VL53L1X

Datasheet

A new generation, long distance ranging Time-of-Flight sensor based on ST's

FlightSense technology

Features
Fully integrated miniature module
• 940 nm invisible laser emitter (Class 1)
• SPAD (single photon avalanche diode) receiving array with integrated lens
• Low power microcontroller running advanced digital firmware
• 4.9 x 2.5 x 1.56 mm

Fast, accurate distance ranging

• Fast and accurate long distance ranging
– Up to 400 cm distance measurement
– Up to 50 Hz ranging frequency
• Pin-to-pin compatible with the VL53L0X FlightSense ranging sensor
Product status link • 27° typical full field of view (FoV)
VL53L1X • Programmable region of interest (ROI) size on the receiving array allows
reduction of the sensor FoV
• A programmable ROI position on the receiving array, provides multizone
operation control from the host

Eye safety
• Class 1 laser device compliant with latest standard IEC 60825-1:2014 - 3rd
edition

Easy integration
• Software driver and code example for turnkey ranging
• Single reflowable component
• Single power supply 2v8
• Can be hidden behind many cover glass materials
• I²C interface (up to 400 kHz)
• Shutdown and interrupt pins

Application
• User detection (autonomous low-power mode) to power on/off and lock/unlock
devices like personal computers/laptops and the Internet of Things (IoT)
• Service robots and vacuum cleaners (long distance and fast obstacle
detection)
• Drones (landing assistance, hovering, ceiling detection)
• Smart shelves and vending machines (goods inventory monitoring)
• Sanitary (robust user detection whatever the target reflectance)
• Smart building and smart lighting (people detection, gesture control)
• 1 D gesture recognition
• Laser assisted autofocus (AF) enhances the camera AF system's speed and
robustness, especially in difficult scenes such as low light and low contrast,
and provides video focus tracking assistance

DS12385 - Rev 8 - August 2024 www.st.com

For further information contact your local STMicroelectronics sales office.
 VL53L1X

Description
The VL53L1X is a state-of-the-art, Time-of-Flight (ToF) laser-ranging sensor, enhancing the ST FlightSense
product family. It is the fastest miniature ToF sensor on the market with accurate ranging up to 4 m and fast
ranging frequency up to 50 Hz.
Housed in a miniature and reflowable package, it integrates a SPAD receiving array, a 940 nm invisible Class 1
laser emitter, physical infrared filters, and optics to achieve the best ranging performance in various ambient
lighting conditions with a range of cover glass options.
Unlike conventional IR sensors, the VL53L1X uses ST’s latest generation ToF technology, which allows absolute
distance measurement whatever the target color and reflectance.
It is also possible to program the size of the ROI on the receiving array, allowing the sensor FoV to be reduced.

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 VL53L1X
Acronyms and abbreviations

1 Acronyms and abbreviations

Table 1. Acronyms and abbreviations

Acronym/abbreviation Definition

AMR absolute maximum rating

API application programming interface
ESD electrostatic discharge
FoV field of view
HW STANDBY hardware standby
I²C inter-integrated circuit (serial bus)
MSB most significant bit
PCB printed circuit board
ROI region of interest
SCL serial clock line
SDA serial data line
SW STANDBY software standby
SPAD single photon avalanche diode
TB timing budget
ToF Time-of-Flight
VCSEL vertical-cavity surface-emitting laser

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 VL53L1X
Product overview

2 Product overview

2.1 Technical specification

Table 2. Technical specification

Feature Detail

Package Optical LGA12

Size 4.4 x 2.5 x 1.56 mm
Operating voltage 2.6 to 3.5 V
Operating temperature -20 to 85°C
Receiver FoV (diagonal FoV) Programmable from 15 to 27 degrees
Infrared emitter 940 nm
Up to 400 kHz (fast mode) serial bus
I²C
Programmable address default is 0x52

2.2 System block diagram

Figure 1. VL53L1X block diagram

VL53L1X module

VL53L1X silicon
Single Photon
Avalanche Diode (SPAD)
GND Detection array AVDD

SDA ROM XSHUT

Non Volatile
Memory
RAM
SCL GPIO1
Microcontroller

Advanced
Ranging Core

VCSEL Driver

AVSSVCSEL IR+ IR- AVDDVCSEL

940nm

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 VL53L1X
Product overview

2.3 Device pinout

The following figure shows the pinout of the VL53L1X (see also Section 8: Outline drawings).

