STPS2L40

Datasheet

40 V, 2 A low drop power Schottky rectifier

Features
• Very small conduction losses
• Negligible switching losses
• Low forward voltage drop
• Surface mount miniature package
• Avalanche rated
• ECOPACK2 component

Applications
• Telecom power supply
• Set-top box power supply
• TV power supply
• Battery charger

Description
Single chip Schottky rectifiers designed for high frequency miniature switched mode
power supplies such as adaptors and on board DC/DC converters.
Packaged in SMB, SMA Flat, SMA Flat Notch and SMB Flat, the STPS2L40 is ideal
for surface mounting and used in low voltage, high frequency inverters, free wheeling
and polarity protection applications.
Product status

STPS2L40

Product summary

Symbol Value

IF(AV) 2A

VRRM 40 V

T j(max.) 150 °C

VF(typ.) 0.31 V

DS2146 - Rev 6 - September 2019 www.st.com

For further information contact your local STMicroelectronics sales office.
 STPS2L40
Characteristics

1 Characteristics

Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 40 V

SMB TL = 130 °C
Average forward current, δ = 0.5, square
IF(AV) SMB Flat TL = 140 °C 2 A
wave
SMA Flat, SMA Flat Notch TL = 130 °C

IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A

PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 158 W

Tstg Storage temperature range -65 to +150 °C

Tj Maximum operating junction temperature(1) +150 °C

1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.

Table 2. Thermal resistance parameter

Symbol Parameter Max. value Unit

SMB 20
SMB Flat 10
Rth(j-l) Junction to lead °C/W
SMA Flat 20
SMA Flat Notch 20

For more information, please refer to the following application note :

• AN5088 : Rectifiers thermal management, handling and mounting recommendations

Table 3. Static electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

Tj = 25 °C - 220 µA

IR(1) Reverse leakage current Tj = 100 °C VR = 40 V - 20 mA

Tj = 125 °C - 38 80 mA

Tj = 25 °C - 0.39
IF = 1 A
Tj = 125 °C - 0.25 0.28

Tj = 25 °C - 0.43
VF(1) Forward voltage drop IF = 2 A V
Tj = 125 °C - 0.31 0.34

Tj = 25 °C - 0.50
IF = 4 A
Tj = 125 °C - 0.39 0.45

1. Pulse test: tp = 380 µs, δ < 2%

To evaluate the conduction losses, use the following equation:

P = 0.22 x IF(AV) + 0.06 x IF2(RMS)

DS2146 - Rev 6 page 2/17

 STPS2L40
Characteristics

For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode

DS2146 - Rev 6 page 3/17

 STPS2L40
Characteristics (curves)

1.1 Characteristics (curves)

Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient
average forward current temperature (δ = 0.5) SMB

PF(AV)(W) IF(AV)(A)
1.2 2.2
Rth(j-a)=Rth(j-l)
SMB
δ = 0.1 δ = 0.2 2.0
δ = 0.5
1.0 δ = 0.05 1.8

1.6 Rth(j-a)=100°C/W

0.8 δ=1 1.4

1.2
0.6 1.0

0.8
0.4
0.6
T T
0.4
0.2
0.2
IF(AV)(A) δ=tp/T tp δ=tp/T tp Tamb (°C)
0.0
0.0
0 25 50 75 100 125 150
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8

Figure 3. Average forward current versus ambient Figure 4. Average forward current versus ambient
temperature (δ = 0.5, SMB Flat) temperature (δ = 0.5, SMA Flat, SMA Flat Notch)
IF(AV)(A) IF(AV)(A)
2.2 2.2
SMA Flat
Rth(j-a)=Rth(j-l) SMB Flat Rth(j-a)=Rth(j-l) SMA Flat Notch
2.0 2.0

1.8 1.8

1.6 Rth(j-a)=100°C/W 1.6 Rth(j-a)=200°C/W

1.4 1.4

1.2 1.2

1.0 1.0

0.8
0.8
0.6
0.6 T T
0.4
0.4
0.2
0.2 δ=tp/T tp Tamb (°C) δ=tp/T tp Tamb (°C)
0.0
0.0
0 25 50 75 100 125 150
0 25 50 75 100 125 150

