Ads 7038
Ads 7038
                                                                                                                                                                        ADS7038
                                                                                                                               SBAS979B – JUNE 2019 – REVISED JUNE 2020
           ADS7038 Small, 8-Channel, 12-Bit ADC with SPI Interface, GPIOs, and CRC
1 Features                                                                                 2 Applications
1•   Small package size:                                                                   •      Macro remote radio units (RRU)
     – WQFN 3 mm × 3 mm                                                                    •      Battery management systems (BMS)
•    8 channels configurable as any combination of:                                        •      String inverters
     – Up to 8 analog inputs, digital inputs, or digital                                   •      Central inverters
        outputs
•    GPIOs for I/O expansion:                                                              3 Description
     – Open-drain, push-pull digital outputs                                               The ADS7038 is an easy-to-use, 8-channel,
                                                                                           multiplexed,       12-bit,     1-MSPS,      successive
•    Analog watchdog:                                                                      approximation register analog-to-digital converter
     – Programmable thresholds per channel                                                 (SAR ADC). The eight channels can be
     – Event counter for transient rejection                                               independently configured as either analog inputs,
                                                                                           digital inputs, or digital outputs. The device has an
•    Wide operating ranges:                                                                internal oscillator for the ADC conversion process.
     – AVDD: 2.35 V to 5.5 V
                                                                                           The ADS7038 communicates through an SPI-
     – DVDD: 1.65 V to 5.5 V                                                               compatible interface and operates in either
     – –40°C to +125°C temperature range                                                   autonomous or single-shot conversion mode. The
•    Enhanced-SPI digital interface:                                                       ADS7038 implements the analog watchdog function
                                                                                           by event-triggered interrupts per channel using a
     – High-speed, 60-MHz interface                                                        digital window comparator with programmable high
     – Achieve full throughput with >13.5-MHz SPI                                          and low thresholds, hysteresis, and an event counter.
•    CRC for read/write operation:                                                         The ADS7038 has a built-in cyclic redundancy check
                                                                                           (CRC) for data read/write operations and the power-
     – CRC on data read/write
                                                                                           up configuration.
     – CRC on power-up configuration
•    Programmable averaging filters:                                                                                        Device Information(1)
     – Programmable sample size for averaging                                                  PART NUMBER                    PACKAGE                  BODY SIZE (NOM)
     – 16-bit resolution                                                                     (1) For all available packages, see the orderable addendum at
                                                                                                 the end of the datasheet.
                                                                                                                 VCC
                                                                  High/Low Threshold                                                            AVDD
                                                                     ± Hysteresis
                                                                                                        DVDD
                                                                                                                     LOAD
       An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
       intellectual property matters and other important disclaimers. PRODUCTION DATA.
ADS7038
SBAS979B – JUNE 2019 – REVISED JUNE 2020                                                                                                                                 www.ti.com
                                                                           Table of Contents
    1   Features ..................................................................        1         8.3 Feature Description................................................. 14
    2   Applications ...........................................................           1         8.4 Device Functional Modes........................................ 23
    3   Description .............................................................          1         8.5 ADS7038 Registers................................................. 27
    4   Revision History.....................................................              2   9    Application and Implementation ........................ 67
                                                                                                     9.1 Application Information............................................ 67
    5   Device Comparison Table.....................................                       3
                                                                                                     9.2 Typical Applications ................................................ 67
    6   Pin Configuration and Functions .........................                          4
                                                                                               10 Power Supply Recommendations ..................... 70
    7   Specifications.........................................................            5
                                                                                                     10.1 AVDD and DVDD Supply Recommendations....... 70
        7.1    Absolute Maximum Ratings ......................................             5
        7.2    ESD Ratings..............................................................   5   11 Layout................................................................... 71
                                                                                                     11.1 Layout Guidelines ................................................. 71
        7.3    Recommended Operating Conditions.......................                     5
                                                                                                     11.2 Layout Example .................................................... 71
        7.4    Thermal Information ..................................................      5
        7.5    Electrical Characteristics...........................................       6   12 Device and Documentation Support ................. 72
        7.6    Timing Requirements ................................................        7         12.1    Receiving Notification of Documentation Updates                             72
        7.7    Switching Characteristics ..........................................        7         12.2    Support Resources ...............................................           72
        7.8    Typical Characteristics ..............................................      9         12.3    Trademarks ...........................................................      72
                                                                                                     12.4    Electrostatic Discharge Caution ............................                72
    8   Detailed Description ............................................ 13
                                                                                                     12.5    Glossary ................................................................   72
        8.1 Overview ................................................................. 13
        8.2 Functional Block Diagram ....................................... 13                13 Mechanical, Packaging, and Orderable
                                                                                                  Information ........................................................... 72
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
                                                                    RTE Package
                                                                    16-Pin WQFN
                                                                      Top View
AIN1/GPIO1
AIN0/GPIO0
                                                                                                           SCLK
                                                                                                    SDI
                                                                        16
15
14
                                                                                                           13
                                            AIN2/GPIO2         1                                                   12          SDO
                                            AIN3/GPIO3         2                                                   11          CS
                                                                                     Thermal
                                            AIN4/GPIO4         3                              Pad                  10          DVDD
                                            AIN5/GPIO5         4                                                   9           GND
                                                                        5
                                                                                                           8
                                                                        AIN6/GPIO6
AIN7/GPIO7
AVDD
                                                                   Pin Functions
           PIN
                             FUNCTION (1)                                                                           DESCRIPTION
      NAME          NO.