Figure 2. VL53L1X pinout (bottom view)

GND3

GPIO1 7 6 5 XSHUT

DNC 8 4 GND2

SDA 9 3 GND

SCL 10 2 AVSSVCSEL

AVDD 11 12 1 AVDDVCSEL

GND4

Table 3. VL53L1X pin description

Pin number Signal name Signal type Signal description

1 AVDDVCSEL Supply VCSEL supply, connect to main supply

2 AVSSVCSEL VCSEL ground, connect to main ground
3 GND Ground
Connect to the main ground
4 GND2
5 XSHUT Digital input Xshutdown pin, active low
6 GND3 Ground Connect to the main ground
7 GPIO1 Digital output Interrupt output. Open drain output
8 DNC Digital input Do not connect, must be left floating
9 SDA Digital input/output I²C serial data
10 SCL Digital input I²C serial clock input
11 AVDD Supply Supply, connect to the main supply
12 GND4 Ground Connect to the main ground

Note: AVSSVCSEL and GND are ground pins and can be connected together in the application schematics.
Note: GND2, GND3, and GND4 are standard pins that we force to the ground domain in the application schematics to
avoid possible instabilities if set to other states.

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 VL53L1X
Product overview

2.4 Application schematic

The following figure shows the application schematic of the VL53L1X.

Figure 3. VL53L1X schematic

IOVDD

AVDD
5 1
XSHUT AVDDVCSEL
7 11
GPIO1 AVDD Capacitors as
HOST 9 2 close as
SDA AVSSVCSEL
100nF 4.7µF possible to
10 3 VL53L1X
SCL GND
8 4
DNC GND2
6
GND3
12
VL53L1X GND4

Note: Place the capacitors on the external supply AVDD as close as possible to the AVDDVCSEL and AVSSVCSEL
module pins.
Note: The external pull-up resistor values can be found in the I²C-bus specification. Pull-ups are typically fitted only
once per bus, near the host. See Table 4. Suggested pull-up and series resistors for I2C fast mode for
suggested values.
Note: The XSHUT pin must always be driven to avoid leakage current. A pull-up is needed if the host state is not
known. XSHUT is needed to use hardware standby mode (there is no I²C communication).
Note: The recommended value of the XSHUT and GPIO1 pull-ups is 10 kOhms.
Note: Leave the GPIO1 unconnected if not used.
Table 4 shows the recommended values for pull-up resistors for an AVDD of 1.8 V to 2.8 V in I2C fast mode (up to
400 kHz).

Table 4. Suggested pull-up and series resistors for I2C fast mode

I2C load capacitance (CL) (1) Pull-up resistor (Ohms)

CL ≤ 90 pF 3.6 k

90 pF < CL ≤ 140 pF 2.4 k

140 pF < CL ≤ 270 pF 1.2 k

270 pF < CL ≤ 400 pF 0.8 k

1. For each bus line, CL is measured in the application PCB by the customer.

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 VL53L1X
Functional description

3 Functional description

3.1 System functional description

Figure 4. VL53L1X system functional description shows the system level functional description. The host
customer application controls the VL53L1X device using an API (application programming interface). The API
implementation is delivered to the customer as a driver (Bare C code).
The driver shares with the customer application a set of high level functions that allow control of the VL53L1X
firmware. Functions include initialization, ranging start/stop, and setting the system accuracy.
The driver enables fast development of end user applications without the complication of direct multiple register
access. The driver is structured in a way that it can be compiled on any kind of platform through a good hardware
abstraction layer.
A detailed description of the driver is available in the VL53L1X API user manual(UM2356).

Figure 4. VL53L1X system functional description

HOST
User VL53L1X VL53L1X
Application driver I2C

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 VL53L1X
Functional description

3.2 System state machine description

The following figure shows the system state machine.

Figure 5. System state machine

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 VL53L1X
Functional description

3.3 Customer manufacturing calibration flow

The VL53L1X driver includes calibration functions. To benefit from device full performances, it is recommended
they be run once at the customer production line.
Device calibration allows for the compensation of part-to-part parameter variations and the presence of a cover
glass that may affect device performance.
Calibration data stored in the host have to be loaded into the VL53L1X at each startup using a dedicated driver
function.
Three calibration steps are needed: RefSPAD, offset, and crosstalk.
RefSPAD and crosstalk calibrations have to be performed whenever the customer adds a protective cover glass
on top of the VL53L1X module.
Offset calibration has to be performed in all situations. It allows reflow and cover glass effects to be compensated.
The detailed procedure is provided in the VL53L1X API user manual (UM2356).

