Simplifying the Complexities of Multicore Processors with COTS Single Board Computer Solutions
Speaker:
Glenn Beck - Segment Marketing Manager - Single Board Computing and Aerospace & Defense Markets- Freescale Semiconductor
Haritha Treadway- Product Manager at Eurotech Inc.
Adam Auer- Marketing Manager with the Embedded Computing business of Emerson Network Power
Moderator:
Chris Ciufo, OpenSystems Media
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Simplifying the Complexities of QorIQ Multicore Processors with COTS Single Board Computer Solutions
17 February, 2011
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Freescale, the Freescale logo, AltiVec, CodeWarrior and PowerQUICC are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. CoreNet, QorIQ and QUICC Engine are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org.  2011 Freescale Semiconductor, Inc.
Introduction QorIQ Processors from Freescale
Freescale, Glenn Beck  Roadmap  Creating High Assurance Computing
COM Express Platform: Right Fit for QorIQ Processors
Eurotech, Haritha Treadway
Embedded Pin-Out for COM Express Platform
Emerson, Adam Auer
Questions and Answers
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Single Board Computing Market Dynamics
OEM Dynamics
Hardware engineering resources are at 25% of OEMs. Software and Systems engineers now make up the majority. This is at a historical low.  Complexities of processors increasing rapidly
o o
Multicore processors with memory subsystems, high-speed IO, hardware acceleration on a single device High-speed IO  Memories have moved from DDR1 to DDR3 in just a few years  PCI to PCI Express gen 1 to gen 2. (5 GHz)  On board Gigabit Ethernet and 10G Ethernet
Need to get more products to the market faster with more capability at lower development cost Has the expertise to deal with high-speed design and multicore processors Module offering provides customers semicustom capability to make their products unique for a variety of markets Module standardization allows for multi-performance capability Improves the time to market and lowers the development cost
SBC Ecosystem Dynamics
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Power Architecture Processor Roadmap
High Performance within Embedded Power Budget of 30W  64-bit Cores High Performance within Embedded Power Budget of 30W
QorIQ  P5
P5020 P5010
Increase FP Perf Next Gen process Security plus
QorIQ  P4 e600 +SoC
P4080 P4040
Increasing Performance
Next Gen Core Increase FP Perf Security plus
Decreasing Power
Performance at Reasonable Power 15 W
QorIQ  P3
P3041
Increase FP Perf Next Gen process Security plus
Value Priced for Power/Performance Applications 10W Power Sensitive Applications 5W
PowerQUICC III
QorIQ  P2
P2020/P2010 P2040
Trust Architecture More cores
PowerQUICC II Pro PowerQUICC II PowerQUICC I
QorIQ  P1
P1010/P1014 P1020/P1011 P1021/P1012 P1022/P1013 P1023/P1017
Multicore Next Gen Process Trust Arch
Increasing Performance
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Power Architecture Processor Roadmap
High Performance within Embedded Power Budget of 30W  64-bit Cores High Performance within Embedded Power Budget of 30W
QorIQ  P5
P5020 P5010
Increase FP Perf Next Gen process Security plus
AltiVec
Next Gen Core Increase FP Perf Security plus
QorIQ  P4 e600 +Soc
P4080 P4040
Increasing Performance
Decreasing Power
AltiVec
Performance at Reasonable Power 15 W
QorIQ  P3
P3041
Increase FP Perf Next Gen process Security plus
AltiVec
Value Priced for Power/Performance Applications 10W Power Sensitive Applications 5W
PowerQUICC III
QorIQ
P2020/P2011 O2040
Trust Arch More cores AltiVec Multicore Next Gen Process Trust Arch
PowerQUICC II Pro PowerQUICC II PowerQUICC I
QorIQ  P1
P1010/P1014 P1020/P1011 P1021/P1012 P1022/P1013 P1023/P1017
Increasing Performance
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Balanced SoC Architecture
QorIQ P4080
Multicore Processor
Power Architecture e500-mc Core
32 KB D-Cache 32 KB I-Cache
1024 KB Frontside L3 Cache 1024 KB Frontside L3 Cache 64-bit DDR-2 / 3 Memory Controller 64-bit DDR-2 / 3 Memory Controller
128 KB Backside L2 Cache
eOpenPIC PreBoot Loader Security Monitor Internal BootROM Power Mgmt SD/MMC SPI 2x DUART 4x I 2 C 2x USB 2.0/ULPI Clocks/Reset GPIO CCSR
Test Port/ SAP
Pattern Match Engine 2.0 Frame Manager Parse, Classify, Distribute
Buffer PAMU PAMU PAMU
CoreNet
Coherency Fabric
PAMU PAMU Peripheral Access Mgmt Unit
eLBC
Security
4.0
Queue Mgr.
