DATA SHEET

SURFACE MOUNT MULTILAYER

CERAMIC CAPACITORS
General purpose class II
X6S
4 V TO 50 V
100 pF to 47µF

Product Specification – February 07, 2023 V.7

 Product specification 2

Surface Mount Multilayer Ceramic Capacitors

11
General Purpose X6S 4 V to 50 V

SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER,

This specification describes X6S All part numbers are identified by the series, size, tolerance, TC material,
series chip capacitors with lead- packing style, voltage, process code, termination and capacitance value.
free terminations.
YAGEO BRAND ordering code
APPLICATIONS GLOBAL PART NUMBER (PREFERRED )
PCs, Hard disk, Game PCs
CC XXXX X X X6S X BB XXX
Power supplies (1) (2) (3) (4) (5)
DVD players
Mobile phones (1) SIZE – INCH BASED (METRIC)
Data processing 0201 (0603)
0402 (1005)
FEATURES 0603 (1608)
Supplied in tape on reel 0805 (2012)
Nickel-barrier end termination 1206 (3216)
RoHS compliant 1210 (3225)
Halogen free compliant (2) TOLERANCE

K = ± 10%
M = ± 20%

(3) PACKING STYLE

R = Paper/PE taping reel; Reel 7 inch
K = Blister taping reel; Reel 7 inch
P = Paper/PE taping reel; Reel 13 inch
F = Blister taping reel; Reel 13 inch
C = Bulk case

(4) RATED VOLTAGE

4=4V
5 = 6.3 V
6 = 10 V
7 = 16 V
8 = 25 V
9 = 50 V

(5) CAPACITANCE VALUE

2 significant digits+number of zeros
The 3rd digit signifies the multiplying factor, and letter R is decimal point
Example: 103 = 10 x 103 = 10,000 pF = 10 nF

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 Product specification 3

Surface Mount Multilayer Ceramic Capacitors

11
General Purpose X6S 4 V to 50 V

CONSTRUCTION
The capacitor consists of a
rectangular block of ceramic handbook, 4 columns
terminations

dielectric in which a number of

interleaved metal electrodes are
contained. This structure gives
electrodes
rise to a high capacitance per
unit volume.
The inner electrodes are
connected to the two end
terminations and finally covered
MLB457
with a layer of plated tin (NiSn).
Thterminations are lead-free. A ceramic material

cross section of the structure is Fig. 1 Surface mount multilayer ceramic capacitor construction
shown in Fig.1.

DIMENSION

Table 1 For outlines see fig. 2

L2 / L3 (mm) L4 (mm) OUTLINES
TYPE L1 (mm) W (mm) T (MM)
min. max. min.
For dimension see Table 1
0.6 ± 0.03 0.3 ± 0.03 0.3 ± 0.03
0201 0.10 0.20 0.20
0.6± 0.09 0.3 ± 0.09 0.3± 0.09
1.0 ± 0.05 0.5 ± 0.05 0.5 ± 0.05
T W
1.0 ± 0.1 0.5 ± 0.1 0.5 ± 0.1
0402 0.15 0.35 0.30
1.0 ± 0.15 0.5 ± 0.15 0.5 ± 0.15 L2 L4 L3

1.0 ± 0.20 0.5 ± 0.20 0.5 ± 0.20

MBB211
L1

1.6± 0.10 0.8 ± 0.10 0.8 ± 0.10

0603 1.6 ± 0.15 0.8 ± 0.15 0.8 ± 0.15 0.20 0.60 0.40 Fig. 2 Surface mount multilayer
ceramic capacitor dimension
1.6 ± 0.20 0.8 ± 0.20 0.8 ± 0.20
0805 2.0± 0.20 1.25 ± 0.20 1.25 ± 0.20 0.25 0.75 0.70
1206 3.2 ± 0.30 1.6 ± 0.20 1.6 ± 0.20 0.25 0.75 1.40
3.2 ± 0.40 2.5 ± 0.30 2.5 ± 0.20
1210 0.25 0.75 1.40
3.2 ± 0.40 2.5 ± 0.30 2.5 ± 0.30

