VL53L1

Datasheet

Time-of-Flight long-distance ranging sensor with advanced multizone and

multiobject detection

Features
Fully integrated miniature module
• 940 nm invisible laser VCSEL (vertical-cavity surface-emitting laser) emitter
and its analog driver
• Receiving array with integrated lens
• Low power microcontroller running advanced digital firmware
• 4.9 x 2.5 x 1.56 mm

Fast, accurate distance ranging

• Up to 800 cm ranging
• A comprehensive application note (AN5573) providing detailed technical
Product status link guidance
• 60 Hz ranging capability up to 300 cm
VL53L1
• Immunity to cover glass crosstalk and fingerprint smudge at long distances
with patented dToF (direct Time-of-Flight) algorithms
• Multiobject detection capability
• Multizone scanning and selectable array (2x2, 3x3, 4x4, or defined by the user
through software)

Eye safety
• Class 1 laser device compliant with latest standard IEC 60825-1:2014 - 3rd
edition

Easy integration
• Keystone correction example code for projectors available with STSW-IMG047
• Single reflowable component
• Single power supply 2v8
• Works with many types of cover glass material
• I²C interface (up to 1 MHz)
• Xshutdown (reset) and interrupt GPIO (general-purpose input/output)
• Full set of software drivers (Linux® and Android compatible) for turnkey
ranging

Application
• Laser assisted autofocus (AF): enhances the camera AF system speed and
robustness, especially in difficult scenes (low light and low contrast). Ideal
companion for PDAF sensors.
• Video focus tracking assistance at 60 Hz
• Scene understanding with multiobject detection: “choose the focus point”
• Dual camera stereoscopy and 3D depth assistance thanks to multizone
measurements
• Presence detection (autonomous timed mode), typically to lock/unlock and
power on/off devices like notebooks, tablets, or white goods

DS11786 - Rev 15 - August 2024 www.st.com

For further information contact your local STMicroelectronics sales office.
 VL53L1

Description
The VL53L1 is a laser-ranging ToF sensor. It covers applications requiring long distance ranging up to 800 cm
(ranging mode), multizone ranging (scanning mode), and low-power (autonomous mode). A comprehensive
application note (AN5573) provides technical details on the programming interface including its bare driver. The
API (application programming interface) enables the device to be controlled and managed in these three modes,
to meet the requirements of all applications.
With patented algorithms and ingenious module construction, the VL53L1 is also able to detect different objects
within the FoV (field of view). Its depth information (histogram) is at 60 Hz.
Scene browsing and multizone detection are now possible with the VL53L1, thanks to a software customizable
detection array. This provides a quicker “touch-to-focus”, or minidepth map use cases.

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 VL53L1
Acronyms and abbreviations

1 Acronyms and abbreviations

Table 1. Acronym and abbreviations

Acronym/abbreviation Definition

AMR absolute maximum rating

API application programming interface
ESD electrostatic discharge
FoV field of view
FW BOOT firmware boot
HW STANDBY hardware standby
I²C inter-integrated circuit (serial bus)
MSB most significant bit
NVM nonvolatile memory
PCB printed circuit board
PVT power, voltage, and temperature
SCL serial clock line
SDA serial data line
SW STANDBY software standby
SPAD single photon avalanche diode
STG storage
T temperature
t time
ToF Time-of-Flight
VCSEL vertical-cavity surface-emitting laser

DS11786 - Rev 15 page 3/36

 VL53L1
Overview

2 Overview

2.1 Technical specification

Table 2. Technical specification

Feature Detail

Package Optical LGA12

Size 4.4 x 2.5 x 1.56 mm
Operating voltage 2.6 to 3.5 V
Operating temperature -20 to 85°C
Infrared emitter 940 nm
Up to 1 MHz (fast mode plus) serial bus
I²C
Address: 0x52

2.2 System block diagram

Figure 1. VL53L1 block diagram

VL53L1 module

VL53L1 silicon
Single Photon
Avalanche Diode (SPAD)
GND Detection array AVDD

SDA ROM XSHUT

Non Volatile
Memory
RAM
SCL GPIO1
Microcontroller

Advanced
Ranging Core

VCSEL Driver

AVSSVCSEL IR+ IR- AVDDVCSEL

940nm

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 VL53L1
Overview

2.3 Device pinout

The following figure shows the pinout of the VL53L1 (see also Section 8: Outline drawings).