3.4 Ranging description

The VL53L1X software driver proposes a turnkey solution to allow fast implementation and easy ranging in all
customer applications.
Autonomous ranging mode is the default configuration that offers optimized functionalities of the VL53L1X.
• Ranging is continuous, with a programmable delay between two ranging operations (called an
intermeasurement period). The ranging duration (timing budget) is also programmable.
• The user can set distance thresholds (below, above, inside, or outside the user-defined thresholds). An
interrupt is raised only when threshold conditions are met.
• ROI size and position are programmable. The user chooses a custom FoV from 4x4 SPADs (minimum
size) up to 16x16 SPADs (full FoV).
• A clear interrupt is mandatory to allow the next ranging data to be updated.
If the ranging distance cannot be measured (when there is no target or a weak signal), a corresponding range
status is generated. The host can read the range status.
The VL53L1X software driver provides turnkey functions to read output results after the measurement. The main
values reported are:
• Ranging distance in mm
• Return signal rate
• Ambient signal rate
• Range status
Range status and output measurement definitions are provided in the VL53L1X API user manual (UM2356).

3.5 Key parameters

3.5.1 Distance mode

The VL53L1X has three distance modes (DM): short, medium, and long.
Long distance mode allows the longest possible ranging distance of 4 m to be reached. However, this maximum
ranging distance is impacted by ambient light.
Short distance mode is more immune to ambient light, but its maximum ranging distance is typically limited to 1.3
m.

Table 5. Maximum distance vs. distance mode under ambient light

Distance mode Max. distance in the dark (cm) Max. distance under strong ambient light (cm)

Short 136 135

Medium 290 76
Long 360 73

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 VL53L1X
Functional description

Test conditions
Timing budget (TB) = 100 ms, white target 88%, dark = no IR ambient, and ambient light = 200 kcps/SPAD

3.5.2 Timing budget

The VL53L1X timing budget can be set from 20 ms up to 1000 ms.
• 20 ms is the minimum timing budget and can be used only in short distance mode.
• 33 ms is the minimum timing budget which can work for all distance modes.
• 140 ms is the timing budget which allows the maximum distance of 4 m (in the dark on a white chart) to be
reached with long distance mode
Increasing the timing budget increases the maximum distance the device can range and improves the
repeatability error. However, average power consumption augments accordingly.

Figure 6. Maximum distance and repeatability error vs. timing budget

Test conditions
Timing budget = 33 ms, 40 ms, 200 ms, grey target 54%, ambient light = dark

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 VL53L1X
Functional description

3.6 Power up and boot sequence

Two options are available for device power-up/boot.

Option 1
The XSHUT pin is connected and controlled from the host.
This option optimizes power consumption. The device can be completely powered off when not used, and then
woken up through the host GPIO (using the XSHUT pin).
Hardware standby mode is the period when the power supply is present and the XSHUT is low.

Figure 7. Power-up and boot sequence

Note: The boot duration is 1.2 ms maximum.

Option 2
The host does not control the XSHUT pin. This pin is tied to the power supply value through a pull-up resistor.
When the XSHUT pin is not controlled, the power-up sequence is as shown in the following figure. In this case,
the device goes automatically to software standby after boot, without entering hardware standby.

Figure 8. Power-up and boot sequence with XSHUT not controlled

Note: The boot duration is 1.2 ms maximum.

Note: In all cases, XSHUT has to be raised only when the power supply is tied on.

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 VL53L1X
Functional description

3.7 Ranging sequences

The following figure shows the combination of the driver commands and the system states.

Figure 9. Autonomous sequence

Note: The user sets the timing budget and inter measurement timing parameters using a dedicated driver function.

3.8 Sensing array optical center

The VL53L1X module includes a lens that focuses the photons on the 16x16 SPAD-sensing array.
The sensing array optical center specification considers the part-to-part variation in production.
The optical center is defined by the coordinates Xo and Yo.
The optical center is measured for each part during a factory test at STMicroelectronics. The coordinates are
stored in the VL53L1X nonvolatile memory and are readable by the customer through the software driver in the
application. This helps optimize design alignment with the image sensor in the application and its ranging
performance.
The green array in Figure 10. Optical center specification gives the possible location of the optical center. For
more details, refer to the VL53L1X API user manual (UM2356).

Table 6. Optical center specification

Parameter Min. Typ. Max. Unit

Xo offset -2 0 2
SPAD
Yo offset -2 0 2

Figure 10. Optical center specification

2, -2

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 VL53L1X
Control interface

4 Control interface

This section specifies the control interface. The I²C interface uses two signals: serial data line (SDA) and serial
clock line (SCL). Each device connected to the bus uses a unique address and a simple controller/target
relationship exists.
Both SDA and SCL lines are connected to a positive supply voltage using pull-up resistors located on the host.
Lines are only actively driven low. A high condition occurs when lines are floating and the pull-up resistors pull
lines up. When no data are transmitted both lines are high.
Clock signal generation is performed by the controller device. The controller device initiates data transfer. The I²C
bus on the VL53L1X has a maximum speed of 400 kbits/s and uses a default device address of 0x52.

