Data Sheet: Self Tuned Radio (STR)
Data Sheet: Self Tuned Radio (STR)
DATA SHEET
TEA5762
Self Tuned Radio (STR)
Product specification 1999 Aug 04
Supersedes data of 1995 Jun 23
File under Integrated Circuits, IC01
Philips Semiconductors Product specification
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TEA5762H QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); SOT307-2
body 10 × 10 × 1.75 mm
1999 Aug 04 2
Philips Semiconductors Product specification
Notes
1. VCC1 = 3 V; VCC2 = 12 V; VDDD = 3 V; fi = 1 MHz; m = 0.3; fmod = 1 kHz; measured in Fig.9 with S1 in position A; S2
in position B; unless otherwise specified.
2. VCC1 = 3 V; VCC2 = 12 V; VDDD = 3 V; fi = 10.7 MHz; ∆fm = 22.5 kHz; fm = 1 kHz; measured in Fig.9 with S2 in
position A; S3 in position A; unless otherwise specified.
3. VCC1 = 3 V; VCC2 = 12 V; VDDD = 3 V; Vi3(L + R) = 155 mV; Vpilot = 15.5 mV; fi = 1 kHz; measured in Fig.9 with S2 in
position B; S3 in position B; unless otherwise specified.
1999 Aug 04 3
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1999 Aug 04
BLOCK DIAGRAM
Philips Semiconductors
Self Tuned Radio (STR)
FM-IFI2 DATA
WRITE- BUS-
FM-IFI1 FM-IFO1 ENABLE CLOCK IFGND FMDEM FSI
37 35 33 29 28 27 17 18 21
16
PILFIL
39 TUNER FM FM FM PILOT
FM-ON/OFF
SWITCH IF1 IF2 DETECTOR DETECTOR
MO/ST
24
19 kHz
12
LFI
VSTAB(A) 38 PLL
VSTAB(B) 34 VCO
AM/FM 9
7
VCC1 STATUS INDICATOR 38 kHz
SHIFT REGISTER
STABILIZER REGISTER
23 DECODER
VDDD
RIPPLE 1 up IN-LOCK stereo
down DETECTOR 14
AFLO
5 LAST-STATION level
COUNTI MATRIX
PRESCALER MEMORY
AFRO
4 15
stereo mono
FM SEQUENTIAL
4
CHARGE
PROGRAMMABLE AM CIRCUIT PUMP SDS 13
CGND MULTIPLEXER MUTE
COUNTER MUTE
hard mute level
25
XTAL
CRYSTAL WINDOW
AFC
26 OSCILLATOR DETECTOR
TEA5762
DGND 19
AFC(n)
20
AFC(p)
32
AFC
AM
2 AM AM AM AM V/I
AM-RFI FRONT AGC
OSCILLATOR MIXER IF DETECTOR CONVERTER
END
6 40 41 36 44 31 30 8 22 10 42 11 3 MBE815
Product specification
handbook, full pagewidth
TEA5762
AMOSC AM-MIXER AM-IFI/O2 AGC P1 P0 TUNE AFO RFGND MPXI RFGND
AM-IFI1 VCC2
PINNING
1999 Aug 04 5
Philips Semiconductors Product specification
39 FM-ON/OFF
36 AM-IFI/O2
38 VSTAB(A)
34 VSTAB(B)
35 FM-IFO1
42 RFGND
41 AM-IFI1
37 FM-IFI1
44 AGC
43 n.c.
RIPPLE 1 33 FM-IFI2
AM-RFI 2 32 AFC
RFGND 3 31 P1
CGND 4 30 P0
COUNTI 5 29 WRITE-ENABLE
TEA5762H
AMOSC 6 28 DATA
VCC1 7 27 BUS-CLOCK
TUNE 8 26 DGND
VCO 9 25 XTAL
AFO 10 24 MO/ST
MPXI 11 23 VDDD
LFI 12
MUTE 13
AFLO 14
AFRO 15
PILFIL 16
IFGND 17
FMDEM 18
AFC(n) 19
AFC(p) 20
FSI 21
VCC2 22
MBE820
1999 Aug 04 6
Philips Semiconductors Product specification
1999 Aug 04 7
Philips Semiconductors Product specification
To ensure that the search function operates correctly These three signals, together with the mono/stereo pin
under all conditions the following search sequence must (MO/ST; pin 24), communicate with the microcontroller.
be applied: The mono/stereo indicator has two functions, which are
• Store the current frequency in the memory controlled by the BUS-CLOCK, as shown in Table 2.