Figure 2. VL53L1 pinout (bottom view)

GND3

GPIO1 7 6 5 XSHUT

DNC 8 4 GND2

SDA 9 3 GND

SCL 10 2 AVSSVCSEL

AVDD 11 12 1 AVDDVCSEL

GND4

Table 3. VL53L1 pin description

Pin number Signal name Signal type Signal description

1 AVDDVCSEL Supply VCSEL supply, connect to main supply

2 AVSSVCSEL VCSEL ground, connect to main ground
3 GND Ground
Connect to the main ground
4 GND2
5 XSHUT Digital input Xshutdown pin, active low
6 GND3 Ground Connect to the main ground
7 GPIO1 Digital output Interrupt output. Open drain output
8 DNC Digital input Do not connect, must be left floating
9 SDA Digital input/output I²C serial data
10 SCL Digital input I²C serial clock input
11 AVDD Supply Supply, connect to the main supply
12 GND4 Ground Connect to the main ground

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 VL53L1
Overview

2.4 Application schematic

The following figure shows the application schematic of the VL53L1.

Figure 3. VL53L1 schematic

Rserial

Rserial

For hardwa re interrupt

Note: Place the capacitors on the external supply AVDD as close as possible to the AVDDVCSEL and AVSSVCSEL
module pins.
Note: The external pull-up resistor values can be found in the I²C-bus specification. Pull-ups are typically fitted only
once per bus, near the host. See Table 4. Suggested pull-up and series resistors for I2C fast mode and
Table 5. Suggested pull-up and series resistors for I2C fast mode plus for suggested values.
Note: The XSHUT pin must always be driven to avoid leakage current. A pull-up is needed if the host state is not
known. XSHUT is needed to use hardware standby mode (there is no I²C communication).
Note: The recommended value of the XSHUT and GPIO1 pull-ups is 10 kOhms.
Note: Leave the GPIO1 unconnected if not used.
Table 4 and Table 5 show recommended values for pull-up and series resistors for an AVDD of 1.8 V to 2.8 V in
I2C fast mode (up to 400 kHz) and fast mode plus (up to 1 MHz).

Table 4. Suggested pull-up and series resistors for I2C fast mode

I2C load capacitance (CL) (1) Pull-up resistor (Ohms) Series resistor (Ohms)

CL ≤ 90 pF 3.6 k 0

90 pF < CL ≤ 140 pF 2.4 k 0

140 pF < CL ≤ 270 pF 1.2 k 0

270 pF < CL ≤ 400 pF 0.8 k 0

1. For each bus line, CL is measured in the application PCB by the customer.

Table 5. Suggested pull-up and series resistors for I2C fast mode plus

I2C load capacitance (CL) (1) Pull-up resistor (Ohms) Series resistor (Ohms)

CL ≤ 90 pF 1.5 k 100

90 pF < CL ≤ 140 pF 1k 50

140 pF < CL ≤ 270 pF 0.5 k 50

270 pF < CL ≤ 400 pF 0.3 k 50

1. For each bus line, CL is measured in the application PCB by the customer.

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 VL53L1
Functional description

3 Functional description

3.1 System functional description

Figure 4. VL53L1 system functional description shows the system level functional description. The host customer
application controls the VL53L1 device using an API (application programming interface). The API implementation
is delivered to the customer as a driver (Bare C code, or Linux/Android driver).
The driver shares with the customer application a set of high level functions that allow control of the VL53L1
firmware. Functions include initialization, ranging start/stop, setting the system accuracy, and choice of ranging
mode.
The driver is a turnkey solution consisting of a set of “C” functions that enables fast development of end user
applications without the complication of direct multiple register access. The driver is structured in a way that it can
be compiled on any kind of platform through a well abstracted platform layer. The driver package allows the user
to take full advantage of the VL53L1 capabilities.
A detailed description of the driver is available in the VL53L1 driver user manual(UM2133).
The VL53L1 firmware fully manages the hardware register accesses.
Section 3.2: Firmware state machine description details the firmware state machine.

