MP23ABS1

High-performance MEMS audio sensor:

single-ended analog bottom-port microphone
Datasheet - production data

Description
The MP23ABS1 is a compact, low-power
microphone built with a capacitive sensing
element and an IC interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process to
produce audio sensors.
The MP23ABS1 has an acoustic overload point of
RHLGA metal cap 5-lead 130 dBSPL with a typical 64 dB signal-to-noise
3.5 x 2.65 x 0.98 mm ratio.
The sensitivity of the MP23ABS1 is -38 dBV
±1 dB @ 94 dBSPL, 1 kHz.
Features The MP23ABS1 is available in a package
compliant with reflow soldering and is guaranteed
 Single supply voltage operation 1.52 V - 3.6 V to operate over an extended temperature range
 Omnidirectional sensitivity from -40 °C to +85 °C.
 High signal-to-noise ratio
 High acoustic overload point: 130 dBSPL typ. Applications
 Package compliant with reflow soldering  Mobile phones
 Enhanced RF immunity  Wearables
 Ultra-flat frequency response  Hearables
 Low latency  Smart speakers
 Ultra-low-power: 150 μA max  Active noise-canceling headsets
 ECOPACK, RoHS, and “Green” compliant

Table 1. Device summary

Order code Temperature range (C) Package Packing

MP23ABS1 -40 to +85 (3.5 x 2.65 x 0.98) mm Tray

MP23ABS1TR -40 to +85 (3.5 x 2.65 x 0.98) mm Tape and reel

October 2020 DocID031167 Rev 6 1/15

This is information on a product in full production. www.st.com
Contents MP23ABS1

Contents

1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 MP23ABS1 schematic hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

6 Reliability tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7.1 RHLGA-5L package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7.2 Land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.3 RHLGA-5L packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2/15 DocID031167 Rev 6

MP23ABS1 Pin description

1 Pin description

Figure 1. Pin connections (bottom view)

Table 2. Pin description

Pin n° Pin name Function

1 Out Output
2 GND GND
3 GND GND
4 GND GND
5 Vdd Supply voltage

DocID031167 Rev 6 3/15

15
Acoustic and electrical specifications MP23ABS1

2 Acoustic and electrical specifications

2.1 Acoustic and electrical characteristics

The values listed in the table below are specified for Vdd = 2.75 V, no load, Tamb = 25 °C
unless otherwise specified.

Table 3. Acoustic and electrical characteristics

Symbol Parameter Test condition Min. Typ. Max. Unit

Vdd Supply voltage 1.52 2.75 3.6 V

Idd Current consumption 120 150 μA
So Sensitivity 1 kHz @ 94 dBSPL -39 -38 -37 dBV
SNR Signal-to-noise ratio 64 dB(A)
100 mVpp sine wave,
PSRR Power Supply Rejection 60 dB
1 kHz, Vdd > 1.6 V
AOP Acoustic Overload Point 130 dBSPL
(1)
Rload Load resistance 15 kΩ
Top Operating temperature range -40 +85 °C
1. Guaranteed by design

4/15 DocID031167 Rev 6

MP23ABS1 Acoustic and electrical specifications

2.2 Frequency response

Figure 2. Typical free-field frequency response normalized at 1 kHz

ϭϬ

ϲ
DĂŐŶŝƚƵĚĞ;ĚͿ

ͲϮ

Ͳϰ
ϭϬ ϭϬϬ ϭϬϬϬ ϭϬϬϬϬ
ĨƌĞƋƵĞŶĐLJ;,njͿ

Table 4. Frequency response mask

Frequency (Hz) LSL USL Unit

35 -2 0 dBr 1kHz
100 -1.5 0.5 dBr 1kHz
900 -1 1 dBr 1kHz
1000 0 0 dBr 1kHz
1100 -1 1 dBr 1kHz
8000 -1 4 dBr 1kHz
15000 0 9 dBr 1kHz

DocID031167 Rev 6 5/15

15
Absolute maximum ratings MP23ABS1

3 Absolute maximum ratings

Stresses above those listed as “Absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.