Figure 11. Data transfer protocol

Acknowledge
Start condition

SDA
MSB LSB

SCL
S 7 8 P
1 2 3 4 5 6 Ac/Am
Address or data byte
Stop condition

Information is packed in 8-bit packets (bytes) and is always followed by an acknowledge bit, Ac for the VL53L1X
acknowledge and Am for the controller acknowledge (host bus controller). The internal data are produced by
sampling SDA at a rising edge of SCL. The external data must be stable during the high period of SCL. The
exceptions to this are start (S) or stop (P) conditions when SDA falls or rises respectively, while SCL is high.
A message contains a series of bytes preceded by a start condition, and followed by either a stop or repeated
start (another start condition but without a preceding stop condition), followed by another message. The first byte
contains the device address (0x52) and also specifies the data direction. If the least significant bit is low (that is,
0x52) the message is a controller write-to-the-target. If the LSB is set (that is, 0x53) then the message is a
controller read-from-the-target.

Figure 12. I²C device address: 0x52

MSBit LSBit

0 1 0 1 0 0 1 R/W

All serial interface communications with the ToF sensor must begin with a start condition. The VL53L1X module
acknowledges the receipt of a valid address by driving the SDA wire low. The state of the read/write bit (LSB of
the address byte) is stored and the next byte of data, sampled from SDA, can be interpreted. During a write
sequence, the second byte received provides a 16-bit index, which points to one of the internal 8-bit registers.

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 VL53L1X
Control interface

Figure 13. Data format (write)

VL53L1X acknowledges Acknowledge from VL53L1X

Start valid address

S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As DATA[7:0] As P

0x52 (write)
Stop

As data are received by the target, they are written bit by bit to a serial/parallel register. After each data byte has
been received by the target, an acknowledge is generated, the data are then stored in the internal register
addressed by the current index.
During a read message, the contents of the register addressed by the current index is read out in the byte
following the device address byte. The contents of this register are parallel loaded into the serial/parallel register
and clocked out of the device by the falling edge of SCL.

Figure 14. Data format (read)

0x52 (write)
S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As P

0x53 (read)
S ADDRESS[7:0] As DATA[7:0] Am P

At the end of each byte, in both read and write message sequences, an acknowledge is issued by the receiving
device (that is, the VL53L1X for a write, and the host for a read).
A message can only be terminated by the bus controller, either by issuing a stop condition or by a negative
acknowledge (that is, not pulling the SDA line low) after reading a complete byte during a read operation.
The interface also supports auto increment indexing. After the first data byte has been transferred, the index is
automatically incremented by 1. The controller can therefore send data bytes continuously to the target until the
target fails to provide an acknowledge, or the controller terminates the write communication with a stop condition.
If the auto increment feature is used, the controller does not have to send address indexes to accompany the data
bytes.

Figure 15. Data format (sequential write)

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 VL53L1X
Control interface

Figure 16. Data format (sequential read)

0x52 (write)
S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As P

0x53 (read)
S ADDRESS[7:0] As DATA[7:0] Am DATA[7:0] Am

DATA[7:0] Am DATA[7:0] Am DATA[7:0] Am P

4.1 I²C interface - timing characteristics

Timing characteristics are shown in the Table 7. I²C interface - timing characteristics for fast mode (400 kHz).
Refer to Figure 17. I²C timing characteristics for an explanation of the parameters used.

Table 7. I²C interface - timing characteristics for fast mode (400 kHz)

Symbol Parameter Minimum Typical Maximum Unit

FI2C Operating frequency 0 — 400 kHz

tLOW Clock pulse width low 1.3 — —

μs
tHIGH Clock pulse width high 0.6 — —

Pulse width of spikes that are

tSP — — 50 ns
suppressed by the input filter
Bus free time between
tBUF 1.3 — — µs
transmissions
tHD.STA Start hold time 0.26 — —

tSU.STA Start setup time 0.26 — — μs

tHD.DAT Data in hold time 0 — 0.9

tSU.DAT Data in setup time 50 — —

tR SCL/SDA rise time — — 300 ns

tF SCL/SDA fall time — — 300

tSU.STO Stop setup time 0.6 — — μs

Ci/o Input/output capacitance (SDA) — — 10

Cin Input capacitance (SCL) — — 4 pF
CL Load capacitance — 125 400

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 VL53L1X
Control interface

Figure 17. I²C timing characteristics

stop start start stop

VIH
SDA ... VIL

tBUF tLOW tR tF tHD.STA

VIH
SCL
VIL
...

tHD.STA tHD.DAT tHIGH tSU.DAT tSU.STA tSU.STO

All timings are measured from either VIL or VIH.