Figure 4. VL53L1 system functional description

HOST VL53L1
Customer VL53L1
Firmware Hardware
Application API/Driver
I2C

3.2 Firmware state machine description

The following figure shows the device state machine.

Figure 5. Firmware state machine

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 VL53L1
Functional description

3.3 Customer manufacturing calibration flow

The detailed procedure is provided in the VL53L1 driver user manual (UM2133).

3.4 Device programming and control

The VL53L1 physical control interface is the I2C, with is described in Section 4: Control interface.
A software layer (driver) is provided to control the device. This avoids complex I2C register operations with
turnkey functions to start, stop, and read the ranging values.
The driver structure and functions are described in the VL53L1 driver user manual (UM2133).

3.5 Description of operating “preset” modes

The VL53L1 software driver proposes four turnkey operating modes (called “preset”) to allow fast and easy
ranging in all customer applications:
• Ranging mode
• Multizone scanning mode
• Lite ranging mode
• Autonomous mode
Ranging mode is the default (recommended) configuration to the get the best of the VL53L1 functionalities.
• Ranging mode is natively immune to cover glass crosstalk and smudge beyond 80 cm. With patented dToF
algorithms, temporal filtering is possible to distinguish crosstalk from an object signal over long distances >
80 cm. Best-in-the-class ranging performances of 300 cm+ with the cover glass in place are now possible.
They can be reached with any computation unlike other sensors on the market.
• Ranging mode can detect several objects concurrently within the FoV. Up to four ranges can be output
simultaneously by the software driver, to indicate objects range. Check the latest software driver manual for
further details.
• Ranging mode is compatible with the ROI (region of interest) selection. The user may chose a custom FoV
by software, from 4x4 SPADs (minimum size) up to 16x16 SPADs (full FoV). This gives full flexibility to
support “touch-to-focus” or custom ranging.
• Ranging operation is performed by default at 60 Hz once the driver function is called (typical ranging
operation lasts 16 ms). It includes internal housekeeping, ranging, and postprocessing.
Multizone scanning mode provides ranging results of all the selected ROIs sequentially. The ROIs include
quadrant (four zones), nine zones, 16 zones, or custom numbers of zones and location. In each ROI, the VL53L1
system can also detect multiple objects, and the software driver returns a ranging quality level and signal, in
addition to the distance in millimeters.
Lite ranging mode is recommended to minimize postprocessing with a low-performance host (microcontroller or
low frequency CPU).
Autonomous mode triggers ranging interrupts under certain conditions. The user can set distance thresholds,
signal thresholds, and a timing interval between two consecutive ranging operations.
Note: Ranging, multizone scanning, and lite ranging modes require a handshake between the host and the VL53L1, at
each ranging operation. This handshake is mandatory to ensure the right result is read by the host to continue
the ranging operation.
Refer to Section 3.10: Handshake management for further details.

3.6 Digital processing and reading the results

The digital processing is the final operation of the ranging sequence that computes, validates, or rejects a ranging
measurement. Part of this processing is performed by the VL53L1 internal firmware. It is completed on the host
processor running the software driver.
At the end of the digital processing, the ranging distance is computed by the VL53L1 itself. If the distance cannot
be measured (no target or weak signal), a corresponding status error code is generated and can be read by the
host.

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 VL53L1
Functional description

3.7 Reading the results

The VL53L1 software driver provides turnkey functions to read the following output results after the measurement:
• Signal rate
• Ranging distance per object detected
• Min. and max. distances where object is located
• Dmax and range quality level
A full description is provided in the VL53L1 driver user manual (UM2133).