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 Product specification 4

Surface Mount Multilayer Ceramic Capacitors

11
General Purpose X6S 4 V to 50 V

CAPACITANCE RANGE & THICKNESS FOR X6S

Table 2 Sizes from 0201 to 0603

CAP. 0201 0402 0603

6.3V 10V 16V 25V 6.3 V 10 V 16 V 25 V 4V 6.3 V 10 V 16 V 25 V 50 V
100 nF 0.3± 0.03 0.3± 0.03 0.3± 0.03 0.3± 0.03

220 nF 0.3± 0.03 0.3± 0.03 0.5± 0.05 0.5± 0.05 0.5± 0.05 0.5± 0.05
470 nF 0.3± 0.09 0.3± 0.09 0.5± 0.05 0.5± 0.05 0.5± 0.1
1 uF 0.3± 0.09 0.5± 0.05 0.5± 0.05 0.5± 0.1 0.8± 0.1 0.8± 0.1 0.8± 0.1 0.8± 0.1 0.8± 0.1
2.2 uF 0.5± 0.20 0.5± 0.20 0.8± 0.1 0.8± 0.1 0.8± 0.1 0.8± 0.2
4.7 uF 0.5± 0.15 0.8± 0.2 0.8± 0.2
10 uF 0.8± 0.2 0.8± 0.2
22 uF 0.8± 0.2 0.8± 0.2
47 uF

Table 3 Sizes from 0805 to 1210

CAP. 0805 1206 1210
6.3 V 10 V 16 V 25 V 50 V 6.3 V 10 V 16 V 25 V 6.3 V 10 V 16V

100 nF

220 nF

470 nF

1 uF

2.2 uF 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2
4.7 uF 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2
10 uF 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.6± 0.2 1.6± 0.2 1.6± 0.2 1.6± 0.2
22 uF 1.25± 0.2 1.6± 0.2 1.6± 0.2
47 uF 2.5± 0.2 2.5± 0.2
100 uF

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 Product specification 5

Surface Mount Multilayer Ceramic Capacitors

11
General Purpose X6S 4 V to 50 V

THICKNESS CLASSES AND PACKING QUANTITY

Table 4
Ø 180 MM / 7 INCH Ø 330 MM / 13 INCH
SIZE THICKNESS TAPE WIDTH QUANTITY
CODE CLASSIFICATION QUANTITY PER REEL Paper Blister Paper Blister PER BULK CASE
0201 0.3 ± 0.03 mm 8 mm 15,000 --- 50,000 --- ---
0402 0.5 ± 0.05 mm 8 mm 10,000 --- 50,000 --- 50,000
0603 0.8 ± 0.1 mm 8 mm 4,000 --- 15,000 --- 15,000
0805 1.25 ± 0.2 mm 8 mm --- 3,000 --- 10,000 5,000
1206 1.6 ± 0.2 mm 8 mm --- 2,000 --- 8,000 ---
1210 2.5± 0.2/0.3 mm 8 mm --- 500 --- --- ---

ELECTRICAL CHARACTERISTICS
X6S DIELECTRIC CAPACITORS; NISN TERMINATIONS
Unless otherwise specified, all tests and measurements shall be made under standard atmospheric conditions
for testing as given in 5.3 of IEC 60068-1:
- Temperature: 15 °C to 35 °C
- Relative humidity: 25% to 75%
- Air pressure: 86 kPa to 106 kPa
Before the measurements are made, the capacitor shall be stored at the measuring temperature for a time
sufficient to allow the entire capacitor to reach this temperature.
The period as prescribed for recovery at the end of a test is normally sufficient for this purpose.
Table 5

DESCRIPTION VALUE
Capacitance range 100 nF to 100 µF
Capacitance tolerance ± 10% and ± 20%
Dissipation factor (D.F.) ≤10%
Insulation resistance after 1 minute at Ur (DC) Rins × Cr ≥ 100 / 50 Ω.F *
Maximum capacitance change as a function of temperature
± 22%
(temperature characteristic/coefficient):
Operating temperature range: –55 °C to +105 °C
Note:
Rins × Cr ≥ 100 Ω.F Rins × Cr ≥ 50 Ω.F
0201: 100nF to 470nF 0201: 100nF / 16V to 25V, 1uF
0603: 1uF, 2.2uF/ 6.3V to 16V, 4.7uF/ 6.3V to 16V 0402: 220nF/ 6.3V to 25V, 470nF/ 6.3V to 16V,
0805: 2.2uF, 4.7uF to 10uF/ 6.3V to 16V 1uF to 2.2uF/ 6.3V to 16V, 4.7uF/ 6.3V
1206: 10uF/ 6.3V to 16V, 22uF/ 6.3V to 10V 0603: 2.2uF/ 25V, 4.7uF/ 25V, 10uF to 22uF
0805: 4.7uF/ 50V, 10uF/ 25V, 22uF to 47uF
1206: 10uF/ 25V, 22uF/ 16V, 47uF to 100uF
1210: 47uF to 100uF