AIN0/GPIO0          15         AI, DI, DO        Channel 0; can be configured as either an analog input (default), digital input, or digital output.
AIN1/GPIO1          16         AI, DI, DO        Channel 1; can be configured as either an analog input (default), digital input, or digital output.
AIN2/GPIO2           1         AI, DI, DO        Channel 2; can be configured as either an analog input (default), digital input, or digital output.
AIN3/GPIO3           2         AI, DI, DO        Channel 3; can be configured as either an analog input (default), digital input, or digital output.
AIN4/GPIO4           3         AI, DI, DO        Channel 4; can be configured as either an analog input (default), digital input, or digital output.
AIN5/GPIO5           4         AI, DI, DO        Channel 5; can be configured as either an analog input (default), digital input, or digital output.
AIN6/GPIO6           5         AI, DI, DO        Channel 6; can be configured as either an analog input (default), digital input, or digital output.
AIN7/GPIO7           6         AI, DI, DO        Channel 7; can be configured as either an analog input (default), digital input, or digital output.
                                                 Analog supply input, also used as the reference voltage to the ADC; connect a 1-µF
AVDD                 7           Supply
                                                 decoupling capacitor to GND.
                                                 Chip-select input pin; active low. The device takes control of the data bus when CS is low.
CS                  11              DI           The device starts converting the active input channel on the rising edge of CS. SDO goes hi-Z
                                                 when CS is high.
DECAP                8           Supply          Connect a 1-µF decoupling capacitor to GND for the internal power supply.
DVDD                10           Supply          Digital I/O supply voltage; connect a 1-µF decoupling capacitor to GND.
GND                  9           Supply          Ground for the power supply; all analog and digital signals are referred to this pin voltage.
SCLK                13              DI           Serial clock for the SPI interface.
SDI                 14              DI           Serial data in for the device.
SDO                 12             DO            Serial data out for the device.
Thermal pad          —           Supply          Exposed thermal pad; connect to GND.
7 Specifications
7.1 Absolute Maximum Ratings
Over operating ambient temperature range (unless otherwise noted) (1).
                                                                                                                 MIN        MAX          UNIT
DVDD to GND                                                                                                      –0.3        5.5          V
AVDD to GND                                                                                                      –0.3        5.5          V
AINx / GPOx (2) to GND                                                                                 GND – 0.3 AVDD + 0.3               V
Digital input to GND                                                                                   GND – 0.3             5.5          V
                                              (3)
Current through any pin except supply pins                                                                       –10          10          mA
Junction temperature, TJ                                                                                         –40         125          °C
Storage temperature, Tstg                                                                                        –60         150          °C
(1)   Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
      only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
      Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)   AINx / GPIOx refers to pins 1, 2, 3, 4, 5, 6, 15, and 16.
(3)   Pin current must be limited to 10 mA or less.
(1)   JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)   JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) AINx refers to AIN0, AIN1, AIN2, AIN3, AIN4, AIN5, AIN6, and AIN7.