3.8 Power sequence

Two options are available for device power-up/boot.

Option 1
The XSHUT pin is connected and controlled from the host.
This option optimizes power consumption. The device can be completely powered off when not used, and then
woken up through the host GPIO (using the XSHUT pin).
Hardware standby mode is the period when the AVDD is present and the XSHUT is low.

Figure 6. Power-up and boot sequence

Note: tBOOT is 1.2 ms maximum.

Option 2
The host does not control the XSHUT pin. This pin is tied to AVDD through a pull-up resistor.
When the XSHUT pin is not controlled, the power-up sequence is as shown in the following figure. In this case,
the device goes automatically to software standby after a firmware boot, without entering hardware standby.

Figure 7. Power-up and boot sequence with XSHUT not controlled

Note: tBOOT is 1.2 ms maximum.

Note: In all cases, XSHUT has to be raised only when AVDD is tied on.

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 VL53L1
Functional description

3.9 Ranging sequence

Figure 8. Ranging sequence

Note: The ttiming_budget is a parameter set by the user, using a dedicated driver function.

3.10 Handshake management

For all ranging modes described above, every time a ranging measurement is available, an interrupt is generated.
The GPIO1 pin of the VL53L1 is then driven high. Once the host reads the result, the interrupt is cleared and the
ranging sequence can repeat. If the interrupt is not cleared, the ranging operation of the VL53L1 is on hold. It
allows a good synchronization between the VL53L1 and the host, avoids loosing results in case of delay on the
I2C bus, and is mandatory for multizone scanning operations.
It is strongly recommended to use the hardware interrupt pin to manage this handshake. But if not possible a
software polling mode remains available.
For more details, refer to the VL53L1 user manual (UM2133).

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 VL53L1
Control interface

4 Control interface

This section specifies the control interface. The I²C interface uses two signals: serial data line (SDA) and serial
clock line (SCL). Each device connected to the bus uses a unique address and a simple controller/target
relationship exists.
Both SDA and SCL lines are connected to a positive supply voltage using pull-up resistors located on the host.
Lines are only actively driven low. A high condition occurs when lines are floating and the pull-up resistors pull
lines up. When no data are transmitted both lines are high.
Clock signal generation is performed by the controller device. The controller device initiates data transfer. The I²C
bus on the VL53L1 has a maximum speed of 1 Mbits/s and uses a default device address of 0x52.

Figure 9. Data transfer protocol

Acknowledge
Start condition

SDA
MSB LSB

SCL
S 7 8 P
1 2 3 4 5 6 Ac/Am
Address or data byte
Stop condition

Information is packed in 8-bit packets (bytes) and is always followed by an acknowledge bit, Ac for the VL53L1
acknowledge and Am for the controller acknowledge (host bus controller). The internal data are produced by
sampling SDA at a rising edge of SCL. The external data must be stable during the high period of SCL. The
exceptions to this are start (S) or stop (P) conditions when SDA falls or rises respectively, while SCL is high.
A message contains a series of bytes preceded by a start condition, and followed by either a stop or repeated
start (another start condition but without a preceding stop condition), followed by another message. The first byte
contains the device address (0x52) and also specifies the data direction. If the least significant bit is low (that is,
0x52) the message is a controller write-to-the-target. If the LSB is set (that is, 0x53) then the message is a
controller read-from-the-target.

Figure 10. I²C device address: 0x52

MSBit LSBit

0 1 0 1 0 0 1 R/W

All serial interface communications with the ToF sensor must begin with a start condition. The VL53L1 module
acknowledges the receipt of a valid address by driving the SDA wire low. The state of the read/write bit (LSB of
the address byte) is stored and the next byte of data, sampled from SDA, can be interpreted. During a write
sequence, the second byte received provides a 16-bit index, which points to one of the internal 8-bit registers.

