Tea5768hl 3
Tea5768hl 3
DATA SHEET
TEA5768HL
Low-power FM stereo radio for
handheld applications
Product specification 2004 Sep 13
Supersedes data of 2003 Nov 06
Philips Semiconductors Product specification
2004 Sep 13 2
Philips Semiconductors Product specification
1 FEATURES
• High sensitivity due to integrated low-noise RF input
amplifier
• FM mixer for conversion to IF of the US/Europe
(87.5 MHz to 108 MHz) and Japanese
(76 MHz to 91 MHz) FM band • Soft mute, SNC and HCC can be switched off via the
• Preset tuning to receive Japanese TV audio up to I2C-bus
108 MHz • Adjustment-free stereo decoder
• RF Automatic Gain Control (AGC) circuit • Autonomous search tuning function
• LC tuner oscillator operating with low cost fixed chip • Standby mode
inductors
• Two software programmable ports
• FM IF selectivity performed internally
• Bus enable line to switch the bus input and output lines
• No external discriminator needed due to fully integrated into 3-state mode.
FM demodulator
• Crystal reference frequency oscillator; the oscillator
2 GENERAL DESCRIPTION
operates with a 32.768 kHz clock crystal or with a
13 MHz crystal and with an externally applied 6.5 MHz The TEA5768HL is a single-chip electronically tuned FM
reference frequency stereo radio for low-voltage applications with fully
• PLL synthesizer tuning system integrated IF selectivity and demodulation. The radio is
completely adjustment-free and only requires a minimum
• I2C-bus
of small and low cost external components. The radio can
• 7-bit IF counter output via the I2C-bus be tuned to the European, US and Japanese FM bands.
• 4-bit level information output via the I2C-bus
• Soft mute
• Signal dependent mono to stereo blend [Stereo Noise
Cancelling (SNC)]
• Signal dependent High Cut Control (HCC)
3 ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TEA5768HL LQFP32 plastic low profile quad flat package; 32 leads; body 7 × 7 × 1.4 mm SOT358-1
2004 Sep 13 3
Philips Semiconductors Product specification
Note
1. LOW side and HIGH side selectivity can be switched by changing the mixer from HIGH side to LOW side LO injection.
2004 Sep 13 4
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2004 Sep 13
Philips Semiconductors
handheld applications
Low-power FM stereo radio for
BLOCK DIAGRAM
47 nF 47 nF 47 nF 33 nF 33 nF
R1 Igain 25
GAIN POWER
STABILIZATION SUPPLY
AGND 26
22 nF 22 µF
VCCA 27
VCCA DEMODULATOR
4.7 Ω RESONANCE SOFT
AMPLIFIER LIMITER
MUTE
SDS
I/Q-MIXER LEVEL IF
FM antenna 1st FM ÷2 ADC COUNTER 16 PILFIL
1 nF
N1
MPX 22 nF
33 kΩ
IF CENTRE DECODER
100 pF
FREQUENCY 15 22 nF
RFI1 28 ADJUST
Iref PHASEFIL
27 pF RFGND 29 Ccomp(1)
L1 AGC 14 XTAL2
47 pF RFI2 30
TEA5768HL CRYSTAL Cpull(1) 32.768 kHz
TAGC 31 OSCILLATOR 13 XTAL1
or
4.7 nF 13 MHz
5
mono 10 BUSENABLE
VCO
I2C-BUS
9 BUSMODE
1 2 3 4 5 6 7 8
CPOUT VCOTANK1 VCOTANK2 VCC(VCO) DGND VCCD DATA CLOCK mhc275
10 nF 12 Ω
39 nF VCCD
D1 D2
10 kΩ 22 nF
L3 L2
100 kΩ
TEA5768HL
Product specification
22 nF
47 Ω
VCC(VCO)
The component list is given Chapter 14.
(1) Ccomp and Cpull data depends on crystal specification.