4.2 I²C interface - reference registers

The registers shown in the table below can be used to validate the user I²C interface.

Table 8. Reference registers

After fresh reset, without the driver

Register name Index
loaded

Model ID 0x010F 0xEA

Module type 0x0110 0xCC
Mask revision 0x0111 0x10

Note: The I²C read/writes can be 8, 16, or 32-bit. Multibyte read/writes are always addressed in ascending order with
the MSB first as shown in Table 9. 32-bit register example.
The customer must use the VL53L1X software driver for easy and efficient ranging operations to match
performance and accuracy criteria. Hence full register details are not exposed. The customer should refer to the
VL53L1X API user manual (UM2356).

Table 9. 32-bit register example

Register address Byte

Address MSB
Address + 1 ...
Address + 2 ...
Address + 3 LSB

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 VL53L1X
Thermal characteristics

5 Thermal characteristics

5.1 Absolute maximum rating (TSTG)

Warning: Stresses above those listed in the following table may cause permanent damage to the
device. These are stress ratings only. Functional operation of the device is not implied at
these or any other conditions above those indicated in the operational sections of the
specification. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.

The storage temperature (TSTG) is the ambient temperature at which the device can be stored with no voltage
applied.

Table 10. Absolute maximum rating conditions

Parameter Min. Max. Unit

Storage temperature (TSTG) -40 105 °C

5.2 Ambient operating temperature

The ambient operating temperature is the temperature at which the device may be powered and can operate
without any damage.

Table 11. Recommended operating temperature

Parameter Min. Max. Unit

Ambient operating temperature -20 85 °C

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 VL53L1X
Electrical characteristics

6 Electrical characteristics

6.1 Absolute maximum ratings

Warning: Stresses above those listed in the following table may cause permanent damage to the
device. These are stress ratings only. Functional operation of the device is not implied at
these or any other conditions above those indicated in the operational sections of the
specification. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.

Table 12. Absolute maximum ratings

Parameter Min. Typ. Max. Unit

AVDD
-0.5 — 3.6 V
SCL, SDA, XSHUT, and GPIO1

6.2 Recommended operating conditions

Table 13. Recommended operating conditions

There are no power supply sequencing requirements. The I/Os may be high, low, or floating when AVDD is applied. The I/Os
are internally failsafe with no diode connecting them to AVDD.
Parameter Min. Typ. Max. Unit

Voltage (AVDD) 2.6 2.8 3.5

Standard mode 1.6 1.8 1.9 V
IO (IOVDD) (1)
2V8 mode (2) (3) 2.6 2.8 3.5

1. XSHUT should be high only when AVDD is on.

2. SDA, SCL, XSHUT, and GPIO1 high levels have to be equal to AVDD in 2V8 mode.
3. The default driver mode is 1V8. 2V8 mode is programmable using the device settings loaded by the driver. For more details,
refer to the VL53L1X API user manual (UM2356).

6.3 Electrostatic discharge

The VL53L1X is compliant with the ESD values presented in the following table.

Table 14. ESD performances

Parameter Specification Conditions

Human body model JS-001-2012 ± 2 kV, 1500 ohms, 100 pF

Charged device model JESD22-C101 ± 500 V

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 VL53L1X
Electrical characteristics

6.4 Current consumption

Table 15. Power consumption at ambient temperature

All current consumption values include silicon process variations. Temperature and voltage are nominal conditions (23°C and
2.8 V). All values include AVDD and AVDDVCSEL.
Parameter Min. Typ. Max. Unit

HW STANDBY 3 5 7

SW STANDBY (2V8 mode) (1) 4 6 9 μA

Inter measurement — 20 —
Ranging average (AVDD +
— 16 18 mA
AVDDVCSEL) (2) (3)
Average power consumption at 10 Hz
— — 20
with 33 ms timing budget
Average power consumption at 1 Hz
with 20 ms timing budget when no target — 0.9 —
mW
is detected
Average power consumption at 1 Hz
with 20 ms timing budget when the — 1.4 —
target is detected

1. In 2V8 (IOVDD) mode, pull-ups have to be modified. Then the SW STANDBY consumption is increased by 0.6 µA.
2. Average consumption during the ranging operation in long distance mode.
3. Peak current (including VCSEL) can reach 40 mA.