(1)   For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
      report.
tCYCLE
tCONV tACQ
               Acquiring
       CS      Sample N        Converting Sample N                                   Acquiring Sample N+1
                                          HI-Z
      SDI                                                          MSB     MSB-1            MSB-2               LSB+1        LSB
                                          HI-Z
     SDO                                                           MSB     MSB-1            MSB-2               LSB+1        LSB
tQUIET
SCLK
tCLK
                                                                                                       tPH_CK                 tPL_CK
        CS                                                                        SCLK(1)
tSU_CKDI
SCLK(1) SDI
SDO SDO
(1) The SCLK polarity, launch edge, and capture edge depend on the SPI protocol selected.
                                         45000                                                                                                           0
                                                             39581
                                                                                                                                                       -30
                                                                                                                   Amplitude (dB)
                                         30000
                                                                                        25955                                                          -60
  Frequency
                                                                                                                                                       -90
                                         15000
-120
                                             0                                                                                                        -150
                                                             2048                       2049                                                                  0         100         200        300        400        500
                                                                                                                                                                                    Frequency (kHz)                      C008
                                                                        Output Code                     C001
                                                                                                                                                                  fIN = 2 kHz, SNR = 73.2 dB, THD = –92.1 dB
                                                        Standard deviation = 0.49 LSB
                                                                                                                                                                                 Figure 4. Typical FFT
                                                             Figure 3. DC Input Histogram
                                          0.8                                                                                                          0.8
       Differential Nonlinearity (LSB)
0.4 0.4
0 0
-0.4 -0.4
                                          -0.8                                                                                                        -0.8
                                                 0       1024             2048          3072          4095                                                   0            1024          2048           3072         4095
                                                                       Output Code                     C002
                                                                                                                                                                                     Output Code                     C004
                                                             Typical DNL = ±0.5 LSB                                                                                           Typical INL = ±0.5 LSB
                                          0.3                                                                                                         0.45
                                                                                                               Integral Nonlinearity (LSB)
0.1 0.15
-0.1 -0.15
-0.3 -0.45
                                         -0.5                                                                                                         -0.75
                                            -40         -7            26         59        92         125                                                 -40            -7          26         59        92         125
                                                                     Temperature (qC)                  C003
                                                                                                                                                                                    Temperature (qC)                     C005
0.3 0.45
-0.1 -0.15
-0.3 -0.45
                                       -0.5                                                                                        -0.75
                                           2.5     3         3.5      4       4.5        5   5.5                                        2.5     3          3.5      4       4.5        5       5.5
                                                                   AVDD (V)                   C018
                                                                                                                                                                 AVDD (V)                       C019
                                       1.2                                                                                         0.03
                                                                                                     Gain Error (%FSR)
     Offset Error (LSB)
0.4 0.01
-0.4 -0.01
-1.2 -0.03
                                         -2                                                                                        -0.05
                                          -40          -7       26         59       92       125                                       -40          -7        26         59       92           125
                                                               Temperature (°C)               C006
                                                                                                                                                             Temperature (°C)                   C007
                                                 Figure 11. Offset Error vs Temperature                                                       Figure 12. Gain Error vs Temperature
                                         2                                                                                         0.05
                                       1.2                                                                                         0.03
                                                                                                     Gain Error (%FSR)
     Offset Error (LSB)
0.4 0.01
-0.4 -0.01
-1.2 -0.03
                                         -2                                                                                        -0.05
                                           2.5     3         3.5      4       4.5        5   5.5                                        2.5     3          3.5      4       4.5        5       5.5
                                                                   AVDD (V)                   C016
                                                                                                                                                                 AVDD (V)                       C017
Figure 13. Offset Error vs AVDD Figure 14. Gain Error vs AVDD
                                                                                                                                                                                                                                      ENOB (Bits)
                            73                                                              11.7                                     72.5                                                                       11.7