6 PINNING
2004 Sep 13 6
Philips Semiconductors Product specification
32 LOOPSW
29 RFGND
26 AGND
31 TAGC
27 VCCA
30 RFI2
28 RFI1
25 Igain
CPOUT 1 24 LIMDEC2
VCOTANK1 2 23 LIMDEC1
VCOTANK2 3 22 TIFC
VCC(VCO) 4 21 Vref
TEA5768HL
DGND 5 20 MPXO
VCCD 6 19 TMUTE
DATA 7 18 VAFR
CLOCK 8 17 VAFL
BUSENABLE 10
SWPORT1 11
SWPORT2 12
XTAL1 13
XTAL2 14
PHASEFIL 15
PILFIL 16
9
001aab494
BUSMODE
2004 Sep 13 7
Philips Semiconductors Product specification
7.8 FM demodulator Information about the I2C-bus can be found in the brochure
“The I2C-bus and how to use it” (order number
The FM quadrature demodulator has an integrated 9398 393 40011).
resonator to perform the phase shift of the IF signal.
The standard I2C-bus specification is expanded by the
7.9 Level voltage generator and analog-to-digital following definitions.
converter IC address C0: 1100000.
The FM IF analog level voltage is converted to 4 bits digital Structure of the I2C-bus logic: slave transceiver.
data and output via the I2C-bus.
Subaddresses are not used.
7.10 IF counter The maximum LOW-level input and the minimum
The IF counter outputs a 7-bit count result via the I2C-bus. HIGH-level input are specified to 0.2VCCD and 0.45VCCD
respectively.
7.11 Soft mute The pin BUSMODE must be connected to ground.
The low-pass filtered level voltage drives the soft mute Before any READ or WRITE operation the pin
attenuator at low RF input levels. The soft mute function BUSENABLE has to be HIGH for at least 10 µs.
can be switched off via the I2C-bus.
Note: The bus operates at a maximum clock frequency of
7.12 MPX decoder 400 kHz. It is not allowed to connect the IC to a bus
operating at a higher clock rate.
The PLL stereo decoder is adjustment-free. The stereo
decoder can be switched to mono via the I2C-bus. 8.1.1 DATA TRANSFER
7.13 Signal dependent mono to stereo blend Data sequence: address, byte 1, byte 2, byte 3, byte 4 and
byte 5 (the data transfer has to be in this order). The
With a decreasing RF input level the MPX decoder blends LSB = 0 of the address indicates a WRITE operation to the
from stereo to mono to limit the output noise. The TEA5768HL.
continuous mono to stereo blend can also be programmed
via the I2C-bus to an RF level depending switched mono to Bit 7 of each byte is considered as the MSB and has to be
stereo transition. Stereo Noise Cancelling (SNC) can be transferred as the first bit of the byte.
switched off via the I2C-bus. The data becomes valid bitwise at the appropriate falling
edge of the clock. A STOP condition after any byte can
7.14 Signal dependent AF response shorten transmission times.
The audio bandwidth will be reduced with a decreasing RF When writing to the transceiver by using the STOP
input level. This function can be switched off via the condition before completion of the whole transfer:
I2C-bus.
• The remaining bytes will contain the old information
7.15 Software programmable ports • If the transfer of a byte is not completed, the new bits will
be used, but a new tuning cycle will not be started.
Two software programmable ports (open-collector) can be
addressed via the I2C-bus. The IC can be switched into a low current standby mode
with the standby bit; the bus is then still active. The
The port 1 (pin SWPORT1) function can be changed with standby current can be reduced by deactivating the bus
write data byte 4 bit 0 (see Table 13). Pin SWPORT1 is interface (pin BUSENABLE LOW). If the bus interface is
then output for the ready flag of read byte 1. deactivated (pin BUSENABLE LOW) without the standby
mode being programmed, the IC maintains normal
operation, but is isolated from the bus lines.
2004 Sep 13 8
Philips Semiconductors Product specification
Notes
1. S = START condition.
2. A = acknowledge.
3. P = STOP condition.
Notes
1. S = START condition.
2. A = acknowledge.
IC ADDRESS MODE
1 1 0 0 0 0 0 R/W(1)
Note
1. Read or write mode:
a) 0 = write operation to the TEA5768HL
b) 1 = read operation from the TEA5768HL.
