PC8171xNSZ0F Series

DIP 4pin High CMR,

PC8171xNSZ0F Low Input Current
Series Photocoupler

■ Description ■ Agency approvals/Compliance

PC8171xNSZ0F Series contains an IRED optically 1. Recognized by UL1577 (Double protection isolation),
coupled to a phototransistor. file No. E64380 (as model No. PC8171)
It is packaged in a 4pin DIP, available in SMT gullw- 2. Package resin : UL flammability grade (94V-0)
ing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V, CTR is 100% to ■ Applications
600% at input current of 0.5mA and CMR is MIN. 1. Programmable controllers
10kV/µs. 2. Facsimiles
3. Telephones

■ Features
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Low input current type (IF=0.5mA)
4. High collector-emitter voltage(VCEO : 80V)
5. High noise immunity due to high common rejection
voltage (CMR : MIN. 10kV/µs)
6. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant

Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A03302EN
1 Date Jun. 30. 2005
© SHARP Corporation
 PC8171xNSZ0F Series

■ Internal Connection Diagram

1 Anode
1 4
2 Cathode
3 Emitter
2 3
4 Collector

■ Outline Dimensions (Unit : mm)

1. Through-Hole [ex. PC8171xNSZ0F] 2. SMT Gullwing Lead-Form [ex. PC8171xNIP0F]

Rank mark Rank mark
Anode mark Anode mark
Factory identification mark Factory identification mark

1.2±0.3
1.2±0.3

0.6±0.2
0.6±0.2

Date code Date code

1 4

4.58±0.5
1 4
4.58±0.5

8 1 7 1 2 8 1 7 1 3
2 3
2.54±0.25

2.54±0.25
6.5±0.5 6.5±0.5

7.62±0.3 4.58±0.5
7.62±0.3 4.58±0.5

0.35±0.25
±0.1

3.5±0.5
0.5TYP.
3.5±0.5

0.26
3.0±0.5

Epoxy resin
2.7±0.5

Epoxy resin 2.54±0.25

1.0+0.4
−0 1.0+0.4
−0

10.0+0
−0.5
0.5±0.1
θ θ
θ : 0 to 13˚

Product mass : approx. 0.23g Product mass : approx. 0.22g

Plating material : SnCu (Cu : TYP. 2%)

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

Date code (2 digit)

1st digit 2nd digit
Year of production Month of production
A.D. Mark A.D Mark Month Mark
1990 A 2002 P January 1
1991 B 2003 R February 2
1992 C 2004 S March 3
1993 D 2005 T April 4
1994 E 2006 U May 5
1995 F 2007 V June 6
1996 H 2008 W July 7
1997 J 2009 X August 8
1998 K 2010 A September 9
1999 L 2011 B October O
2000 M 2012 C November N
2001 N ·· ·· December D
· ·

repeats in a 20 year cycle

Factory identification mark

Factory identification Mark Country of origin
no mark
Japan

Indonesia

China
* This factory making is for identification purpose only.
Please contact the local SHARP sales representative to see
the actual status of the production.

Rank mark
Refer to the Model Line-up table

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

■ Absolute Maximum Ratings (Ta=25˚C)

Parameter Symbol Rating Unit
Forward current IF 10 mA
*1
Input

Peak forward current IFM 200 mA

Reverse voltage VR 6 V
Power dissipation P 15 mW
Collector-emitter voltage VCEO 80 V
Output

Emitter-collector voltage VECO 6 V

Collector current IC 50 mA
Collector power dissipation PC 150 mW
Total power dissipation Ptot 170 mW
*2
Isolation voltage Viso (rms) 5.0 kV
Operating temperature Topr −30 to +100 ˚C
Storage temperature Tstg −55 to +125 ˚C
*3
Soldering temperature Tsol 260 ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s

■ Electro-optical Characteristics (Ta=25˚C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit
Forward voltage VF IF=10mA − 1.2 1.4 V
Input Reverse Current IR VR=4V − − 10 µA
Terminal capacitance Ct V=0, f=1kHz − 30 250 pF
Collector dark current ICEO VCE=50V, IF=0 − − 100 nA
Output Collector-emitter breakdown voltage BVCEO IC=0.1mA, IF=0 80 − − V
Emitter-collector breakdown voltage BVECO IE=10µA, IF=0 6 − − V
Collector current IC IF=0.5mA, VCE=5V 0.5 − 3.0 mA
Collector-emitter saturation voltage VCE (sat) IF=10mA, IC=1mA − − 0.2 V
Isolation resistance RISO DC500V, 40 to 60%RH 5×1010 1×1011 − Ω
Transfer Floating capacitance Cf V=0, f=1MHz − 0.6 1.0 pF
charac-
Rise time tr − 4 18 µs
teristics Response time VCE=2V, IC=2mA, RL=100Ω
Fall time tf − 3 18 µs
Ta=25˚C, RL=470Ω, VCM=1.5kV(peak)
Common mode rejection voltage CMR IF=0, VCC=9V, Vnp=100mV 10 − − kV/µs