• Issue the search command
Table 2 Bus-clock functions
• Wait for data valid and read the new frequency
BUS-CLOCK MO/ST (PIN 24) RESULT
• If the new frequency is the same as the stored
frequency, issue a pre-set step (e.g. 50 kHz) and start LOW LOW stereo
the search sequence again. LOW HIGH mono
HIGH LOW tuned
Description of the bus
HIGH HIGH not tuned
The TEA5762 radio has a bus which consists of three
wires, as shown in Table 1.
The TEA5762 has a 25-bit shift register; see Table 3 for an
explanation of the shift register bits.
Table 1 Bus signals
If in search mode no transmitter can be found, all
SIGNAL DESCRIPTION PIN
frequency bits of the shift register are set to logic 0.
BUS-CLOCK software driven clock input 27
The bus protocol is depicted in Figs 3 and 4.
DATA data input/output 28
WRITE-ENABLE write/read-input 29
1999 Aug 04 8
Philips Semiconductors Product specification
Note
1. The given values for signal reception are
corresponding to a −3 dB point of 20 µV for FM.
1999 Aug 04 9
Philips Semiconductors Product specification
data read
BUS-CLOCK
DATA
data available
data available after search ready data shift MBE817
MSB is LOW
WRITE-ENABLE
BUS-CLOCK
DATA
MBE818
data shift data change
1999 Aug 04 10
Philips Semiconductors Product specification
BUS TIMING
WRITE-ENABLE
VIH
BUS-CLOCK
VIL
t HIGH t LOW
DATA
MBE819
t da
1999 Aug 04 11
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC1 supply voltage 0 13.2 V
Ptot total power dissipation Tamb = 70 °C − 250 mW
Tstg storage temperature −65 +150 °C
Tamb operating ambient temperature −15 +60 °C
Tj operating junction temperature −15 +150 °C
Ves electrostatic handling for all pins note 1 − ±200 V
Note
1. Charge device model; equivalent to discharging a 200 pF capacitor via a 0 Ω series resistor.
THERMAL CHARACTERISTICS
1999 Aug 04 12
Philips Semiconductors Product specification
CHARACTERISTICS
VCC1 = 3 V; Tamb = 25 °C; unless otherwise specified.
Note
1. Depending on band.
1999 Aug 04 13
Philips Semiconductors Product specification
AM CHARACTERISTICS
Input frequency = 1 MHz; m = 0.3; fmod = 1 kHz; measured in test circuit at pin 10 (see Fig.9); S2 in position B;
Vi1 measured at input of matching network at pin 2; matching network adjusted to maximum output voltage at low input
level; refer to test circuit (see Fig.9); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V10 AF output voltage Vi1 = 5 mV 36 45 70 mV
Vi1 RF sensitivity S/N = 26 dB 40 55 70 µV
Vil large signal voltage handling m = 0.8; THD ≤ 8% 150 300 − mV
capacity
PSRR power supply ripple rejection ∆V7 = 100 mV (RMS); − −47 − dB
V 10 100 Hz; V7 = 3.0 V
----------
∆V 7
FM-IF CHARACTERISTICS
Input frequency = 10.7 MHz; ∆f = 22.5 kHz; fmod = 1 kHz; measured in test circuit (see Fig.9) at pin 10; S2 in position B;
refer to test circuit (see Fig.9); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V10 AF output voltage Vi4 = 10 mV 40 48 57 mV
Vi4 IF limiting sensitivity V10 = −3 dB; V10 = 0 dB at − 50 80 µV
Vi4 = 10 mV
PSRR power supply ripple rejection ∆V7 = 100 mV (RMS); −44 − − dB
V 10 100 Hz; V7 = 3.0 V
----------
∆V 7
1999 Aug 04 14
Philips Semiconductors Product specification
TUNING CHARACTERISTICS
1999 Aug 04 15
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1999 Aug 04
Philips Semiconductors
Self Tuned Radio (STR)
handbook, full pagewidth (dBµV)
−20 0 20 40 60 80 100 120
10 9
THD
(dB)
(%)
0 8
(1)
−10 7
−20 6
−30 5
(2)
−40 4
16
−50 3
−60 (3) 2
−70 1
−80 0
10−7 10−6 10−5 10−4 10−3 10−2 10−1 Vi1 (V) 1
MBE853
Product specification
TEA5762
(1) Audio signal.
(2) Noise.
(3) Harmonic distortion.
Fig.6 AM mode.