                                         Figure 15. Noise Performance vs Temperature                                                                     Figure 16. Noise Performance vs AVDD
                     -90.3                                                                    94.8                                       -82                                                                     96
                                          THD                                                                                                          THD
                                          SFDR(dBFS)                                                                                                   SFDR
                                                                                                                                         -84                                                                     94
                     -90.5                                                                    94.4
                                                                                                         SFDR (dBFS)
                                                                                                                                                                                                                        SFDR (dBFS)
THD (dBFS)
THD (dBFS)
                                                                                                                                         -86                                                                     92
                     -90.7                                                                    94
-88 90
                     -90.9                                                                    93.6
                                                                                                                                         -90                                                                     88
                                       Figure 17. Distortion Performance vs Temperature                                                                Figure 18. Distortion Performance vs AVDD
                                 490                                                                                                          500
                                 484
                                                                                                                                              480
                                 478
                    IAVDD (PA)
IAVDD (PA)
                                                                                                                                              460
                                 472
                                                                                                                                              440
                                 466
                                 460                                                                                                          420
                                   -40            -7       26         59           92         125                                                2.5         3         3.5        4             4.5       5       5.5
                                                          Temperature (°C)                        C013                                                                         AVDD (V)                            C014
Figure 19. Analog Supply Current vs Temperature Figure 20. Analog Supply Current vs AVDD
400
300
                                   IAVDD (PA)
                                                200
100
                                                 0
                                                      0         200      400         600        800      1000
                                                                        Throughput (kSPS)                  C015
8 Detailed Description
8.1 Overview
The ADS7038 is a small, eight-channel, multiplexed, 12-bit, 1-MSPS, analog-to-digital converter (ADC) with an
enhanced-SPI serial interface. The eight channels of the ADS7038 can be individually configured as either
analog inputs, digital inputs, or digital outputs. The device includes a digital comparator which can be used to
interrupt the host when a programmed high or low threshold is crossed on any input channel. The device uses an
internal oscillator for conversion. The ADC can be used in manual mode for reading ADC data over the SPI
interface or in autonomous mode for monitoring the analog inputs without an active SPI interface.
The device features a programmable averaging filter that outputs a 16-bit result for enhanced resolution.
AVDD DECAP
                                                                               High/Low Threshold
                                                                                  ± Hysteresis
                                                                                                                     DVDD
                    AIN0 / GPIO0                                                                    Digital Window
                                                                                                     Comparator
                    AIN1 / GPIO1                                          Averager
                                                              ADC
                                                                          1 to 128
                    AIN2 / GPIO2
                    AIN3 / GPIO3
                                                                                                                     CS
                                                MUX
                    AIN4 / GPIO4
                                                          Sequencer                                                  SCLK
                    AIN5 / GPIO5                                                               SPI Interface
                                                           Pin CFG                                                   SDI
                    AIN6 / GPIO6
                                                          GPO Write                                                  SDO
                    AIN7 / GPIO7
                                                           GPI Read                           CRC (optional)
                                                                                                                     GND
GPO_VALUE[0]
AVDD GPIO_CFG[0]
GPI_VALUE[0]
PIN_CFG[0]
AIN0 / GPIO0
RSW
SW
AIN7 / GPIO7
PIN_CFG[7]
GPI_VALUE[7]
GPIO_CFG[7]
GPO_VALUE[7]
During acquisition, the SW switch is closed to allow the signal on the selected analog input channel to charge the
internal sampling capacitor. During conversion, the SW switch is opened to disconnect the analog input channel
from the sampling capacitor.
The multiplexer channels can be configured as GPIOs in the PIN_CFG register. The direction of a GPIO (either
as an input or an output) can be set in the GPIO_CFG register. The logic level on the channels configured as
digital inputs can be read from the GPI_VALUE register. The digital outputs can be accessed by writing to the
GPO_VALUE register. The digital outputs can be configured as either open-drain or push-pull in the
GPO_DRIVE_CFG register.
8.3.2 Reference
The device uses the analog supply voltage (AVDD) as a reference for the analog-to-digital conversion process.
TI recommends connecting a 1-µF, low-equivalent series resistance (ESR) ceramic decoupling capacitor
between the AVDD and GND pins.
MC + 1
MC
NFSC+1
                                                    NFSC                                                                           VIN
                                                            1 LSB          AVDD/2 (AVDD/2 + 1 LSB)    (AVDD ± 1 LSB)
                         CS
                                                           N ± 1 conversions triggered
                                                                    internally
                                                  tAVG = N samples x tCYCLE
                    SCLK
16 clocks
In autonomous mode of operation, samples from analog input channels that are enabled in the
AUTO_SEQ_CH_SEL register are averaged sequentially. The digital window comparator compares the top 12
bits of the 16-bit average result with the thresholds.
Equation 2 provides the LSB value of the 16-bit average result.