6.5 Digital input and output

Table 16. Digital I/O electrical characteristics

Symbol Parameter Min. Typ. Max. Unit

Interrupt pin (GPIO1)

VIL Low level input voltage — 0.3 IOVDD

VIH High level input voltage 0.7 IOVDD —

Low level output voltage (IOUT = 4 V

VOL — 0.4
mA) —

High level output voltage (IOUT = 4

VOH IOVDD-0.4 —
mA)
FGPIO Operating frequency (CLOAD = 20 pF) 0 108 MHz

I²C interface (SDA/SCL)

VIL Low level input voltage -0.5 0.6

VIH High level input voltage 1.12 3.5

V
Low level output voltage (IOUT = 4
VOL — — 0.4
mA)

Leakage current (1) — 10

IIL/IH μA
Leakage current (2) — 0.15

1. AVDD = 0 V
2. AVDD = 2.85 V, and I/O voltage = 1.8 V

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 VL53L1X
Ranging performance

7 Ranging performance

7.1 Test conditions

In all the measurement tables of this document, it is considered that:
1. The full FoV is covered (typically at 27°). Alternatively, a partial FoV is covered after a specific ROI definition
by the user. The array size of the partial FoV is from 4x4 SPADs to 16x16 SPADs.
2. The charts used as targets are:
– Gray with a reflectance of 17% and a Munsell of N4.74.
– Gray with a reflectance of 54% and a Munsell of N8.25.
– White with a reflectance of 88% and a Munsell of N9.5.
3. The nominal voltage is 2.8 V and the temperature is 23°C.
4. The detection rate is considered as 100%.
5. Unless mentioned, the device is controlled through the driver using the following default settings:
– Distance mode is long.
– Timing budget is 100 ms.
– No cover glass is present.
– Target covers the full FoV.
6. Ambient light is defined as follows:
– Dark = no IR light in the band 940 nm ±30 nm.
– 50 kcps/SPAD = lighting on a sunny day from behind a window.
– 200 kcps/SPAD = lighting on a sunny day from behind a window, with direct illumination on the sensorNo
cover glass is present.
– For reference, usual office lighting is around 5 kcps/SPAD.
Note: kcps is kilo counts per second. kcps/SPAD is the return ambient rate measured by the VL53L1X.

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Ranging performance

7.2 Accuracy, repeatability, and ranging error definitions

7.2.1 Accuracy definition

Accuracy = mean distance–actual distance
• The mean distance is the average of 32 measured distances.
• The actual distance is the actual target distance.
An offset error, a temperature drift, or a voltage drift may affect the accuracy.

7.2.2 Repeatability definition

Repeatability is the standard deviation of the mean ranging value of 32 measurements. It can be improved by
increasing the timing budget. A typical repeatability value for the VL53L1X ranges from ±1% to ±0.15% depending
on the timing budget and the ambient light.

7.2.3 Ranging error definition

Ranging error = accuracy + repeatability error.
The ranging error value is an ST metric that is used in the performances tables below.

7.3 Minimum ranging distance

The minimum ranging distance ensured is 4 cm. Under this minimum distance, the sensor detects a target, but
the measurement is not accurate.

7.4 Performance in dark conditions

Table 17. Performance in dark conditions

Parameter Target reflectance Min. value Typ. value

White 88% 260 360 (1)

Max. distance (cm) Gray 54% 220 340
Gray 17% 80 170
Ranging error (mm) — ± 20

1. The typical value is 400 with a timing budget of 140 ms.

Test conditions (including those described in Section 7.1: Test conditions) are:
• Ambient light = dark
• Timing budget = 100 ms unless state otherwise
• Long distance mode

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 VL53L1X
Ranging performance

7.5 Performance in ambient light conditions

7.5.1 Long distance mode

Table 18. Typical performance in ambient light with long distance mode

Parameter Target reflectance Dark 50 kcps/SPAD 200 kcps/SPAD

White 88% 360 166 73

Max. distance (cm) Gray 54% 340 154 69
Gray 17% 170 114 68
Ranging error (mm) — ± 20 ± 25 ± 25

Test conditions (including those described in Section 7.1: Test conditions) are:
• Ambient light = dark, 50 kcps/SPAD, or 200 kcps/SPAD.
• Distance mode = long

7.5.2 Short distance mode

Table 19. Typical performance in ambient light with short distance mode

Parameter Target reflectance Dark 200 kcps/SPAD

White 88% 130 130

Max. distance (cm) Gray 54% 130 130
Gray 17% 130 120
Ranging error (mm) — ± 20 ± 25