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1999 Aug 04
Philips Semiconductors
Self Tuned Radio (STR)
handbook, full 0
pagewidth 20 40 60 80 100 (dBµV) 120
10 9
THD
(dB)
(1) (%)
0 8
(3)
−10 7
−20 6
(4)
−30 5
−40 4
(2)
−50 (5) 3
17
−60 2
(6)
−70 1
(7)
−80 0
10−6 10−5 10−4 10−3 10−2 10−1 Vi1 (V) 1
MBE854
Product specification
(3) Left channel with modulation left.
(4) Right channel with modulation left.
TEA5762
(5) Noise in stereo mode.
(6) Harmonic distortion ∆f = 75 kHz.
(7) Total harmonic distortion ∆f = 22.5 kHz.
Fig.7 FM mode.
Philips Semiconductors Product specification
INTERNAL CIRCUITRY
Table 8 Equivalent pin circuits and pin voltages
DC VOLTAGE
PIN SYMBOL (V) EQUIVALENT CIRCUIT
AM FM
1 RIPPLE 2.1 2.1 7
1 kΩ
1
3 kΩ 70 pF
17 MBE821
2 AM-RFI 0 0
2
MBE822
3 RFGND − −
4 CGND 0 0
5 COUNTI 0 0
4 MBE823
6 AMOSC 0 0
4 MBE824
1999 Aug 04 18
Philips Semiconductors Product specification
DC VOLTAGE
PIN SYMBOL (V) EQUIVALENT CIRCUIT
AM FM
8 TUNE − − 22
26 MBE825
1 kΩ
10 kΩ
MBE826
17
10
5 kΩ
MBE827
17
11
9.5 kΩ
MBE828
17
1999 Aug 04 19
Philips Semiconductors Product specification
DC VOLTAGE
PIN SYMBOL (V) EQUIVALENT CIRCUIT
AM FM
12 LFI 0.1 0.8
4 kΩ
12 13 kΩ
17 MBE829
7 kΩ 50 kΩ
13
17 MBE830
14
5 kΩ
17 MBE831
15
5 kΩ
17 MBE832
1999 Aug 04 20
Philips Semiconductors Product specification
DC VOLTAGE
PIN SYMBOL (V) EQUIVALENT CIRCUIT
AM FM
16 PILFIL 0.95 0.95
16
10 kΩ 10 kΩ
17 MBE833
17 IFGND 0 0
18 FMDEM − 1.0
180 Ω
18
910 Ω
17 MBE834
19 AFC(n) − −
20 AFC(p) − −
10 kΩ 10 kΩ
19/20
MBE835
21 FSI − − 1.4 V
40 kΩ
21
12 to 34 kΩ
(dependent on
bits 16 and 17)
26
MBE836
22 VCC2 − −
23 VDDD 3.0 3.0
1999 Aug 04 21
Philips Semiconductors Product specification
DC VOLTAGE
PIN SYMBOL (V) EQUIVALENT CIRCUIT
AM FM
24 MO/ST − −
100 Ω
24
26 MBE837
25 XTAL − −
50 kΩ 50 kΩ 50 kΩ
25
MBE838
26
26 DGND 0 0
27 BUS-CLOCK − −
27
26 MBE839
28 DATA − − 100 Ω
29 WRITE- − − 28
100 kΩ
ENABLE
50 kΩ
29
26 MBE840
1999 Aug 04 22
Philips Semiconductors Product specification
DC VOLTAGE
PIN SYMBOL (V) EQUIVALENT CIRCUIT
AM FM
30 P0 − −
23
120 Ω
100 kΩ
30
20 kΩ
26 MHA108
31 P1 − −
23
120 Ω
100 kΩ
31
20 kΩ
26 MHA109
32 AFC − −
34
20 kΩ
32
MBE842
33 FM-IF12 − 0.73
34
140 Ω
33
6 pF
2.2 kΩ
17 MBE843
1999 Aug 04 23
Philips Semiconductors Product specification
DC VOLTAGE
PIN SYMBOL (V) EQUIVALENT CIRCUIT
AM FM
34 VSTAB(B) 1.4 1.4
7
1 kΩ
1
34 MBE844
35 FM-IFO1 − 0.69
34
35 560 Ω
MBE845
36
3.6 kΩ 3.6 kΩ
MBE846
17
37 FM-IFI1 − 0.73
38
140 Ω
37
6 pF
1.9 kΩ
17 MBE847
38 MBE848
1999 Aug 04 24
Philips Semiconductors Product specification
DC VOLTAGE
PIN SYMBOL (V) EQUIVALENT CIRCUIT
AM FM
39 FM-ON/OFF − − 500 Ω
39
26 MBE849
38
MBE850
3 kΩ
41
7.5 kΩ 7.5 kΩ
MBE851
17
42 RFGND2 0 0
43 n.c. − −
44 AGC 0.1 0.7
1 kΩ 1 kΩ
1 kΩ
44
17 MBE852
1999 Aug 04 25
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1999 Aug 04
Philips Semiconductors
Self Tuned Radio (STR)