Table 5. Absolute maximum ratings

Symbol Ratings Maximum value Unit

Vdd Supply voltage -0.5 to 4.8 V

TSTG Storage temperature range -40 to +125 °C
Top Operating temperature range -40 to +105 °C

This device is sensitive to mechanical shock, improper handling can cause

permanent damage to the part.
This device is sensitive to electrostatic discharge (ESD), improper handling can
cause permanent damage to the part.

6/15 DocID031167 Rev 6

MP23ABS1 Application recommendations

4 Application recommendations

4.1 MP23ABS1 schematic hints

Figure 3. MP23ABS1 electrical connections and external component values

DocID031167 Rev 6 7/15

15
Soldering information MP23ABS1

5 Soldering information

Figure 4. Recommended soldering profile limits

WS
73
5$0383 &5,7,&$/=21(
7/ WR7 3

7/
760$; W/
7(03(5$785(

760,1

WV
35(+($7
5$03'2:1

7ƒ&WR3($.
7,0(


Table 6. Recommended soldering profile limits

Description Parameter Pb free

Average ramp rate TL to TP 3 °C/sec max

Preheat
Minimum temperature TSMIN 150 °C
Maximum temperature TSMAX 200 °C
Time (TSMIN to TSMAX) tS 60 sec to 120 sec
Ramp-up rate TSMAX to TL

Time maintained above liquidus temperature tL 60 sec to 150 sec

Liquidus temperature TL 217 °C
Peak temperature TP 260 °C max
Time within 5 °C of actual peak temperature 20 sec to 40 sec
Ramp-down rate 6 °C/sec max
Time 25 °C (t = 25 °C) to peak temperature 8 minutes max

8/15 DocID031167 Rev 6

MP23ABS1 Reliability tests

6 Reliability tests

The device passed all reliability tests on three different assembly lots under the following conditions
given in the table below.

Table 7. Reliability specifications

Test name Description Conditions

ESD-GUN: 25 discharges at ±8 kV, direct contact

to housing of MIC
To classify ESD susceptibility Reference specification IEC 61000-4-2
the device is submitted to a high ESD-HBM 3 discharges up to ±2 kV pin-to-pin
Electrostatic Discharge
voltage peak on all his pins, Reference specification ANSI/ESDA/JEDEC JS001
Immunity Test
simulating ESD stress according
(ESD) ESD-MM, 3 discharges up to ±200 V pin-to-pin
to different simulation models
(GUN, HBM, MM, CDM) Reference specification JEDEC JESD22-A115C
ESD-CDM, 3 discharges up to ±750 V
Reference specification ANSI/ESDA/JEDEC JS002
To verify latch-up immunity the
Latch-Up device is submitted to a current ±100 mA & 1.5 x Vdd @ 85 °C
(LU) injection on I/O or supply Reference specification JEDEC JESD78
overvoltage
To simulate the worst-case
High Temperature application stress conditions, the Ta 125 °C, Tj 125 °C, 1000 Hrs, @ Max Op Voltage
Operative Life device is stressed in dynamic Preconditioning (PC) before
(HTOL) configuration at operative max. Reference specification JESD22-A108
absolute ratings
To investigate failure
mechanisms activated by
Temperature Humidity electrical field and humidity, the Ta 85°C, R.H. 85%, 1000 Hrs, @ Max Op Voltage
Bias device is biased in static or Preconditioning (PC) before
(THB) dynamic operative conditions at Reference specification JESD22-A101
controlled high temperature and
relative humidity
To investigate effects of
customer manufacturing
soldering enhanced by package MSL3 as moisture soak conditions followed by n.3
Preconditioning MSL3
water absorption, the device is reflow @ Tpeak 260 °C
(PC)
submitted to typical temperature Reference specification JEDEC J-STD-020
profile after controlled moisture
absorption
To investigate the failure
mechanisms activated by
extremely cold conditions, the
Low Temperature Storage Ta = -40 °C, 1000 Hrs
device is stored in unbiased
(LTS) Reference specification JESD22-A120
condition at the min.
temperature allowed by the
package materials

DocID031167 Rev 6 9/15

15
Reliability tests MP23ABS1

Table 7. Reliability specifications (continued)