Test conditions (including those described in Section 7.1: Test conditions) are:
• Ambient light = dark, 200 kcps/SPAD.
• Distance mode = short

7.6 Performance under partial ROI in dark conditions

Table 20. Typical performance under partial ROI in dark conditions

Parameter Target reflectance 16x16 8x8 4x4

White 88% 360 308 170

Max. distance (cm) Gray 54% 340 254 143
Gray 17% 170 119 45
Diagnol FoV (degrees) — 27 20 15
Ranging error (mm) — ± 20 ± 20 ± 20

Test conditions (including those described in Section 7.1: Test conditions) are:
• Ambient light = dark
• Target covers a partial FoV
• ROI is centered on the optical center
• Distance mode = long

DS12385 - Rev 8 page 22/36

 VL53L1X
Outline drawings

8 Outline drawings

Figure 18. Outline drawing (1/3)

DS12385 - Rev 8 page 23/36

 VL53L1X
Outline drawings

Figure 19. Outline drawing (2/3)

DS12385 - Rev 8 page 24/36

 VL53L1X
Outline drawings

Figure 20. Outline drawing (3/3)

Caution: The VL53L1X module is delivered with a protective liner covering the top of the cap to protect the sensor from
foreign material during the assembly process. It must be removed by the customer just before mounting the
cover glass.

DS12385 - Rev 8 page 25/36

 VL53L1X
Laser safety

9 Laser safety

This product contains a laser emitter and corresponding drive circuitry. The laser output is designed to meet
Class 1 laser safety limits under all reasonably foreseeable conditions including single faults in compliance with
IEC 60825-1:2014.
Do not increase the laser output power by any means. Do not use any optics to focus the laser beam.
Caution: Use of controls or adjustments, or performance of procedures other than those specified herein may result in
hazardous radiation exposure.

Figure 21. Class 1 laser label

This product complies with:

• IEC 60825-1:2014
• 21 CFR 1040.10 and 1040.11, except for conformance with IEC 60825-1:2014 as described in the laser
notice number 56, dated May 8, 2019.
• EN 60825-1:2014 including EN 60825-1:2014/A11:2021
• EN 50689:2021, however STMicroelectronics does not guarantee compliance with the requirement of
clause 5 from EN50689 regarding child appealing products. If designing a child appealing product, contact
STMicroelectronics' technical application support.

DS12385 - Rev 8 page 26/36

 VL53L1X
Packing and labeling

10 Packing and labeling

10.1 Product marking

A two line product marking is applied on the backside of the module (on the substrate). The first line is the silicon
product code, and the second line, the internal tracking code.

10.2 Inner box labeling

The labeling follows the STMicroelectronics' standard packing acceptance specification.
The following information is on the inner box label:
• Assembly site
• Sales type
• Quantity
• Trace code
• Marking
• Bulk ID number

10.3 Packing
At the customer/subcontractor level, it is recommended to mount the device in a clean environment to avoid
foreign material deposition.
To help avoid any foreign material contamination at product assembly level the modules are shipped in a tape and
reel format with a protective liner, starting from production version (cut1.1).
The packing is vacuum-sealed and includes a desiccant.

DS12385 - Rev 8 page 27/36

 VL53L1X
Packing and labeling

10.4 Tape outline drawing

Figure 22. Tape outline drawing

DS12385 - Rev 8 page 28/36

 VL53L1X
Handling, moisture, and reflow precautions

11 Handling, moisture, and reflow precautions

11.1 Shock precaution

Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject
to excessive shock, it must be rejected even if no apparent damage is visible. For example, if it is dropped on the
floor, or if a tray/reel of units is dropped on the floor.

11.2 Part handling

Handling must be done with nonmarring, ESD, safe carbon, plastic, or Teflon™ tweezers. Ranging modules are
susceptible to damage or contamination. The customer is advised to use a clean assembly process after
removing the tape from the parts, and until a protective cover glass is mounted.

11.3 Compression force

A maximum compressive load of 25 N should be applied on the module.

11.4 Moisture sensitivity level

Moisture sensitivity is level 3 (MSL) as described in JEDEC JSTD-020-C.
For devices that are classified to the levels defined in JEDEC JSTD-020-C, JEDEC JSTD-033-C provides:
• Manufacturers and users with standardized methods for handling, packing, and shipping.
• Standardized methods for using moisture/reflow and process sensitive devices.