                AVDD
    1 LSB
                 216                                                                                                                              (2)
When the ADS7038 detects a CRC error on the SPI interface, the erroneous data are ignored and the
CRCERR_IN bit is set. Additional notifications can be enabled as described in Table 2. Further register writes are
disabled until the CRCERR_IN bit is cleared by writing 1b to this bit. When using autonomous conversion mode,
further conversions can be disabled on a CRC error on the SPI interface by setting CONV_ON_ERR = 1b.
Digital outputs can be configured to logic 1 or 0 by writing to the GPO_VALUE register. Reading the GPI_VALUE
register returns the logic level for all channels configured as digital inputs or digital outputs. The GPI_VALUE
register can be read to detect a failure in external components, such as a floating pullup resistor or a low-
impedance pulldown resistor, that prevents digital outputs being set to the desired logic level.
The conversion time of the device, given by tCONV in the Switching Characteristics table, is independent of the
OSC_SEL and CLK_DIV[3:0] configuration.
CS
                    SCLK
                                         1          2            12       13        14       15     16     17        18        19        20
EVENT_RGN[0]
                 Programmable                                              Event
     ADC         Averaging Filter                                         Counter                   ALERT_CH_SEL[0]
The low-side threshold, high-side threshold, event counter, and hysteresis parameters are independently
programmable for each input channel. Figure 27 illustrates that the window comparator can monitor events for
every analog input channel.
                0xFFF             xxxxxxxxxxxxxxxxxxxxxxxxx
                                  xxxxxxxxxxxxxxxxxxxxxxxxx                        0xFFF
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                  xxxxxxxxxxxxxxxxxxxxxxxxx                                                                 High threshold -
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                          Signal above limit
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                                              Hysteresis
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                                            High threshold -
                   Digital code
Hysteresis
                                                                                      Digital code
                                                                                                                            Low threshold +
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                                              Hysteresis
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                                            Low threshold +
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                             Signal below limit
                                                              Hysteresis                             xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                0x000                                                              0x000
                                                  Samples                                                         Samples
                0xFFF             xxxxxxxxxxxxxxxxxxxxxxxxx
                                  xxxxxxxxxxxxxxxxxxxxxxxxx                        0xFFF
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                          Signal out of band
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                  xxxxxxxxxxxxxxxxxxxxxxxxx                                                                 High threshold -
                                                            High threshold -                         xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                                              Hysteresis
                   Digital code
                                                              Hysteresis
                                                                                      Digital code
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                     DWC_CH_POL = 0                                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                              Signal in band
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                                            Low threshold +                          xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                     xxxxxxxxxxxxxxxxxxxxxxxxx
                                                              Hysteresis                                                    Low threshold +
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                  xxxxxxxxxxxxxxxxxxxxxxxxx                                                                   Hysteresis
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                                                                                         DWC_CH_POL = 1
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                                          Signal out of band
                                  xxxxxxxxxxxxxxxxxxxxxxxxx
                0x000             xxxxxxxxxxxxxxxxxxxxxxxxx                        0x000
                                                  Samples                                                         Samples
To enable the digital window comparator, set the DWC_EN bit in the GENERAL_CFG register. By default,
hysteresis = 0, high threshold = 0xFFF, and low threshold = 0x000. For detecting when a signal is in-band, the
EVENT_RGN register must be configured. In each of the cases shown in Figure 27, either or both
ALERT_HIGH_FLAG and ALERT_LOW_FLAG can be set. The programmable event counter counts consecutive
threshold violations before alert flags are set. The event count can be set to a higher value to avoid transients in
the input signal setting the alert flags.
In order to assert the ALERT signal (internal) when the alert flag is set for a particular analog input channel, set
the corresponding bit in the DWC_CH_SEL register. Alert flags are set, irrespective of the DWC_CH_SEL
configuration, if DWC_EN = 1 and high or low thresholds are exceeded.
Digital output 7
Digital output 0
                                                                GPO0_TRIG_EVENT_SEL[7:0]
                                           trigger
GPO_TRIGGER_UPDATE_EN [0]
0 GPO_OUTPUT_VALUE [0]
1 GPO_VALUE_ON_TRIGGER [0]
8.3.10.2.1.1 Trigger
The following events can act as triggers for updating the value on the digital output:
• An alert on one or more analog input channels. The digital window comparator must be enabled for these
   channels.
• An alert on one or more digital input channels. The digital window comparator must be enabled for these
   channels.