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 VL53L1
Control interface

Figure 11. Data format (write)

VL53L1 acknowledges Acknowledge from VL53L1

Start valid address

S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As DATA[7:0] As P

0x52 (write)
Stop

As data are received by the target, they are written bit by bit to a serial/parallel register. After each data byte has
been received by the target, an acknowledge is generated, the data are then stored in the internal register
addressed by the current index.
During a read message, the contents of the register addressed by the current index is read out in the byte
following the device address byte. The contents of this register are parallel loaded into the serial/parallel register
and clocked out of the device by the falling edge of SCL.

Figure 12. Data format (read)

0x52 (write)
S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As P

0x53 (read)
S ADDRESS[7:0] As DATA[7:0] Am P

At the end of each byte, in both read and write message sequences, an acknowledge is issued by the receiving
device (that is, the VL53L1 for a write, and the host for a read).
A message can only be terminated by the bus controller, either by issuing a stop condition or by a negative
acknowledge (that is, not pulling the SDA line low) after reading a complete byte during a read operation.
The interface also supports auto increment indexing. After the first data byte has been transferred, the index is
automatically incremented by 1. The controller can therefore send data bytes continuously to the target until the
target fails to provide an acknowledge, or the controller terminates the write communication with a stop condition.
If the auto increment feature is used, the controller does not have to send address indexes to accompany the data
bytes.

Figure 13. Data format (sequential write)

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 VL53L1
Control interface

Figure 14. Data format (sequential read)

0x52 (write)
S ADDRESS[7:0] As INDEX[15:8] As INDEX[7:0] As P

0x53 (read)
S ADDRESS[7:0] As DATA[7:0] Am DATA[7:0] Am

DATA[7:0] Am DATA[7:0] Am DATA[7:0] Am P

4.1 I²C interface - timing characteristics

Timing characteristics are shown in the following tables. Refer to Figure 15. I²C timing characteristics for an
explanation of the parameters used.
Timings are given for all PVT conditions.

Table 6. I²C interface - timing characteristics for fast mode plus (1 MHz)

Symbol Parameter Minimum Typical Maximum Unit

FI2C Operating frequency 0 — 1000 kHz

tLOW Clock pulse width low 0.5 — —

μs
tHIGH Clock pulse width high 0.26 — —

Pulse width of spikes that are

tSP — — 50 ns
suppressed by the input filter
Bus free time between
tBUF 0.5 — — µs
transmissions
tHD.STA Start hold time 0.26 — —

tSU.STA Start setup time 0.26 — — μs

tHD.DAT Data in hold time 0 — 0.9

tSU.DAT Data in setup time 50 — —

tR SCL/SDA rise time — — 120 ns

tF SCL/SDA fall time — — 120

tSU.STO Stop setup time 0.26 — — μs

Ci/o Input/output capacitance (SDA) — — 10

Cin Input capacitance (SCL) — — 4 pF
CL Load capacitance — 140 550

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 VL53L1
Control interface

Table 7. I²C interface - timing characteristics for fast mode (400 kHz)

Symbol Parameter Minimum Typical Maximum Unit

FI2C Operating frequency 0 — 400 kHz

tLOW Clock pulse width low 1.3 — —

μs
tHIGH Clock pulse width high 0.6 — —

Pulse width of spikes that are

tSP — — 50 ns
suppressed by the input filter
Bus free time between
tBUF 1.3 — — µs
transmissions
tHD.STA Start hold time 0.26 — —

tSU.STA Start setup time 0.26 — — μs

tHD.DAT Data in hold time 0 — 0.9

tSU.DAT Data in setup time 50 — —

tR SCL/SDA rise time — — 300 ns

tF SCL/SDA fall time — — 300

tSU.STO Stop setup time 0.6 — — μs

Ci/o Input/output capacitance (SDA) — — 10

Cin Input capacitance (SCL) — — 4 pF
CL Load capacitance — 125 400

Figure 15. I²C timing characteristics

stop start start stop

VIH
SDA ... VIL

tBUF tLOW tR tF tHD.STA

VIH
SCL
VIL
...

tHD.STA tHD.DAT tHIGH tSU.DAT tSU.STA tSU.STO

All timings are measured from either VIL or VIH.

