there’s still time.
But we never realize that hope
only leaves when we doubt
and time only runs out
the moment we give up.
Solid State 3

Devices
• Operates by virtue of the
movement of electrons with
solid piece of semiconductor
material
4

Electrical Classification of Materials

• Conductor
• Insulator
• Semiconductor

Conductor
5
Conductor 6

• A material with LESS THAN 4


VALENCE ELECTRONS.
• Copper (Cu), Silver (Ag), Gold
(Au) and Aluminum (Al)

Insulator
7

Materials Conductivity

• Silver 63.01 x 106 S/m


• Copper 59.60 x 106 S/m
• Gold 45.20 x 106 S/m
• Aluminum 37.80 x 106 S/m
• Iron 10.44 x 106 S/m
8

Insulator

• A material with MORE THAN 4


VALENCE ELECTRONS.
• glass, mica, hard rubber

Semiconductor
9

Semiconductor
• A material with EXACTLY 4 VALENCE
ELECTRONS.
• Semiconductors have electrical
characteristics in between conductors and
insulators.
• SILICON, GERMANIUM are examples of
semiconductor materials.

Energy Gap (Eg) Comparison


Energy Gap (Eg) Comparison
10

Bonding of Atoms
11

Energy Gaps
• Silicon 1.11 eV
• Germanium 0.67 eV
• Silicon Carbide 2.86 eV
• Aluminum Phosphide 2.45 eV
• Gallium Arsenide 1.43 eV
• Indium Phosphide 1.35 eV
12

Bonding of Atoms
• Ionic Bond
• Metallic Bond
• Covalent Bond

Ionic Bond
13

Ionic Bond

• Results from attractive forces


between positive and negative
ions or between pairs of
oppositely charged ions.

Metallic Bond
Metallic Bond
14

• Results from attractive forces


between a group of positive
ions and a sea of electrons that
are free to move about among
its ions.

Covalent Bonding
Covalent Bonding
15

• Results when atoms


SHARE THEIR
VALENCE ELECTRONS
with other atoms .
• The shared electrons
are attracted
simultaneously to two
atoms resulting in a
force that holds them
together.

Conduction in Semiconductors
16
17
Conduction in Semiconductors

• Electron current flow


• Hole current flow

Electron Flow
18

Electron Flow

Hole Flow
19

Hole Flow

Types of Semiconductor materials


Types of Semiconductor Materials 20

• Intrinsic Material
• A Semiconductor that is FREE FROM
IMPURITIES, such as Silicon or Germanium.

• Extrinsic Materials
• Semiconductor materials with SOME IMPURITIES
ADDED to change its electrical properties.
• The process of adding impurities is called DOPING.

Type of Extrinsic Materials


Type of Extrinsic Materials 21

• N-TYPE SEMICONDUCTORS
• An extrinsic semiconductor material formed by adding DONOR
impurities, such as as PENTAVALENT atoms.
• Majority carriers are ELECTRONS
• Minority carriers are HOLES

Type of Extrinsic Material


Type of Extrinsic Material 22

• P-TYPE SEMICONDUCTORS
• An extrinsic semiconductor material formed by adding
ACCEPTOR impurities, such as TRIVALENT atoms.
• Majority carriers are HOLES
• Minority carriers are ELECTRONS

Types of Dopes
Types of Dopes 23

• DONOR or PENTAVALENT ATOMS


• N-TYPE
• PHOSPOROUS
• ANTIMONY
• ARSENIC
• BISMUTH

• ACCEPTOR or TRIVALENT ATOMS


• P-TYPE
• GALLIUM • ALUMINUM
• BORON • INDIUM

Semiconductor Diodes
24

Semiconductor Diodes

The PN Junction
The PN Junction 25

• When the P-TYPE material and N-TYPE material


are BROUGHT TOGETHER, they form a so-called
PN JUNCTION.

Formation of Depletion Region


Formation of Depletion Region 26

• The region created by


the PN junction
forming a barrier
potential.
• The DEPLETION refers
to the fact that the
region near the PN
junction is DEPLETED
of CHARGED
CARRIERS due to
diffusion across the
junction.

Barrier Potential
27

Barrier Potential
• The POTENTIAL
DIFFERENCE of the
electric field across the
depletion region is the
AMOUNT OF VOLTAGE
required to move
electrons through the
electric field.
• 0.7V for Silicon
• 0.3 for Germanium
• Barrier potential
DECREASES as
temperature INCREASES

Biasing the Diode


28

Biasing the Diode


• BIAS refers to the use of a dc
voltage to establish a certain
operating condition for an electronic
device.
• Types:
• Forward Bias
• Reverse Bias

Forward Bias
Forward Bias
29

• Is the condition
that ALLOWS
CURRENT
THROUGH THE PN
JUNCTION to flow
when a dc voltage
is applied to a PN
junction

Reverse Bias
30

Reverse Bias
• Is the condition that
ESSENTIALLY PREVENTS
CURRENT through the
diode when a dc voltage
is applied to a PN
junction.
• MINORITY CARRIERS
• The EXTREMELY SMALL
CURRENT THAT EXIST IN
THE REVERSE BIAS
condition.

Breakdown Voltage
31
32

Breakdown Voltage
• The MAXIMUM VOLTAGE the junction
diode can handle when reverse
biased.
• Also known as PEAK REVERSE
VOLTAGE (PRV) OR PEAK INVERSE
VOLTAGE (PIV)

Voltage-Current Characteristic of Diode

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