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SOIC-8 Case

This document provides packaging details for an SOIC-8 case microelectronic device. It includes mechanical drawings of the package dimensions and mounting pad geometry. It also specifies the tape dimensions and orientation for packaging the devices in reels. Key details are given on the packaging materials, including the reel labeling information, reel packing information specifying the number of devices per reel and box, as well as ordering information.

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Fabian Cabrera
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223 views3 pages

SOIC-8 Case

This document provides packaging details for an SOIC-8 case microelectronic device. It includes mechanical drawings of the package dimensions and mounting pad geometry. It also specifies the tape dimensions and orientation for packaging the devices in reels. Key details are given on the packaging materials, including the reel labeling information, reel packing information specifying the number of devices per reel and box, as well as ordering information.

Uploaded by

Fabian Cabrera
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Package Details

SOIC-8 Case

Mechanical Drawing

Lead Code: Part Marking:


Reference individual
4-5 Character Alpha/Numeric Code
device datasheet.

Mounting Pad Geometry (Dimensions in mm)

R0 (27-March 2013)
w w w. c e n t r a l s e m i . c o m
Package Details
SOIC-8 Case

Tape Dimensions and Orientation (Dimensions in mm)


Devices are taped in
Tape Width: 12mm accordance with
Electronic Industries
Association Standard
EIA-481-D

Direction of Unreeling

Packaging Base
13” Reel = 2,500 pcs.

Reel Labeling Information


Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code, Ship Date and Marking Code.

Reel Packing Information

Reels per Parts per Box Dimensions Shipping Weight (Max.)


Reel Box Box
Size INCH CM LB KG
(Maximum) (Maximum)

5 12,500 15x4x15 38x10x38 8 4


13” 14 35,000 15x15x9 38x38x23 19 9
26 65,000 15x15x18 38x38x46 34 16

Ordering Information
• For devices taped and reeled on 13” reels, add TR13 suffix to part number.
• All SMDs are available in small quantities for prototype and manual placement applications.

R0 (27-March 2013)
w w w. c e n t r a l s e m i . c o m
Material Composition Specification
SOIC-8 Case

Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74.6 mg


Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%

Material Substance
Component Material Substance CAS No.
(%wt) (mg) (%wt) (mg) (ppm)
active device doped Si 0.43% 0.32 Si 7440-21-3 0.43% 0.32 4,290

bond wire copper 0.03% 0.02 Cu 7440-50-8 0.03% 0.02 268

Cu 7440-50-8 37.47% 27.95 374,665

Fe 7439-89-6 0.912% 0.68 9,115


Cu alloy
leadframe 38.87% 29 P 7723-14-0 0.027% 0.02 268
w/ silver plating
Zn 7440-66-6 0.04% 0.03 402

Ag 7440-22-4 0.429% 0.32 4,290

Ag 7440-22-4 0.075% 0.056 751


die attach silver epoxy 0.094% 0.07
epoxy resin Proprietary 0.019% 0.014 188

silica (fused) 60676-86-0 42.9% 32 428,954

epoxy resin 29690-82-2 5.63% 4.2 56,300

encapsulation* EMC GREEN 60.56% 45.2 phenol resin 9003-35-4 5.63% 4.2 56,300

carbon black 1333-86-4 0.31% 0.23 3,083


metal
hydroxide 1309-42-8 6.1% 4.55 60,992

plating matte tin 0.013% 0.01 Sn 7440-31-5 0.013% 0.01 134


*EMC GREEN molding compound is Halogen-Free.

Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.

R0 (1-May 2012)
w w w. c e n t r a l s e m i . c o m

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