DS2146 - Rev 6 page 4/17

 STPS2L40
Characteristics (curves)

Figure 5. Normalized avalanche power derating versus

pulse duration (Tj = 125 °C) Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
PARM (t p )
PARM (10 µs) Zth(j-a)/ Rth(j-a)
1 1.0
SMB
0.9

0.8

0.7
0.1 0.6

0.5

0.4

0.3
0.01
0.2
Single pulse
0.1
t p (s)
t p(µs) 0.0
0.001 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
1 10 100 1000

Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB flat) to ambient versus pulse duration (SMA Flat)
Zth(j-l) / Rth(j-l) Zth(j-a)/ Rth(j-a)
1.0 1.0
SMB Flat
0.9 0.9
SMA Flat / SMA Flat Notch

0.8 0.8
0.7 0.7
0.6 0.6
0.5 0.5
0.4 0.4
0.3 0.3
Single pulse
0.2 0.2
Single pulse
0.1 0.1
t p (s) t p (s)
0.0 0.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Figure 9. Reverse leakage current versus reverse voltage Figure 10. Junction capacitance versus reverse voltage
applied (typical values) applied (typical values)

IR(mA) C(pF)
1.E+02 1000
Tj = 125 °C F=1MHz
VOSC=30mVRMS
Tj=25°C
1.E+01

1.E+00

100

1.E-01
Tj = 25 °C

1.E-02

VR(V) V R (V)
10
1.E-03
1 10 100
0 5 10 15 20 25 30 35 40

DS2146 - Rev 6 page 5/17

 STPS2L40
Characteristics (curves)

Figure 11. Forward voltage drop versus forward current Figure 12. Forward voltage drop versus forward current
(high level) (low level)

IF(A) IF(A)
10.0 3.0

Tj=125°C
Tj=125°C 2.5 (maximum values)
(Maximum
(maximum values)
(Maximum

Tj=25°C
(maximum values) 2.0
Tj=125°C Tj=125°C
(typical values) (typical values)
1.0 1.5
Tj=25°C
(maximum values)
1.0

0.5
VF(V) VF(V)
0.1 0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.0 0.1 0.2 0.3 0.4 0.5 0.6

Figure 13. Thermal resistance junction to ambient versus Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMB) copper surface under each lead (SMB flat)

Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
200 200
Epoxy printed circuit board FR4, eCu = 35 µm SMB flat
Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm SMB

150 150

100 100

50 50

S(Cu)(cm²) SCu (cm²)

0 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA
Flat Notch)

Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA Flat
SMA Flat Notch

150

100

50

S(Cu)(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

DS2146 - Rev 6 page 6/17

 STPS2L40
Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

2.1 SMB package information

• Epoxy meets UL94, V0
• Lead-free package

Figure 16. SMB package outline

E1

A1

C A2

L b

DS2146 - Rev 6 page 7/17

 STPS2L40
SMB package information

Table 4. SMB package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Max. Min. Max.

A1 1.90 2.45 0.074 0.097

A2 0.05 0.20 0.001 0.008
b 1.95 2.20 0.076 0.087
c 0.15 0.40 0.005 0.016
D 3.30 3.95 0.129 0.156
E 5.10 5.60 0.200 0.221
E1 4.05 4.60 0.159 0.182
L 0.75 1.50 0.029 0.060

Figure 17. SMB recommended footprint

1.62 2.60 1.62

(0.064) (0.102) (0.064)

2.18
(0.086)

5.84
(0.230)

DS2146 - Rev 6 page 8/17

 STPS2L40
SMB Flat package information

2.2 SMB Flat package information

• Epoxy meets UL94, V0
• Lead-free package

Figure 18. SMB Flat package outline

A
c
D

L 2x

L1 2 x

E E1

L2 2 x

Table 5. SMB Flat mechanical data

Dimensions

Ref. Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.90 1.10 0.035 0.044

b 1.95 2.20 0.076 0.087
c 0.15 0.40 0.005 0.016
D 3.30 3.95 0.129 0.156
E 5.10 5.60 0.200 0.221
E1 4.05 4.60 0.159 0.182
L 0.75 1.50 0.029 0.060
L1 0.40 0.016
L2 0.60 0.024