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

■ Model Line-up
Lead Form Through-Hole SMT Gullwing
IC [mA]
Sleeve Taping Rank mark
Package (IF=0.5mA, VCE=5V, Ta=25˚C)
100pcs/sleeve 2 000pcs/reel
PC81710NSZ0F PC81710NIP0F with or without 0.5 to 3.0
PC81711NSZ0F PC81711NIP0F A 0.6 to 1.5
PC81712NSZ0F PC81712NIP0F B 0.8 to 2.0
Model No. PC81713NSZ0F PC81713NIP0F C 1.0 to 2.5
PC81715NSZ0F PC81715NIP0F A or B 0.6 to 2.0
PC81716NSZ0F PC81716NIP0F B or C 0.8 to 2.5
PC81718NSZ0F PC81718NIP0F A, B or C 0.6 to 2.5

Please contact a local SHARP sales representative to inquire about production status.

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

Fig.1 Test Circuit for Common Mode Rejection Voltage

(dV/dt)

VCM

VCC 1)
RL Vnp Vcp Vnp
 VCM : High wave VO

 pulse (Vcp Nearly = dV/dt×Cf×RL)
VCM  RL=470Ω 1) Vcp : Voltage which is generated by displacement current in floating
 VCC=9V capacitance between primary and secondary side.

Fig.2 Forward Current vs. Ambient Fig.3 Diode Power Dissipation vs. Ambient
Temperature Temperature
15

Diode power dissipation P (mW) 15

Forward current IF (mA)

10

10

5
5

0 0
−30 0 25 50 75 100 125 −30 0 25 50 75 100 125
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)

Fig.4 Collector Power Dissipation vs. Fig.5 Total Power Dissipation vs. Ambient
Ambient Temperature Temperature
250 250
Collector power dissipation PC (mW)

Total power dissipation Ptot (mW)

200 200

170
150 150

100 100

50 50

0 0
−30 0 25 50 75 100 125 −30 0 25 50 75 100 125
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

Fig.6 Peak Forward Current vs. Duty Ratio Fig.7 Forward Current vs. Forward Voltage

1 000 100
Pulse width≤100µs
Ta=25˚C
Peak forward current IFM (mA)

Forward current IF (mA)

10

100 Ta=25˚C
Ta=100˚C
Ta=0˚C
1 Ta=75˚C Ta=−25˚C
Ta=50˚C

10 0.1
10−3 10−2 10−1 1 0 0.5 1.0 1.5 2.0
Duty ratio Forward voltage VF (V)

Fig.8 Current Transfer Ratio vs. Forward Fig.9 Collector Current vs. Collector-emitter
Current Voltage
800 40
VCE=5V
Ta=25˚C
700 Ta=25˚C
PC (MAX.)
Current transfer ratio CTR (%)

600 30
Collector current IC (mA)

IF=7mA
500

400 20 IF=5mA IF=3mA

300
IF=2mA
200 10
IF=1mA IF=0.5mA
100

0 0
0.1 1 10 0 2 4 6 8 10
Forward current IF (mA) Collector-emitter voltage VCE (V)

Fig.10 Relative Current Transfer Ratio vs. Fig.11 Collector - emitter Saturation Voltage
Ambient Temperature vs. Ambient Temperature
150 0.16
IF=10mA
Collector-emitter saturation voltage VCE (sat) (V)

IC=1mA
VCE=5V 0.14
Relative current transfer ratio (%)

IF=0.5mA
0.12
100
0.1

0.08

0.06
50
0.04

0.02

0 0
−30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

Fig.12 Collector Dark Current vs. Ambient Fig.13 Response Time vs. Load Resistance
Temperature (active region)
10−5 100
VCE=50V VCE=2V, IC=2mA

10−6
Collector dark current ICEO (A)

10−7

Responce time (µs)

tr
10−8 10 tf

td
10−9

ts
10−10

10−11 1
−30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 0.1 1 10
Ambient temperature Ta (˚C) Load resistance RL (kΩ)

Fig.14 Response Time vs. Load Resistance Fig.15 Test Circuit for Response Time
(saturation region)
1 000
Vcc=5V, IF=1mA, Ta=25˚C VCC