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 Product specification 6

Surface Mount Multilayer Ceramic Capacitors

11
General Purpose X6S 4 V to 50 V

SOLDERING RECOMMENDATION
Table 6
SOLDERING SIZE
METHOD ≤ 0402 0603 0805 1206 ≥ 1210
Reflow Reflow only ≥ 1.0 µF ≥ 2.2 µF ≥ 4.7 µF Reflow only
Reflow/Wave --- < 1.0 µF < 2.2 µF < 4.7 µF ---

TESTS AND REQUIREMENTS

Table 7 Test procedures and requirements
TEST TEST METHOD PROCEDURE REQUIREMENTS
Mounting IEC 60384- 4.3 The capacitors may be mounted on printed-circuit boards or No visible damage
21/22 ceramic substrates

Visual IEC 60384- 4.4 Any applicable method using × 10 magnification In accordance with specification
Inspection and 21/22
Dimension
Check

Capacitance (1) IEC 60384- 4.5.1 Class 2: Within specified tolerance

21/22 At 20 °C, 24 hrs after annealing
Cap ≤ 1 µF, f = 1 KHz, measuring at voltage 1 Vrms at 20 °C
Cap > 1 µF, f = 1 KHz for C ≤ 10 µF, rated voltage > 6.3 V,
measuring at voltage 1 Vrms at 20 °C
f = 1 KHz, for C ≤ 10 µF, rated voltage ≤ 6.3 V, measuring at
voltage 0.5 to 1 Vrms at 20 °C
f = 120 Hz for C > 10 µF, measuring at voltage 0.5 Vrms at 20 °C

Dissipation IEC 60384- 4.5.2 Class 2: In accordance with specification

Factor (D.F.) (1) 21/22 At 20 °C, 24 hrs after annealing
Cap ≤ 1 µF, f = 1 KHz, measuring at voltage 1 Vrms at 20 °C
Cap > 1 µF, f = 1 KHz for C ≤ 10 µF, rated voltage > 6.3 V,
measuring at voltage 1 Vrms at 20 °C
f = 1 KHz, for C ≤ 10 µF, rated voltage ≤ 6.3 V, measuring at
voltage 0.5 Vrms at 20 °C
f = 120 Hz for C > 10 µF, measuring at voltage 0.5 Vrms at 20 °C

Insulation IEC 60384- 4.5.3 At Ur (DC) for 1 minute In accordance with specification
Resistance 21/22

NOTE
1. The figure indicates typical inspection. Please refer to individual specifications.

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 Product specification 7

Surface Mount Multilayer Ceramic Capacitors

11
General Purpose X6S 4 V to 50 V

TEST TEST METHOD PROCEDURE REQUIREMENTS

Temperature IEC 60384- 4.6 Capacitance shall be measured by the steps shown in the X6S: ∆ C/C: ±22%
Characteristic 21/22 following table.
The capacitance change should be measured after 5 min at
each specified temperature stage.
Step Temperature(°C)
a 25± 2
b Lower temperature± 3°C
c 25± 2
d Upper Temperature± 2°C
e 25± 2

Class II
Capacitance Change shall be calculated from the formula
as below
C2 - C1
∆C = x 100%
C1
C1: Capacitance at step c
C2: Capacitance at step b or d

Adhesion IEC 60384- 4.7 A force applied for 10 seconds to the line joining the Force
21/22 terminations and in a plane parallel to the substrate size ≥ 0603: 5N
size = 0402: 2.5N
size = 0201: 1N

Bending IEC 60384- 4.8 Mounting in accordance with IEC 60384-22 paragraph 4.3 No visible damage
Strength 21/22
Conditions: bending 1 mm at a rate of 1 mm/s, radius jig ∆C/C
5 mm X6S: ± 10%