DS2146 - Rev 6 page 9/17

 STPS2L40
SMB Flat package information

Figure 19. Footprint recommendations, dimensions in mm (inches)

1.20 3.44 1.20

(0.047) (0.136) (0.047)

2.07
(0.082)

5.84
(0.230)

millimeters
(inches)

DS2146 - Rev 6 page 10/17

 STPS2L40
SMA Flat package information

2.3 SMA Flat package information

• Epoxy meets UL94, V0
• Lead-free package

Figure 20. SMA Flat package outline

A
c
D

L 2x

L1 2 x

E E1

L
L2 2 x

b 2x

Table 6. SMA Flat package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Typ. Max. Min. Typ. Max.

A 0.90 1.10 0.035 0.044

b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.005 0.016
D 2.25 2.95 0.088 0.117
E 4.80 5.60 0.188 0.221
E1 3.95 4.60 0.155 0.182
L 0.75 1.50 0.029 0.060
L1 0.50 0.020
L2 0.50 0.020

DS2146 - Rev 6 page 11/17

 STPS2L40
SMA Flat package information

Figure 21. SMA Flat recommended footprint in mm (inches)

5.52
(0.217)

1.52
(0.060)

1.20 3.12 1.20

(0.047) (0.123) (0.047)
millimeter s
(inches)

DS2146 - Rev 6 page 12/17

 STPS2L40
SMA Flat Notch package information

2.4 SMA Flat Notch package information

• Epoxy meets UL94, V0
• Cooling method: by conduction (C)
• Band indicates cathode

Figure 22. SMA Flat Notch package outline

Table 7. SMA Flat Notch package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Typ. Max. Min. Typ. Max.

A1 0.90 1.10 0.035 0.044

A1 0.05 0.002
b 1.25 1.65 0.049 0.065
C 0.15 0.40 0.005 0.016
D 2.25 2.90 0.088 0.115
E 5.00 5.35 0.196 0.211
E1 3.95 4.60 0.155 0.182
G 2.00 0.079
G1 0.85 0.033
L 0.75 1.20 0.029
L1 0.45 0.018
L2 0.45 0.018
L3 0.05 0.002
V 8° 8°
V1 8° 8°

DS2146 - Rev 6 page 13/17

 STPS2L40
SMA Flat Notch package information

Figure 23. SMA Flat Notch recommended footprint in mm (inches)

1.20 3.12 1.20

(0.047) (0.123) (0.047)

1.52
(0.060)

5.52
(0.217)

DS2146 - Rev 6 page 14/17

 STPS2L40
Ordering Information

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty. Delivery mode

STPS2L40U GD4 SMB 0.107 g 2500 Tape and reel

STPS2L40UF FGD4 SMB Flat 0.050 g 5000 Tape and reel
STPS2L40AF F2L4 SMA Flat 0.035 g 10 000 Tape and reel
STPS2L40AFN A24 SMA Flat Notch 0.039 g 10 000 Tape and reel

DS2146 - Rev 6 page 15/17

 STPS2L40

Revision history

Table 9. Document revision history

Date Version Changes

Jul-2003 2A Last update.

31-Jan-2007 3 Reformatted to current standard. Added ECOPACK statement. Added SMBflat package.
18-Sep-2008 4 Reformatted to current standard. Updated ECOPACK statement. Added SMAflat package.
Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and
04-Dec-2018 5
Figure 5. Normalized avalanche power derating versus pulse duration (Tj = 125 °C).

27-Sep-2019 6 Added Section 2.4 SMA Flat Notch package information.

DS2146 - Rev 6 page 16/17

 STPS2L40

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DS2146 - Rev 6 page 17/17