2004 Sep 13 9
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VVCOTANK1 VCO tuned circuit output voltage 1 −0.3 +8 V
VVCOTANK2 VCO tuned circuit output voltage 2 −0.3 +8 V
VCCD digital supply voltage −0.3 +5 V
VCCA analog supply voltage −0.3 +8 V
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −10 +75 °C
Ves electrostatic handling voltage
for all pins except pin DATA note 1 −200 +200 V
note 2 −2000 +2000 V
for pin DATA note 1 −150 +200 V
note 2 −2000 +2000 V
Notes
1. Machine model (R = 0 Ω, C = 200 pF).
2. Human body model (R = 1.5 kΩ, C = 100 pF).
10 THERMAL CHARACTERISTICS
2004 Sep 13 14
Philips Semiconductors Product specification
11 DC CHARACTERISTICS
VCCA = VVCOTANK1 = VVCOTANK2 = VCCD = 2.7 V; Tamb = 25 °C; unless otherwise specified.
2004 Sep 13 15
Philips Semiconductors Product specification
2004 Sep 13 16
Philips Semiconductors Product specification
12 AC CHARACTERISTICS
VCCA = VVCOTANK1 = VVCOTANK2 = VCCD = 2.7 V; Tamb = 25 °C; measured in the circuit of Fig.5; all AC values are given
in RMS; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Voltage controlled oscillator
fosc oscillator frequency 150 − 217 MHz
Crystal oscillator
CIRCUIT INPUT: PIN XTAL2
Vi(osc) oscillator input voltage oscillator externally clocked 140 − 350 mV
Ri input resistance oscillator externally clocked
data byte 4 bit 4 = 0 2 3 4 kΩ
data byte 4 bit 4 = 1 230 330 430 kΩ
Ci input capacitance oscillator externally clocked
data byte 4 bit 4 = 0 3.9 5.6 7.3 pF
data byte 4 bit 4 = 1 5 6 7 pF
CRYSTAL: 32.768 kHz
fr series resonance frequency data byte 4 bit 4 = 1 − 32.768 − kHz
∆f/fr frequency deviation −20 × 10−6 − +20 × 10−6
C0 shunt capacitance − − 3.5 pF
RS series resistance − − 80 kΩ
∆fr/fr(25 °C) temperature drift −10 °C < Tamb < +60 °C −50 × 10−6 − +50 × 10−6
CRYSTAL: 13 MHz
fr series resonance frequency data byte 4 bit 4 = 0 − 13 − MHz
∆f/fr frequency deviation −30 × 10−6 − +30 × 10−6
C0 shunt capacitance − − 4.5 pF
Cmot motional capacitance 1.5 − 3.0 fF
RS series resistance − − 100 Ω
∆fr/fr(25 °C) temperature drift −40 °C < Tamb < +85 °C −30 × 10−6 − +30 × 10−6
Synthesizer
PROGRAMMABLE DIVIDER; note 1
Nprog programmable divider ratio data byte 1 = XX111111; − − 8191
data byte 2 = 11111110
data byte 1 = XX010000; 2048 − −
data byte 2 = 00000000
∆Nstep programmable divider step − 1 −
size
REFERENCE FREQUENCY DIVIDER
Nref crystal oscillator divider data byte 4 bit 4 = 0 − 260 −
ratio data byte 5 bit 7 = 1; − 130 −
data byte 4 bit 4 = 0
data byte 4 bit 4 = 1 − 1 −
2004 Sep 13 17
Philips Semiconductors Product specification
2004 Sep 13 18
Philips Semiconductors Product specification
IF filter
fIF IF filter centre frequency 215 225 235 kHz
BIF IF filter bandwidth 85 94 102 kHz
S+200 HIGH side 200 kHz ∆f = +200 kHz; 39 43 − dB
selectivity ftune = 76 MHz to 108 MHz;
note 3
S−200 LOW side 200 kHz ∆f = −200 kHz; 32 36 − dB
selectivity ftune = 76 MHz to 108 MHz;
note 3
S+100 HIGH side 100 kHz ∆f = +100 kHz; 8 12 − dB
