MSMBG5.
0A – MXLSMBG170CAe3,
MSMBJ5.0A – MXLSMBJ170CAe3
Screening in
Available
600 Watt Surface Mount reference to
MIL-PRF-19500
Transient Voltage Suppressor available
DESCRIPTION
The MSMB 5.0A – MSMB 170CA series of surface mount 600 watt transient voltage suppressors
provide a selection of standoff voltages (Vwm) from 5.0 to 170 V. These high-reliability devices are
available in either unidirectional or bidirectional versions. The SMBG Gull-wing design in the DO-
215AA package is ideal for visible solder connections. The SMBJ J-bend design in the DO-
214AA package allows for greater PC board mounting density. It is available with SnPb or
RoHS compliant matte-tin plating.
Important: For the latest information, visit our website http://www.microsemi.com. DO-215AA
FEATURES Gull-wing Package
• High reliability devices with wafer fabrication and assembly lot traceability.
• All devices 100% surge tested.
• Enhanced reliability screening in reference to MIL-PRF-19500 is also available.
Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening
options.
(See part nomenclature for all options.)
• Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B.
• 3σ lot norm screening performed on standby current (I D ).
DO-214AA
• RoHS compliant versions available. J-bend Package
APPLICATIONS / BENEFITS NOTE: All SMB series are
•
equivalent to prior SMS package
Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc. identifications.
• Protection from switching transients & RF induced voltage pulses.
• Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4. Also available in:
• Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance: Commercial Grade
Class 1: MSB 5.0A to MSMB 120CA SMBJ5.0A – SMBJ170CAe3
Class 2: MSMB 5.0A to MSMB 60CA
Class 3: MSMB 5.0A to MSMB 30CA T-18 package
Class 4: MSMB 5.0A to MSMB 15CA (axial-leaded)
• Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance: P6KE6.8A – P6KE200CAe3
Class 1: MSMB 5.0A to MSMB 36CA
Class 2: MSMB 5.0A to MSMB 18CA
MAXIMUM RATINGS @ 25 ºC unless otherwise stated
Parameters/Test Conditions Symbol Value Unit
o
Junction and Storage Temperature TJ and -65 to +150 C
TSTG MSC – Lawrence
o 6 Lake Street,
Thermal Resistance, Junction to Lead R ӨJL 25 C/W
(1) o Lawrence, MA 01841
Thermal Resistance, Junction to Ambient R ӨJA 90 C/W Tel: 1-800-446-1158 or
(2)
Peak Pulse Power Dissipation 10/1000us P PP 600 W (978) 620-2600
(1) Fax: (978) 689-0803
Rated Average Power Dissipation @ TL < 25 ºC P M(AV) 5 W
@ TA = 25 ºC 1.38
MSC – Ireland
Tclamping (0 volts to V (BR) min) Unidirectional < 100 ps
Gort Road Business Park,
Bidirectional <5 ns Ennis, Co. Clare, Ireland
(3)
Forward Surge Current I FS 100 A (pk) Tel: +353 (0) 65 6840044
o
Solder Temperature @ 10 s TSP 260 C Fax: +353 (0) 65 6822298
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see pad layout on last page). Website:
2. With impulse repetition rate (duty factor) of 0.01 % or less (also Figure 1 and 4). www.microsemi.com
3. Peak impulse of 8.3 ms half-sine wave (unidirectional only).
RF01000, Rev. C (1/4/13) ©2013 Microsemi Corporation Page 1 of 7
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MSMBG5.0A – MXLSMBG170CAe3,
MSMBJ5.0A – MXLSMBJ170CAe3
MECHANICAL and PACKAGING
• CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 requirements.
• TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL- STD-750, method 2026.
• MARKING: Part number.
• POLARITY: Cathode end banded.
• TAPE & REEL option: Standard per EIA-481-1-A (add “TR” suffix to part number). Consult factory for quantities.
• WEIGHT: Approximately 0.1 grams.
• See Package Dimensions on last page.
PART NOMENCLATURE
M SM B G 5.0 C A e3
Reliability Level* RoHS Compliance
M e3 = RoHS Compliant
MA Blank = non-RoHS Compliant
MX
MXL +/- 5% Tolerance Level
*(see High Reliability Up-
Screened Plastic Products Polarity
Portfolio) C = bidirectional
Blank = unidirectional
Surface Mount Package
Stand-Off Voltage (V WM )
600 W Power Level (see Electrical Characteristics
table)
Lead Form
G = Gull-Wing
J = J-Bend
SYMBOLS & DEFINITIONS
Symbol Definition
VW M Working Peak (Standoff) Voltage - The maximum peak voltage that can be applied over the operating temperature
range. This is also referred to as standoff voltage.