RD RL
Output Input
tf Input Output
ts 10%
Responce time (µs)

100 VCE
90%
td ts
tr tf

10
tr Please refer to the conditions in Fig.13 and Fig.14.

td

1
1 10 100
Load resistance RL (kΩ)

Fig.16 Frequency Response Fig.17 Collector-emitter Saturation Voltage

vs. Forward Current
5 5
Collector-emitter saturation voltage VCE (sat) (V)

IC=7mA
VCE=2V Ta=25˚C
0 IC=2mA IC=5mA
4
Ta=25˚C IC=3mA
RL=10kΩ
Voltage gain AV (dB)

−5 IC=2mA
3
1kΩ
IC=1mA
−10
IC=0.5mA
100Ω
2
−15

1
−20

−25 0
0.1 1 10 100 1 000 0 2 4 6 8 10
Frequency f (kHz) Forward current IF (mA)

Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

■ Design Considerations
● Design guide
While operating at IF<0.5mA, CTR variation may increase.
Please make design considering this fact.

In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through IRED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of IRED.

This product is not designed against irradiation and incorporates non-coherent IRED.

● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.

● Recommended Foot Print (reference)

8.2
2.54

1.7

2.2
(Unit : mm)

✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)

300 Terminal : 260˚C peak

( package surface : 250˚C peak)

200

Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less

0
0 1 2 3 4 (min)

Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.

Flow soldering should be completed below 270˚C and within 10s.

Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.

Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.

Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less

Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.

Recommended solvent materials:

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.

● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)

Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer

Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless
stopper side.
MAX. 20 sleeves in one case.

Sleeve outline dimensions

12.0

±2
520
10.8
5.8

6.7 (Unit : mm)

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

● Tape and Reel package

Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F D J
E G I

C
B
A
H

H X.
MA
K

5˚
Dimensions List (Unit : mm)
A B C D E F G
16.0 ±0.3 7.5±0.1 1.75±0.1 8.0±0.1 2.0±0.1 4.0±0.1 +0.1
φ1.5−0
H I J K
10.4 ±0.1 0.4±0.05 4.2±0.1 5.1±0.1

Reel structure and Dimensions

e d

g
c

Dimensions List (Unit : mm)

a b c d
330 17.5±1.5 100 ±1.0 13±0.5
f e f g
a b 23 ±1.0 2.0±0.5 2.0±0.5

Direction of product insertion

Pull-out direction

[Packing : 2 000pcs/reel]

Sheet No.: D2-A03302EN

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 PC8171xNSZ0F Series

■ Important Notices
· The circuit application examples in this publication are with equipment that requires higher reliability such as:
provided to explain representative applications of --- Transportation control and safety equipment (i.e.,
SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.)
circuit design or license any intellectual property rights. --- Traffic signals
SHARP takes no responsibility for any problems --- Gas leakage sensor breakers
related to any intellectual property right of a third party --- Alarm equipment
resulting from the use of SHARP's devices. --- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
· Contact SHARP in order to obtain the latest device connection with equipment that requires an extremely
specification sheets before using any SHARP device. high level of reliability and safety such as:
SHARP reserves the right to make changes in the --- Space applications
specifications, characteristics, data, materials, --- Telecommunication equipment [trunk lines]
structure, and other contents described herein at any --- Nuclear power control equipment
time without notice in order to improve design or --- Medical and other life support equipment (e.g.,
reliability. Manufacturing locations are also subject to scuba).
change without notice.
· If the SHARP devices listed in this publication fall
· Observe the following points when using any devices within the scope of strategic products described in the
in this publication. SHARP takes no responsibility for Foreign Exchange and Foreign Trade Law of Japan, it
damage caused by improper use of the devices which is necessary to obtain approval to export such SHARP
does not meet the conditions and absolute maximum devices.
ratings to be used specified in the relevant specification
sheet nor meet the following conditions: · This publication is the proprietary product of SHARP
(i) The devices in this publication are designed for use and is copyrighted, with all rights reserved. Under the
in general electronic equipment designs such as: copyright laws, no part of this publication may be
--- Personal computers reproduced or transmitted in any form or by any
--- Office automation equipment means, electronic or mechanical, for any purpose, in
--- Telecommunication equipment [terminal] whole or in part, without the express written permission
--- Test and measurement equipment of SHARP. Express written permission is also required
--- Industrial control before any use of this publication may be made by a
--- Audio visual equipment third party.
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant · Contact and consult with a SHARP representative if
design should be taken to ensure reliability and safety there are any questions about the contents of this
when SHARP devices are used for or in connection publication.

[E187] Sheet No.: D2-A03302EN

14