selectivity ftune = 76 MHz to 108 MHz;
note 3
S−100 LOW side 100 kHz ∆f = −100 kHz; 8 12 − dB
selectivity ftune = 76 MHz to 108 MHz;
note 3
IR image rejection ftune = 76 MHz to 108 MHz; 24 30 − dB
VRF = 50 dBµV
FM IF level detector and mute voltage
VRF RF input voltage for start of read mode data byte 4 bit 4 = 1 2 3 5 µV
level ADC
∆Vstep level ADC step size 2 3 5 dB
PIN TMUTE
Vlevel level output DC voltage VRF = 0 µV 1.55 1.65 1.80 V
VRF = 3 µV 1.60 1.70 1.85 V
Vlevel(slope) slope of level voltage VRF = 10 µV to 500 µV 150 165 180 mV
---------------
20 dB
Ro output resistance 280 400 520 kΩ
2004 Sep 13 19
Philips Semiconductors Product specification
2004 Sep 13 20
Philips Semiconductors Product specification
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
MHC247
10 THD
handbook, full pagewidth
VAFL, VAFR (%)
(1)
(dB) 0 4.0
(2)
(3)
−10 3.5
−20 3.0
−30 2.5
(4)
−40 2.0
(5)
−50 1.5
−60 1.0
−70 0.5
(6)
−80 0
10−3 10−2 10−1 1 10 102 103
VRF (mV)
Fig.3 FM characteristics 1.
2004 Sep 13 23
Philips Semiconductors Product specification
MHC309
10
handbook, full pagewidth VTMUTE
VAFL, VAFR
(1) (V)
(dB) 0 2.2
−10 2.1
−20 2.0
(2)
−30 1.9
−40 1.8
(3)
−50 1.7
−60 1.6
−70 1.5
−80 1.4
10−3 10−2 10−1 1 10 102 103
VRF (mV)
Fig.4 FM characteristics 2.
2004 Sep 13 24
Philips Semiconductors Product specification
270 Ω
1 MHC251
2 VCOTANK1 2 3
3 VCOTANK2
120 Ω 120 Ω
MHC252
4 VCC(VCO)
5 DGND
6 VCCD
7 DATA
5 MHC253
8 CLOCK
270 Ω
8 5 MHC254
2004 Sep 13 25
Philips Semiconductors Product specification
270 Ω
9 5 MHC255
10 BUSENABLE
150 Ω
10 5 MHC256
11 SWPORT1 150 Ω
11
5
MHC257
12 SWPORT2 150 Ω
12
5
MHC258
13 XTAL1
14 XTAL2
13 14
MHC259
15 PHASEFIL
15
26 MHC260
2004 Sep 13 26
Philips Semiconductors Product specification
26 MHC261
17 VAFL
10 Ω
17
26 MHC262
18 VAFR
10 Ω
18
26 MHC263
19 TMUTE 19
1 kΩ
26
MHC264
20 MPXO
150 Ω
20
26 MHC265
2004 Sep 13 27
Philips Semiconductors Product specification
21
26
MHC266
22 TIFC
40 kΩ
22
MHC267
23 LIMDEC1
270 Ω
23
MHC268
24 LIMDEC2
270 Ω
24
MHC269
25 Igain
25
MHC270
26 AGND
27 VCCA
2004 Sep 13 28
Philips Semiconductors Product specification
29 MHC271
31 TAGC
31
29 MHC272
32 LOOPSW 4
32
MHC273
14 APPLICATION INFORMATION
Table 28 Component list for Figs 1 and 5
COMPONENT PARAMETER VALUE TOLERANCE TYPE MANUFACTURER
R1 resistor with low temperature coefficient 18 kΩ ±1 % RC12G Philips
D1 and D2 varicap for VCO tuning − − BB202 Philips
L1 RF band filter coil 120 nH ±2 % Qmin = 40
L2 and L3 VCO coil 33 nH ±2 % Qmin = 40
XTAL13 13 MHz crystal − − NX4025GA
Cpull pulling capacitor for NX4025GA 10 pF −
XTAL32.768 32.768 kHz crystal − −
2004 Sep 13 29
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2004 Sep 13
Philips Semiconductors
handheld applications
Low-power FM stereo radio for
47 nF 47 nF 47 nF 33 nF 33 nF
LIMDEC2 LIMDEC1 TIFC Vref MPXO TMUTE VAFR VAFL
24 23 22 21 20 19 18 17
R1 Igain 25
GAIN POWER
STABILIZATION SUPPLY
AGND 26
22 nF 22 µF
27
VCCA DEMODULATOR
4.7 Ω VCCA RESONANCE SOFT