PPP Peak Pulse Power - Rated random recurring peak impulse power dissipation.
V (BR) Breakdown Voltage - The minimum voltage the device will exhibit at a specified current.
ID Standby Current - The current at the rated standoff voltage (V WM ).
IPP Peak Pulse Current - The peak current during the impulse.
VC
Clamping Voltage - Clamping voltage at I PP (peak pulse current) at the specified pulse conditions (typically shown as
maximum value).
IBR Breakdown Current – The current used for measuring breakdown voltage V (BR) .
RF01000, Rev. C (1/4/13) ©2013 Microsemi Corporation Page 2 of 7
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MSMBG5.0A – MXLSMBG170CAe3,
MSMBJ5.0A – MXLSMBJ170CAe3
ELECTRICAL CHARACTERISTICS @ 25 ºC
REVERSE BREAKDOWN VOLTAGE MAXIMUM PEAK PULSE MAXIMUM
STAND-OFF CLAMPING CURRENT STANDBY
PART NUMBER VOLTAGE VOLTAGE (see Fig. 2) CURRENT
VWM V(BR) @ I( BR) VC @ IPP IPP ID @ VWM
Gull-Wing J-Bend V V mA V A µA
MSMBG5.0A MSMBJ5.0A 5 6.40 – 7.00 10 9.2 65.2 800
MSMBG6.0A MSMBJ6.0A 6 6.67 – 7.37 10 10.3 58.3 800
MSMBG6.5A MSMBJ6.5A 6.5 7.22 – 7.98 10 11.2 53.6 500
MSMBG7.0A MSMBJ7.0A 7 7.78 – 8.60 10 12 50 200
MSMBG7.5A MSMBJ7.5A 7.5 8.33 – 9.21 1 12.9 46.5 100
MSMBG8.0A MSMBJ8.0A 8 8.89 – 9.83 1 13.6 44.1 50
MSMBG8.5A MSMBJ8.5A 8.5 9.44 – 10.4 1 14.4 41.7 10
MSMBG9.0A MSMBJ9.0A 9 10.0 – 11.1 1 15.4 39 5
MSMBG10A MSMBJ10A 10 11.1 – 12.3 1 17 35.3 5
MSMBG11A MSMBJ11A 11 12.2 – 13.5 1 18.2 33 5
MSMBG12A MSMBJ12A 12 13.3 – 14.7 1 19.9 30.2 5
MSMBG13A MSMBJ13A 13 14.4 – 15.9 1 21.5 27.9 1
MSMBG14A MSMBJ14A 14 15.6 – 17.2 1 23.2 25.8 1
MSMBG15A MSMBJ15A 15 16.7 – 18.5 1 24.4 24 1
MSMBG16A MSMBJ16A 16 17.8 – 19.7 1 26 23.1 1
MSMBG17A MSMBJ17A 17 18.9 – 20.9 1 27.6 21.7 1
MSMBG18A MSMBJ18A 18 20.0 – 22.1 1 29.2 20.5 1
MSMBG20A MSMBJ20A 20 22.2 – 24.5 1 32.4 18.5 1
MSMBG22A MSMBJ22A 22 24.4 – 26.9 1 35.5 16.9 1
MSMBG24A MSMBJ24A 24 26.7 – 29.5 1 38.9 15.4 1
MSMBG26A MSMBJ26A 26 28.9 – 31.9 1 42.1 14.2 1
MSMBG28A MSMBJ28A 28 31.1 – 34.4 1 45.4 13.2 1
MSMBG30A MSMBJ30A 30 33.3 – 36.8 1 48.4 12.4 1
MSMBG33A MSMBJ33A 33 36.7 – 40.6 1 53.3 11.3 1
MSMBG36A MSMBJ36A 36 40.0 – 44.2 1 58.1 10.3 1
MSMBG40A MSMBJ40A 40 44.4 – 49.1 1 64.5 9.3 1
MSMBG43A MSMBJ43A 43 47.8 – 52.8 1 69.4 8.6 1
MSMBG45A MSMBJ45A 45 50.0 – 55.3 1 72.7 8.3 1
MSMBG48A MSMBJ48A 48 53.3 – 58.9 1 77.4 7.7 1
MSMBG51A MSMBJ51A 51 56.7 – 62.7 1 82.4 7.3 1
MSMBG54A MSMBJ54A 54 60.0 – 66.3 1 87.1 6.9 1
MSMBG58A MSMBJ58A 58 64.4 – 71.2 1 93.6 6.4 1
MSMBG60A MSMBJ60A 60 66.7 – 73.7 1 96.8 6.2 1
MSMBG64A MSMBJ64A 64 71.1 – 78.6 1 103 5.8 1
MSMBG70A MSMBJ70A 70 77.8 – 86.0 1 113 5.3 1