Configure the GPOx_TRIG_EVENT_SEL register to select which channels, analog inputs, or digital inputs can
trigger an update on the digital output pin. After configuring the triggers for updating a digital output, the logic can
be enabled by configuring the corresponding bit in the GPO_TRIGGER_UPDATE_EN register.
On power-up or after coming out of any asynchronous reset, the device supports the SPI-00 protocol for data
read and data write operations. To select a different SPI-compatible protocol, program the CPOL_CPHA[1:0]
field. This first write operation must adhere to the SPI-00 protocol. Any subsequent data transfer frames must
adhere to the newly-selected protocol.
CS CS
                                                                                     CPOL = 0
         CPOL = 0
                                                                            SCLK
SCLK
CPOL = 1 CPOL = 1
SDO MSB MSB-1 MSB-2 LSB+1 LSB SDO 0 MSB MSB-1 LSB+1 LSB
                    Figure 29. Standard SPI Timing Protocol                                 Figure 30. Standard SPI Timing Protocol
                                   (CPHA = 0)                                                              (CPHA = 1)
CS
                             SCLK
                                                           1      2           8          9      10           16       17       18            24
                                                               0000 1000b
                                 SDI                                                         8-bit Address                 8-bit Data
                                                               (WR_REG)
CS
SCLK
                1      2          8    9      10           16     17     18         24                            1        2          8       9      10           16   17     18         24
                    0001 0000b
SDI                                        8-bit Address               0000 0000b                                     Command                     8-bit Address             8-bit Data
                    (RD_REG)
                                                                                                                                          Optional; can set SDI = 0
The device powers up in manual mode and can be configured into either of these modes by writing the
configuration registers for the desired mode.
                                                                       Idle
                                                                   SEQ_MODE = 0
                                                                  CONV_MODE = 0
                                                          No           Same              Yes
                                                                     Channel ID?
In manual mode, the command to switch to a new channel (indicated by cycle N in Figure 34) is decoded by the
device on the CS rising edge. The CS rising edge is also the start of the conversion signal, and therefore the
device samples the previously selected MUX channel in cycle N+1. The newly selected analog input channel
data are available in cycle N+2. For switching the analog input channel, a register write to the MANUAL_CHID
field requires 24 clocks; see the Register Write section for more details. After a channel is selected, the number
of clocks required for reading the output data depends on the device output data frame size; see the Output Data
Format section for more details.
tCONV tCYCLE
CS
SCLK
100-ns 24 clocks
MUX MUX OUT = AINx MUX OUT = AINy MUX OUT = AINz
tCONV tCYCLE
CS
SCLK
                              1                 24                 1    2      3        4     5         12                    1   2       3     4     5          12
5 clocks
                                  SEQ_MODE =
 SDI                                                               1        4-bit AINy ID                                 1           4-bit AINz ID
                                      10b
12 clocks 12 clocks
24 clocks
MUX MUX OUT = AINx MUX OUT = AINx MUX OUT = AINy MUX OUT = AINz
The number of clocks required for reading the output data depends on the device output data frame size; see the
Output Data Format section for more details.
tCYCLE
CS
SCLK
SDI SEQ_START
SDO Data AINx Data AINx Data AIN2 Data AIN6 Data AIN2
24 clocks 12 clocks
MUX MUX OUT = AINx MUX OUT = AIN2 MUX OUT = AIN6 MUX OUT = AIN2 MUX OUT = AIN6
Figure 37 shows the steps for configuring the functional mode to autonomous mode. Abort the on-going
sequence by setting the SEQ_START to 0b before changing the functional mode or configuration of device.
                                                                Idle
                                                            SEQ_MODE = 0
                                                           CONV_MODE = 0
                                                                                                                     Channel
                                                                                                                     selection
                                       Enable analog inputs for sequencing (AUTO_SEQ_CHSEL)
                                           Select Auto-sequence mode (SEQ_MODE = 01b)
       Active Operation
        (Host can sleep)                                                      No              (optional) read conversion results in
                                                               ALERT?                      MIN_VALUE_CHx, MAX_VALUE_CHx, and
                                                                                                 LAST_VALUE_CHx registers
Yes
Complex bit access types are encoded to fit into small table cells. Table 10 shows the codes that are used for
access types in this section.