VSTAB(A)
FM front-end
Mitsumi FE415-G11
(6)
K1
OSC-OUT
150 Ω 150 Ω
IF-OUT VSTAB(B)
VCC
220 Ω
VTUNE (7)
K2 DATA
220 kΩ
(8)
GND WRITE- BUS- K3
AGC ENABLE CLOCK 100 nF
470
n.c. 150 kΩ
pF
ANT 37 35 33 29 28 27 17 18 21 VCC1
10 kΩ 39 2.2 µF
16
10 kΩ
68 kΩ
24
MO/ST
VSTAB(A) 38 470 nF
VSTAB(B) 34
VCC1 12 2.2 kΩ
7
10 Ω
100 nF 23 9 470 nF
100 1 68 kΩ
µF 50 kΩ
220 nF
(11) 12 nF
5
TEA5762
26
100 nF
14
AFLO
120 Ω
4 AFRO
15
(11) 100 nF
25
12 nF
75 kHz (10) 13
26 4.7 µF
GND 470 nF
19
TUNE
20
47 kΩ (9)
BB112
2 32
22 nF VSTAB(B)
L1 (1) 18 pF 6 40 41 36 44 31 30 8 22 10 11 3 L5 (5)
(2) 10 µF
L2 220 nF
(3)
18 pF (4) 470 nF
18 pF L3 10 nF 330 pF
(9)
BB112 L4 MBE816
470 pF P1 P0 TUNE VCC2
Product specification
47 kΩ VSTAB(A) VSTAB(B)
TEA5762
handbook, full pagewidth
TUNE
1999 Aug 04
Philips Semiconductors
Self Tuned Radio (STR)
DATA
50 Ω Vi4 330 Ω VSTAB(B) WRITE- BUS-
ENABLE CLOCK K2 (8)
VCC1
10.7 MHz 50 Ω (7)
K1 100 nF
1 nF
37 35 33 29 28 27 17 18 21 10 kΩ
2.2 µF
16
39 TUNER FM FM FM PILOT
FM-ON/OFF
SWITCH IF1 IF2 DETECTOR DETECTOR
MO/ST
24 470 nF
19 kHz
12 2.2 kΩ
B A
75 kHz 25
CRYSTAL WINDOW
(9) AFC 8.2 kΩ
26 OSCILLATOR DETECTOR
DGND TEA5762
470 nF
19
20
32 VSTAB(B)
(1)
L1
50 Ω Vi1 43 Ω 2
AM
AM AM AM AM V/I
FRONT
OSCILLATOR MIXER IF
AGC
DETECTOR CONVERTER L5 (5)
END
1 MHz 6.8 Ω 680 pF
6 40 41 36 44 31 30 8 22 10 11 3
(2) B
L2
S1 10 µF S2
18 pF
A B A
(4) 470 nF 10 nF
A S3 330 pF
18 pF L3
3 kΩ
L4 B 220 nF
(10) 50 Ω
220 µF Vi3
handbook, full pagewidth
Product specification
(3)
BB112
5 kΩ
Vi2 50 Ω
50 Ω MPXI
TEA5762
470 pF
VSTAB(A) 450 kHz
47 kΩ
VSTAB(B) P1 P0 TUNE VCC2
MBE814
1999 Aug 04 28
Philips Semiconductors Product specification
PACKAGE OUTLINE
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2
c
y
X
33 23
34 22 ZE
E HE
A A2 (A 3)
A1
wM
θ
bp
Lp
pin 1 index
L
44 12
detail X
1 11
wM ZD v M A
e bp
D B
HD v M B
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
95-02-04
SOT307-2
97-08-01
1999 Aug 04 29
Philips Semiconductors Product specification
1999 Aug 04 30
Philips Semiconductors Product specification
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE REFLOW(1)
BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2) suitable
PLCC(4), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(4)(5) suitable
SSOP, TSSOP, VSO not recommended(6) suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a s
3. older joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may
stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
1999 Aug 04 31
Philips Semiconductors – a worldwide company
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TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
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Middle East: see Italy Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Printed in The Netherlands 545002/02/pp32 Date of release: 1999 Aug 04 Document order number: 9397 750 06057