Frame Manager Parse, Classify, Distribute
Buffer
Real Time Debug
RapidIO Message Unit (RMU) PCIe PCIe
2x DMA
Watchpoint Cross Trigger Perf CoreNet Monitor Trace
Buffer Mgr.
1GE 10GE 1GE
1GE 10GE 1GE
1GE 1GE
1GE 1GE
SRIO
PCIe SRIO Aurora
18-Lane 5GHz SerDes
Power Architecture technology: superscalar OOO transactions Memory Hierarchy: L1  L2  L3  Main Memory High-speed IO: Gen 2 PCI Express, RapidIO, Gig and 10G Ethernet
Embedded IOs: UARTs, SPI, USB, GPIO Hardware accelerators: SEC, Pattern Matching Engine, Data Path Acceleration Architecture Assured Computing: Secure Boot, Separation of Domains and threat detection
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High Assurance Platform - Security in a Connected World
Key Capabilities of the High Assurance PlatformR  HAP
Embedded Security Module  provides hardware-based protection of cryptographic keys, stores measurements of device state and helps to prove to a third party that the device is trustworthy. Device Hardware Security  hardware memory partition provides a secure connection to the ESM to guard against unauthorized access and separation of resources to isolate different security domains. Software Measurement - At boot time and at runtime, a HAP device measures software in a trusted manner before that software is allowed to execute. Separation of Domains - Software can be run free from interference or threat from other software running in other domains on the same device. Remote Attestation - When connecting to a network, a HAP device provides proof of its state to HAP network devices and servers, which can then make a determination about the trustworthiness of the HAP device and, based on that determination, allow access, quarantine or remediate the HAP device. Secure Central Administration - HAP devices can be administered centrally through their entire lifecycle, enabling the secure provisioning, audit, identification, authentication, management and decommissioning of the HAP devices in enterprise environments.
Source: www.nsa.gov/hap
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QorIQ Processors
Objective of the Assurance: Trust Architecture
Protection Against:
Theft of Functionality - loss of control of the systems functionality  Theft of Data - where a data protection policy exists, loss of data to an unauthorized party  Theft of Uniqueness - loss of product differentiation through reverse engineering, duplication and unapproved inter-operability.