Test name Description Conditions

To investigate the failure

mechanisms activated by high
temperature, the device is
High Temperature Storage Ta = 125 °C, 1000 Hrs
stored in unbiased condition at
(HTS) Reference specification JESD22-A104
the maximum temperature
allowed by the package
materials
To investigate failure modes
related to thermo-mechanical
Low T = - 40 °C, High T = +125 °C, 1000 Cys
Temperature Cycling stress, the device is submitted to
Preconditioning (PC) before
(TC) cycled temperature excursions,
Reference specification JESD22-A105
between a hot and a cold
chamber in air atmosphere
To investigate degradations
induced by wet conditions, the Ta = 85°C, R.H. = 85%, 1000Hrs
Temperature Humidity
device is stored at controlled Preconditioning (PC) before
Storage (THS)
high temperature and relative Reference specification JESD22-A102
humidity
To investigate durability to
Microphone soldered on PCB which is mounted on
mechanical repeated drops
Random Free-Fall on PCB a specific jig
without any preferential impact
(TUMBLE) Random drop from 1 mt on steel base, 300 drops
direction simulating drop effect
Reference specification IEC 60068-2-32
on handheld devices
To verify durability of the whole Microphone soldered on PCB which is mounted on
device to mechanical shocks, a specific jig
Guided Free-Fall on PCB
done by controlling height and Guided drop from 1.5 mt on marble base,
(GFF)
impact direction simulating drop 2 drops x 6 directions
effect on handheld devices Reference specification IEC 60068-2-32
Microphone membrane is subjected to repeated air
Test dedicated on the MEMS
pulses controlled on duration, rise and fall time and
Compressed Air Test Microphone to check
amplitude.
(CAT) mechanical robustness of
Amplitude is varied with increasing steps.
sensor membrane alone
ST internal specification
To verify mechanical robustness
of internal structural elements
Five pulses of 10,000 g in each of six directions
Mechanical Shock (MEMS, package components)
with duration time 0.2 ms
(MS) to withstand severe shocks
Reference specification MIL 883, Method 2002.5
produced by handling,
transportation or field operations
The vibration variable frequency
Variable Frequency test is performed to determine Peak acceleration of 20 g, from 20 Hz to 2000 Hz in
Vibration the effect of vibration, within a three perpendicular directions
(VB) specified frequency range, on Reference specification MIL 883, Method 2007.3-A
the internal structural elements

10/15 DocID031167 Rev 6

MP23ABS1 Package information

7 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

7.1 RHLGA-5L package information

Figure 5. RHLGA metal cap 5-lead (3.5 x 2.65 x 0.98 mm) package outline and mechanical data

'LPHQVLRQVDUHLQPLOOLPHWHUXQOHVVRWKHUZLVHVSHFLILHG
*HQHUDO7ROHUDQFHLVPPXQOHVVRWKHUZLVHVSHFLILHG

287(5',0(16,216

,7(0 ',0(16,21>PP@ 72/(5$1&(>PP@

/HQJWK>/@  “
: LGWK>: @  “
+HLJKW>+@ 0$; 

'0B

DocID031167 Rev 6 11/15

15
Package information MP23ABS1

7.2 Land pattern

Figure 6. Land pattern and recommended stencil opening

/DQGSDWWHUQ 6WHQFLORSHQLQJ
 


   

 



  




ij

ij 
ij  ij
ij   

12/15 DocID031167 Rev 6

MP23ABS1 Package information

7.3 RHLGA-5L packing information

Figure 7. Carrier tape information for RHLGA-5L package

DocID031167 Rev 6 13/15

15
Revision history MP23ABS1

8 Revision history

Table 8. Document revision history

Date Revision Changes

08-Nov-2017 1 Initial release

Updated Figure 2: Typical free-field frequency response normalized
29-Jan-2018 2 at 1 kHz
Added Table 4
Document status promoted to production data
27-Mar-2018 3
Modified title of Table 4
Updated Table 3: Acoustic and electrical characteristics
Updated storage temperature range in Table 5: Absolute maximum
29-Nov-2018 4 ratings
Updated Table 7: Reliability specifications
Added Section 7.2: Land pattern
11-Feb-2019 5 Added Figure 7: Carrier tape information for RHLGA-5L package
Added operating temperature range to Table 5: Absolute maximum
28-Oct-2020 6
ratings

14/15 DocID031167 Rev 6

MP23ABS1

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other
product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2020 STMicroelectronics – All rights reserved

DocID031167 Rev 6 15/15

15