MSMBG75A MSMBJ75A 75 83.3 – 92.1 1 121 4.9 1
MSMBG78A MSMBJ78A 78 86.7 – 95.8 1 126 4.7 1
MSMBG85A MSMBJ85A 85 94.4 – 104 1 137 4.4 1
MSMBG90A MSMBJ90A 90 100 – 111 1 146 4.1 1
MSMBG100A MSMBJ100A 100 111 – 123 1 162 3.7 1
MSMBG110A MSMBJ110A 110 122 – 135 1 177 3.4 1
MSMBG120A MSMBJ120A 120 133 – 147 1 193 3.1 1
MSMBG130A MSMBJ130A 130 144 – 159 1 209 2.9 1
MSMBG150A MSMBJ150A 150 167 – 185 1 243 2.5 1
MSMBG160A MSMBJ160A 160 178 – 197 1 259 2.3 1
MSMBG170A MSMBJ170A 170 189 – 209 1 275 2.2 1
RF01000, Rev. C (1/4/13) ©2013 Microsemi Corporation Page 3 of 7
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MSMBG5.0A – MXLSMBG170CAe3,
MSMBJ5.0A – MXLSMBJ170CAe3
GRAPHS
PPP - Peak Pulse Power - kW
tw – Pulse Width µs
FIGURE 1
Peak Pulse Power vs Pulse Time
Pulse Current in Percent of IPP
t – Time – ms
Test waveform parameters: tr=10 µs, tp=1000µs
FIGURE 2
Pulse Waveform for 10/1000 Exponential Surge
RF01000, Rev. C (1/4/13) ©2013 Microsemi Corporation Page 4 of 7
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MSMBG5.0A – MXLSMBG170CAe3,
MSMBJ5.0A – MXLSMBJ170CAe3
GRAPHS (continued)
Peak Pulse Power (PPP) or continuous
Power in Percent of 25°C Rating
T L Lead Temperature °C
FIGURE 3
Derating Curve
C – Capacitance - Picofarads
V (BR) - Breakdown Voltage - Volts
FIGURE 4
Typical Capacitance vs. Breakdown Voltage
NOTE: Bidirectional capacitance is half that shown at zero volts.
RF01000, Rev. C (1/4/13) ©2013 Microsemi Corporation Page 5 of 7
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MSMBG5.0A – MXLSMBG170CAe3,
MSMBJ5.0A – MXLSMBJ170CAe3
PACKAGE DIMENSIONS
SMBG (DO-215AA)
Dimensions
Ltr Inch Millimeters
Min Max Min Max
A .077 .083 1.96 2.10
B .160 .180 4.06 4.57
C .130 .155 3.30 3.94
E .077 .104 1.95 2.65
F .235 .255 5.97 6.48
K .015 .030 .381 .762
SMBJ (DO-214AA)
Dimensions
Ltr Inch Millimeters
Min Max Min Max
A .077 .083 1.96 2.10
B .160 .180 4.06 4.57
C .130 .155 3.30 3.94
D .205 .220 5.21 5.59
E .077 .104 1.95 2.65
L .030 .060 .760 1.52
See pad layout on next page.
RF01000, Rev. C (1/4/13) ©2013 Microsemi Corporation Page 6 of 7
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MSMBG5.0A – MXLSMBG170CAe3,
MSMBJ5.0A – MXLSMBJ170CAe3
PAD LAYOUT
SMBG (DO-215AA)
Ltr Inch Millimeters
A 0.320 8.13
B 0.085 2.16
C 0.110 2.79
SMBJ (DO-214AA)
Ltr Inch Millimeters
A 0.260 6.60
B 0.085 2.16
C 0.110 2.79
RF01000, Rev. C (1/4/13) ©2013 Microsemi Corporation Page 7 of 7
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Datasheets for electronic components.
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