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 Product specification 8

Surface Mount Multilayer Ceramic Capacitors

11
General Purpose X6S 4 V to 50 V

TEST TEST METHOD PROCEDURE REQUIREMENTS

Resistance to IEC 60384- 4.9 Precondition: 150 +0/–10 °C for 1 hour, then keep for Dissolution of the end face plating shall
Soldering 21/22 24 ± 1 hours at room temperature not exceed 25% of the length of the
Heat Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 edge concerned
minute ∆C/C
Preheating: for size >1206: 100 °C to 120 °C for 1 X6S: ± 10%
minute and 170 °C to 200 °C for 1 minute
D.F. within initial specified value
Solder bath temperature: 260 ± 5 °C
Rins within initial specified value
Dipping time: 10 ± 0.5 seconds
Recovery time: 24 ± 2 hours

Solderability IEC 60384- 4.10 Preheated the temperature of 80 °C to 140 °C and The solder should cover over 95% of
21/22 maintained for 30 seconds to 60 seconds. the critical area of each termination

1. Temperature: 235± 5°C / Dipping time: 2 ± 0.5 s

2. Temperature: 245± 5°C / Dipping time: 3 ± 0.5 s
(lead free)
Depth of immersion: 10mm

Rapid Change IEC 60384- 4.11 Preconditioning; No visual damage

of 21/22 150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at
Temperature room temperature ∆C/C
X6S: ± 15%
5 cycles with following detail:
30 minutes at lower category temperature
30 minutes at upper category temperature
D.F. meet initial specified value
Recovery time 24 ± 2 hours Rins meet initial specified value

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 Product specification 9

Surface Mount Multilayer Ceramic Capacitors

11
General Purpose X6S 4 V to 50 V

TEST TEST METHOD PROCEDURE REQUIREMENTS

Damp Heat IEC 60384- 4.13 1. Preconditioning, class 2 only: No visual damage after recovery
with Ur Load 21/22 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour
∆C/C
at room temp
2. Initial measure:
Spec: refer to initial spec C, D, IR ± 20%
3. Damp heat test: D.F.
500 ± 12 hours at 40 ± 2 °C;
90 to 95% R.H. 1.0 Ur applied 2 x initial value max
4. Recovery: Rins
Class 2: 24 ± 2 hours
5. Final measure: C, D, IR
Rins x Cr ≥ 5s
P.S. If the capacitance value is less than the minimum
value permitted, then after the other measurements
have been made the capacitor shall be
preconditioned according to “IEC 60384 4.1” and
then the requirements shall be met.

Endurance IEC 60384- 4.14 1. Preconditioning, class 2 only: No visual damage

21/22 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour
at room temp ∆C/C
2. Initial measure:
Spec: refer to initial spec C, D, IR ± 20%
3. Endurance test:: D.F.
Temperature: X6S: 105 °C
Specified stress voltage applied for 1,000 hours: 2 x initial value max
Applied 1.5 x Ur. Rins
Applied 1 Ur:
0201: 1uF
Rins x Cr ≥ 10s
0402: 4.7uF, 10uF
0603: 10uF, 22uF
0805: 10uF/ 25V, 22uF/ 10V to 16V
Recovery time: 24 ± 2 hours
4. Final measure: C, D, IR
P.S. If the capacitance value is less than the minimum
value permitted, then after the other measurements
have been made the capacitor shall be
preconditioned according to “IEC 60384 4.1” and
then the requirements shall be met.

Voltage Proof IEC 60384-1 4.6 Specified stress voltage applied for 1~5 seconds No breakdown or flashover
Ur ≤ 100 V: series applied 2.5 Ur
Charge/Discharge current is less than 50 mA

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 Product specification 10

Surface Mount Multilayer Ceramic Capacitors

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General Purpose X6S 4 V to 50 V

REVISION HISTORY
REVISION DATE CHANGE NOTIFICATION DESCRIPTION
Version 7 Feb. 07, 2023 - - Product range updated
Version 6 Jan. 20, 2021 - - Product range updated
Version 5 Jun. 2, 2020 - - Product range updated
Version 4 Aug 7, 2017 - - 0402 Dimension update

Version 3 Jul 19, 2017 - - Product range updated

Version 2 Feb. 20, 2017 - - Dimension & capacitance update

Version 1 Sep. 16, 2015 - - Dimension & capacitance update

Version 0 Nov. 18, 2014 - - New datasheet for general purpose High Cap X6S

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 Product specification

Surface-Mount Ceramic Multilayer Capacitors

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