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 VL53L1
Control interface

4.2 I²C interface - reference registers

The registers shown in the table below can be used to validate the user I²C interface.

Table 8. Reference registers

Address After fresh reset, without the API loaded

0xC0 0xEE
0xC1 0xAA
0xC2 0x10
0X51 0x0099
0x61 0x0000

Note: The I²C read/writes can be 8, 16, or 32-bit. Multibyte read/writes are always addressed in ascending order with
the MSB first as shown in the following table.

Table 9. 32-bit register example

Register address Byte

Address MSB
Address + 1 ...
Address + 2 ...
Address + 3 LSB

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 VL53L1
Thermal characteristics

5 Thermal characteristics

5.1 Absolute maximum rating (TSTG)

Warning: Stresses above those listed in the following table may cause permanent damage to the
device. These are stress ratings only. Functional operation of the device is not implied at
these or any other conditions above those indicated in the operational sections of the
specification. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.

The storage temperature (TSTG) is the ambient temperature at which the device can be stored with no voltage
applied.

Table 10. Absolute maximum rating conditions

Parameter Min. Max. Unit

Storage temperature (TSTG) -40 125 °C

5.2 Ambient operating temperature

The ambient operating temperature is the temperature at which the device may be powered and can operate
without any damage.

Table 11. Recommended operating temperature

Parameter Min. Max. Unit

Ambient operating temperature -20 85 °C

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 VL53L1
Electrical characteristics

6 Electrical characteristics

6.1 Absolute maximum ratings

Warning: Stresses above those listed in the following table may cause permanent damage to the
device. These are stress ratings only. Functional operation of the device is not implied at
these or any other conditions above those indicated in the operational sections of the
specification. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.

Table 12. Absolute maximum ratings

Parameter Min. Typ. Max. Unit

AVDD
-0.5 — 3.6 V
SCL, SDA, XSHUT, and GPIO1

6.2 Recommended operating conditions

Table 13. Recommended operating conditions

There are no power supply sequencing requirements. The I/Os may be high, low, or floating when AVDD is applied. The I/Os
are internally failsafe with no diode connecting them to AVDD.
Parameter Min. Typ. Max. Unit

Voltage (AVDD) 2.6 2.8 3.5

Standard mode 1.6 1.8 1.9 V
IO (IOVDD) (1)
2V8 mode (2) (3) 2.6 2.8 3.5

1. XSHUT should be high only when AVDD is on.

2. SDA, SCL, XSHUT, and GPIO1 high levels have to be equal to AVDD in 2V8 mode.
3. The default driver mode is 1V8. 2V8 mode is programmable using the device settings loaded by the driver. For more details,
refer to the VL53L1 driver user manual (UM2133).

6.3 Electrostatic discharge

The VL53L1 is compliant with the ESD values presented in the following table.

Table 14. ESD performances

Parameter Specification Conditions

Human body model JS-001-2012 ± 2 kV, 1500 ohms, 100 pF

Charged device model JESD22-C101 ± 500 V

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 VL53L1
Electrical characteristics

6.4 Current consumption

Table 15. Power consumption at ambient temperature

All current consumption values include silicon process variations. Temperature and voltage are nominal conditions (23°C and
2.8 V).
Parameter Min. Typ. Max. Unit

HW STANDBY 3 5 7

SW STANDBY (2V8 mode) (1) 4 6 9 μA

Timed ranging intermeasurement — 20 —

Active ranging average consumption
— 16 18 mA
(including VCSEL) (2) (3)
Average power consumption at 10 Hz
— — 20 mW
with 33 ms ranging sequence

1. In standard mode (1V8), pull-ups have to be modified. Then the SW STANDBY consumption is increased by 0.6 µA.
2. Active ranging is an average value, measured using the default driver settings: Ranging mode with the default settings at a
16 ms timing budget.
3. Peak current (including VCSEL) can reach 40 mA.