AMPLIFIER LIMITER
MUTE
SDS
I/Q-MIXER LEVEL IF
2 1 nF
1st FM ADC COUNTER 16 PILFIL
N1
MPX 33 kΩ 22 nF
IF CENTRE DECODER
100 pF
FREQUENCY 22 nF
15
RFI1 28 ADJUST
Iref PHASEFIL
27 pF RFGND 29
40 Ω
L1 AGC Ccomp(1)
14 XTAL2
47 pF
RFI2 30
VRF TEA5768HL CRYSTAL Cpull(1) 32.768 kHz
TAGC 31 OSCILLATOR 13 XTAL1
or
13 MHz
30
4.7 nF
programmable divider output SOFTWARE 12 SWPORT2 10 kΩ
LOOPSW 32
TUNING SYSTEM MUX PROGRAMMABLE 11 SWPORT1
PORT VCCA
reference frequency divider output 10 kΩ
pilot
mono 10 BUSENABLE
VCO
I2C-BUS
9 BUSMODE
1 2 3 4 5 6 7 8
CPOUT VCOTANK1 VCOTANK2 VCC(VCO) DGND VCCD DATA CLOCK mhc276
10 nF 12 Ω
39 nF VCCD
D1 D2
10 kΩ 22 nF
L3 L2
100 kΩ
TEA5768HL
Product specification
22 nF
47 Ω
VCC(VCO)
15 PACKAGE OUTLINE
LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1
c
y
X
24 17 A
25 16 ZE
E HE
A A2 A (A 3)
1
wM
θ
bp Lp
pin 1 index
L
32 9
detail X
1 8
e ZD v M A
wM
bp
D B
HD v M B
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
00-01-19
SOT358 -1 136E03 MS-026
03-02-25
2004 Sep 13 31
Philips Semiconductors Product specification
2004 Sep 13 32
Philips Semiconductors Product specification
16.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, not suitable suitable
VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, not suitable(4) suitable
HTQFP, HTSSOP, HVQFN, HVSON, SMS
PLCC(5), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(5)(6) suitable
SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable
CWQCCN..L(8), PMFP(9), WQCCN..L(8) not suitable not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2004 Sep 13 33
Philips Semiconductors Product specification
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
18 DEFINITIONS 19 DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes in the products -
Characteristics sections of the specification is not implied. including circuits, standard cells, and/or software -
Exposure to limiting values for extended periods may described or contained herein in order to improve design
affect device reliability. and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information Applications that are
communicated via a Customer Product/Process Change
described herein for any of these products are for
Notification (CPCN). Philips Semiconductors assumes no
illustrative purposes only. Philips Semiconductors make
responsibility or liability for the use of any of these
no representation or warranty that such applications will be
products, conveys no licence or title under any patent,
suitable for the specified use without further testing or
copyright, or mask work right to these products, and
modification.
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2004 Sep 13 34
Philips Semiconductors Product specification
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2004 Sep 13 35
Philips Semiconductors – a worldwide company
Contact information
Printed in The Netherlands R30/03/pp36 Date of release: 2004 Sep 13 Document order number: 9397 750 13529