                                                           NOTE
               Information in the following applications sections is not part of the TI component
               specification, and TI does not warrant its accuracy or completeness. TI’s customers are
               responsible for determining suitability of components for their purposes. Customers should
               validate and test their design implementation to confirm system functionality.
                                                    Analog Input
                                                    Analog Input                    SPI
                                                                        Device             Controller
                                                    Analog Input
                                                    Analog Input
                                                     Digital Input
                                                     Digital Input
ADC
                                                           SW
                                            AVDD
GPIx
RPULL_UP
GPOx
ILOAD
The minimum value of the pullup resistor, as calculated in Equation 3, is given by the ratio of VPULL_UP and the
maximum current supported by the device digital output (5 mA).
      RMIN = (VPULL_UP / 5 mA)                                                                                                             (3)
The maximum value of the pullup resistor, as calculated in Equation 4, depends on the minimum input current
requirement, ILOAD, of the receiving device driven by this GPIO.
      RMAX = (VPULL_UP / ILOAD)                                                                                                            (4)
Select RPULL_UP such that RMIN < RPULL_UP < RMAX.
                                                    30000
                                                                                          25955
                                        Frequency
                                                    15000
                                                        0
                                                                  2048                    2049
                                                                           Output Code                    C001
AVDD
                                                                      Q1
                                                                                 GPOx
                                                                                               Digital
                                                                                               output
Q2
AVDD AVDD
                                                            1 PF
                                                                          DECAP
1 PF
GND GND
                                                            1 PF
                                           DVDD                           DVDD
11 Layout
                                                                          DVDD
                                                               SDO
                                                                                 GND
                                                                     CS
SCLK DECAP
SDI AVDD
AIN/GPIO
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
         This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
         appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
         ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
         susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary.
   This glossary lists and explains terms, acronyms, and definitions.
                                                       3.1                                      B
                                  A
                                                       2.9
                                                                                                                                SIDE WALL
                                                                                                                            METAL THICKNESS
                                                                                                                                   DIM A
                                                                                                                           OPTION 1     OPTION 2
                                                                                                                             0.1          0.2
                                                                                                      C
                        0.8 MAX
                                                                                                            SEATING PLANE
                           0.05
                           0.00                                                                             0.08
                           4X                             17                                 SYMM
                           1.5
                                      1
                                                                                         12
                                                                                                          0.30
                                                                                                    16X
                                                                                                          0.18
                        PIN 1 ID                16               13                                       0.1      C A B
                     (OPTIONAL)                      SYMM
                                                                                                          0.05
                                                               0.5
                                                        16X
                                                               0.3
4219117/B 04/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
   per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
                                                                                   www.ti.com
                                                                                        EXAMPLE BOARD LAYOUT
RTE0016C                                                                                         WQFN - 0.8 mm max height
                                                                                                          PLASTIC QUAD FLATPACK - NO LEAD
                                                                    ( 1.68)
                                                                     SYMM
                                                         16                      13
16X (0.6)
                                          1
                                                                                                     12
                        16X (0.24)
                                                                         17                                        SYMM
                                                                                                                          (2.8)
                                                                                                          (0.58)
                                                                                                           TYP
                            12X (0.5)
                                                                                                     9
                                          4
                            ( 0.2) TYP
                                    VIA
                                                         5                        8
                              (R0.05)                  (0.58) TYP
                    ALL PAD CORNERS
                                                                     (2.8)
                                                                                                                    SOLDER MASK
                                                     METAL                                                          OPENING
                     EXPOSED                                                     EXPOSED
                                                      SOLDER MASK                  METAL                              METAL UNDER
                       METAL
                                                      OPENING                                                         SOLDER MASK
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
   number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
   on this view. It is recommended that vias under paste be filled, plugged or tented.
                                                                       www.ti.com
                                                                              EXAMPLE STENCIL DESIGN
RTE0016C                                                                                 WQFN - 0.8 mm max height
                                                                                              PLASTIC QUAD FLATPACK - NO LEAD
                                                            ( 1.55)
                                              16                                  13
16X (0.6)
                               1
                                                                                                 12
16X (0.24)
                                                                  17                                  SYMM
                                                                                                             (2.8)
12X (0.5)
                                                                                                 9
                               4
                       METAL
                  ALL AROUND
                                                   5                          8
                                                             SYMM
                     (R0.05) TYP
(2.8)
4219117/B 04/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
  design recommendations.