6.5 Digital input and output

Table 16. Digital I/O electrical characteristics

Symbol Parameter Min. Typ. Max. Unit

Interrupt pin (GPIO1)

VIL Low level input voltage — 0.3 IOVDD

VIH High level input voltage 0.7 IOVDD —

Low level output voltage (IOUT = 4 V

VOL — 0.4
mA) —

High level output voltage (IOUT = 4

VOH IOVDD-0.4 —
mA)
FGPIO Operating frequency (CLOAD = 20 pF) 0 108 MHz

I²C interface (SDA/SCL)

VIL Low level input voltage -0.5 0.6

VIH High level input voltage 1.12 3.5

V
Low level output voltage (IOUT = 4
VOL — — 0.4
mA)

Leakage current (1) — 10

IIL/IH μA
Leakage current (2) — 0.15

1. AVDD = 0 V
2. AVDD = 2.85 V, and I/O voltage = 1.8 V

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 VL53L1
Ranging performance

7 Ranging performance

7.1 Measurement conditions

In all the measurement tables of this document, it is considered that:
1. The full FoV is covered (typically at 27°). Alternatively, a partial FoV is covered after a specific ROI definition
by the user. The array size of the partial FoV is from 4x4 SPADs to 16x16 SPADs.
2. The charts used as targets are:
– Gray with a reflectance of 17% and a Munsell of N4.74.
– White with a reflectance of 88% and a Munsell of N9.5.
3. The nominal voltage is 2.8 V and the temperature is 23°C.
4. Unless mentioned, the device is controlled through the driver using the default settings. Refer to the user
manual for driver setting descriptions.
5. The detection rate is considered as 94%.
6. Indoor (no IR) means that there is no light contribution in the band 940 nm ± 30 nm. Outdoor overcast
conditions mean an illumination level of 0.7 W/m² back on the sensor, in the band 940 nm ± 30 nm.
7. No cover glass is present.
8. A gain correction is available in the driver. The performance assumes that an average gain correction has
been applied.

7.2 Minimum ranging distance

The minimum ranging distance ensured is 4 cm. This is valid for all modes: Ranging, scanning, lite, and
autonomous.

7.3 Ranging and scanning modes: Multiobject detection

Thanks to the direct Time-of-Flight principle and ST patents, the VL53L1 is able to detect up to four objects in a
FoV.
The typical depth separation between objects has to be at least 80 cm.

7.4 Ranging and scanning modes: Full FoV performance

Table 17. Ranging accuracy shows the performance with a full FoV (gray and white targets), a 16 ms timing
budget, and the default software driver settings.

Table 17. Ranging accuracy

Applicable to ranging and scanning modes Dark or indoor (no infrared) Outdoor overcast

Target color Performances full FoV Min. Typ. Max. Min. Typ. Max.

Maximum distance detection 320 cm 320 cm — 70 cm 90 cm —

White target Accuracy — — 1% — — 8.5%
Ranging offset — — ±25 mm — — ±25 mm
Maximum distance detection 180 cm 230 cm — 70 cm 90 cm —
Gray target Accuracy — — 2.5% — — 8.5%
Ranging offset — — ±25 mm — — ±25 mm

Note: It is assumed that an offset calibration is performed.

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 VL53L1
Ranging performance

7.5 Range and scanning modes: Partial FoV performance

7.5.1 Optical center definition

The sensing array optical center specification considers the part-to-part variation in production.
The Xo, Yo coordinates define the optical center.
The optical center is measured for each part during a factory test at STMicroelectronics. The coordinates are
stored in the VL53L1 nonvolatile memory and are readable by the customer through a software driver in the
application. This helps optimize application design, and the alignment between the camera module and ranging
performance of the application.
The green array in Figure 16. Optical center specification gives the possible location of the optical center. See
also Table 18. Optical center specification.
The user can define their own priorities. Example:
• Priority FoV: Full matrix 16x16 active and a maximum ranging distance on the corners, which may be
smaller than in the center.
• Priority distance: Cropped matrix around the optical center. Refer to Table 19. Ranging and scanning
modes: Performance with a partial FoV, which shows how to get the target performance.