Relying on:
Secure Boot  start from Trusted code base or dont start at all  Strong Partitioning of the System  isolation of cores from each other to provide redundancy and data corruption protection between critical functions  Threat detection  internal and external security event detection  Secure Debug  allows for protected on sight and remote debug
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Trusted Boot Process
(Embedded Security Module, Software Measurement)
Code Signing Entity System Code (Plaintext)
Plaintext Hash = (ciphertext hash)(e) mod N
Ciphertext Hash = (plaintext hash) (d) mod N E,d, and N are large integers, at least 2048b E, d, and N are mathematically chosen so that RSA works (N is the product of 2 large primes) Sign and Verify are identical operations (modular exponentiation)
Internal Secure Boot Code
If Decrypted Hash = Generated Hash, the Syst Code has not been modifi Decrypted Hash
Hash
Public Key (e) Public Modulus (N)
Generated Hash
RSA Sign
Private Key (d) Public Modulus (N)
RSA Verify
Signature System Code (Plaintext)
System NV RAM
Signature System Code (Plaintext)
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Partition 1
128 KB Backside L2 Cache
Domain Separation
Partition 2
HV MMU
Power e500-mc Core
32 KB D-Cache
Qman Portal Qman Portal
Architecture
32 KB I-Cache 128 KB Backside L2 Cache
Power Architecture e500-mc Core
HV MMU
Shared Main Memory
32 KB D-Cache
Qman Portal Qman Portal
32 KB I-Cache
2 MB Front side L3 Cache HV Private Memory
128 KB Backside L2 Cache
Power Architecture e500-mc Core
32 KB D-Cache
HV MMU
32 KB I-Cache
128 KB Backside L2 Cache
Power Architecture e500-mc Core
32 KB D-Cache
HV MMU
Partition 1 Private Memory Partition 2 Private Memory Partition 3 Private Memory Partition 4 Private Memory Command Control Status Registers
32 KB I-Cache
Partition 3
Qman Portal Qman Portal
Partition 4
Qman Portal Qman Portal
QMan
CoreNet Coherency Fabric
PAMU PAMU PAMU PAMU PAMU
BMan
Peripheral Access Mgmt Units
Frame Manager Parse, Classify, Distribute SEC
4.0
Frame Manager Parse, Classify, Distribute
Buffer 1GE 1GE 1GE 1GE
PME 2.0
10GE
Buffer 1GE 1GE 1GE 1GE 10GE
PCIe PCIe PCIe sRIO sRIO
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Power Architecture Technology: QorIQ Platform
Size, Weight, Power and Performance
 Answering the demands of the market
High Assurance Architecture
 User controlled line of trust
QorIQ  A balanced architecture for performance and power  High performance multicore processing  Tri-level Memory subsystem  High Speed IO  PCI Express, Rapid IO  Hardware Acceleration - Security and Networking  CoreNet - Non-blocking Fabric Control  Scalable Signal Processing
Secure Boot
    Drive Linux enhancements Drive multicore support Drive open virtualization technologies Drive open firmware, x86 emulation, HAL
Threat Protection
&
QorIQ  Scalable Performance  600 MHz to 2.2 GHz/core  4 to 30 Watts  Single ISA across family
Signal Processing
Trusted Architecture
 From Loss of Functionality  From Loss of Data  From Loss of Uniqueness
Strong Partitioning Tamper Detection
Ecosystem
Tools and OS Single Board Computing
- Emerson - Eurotech  Broad OS support - Green Hills - ENEA - Mentor Embedded - QNX - Wind River
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Introduction QorIQ Processors from Freescale
Freescale, Glenn Beck  Roadmap  Creating High Assurance Computing
COM Express Platform: Right Fit for QorIQ Processors
Eurotech, Haritha Treadway
Embedded Pin-Out for COM Express Platform
Emerson, Adam Auer
Questions and Answers
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Benefits of COM Express:
Optimize Performance, Power and Size
Delivers full performance capabilities of the QorIQ platform
     Multicore capabilities PCI Express interconnects Gigabit Ethernet USB 2.0 SATA LVDS Compact form factor Six channels for data communication
Reduces power usage for minimal consumption specs
 Small footprint supports a broad range of applications
 Basic and compact form factor solutions Ideal for battery-operated or space-constrained devices