DS12385 - Rev 8 page 29/36

 VL53L1X
Handling, moisture, and reflow precautions

11.5 Pb-free solder reflow process

Table 21. Recommended solder profile and Figure 23. Solder profile show the recommended and maximum
values for the solder profile.
Customers have to tune the reflow profile depending on the PCB, solder paste, and material used. We expect
customers to follow the recommended reflow profile, which is specifically tuned for the VL53L1X package.
If a customer must perform a reflow profile, which is different from the recommended one, the new profile must be
qualified by the customer at their own risk. This is especially true for peaks >240°C. In any case, the profile must
be within the “maximum” profile limit described in JEDEC JSTD-020-C and in Table 21. Recommended solder
profile.
Note: Temperatures mentioned in the table below are measured at the top of the VL53L1X package.

Table 21. Recommended solder profile

Parameters Recommended Maximum Unit

Minimum temperature (TS min) 130 150

°C
Maximum temperature (TS max) 200 200

Time ts (TS min to TS max) 90-110 60-120 s

Temperature (TL) 217 217 °C

Time (tL) 55-65 55-65 s

Ramp up 2 3 °C/s
Temperature (Tp-10) 250 °C

Time (tp) — 10 s

Ramp up 3 °C/s
Peak temperature (Tp) 240 245 °C
Time to peak 300 300 s
Ramp down (peak to TL) -4 -6 °C/s

Figure 23. Solder profile

Note: The component should be limited to a maximum of three passes through this solder profile.
Note: As the VL53L1X package is not sealed, only a dry reflow process should be used (such as convection reflow).
Vapor phase reflow is not suitable for this type of optical component.
Note: The VL53L1X is an optical component and should be treated carefully. This would typically include using a ‘no-
wash’ assembly process.

DS12385 - Rev 8 page 30/36

 VL53L1X
Package information

12 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

DS12385 - Rev 8 page 31/36

 VL53L1X
Ordering information

13 Ordering information

Table 22. Order codes

Order codes Package Packing Minimum order quantity

VL53L1CXV0FY/1 Optical LGA12 with liner Tape and reel 3600 pcs

DS12385 - Rev 8 page 32/36

 VL53L1X
Ordering information

Revision history
Table 23. Document revision history

Date Version Changes

Removed "™" from the document title.

24-Jun-2022 6
Updated Figure 15. Data format (sequential write)
Updated Figure 18. Outline drawing (1/3), Figure 19. Outline drawing (2/3),
29-Nov-2022 7 and Figure 20. Outline drawing (3/3).
Updated Figure 22. Tape outline drawing.
Features section: Added "eye safety".
Updated master/slave to controller/target.
Added Section 5: Thermal characteristics, including a maximum AMR of
105°C.
Table 13. Recommended operating conditions: Removed ambient
09-Aug-2024 8 temperature data.
Section 6.5: Digital input and output: Updated maximum value of VIH to 3.5 V.
Updated Section 9: Laser safety.
Updated Section 10: Packing and labeling.
Added Section 11: Handling, moisture, and reflow precautions.

DS12385 - Rev 8 page 33/36

 VL53L1X
Contents

Contents
1 Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2.1 Technical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3 Device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.4 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 System functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 System state machine description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3 Customer manufacturing calibration flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.4 Ranging description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.5 Key parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.5.1 Distance mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.5.2 Timing budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.6 Power up and boot sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.7 Ranging sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.8 Sensing array optical center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 Control interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
4.1 I²C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.2 I²C interface - reference registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
5.1 Absolute maximum rating (TSTG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.2 Ambient operating temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
6.1 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.3 Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.4 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.5 Digital input and output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7 Ranging performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
7.1 Test conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.2 Accuracy, repeatability, and ranging error definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.2.1 Accuracy definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.2.2 Repeatability definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DS12385 - Rev 8 page 34/36

 VL53L1X
Contents

7.2.3 Ranging error definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.3 Minimum ranging distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.4 Performance in dark conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.5 Performance in ambient light conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.5.1 Long distance mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.5.2 Short distance mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.6 Performance under partial ROI in dark conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8 Outline drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
9 Laser safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
10 Packing and labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
10.1 Product marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.2 Inner box labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.3 Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.4 Tape outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
11 Handling, moisture, and reflow precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
11.1 Shock precaution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11.2 Part handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11.3 Compression force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11.4 Moisture sensitivity level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11.5 Pb-free solder reflow process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
12 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
13 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

DS12385 - Rev 8 page 35/36

 VL53L1X

IMPORTANT NOTICE – READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names
are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2024 STMicroelectronics – All rights reserved

DS12385 - Rev 8 page 36/36