                                                                 www.ti.com
                                                                                                                                                     PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2021
PACKAGING INFORMATION
           Orderable Device             Status    Package Type Package Pins Package             Eco Plan            Lead finish/           MSL Peak Temp          Op Temp (°C)                   Device Marking       Samples
                                          (1)                  Drawing        Qty                   (2)             Ball material                  (3)                                                (4/5)
                                                                                                                         (6)
ADS7038IRTER ACTIVE WQFN RTE 16 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 7038
ADS7038IRTET ACTIVE WQFN RTE 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 7038
(1)
   The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
   RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
      MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
      There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
   Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
   Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
                                                                                                Addendum-Page 1
                                                                                                                   PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2021
• Automotive : ADS7038-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
                                                                                              Addendum-Page 2
                                                                   PACKAGE MATERIALS INFORMATION
www.ti.com 8-May-2020
                                                           Pack Materials-Page 1
                                                                PACKAGE MATERIALS INFORMATION
www.ti.com 8-May-2020
                                                        Pack Materials-Page 2
                                                                  GENERIC PACKAGE VIEW
RTE 16                                                                  WQFN - 0.8 mm max height
3 x 3, 0.5 mm pitch                                                         PLASTIC QUAD FLATPACK - NO LEAD
               This image is a representation of the package family, actual package may vary.
                             Refer to the product data sheet for package details.
4225944/A
                                                    www.ti.com
                                                                                                                    PACKAGE OUTLINE
RTE0016C                                                             SCALE 3.600
                                                                                                                 WQFN - 0.8 mm max height
                                                                                                                    PLASTIC QUAD FLATPACK - NO LEAD
                                                       3.1                                      B
                                  A
                                                       2.9
                                                                                                                                SIDE WALL
                                                                                                                            METAL THICKNESS
                                                                                                                                   DIM A
                                                                                                                           OPTION 1     OPTION 2
                                                                                                                             0.1          0.2
                                                                                                      C
                        0.8 MAX
                                                                                                            SEATING PLANE
                           0.05
                           0.00                                                                             0.08
                           4X                             17                                 SYMM
                           1.5
                                      1
                                                                                         12
                                                                                                          0.30
                                                                                                    16X
                                                                                                          0.18
                        PIN 1 ID                16               13                                       0.1      C A B
                     (OPTIONAL)                      SYMM
                                                                                                          0.05
                                                               0.5
                                                        16X
                                                               0.3
4219117/B 04/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
   per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
                                                                                   www.ti.com
                                                                                        EXAMPLE BOARD LAYOUT
RTE0016C                                                                                         WQFN - 0.8 mm max height
                                                                                                          PLASTIC QUAD FLATPACK - NO LEAD
                                                                    ( 1.68)
                                                                     SYMM
                                                         16                      13
16X (0.6)
                                          1
                                                                                                     12
                        16X (0.24)
                                                                         17                                        SYMM
                                                                                                                          (2.8)
                                                                                                          (0.58)
                                                                                                           TYP
                            12X (0.5)
                                                                                                     9
                                          4
                            ( 0.2) TYP
                                    VIA
                                                         5                        8
                              (R0.05)                  (0.58) TYP
                    ALL PAD CORNERS
                                                                     (2.8)
                                                                                                                    SOLDER MASK
                                                     METAL                                                          OPENING
                     EXPOSED                                                     EXPOSED
                                                      SOLDER MASK                  METAL                              METAL UNDER
                       METAL
                                                      OPENING                                                         SOLDER MASK
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
   number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
   on this view. It is recommended that vias under paste be filled, plugged or tented.
                                                                       www.ti.com
                                                                              EXAMPLE STENCIL DESIGN
RTE0016C                                                                                 WQFN - 0.8 mm max height
                                                                                              PLASTIC QUAD FLATPACK - NO LEAD
                                                            ( 1.55)
                                              16                                  13
16X (0.6)
                               1
                                                                                                 12
16X (0.24)
                                                                  17                                  SYMM
                                                                                                             (2.8)
12X (0.5)
                                                                                                 9
                               4
                       METAL
                  ALL AROUND
                                                   5                          8
                                                             SYMM
                     (R0.05) TYP
(2.8)
4219117/B 04/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
  design recommendations.
                                                                 www.ti.com
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