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Benefits of COM Express:
Reduce Cost and Time to Market
Low cost of total ownership
  Freescale 10-year product lifecycle for QorIQ platform Critical component EOL issues managed by module vendor Extends life of final solution Processor design complexities already addressed in module Enables OEMs to focus on core, application-specific designs Reduce time to market and revenue Fewer layers required on the carrier Reduced effort to manage component procurement Overall total cost reductions
Reduce design and development costs
  Reduce manufacturing costs
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Benefits of COM Express:
Flexibility and Customization
Scalability
Standard footprints and pin-outs offer migration paths to newer technologies without carrier board redesign  No need to redesign enclosures since carrier boards can remain the same
SBC
Portability
COM
Design several carrier boards using one processor platform  Migrate across product line with minimal design work required
Carrier boards
Application-specific carrier boards
Form, fit and function suited specifically for end application  Minimized development efforts
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Overall Comparison: COM Express Versus SBC
Product Development Phase Designing the product
COM Express Module  Board supplier optimizes module for processor capabilities  OEM focuses on application design
SBC Designs  OEM required to work with board supplier on understanding features, pop/depop requirements  Essentially introducing new product with every SBC design  High inventory because of inability to reuse existing designs and enclosures  Board EOLed, OEM negotiates Last Time Buy conditions
Introducing to the factory
 Opportunity to reuse existing resources  Low system assembly costs
Maintenance and manufacturing End of lifecycle costs
 Lower cost overall  Fewer components to maintain  Scale to new technology to extend product lifecycle
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Eurotechs QorIQ Solutions:
Target Markets and Applications
Adbc7517
P4080 Up to 1.5 GHz, <35W Max, 8 cores, ECC, high speed I/O Medical Xray Industrial Automation Military/Aerospace
Performance
Adbc7520
P1021
Adbc7519
P2020 Up to 1.2 GHz, <10W Max, 2 cores, networking, graphics, ECC Transportation Semiconductor manufacturing
Up to 800 MHz, <5W Max, 2-core, QUICC Engine, networking, graphics
Security camera
Networked communications
Power Consumption
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Introduction QorIQ Processors from Freescale
Freescale, Glenn Beck  Roadmap  Creating High Assurance Computing
COM Express Platform: Right Fit for QorIQ Processors
Eurotech, Haritha Treadway
Embedded Pin-Out for COM Express Platform
Emerson, Adam Auer
Questions and Answers
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Emerson Network Power
Corporate Sales of $21B (2010)
Best cost design and manufacturing facilities
Widest range of embedded computing products
 Over 30 years legacy in Embedded Computing incorporating Motorola Computer Group, Force Computers, Prolog, Blue Wave Systems, Paceline, Artesyn and others  Globally recognized for our quality, reliability and long life-cycle products  Excellent pre- and post-sales support plus comprehensive services portfolio for trouble-free deployment
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COM Express Pins and Headers
COM Express pin-outs define which signals are taken to the end of a processing module via the 4 COM Express connectors: A,B,C,D Modules are built according to a certain type - in order to successfully mate with a carrier The types are defined by PICMG. http://www.picmg.org/ The QorIQ modules use new pinouts that are PICMG compatible, not compliant.
A B C D
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Goals of the Pin-Out
Processor-agnostic approach
Greater flexibility
Removal of x86 specific pins
LPC, PEG, AC'97 Audio, Sleep states 3, and 4, etc.
Addition of embedded interfaces:
IEEE 1588 Precision Time Protocol 8 Bit local bus UART interfaces Configurable SerDes lanes - enabling 10G XAUI Ethernet, SGMII, Serial RapidIO or PCI Express interconnects
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QorIQ P1022 Processor Compared to a Type 6
P1022
A GIGE 0 B 1588 CK i2C SATA SATA DDI x 1 C GIGE 1 D
Type 6 A
GIGE 0
B
LPC SMB i2C
C
USB 3.0 PCIE 7 DDI x 3
D
USB 3.0 PCIE 8
SATA
SATA
SATA
SATA
AC97 Audio AC97 Audio USB USB USB USB PCIE 1 PCIE 2 PCIE 3 LVDS A SPI SDIO SPI VGA SDIO UART 0 UART 1 SPI I2S Audio MDIO IRQ SPI USB USB PCIE 4 USB USB PCIE 1 PCIE 2 PCIE 3 LVDS A SPI LPC USB USB USB USB PCIE 4 PCIE 5 PCIE 6 LVDS B SPI VGA PEG
GPIO/SDIO GPIO/SDIO
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QorIQ P2020 Processor Compared to a Type 2
P2020 A
GIGE 0
Type 2
B
1588 CK i2C
C
GIGE 1
D
GIGE 2
A
GIGE 0
B
LPC SMB i2C
C
IDE
SATA
SATA
PCI
SATA
AC97 Audio USB USB USB
SATA
AC97 Audio USB USB USB USB PEG
USB USB PCIE 1 PCIE 2 PCIE 3 LVDS A SPI SDIO
USB USB
USB
PCIE 1
PCIE 2 PCIE 3 LVDS A SPI LPC GPIO/SDIO ExpressCard
PCIE 4
PCIE 5 PCIE 6 LVDS B SPI VGA GPIO/SDIO ExpressCard
UART 0 UART 1 SPI VGA SDIO SPI
MDIO IRQ SPI
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QorIQ P4080 Processor Compared to a Type 5
P4080 A
GIGE 0
Type 5 C D
GIGE 2
B
1588 CK i2C
A
GIGE 0
B
LPC SMB i2C
C
GIGE 1
D
GIGE 2
GIGE 1
SERDES 6 SERDES 7
SATA
SATA
SATA
SATA
PCIE 7
PCIE 9 PCIE 11 PCIE 13 PCIE 15 PCIE 17 PCIE 19 PCIE 21 PCIE 23 PCIE 25 PCIE 27 PCIE 29 PCIE 31
PCIE 8
PCIE 10 PCIE 12 PCIE 14 PCIE 16 PCIE 18 PCIE 20 PCIE 22 PCIE 24 PCIE 26 PCIE 28 PCIE 30 PCIE 32
AC97 Audio AC97 Audio USB USB USB USB USB USB USB USB SERDES 17 SERDES 17 SERDES 18 SERDES 19 USB USB USB USB PCIE 1 PCIE 2 UART 0 UART 1 SPI SDIO SPI SDIO SPI UART 2 Local Bus Tamper MDIO IRQ SPI PCIE 3 LVDS A SPI LPC USB USB USB USB PCIE 4 PCIE 5 PCIE 6 LVDS B SPI VGA
SERDES 0 SERDES 3
SERDES 1 SERDES 4 SERDES 2 SERDES 5
GPIO/SDIO GPIO/SDIO
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Results
Dramatically increased flexibility
Configurable SerDes lanes allow interfaces to be configured during boot-up
100% compatible power and ground pins 100% compatible common interfaces (SATA, USB) Interchangeable with limited functionality Mechanically Identical - mounting and thermal designs can be re-used
Pin-out Compatible modules
 QorIQ Architecture is now available on modules! For more information:
COM Express please visit PICMG.org: http://www.picmg.org/ QorIQ implementation: contact Emerson Network Power, Eurotech or Freescale Semiconductor for more information.
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QorIQ Modules from Emerson Network Power
COMX-P4080
  
8 Core 1.5 GHz CPU Up to 4 GB DDR3 12 configurable SerDes lanes
COMX-P2020
 
2 Core 1.0 GHz CPU Up to 2 GB DDR3
COMX-P1022
 
2 Core 800 MHz CPU Up 2 GB DDR3
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Introduction QorIQ Processors from Freescale
Freescale, Glenn Beck  Roadmap  Creating High Assurance Computing
COM Express Platform: Right Fit for QorIQ Processors
Eurotech, Haritha Treadway
Embedded Pin-Out for COM Express Platform
Emerson, Adam Auer
Questions and Answers
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Glenn Beck - Segment Marketing Manager - Single Board Computing and Aerospace & Defense Markets- Freescale Semiconductor Haritha Treadway- Product Manager at Eurotech Inc. Adam Auer- Marketing Manager with the Embedded Computing business of Emerson Network Power
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Thanks for joining us
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E-mail us at: clong@opensystemsmedia.com