Table 18. Optical center specification

Parameter Min. Typ. Max. Unit

Xo offset -2 0 2
SPAD
Yo offset -2 0 2

Figure 16. Optical center specification

DS11786 - Rev 15 page 20/36

 VL53L1
Ranging performance

7.5.2 Partial FoV performance

Table 19. Ranging and scanning modes: Performance with a partial FoV shows the performance with a partial
FoV (gray and white targets), a 16 ms timing budget per zone, and the default software driver settings.

Table 19. Ranging and scanning modes: Performance with a partial FoV

Applicable to ranging and scanning

8x8 SPAD ROI array 4x4 SPAD ROI array
modes

In corner Centered In corner Centered

ROI center Max. 4 SPADs Max. 6 SPADs
Target color ROI center = ROI center =
location from optical from optical
optical center optical center
center center

Maximum distance Typ. = 250 cm Typ. = 250 cm Typ. = 110 cm Typ. = 170 cm
detection Min. = 190 cm Min. = 250 cm Min. = 50 cm Min. =150 cm
White target
Accuracy 2% 2% 2% 2%
Ranging offset ±25 mm ±25 mm ±25 mm ±25 mm

Maximum distance Typ. =125 cm Typ. = 155 cm Typ. = 50 cm Typ. = 90 cm

detection Min. = 70 cm Min. = 100 cm Min. = 20 cm Min. = 50 cm
Gray target
Accuracy 5% 5% 5% 5%
Ranging offset ±25 mm ±25 mm ±25 mm ±25 mm

Note: It is assumed that an ROI offset calibration is performed.

Note: The above performance table is specified after optical centering of the VL53L1 defined in the user manual. The
optical center of the VL53L1 is stored in the VL53L1 NVM and can be read by the user through the software
driver.

7.6 Lite mode performance

Performance for lite mode, as defined in the software driver, is provided in Table 20. Lite mode: Performance with
a full FoV.

Table 20. Lite mode: Performance with a full FoV

Applicable to lite mode with default settings Dark or indoor (no infrared)

15 Hz (default, recommended)
Target color Performance
Min. Typ. Max.

Maximum distance detection 330 cm 410 cm —

White target Accuracy — — 2.5%
Ranging offset — — ±25 mm
Maximum distance detection 130 cm 170 cm —
Gray target Accuracy — — 2.5%
Ranging offset — — ±25 mm

DS11786 - Rev 15 page 21/36

 VL53L1
Ranging performance

7.7 Autonomous mode performance

Performance for autonomous mode, as defined in the software driver, is provided in Table 21. Autonomous mode:
Performance with a full FoV.

Table 21. Autonomous mode: Performance with a full FoV

Applicable to autonomous mode with default settings Dark or indoor (no infrared)

76 ms timing budget
Target color Performance
Min. Typ. Max.

Maximum distance detection 280 cm —

White target Accuracy — 1.5%
Ranging offset — ±25 mm
—
Maximum distance detection 180 cm —
Gray target Accuracy — 2.5%
Ranging offset — ±25 mm

Note: The accuracy of the ranging thresholds programmed by user in autonomous mode are compliant with the values
described the above table.

DS11786 - Rev 15 page 22/36

 VL53L1
Outline drawings

8 Outline drawings

Figure 17. Outline drawing (1/3)

DS11786 - Rev 15 page 23/36

 VL53L1
Outline drawings

Figure 18. Outline drawing (2/3)

DS11786 - Rev 15 page 24/36

 VL53L1
Outline drawings

Figure 19. Outline drawing (3/3)

Caution: The VL53L1 module is delivered with a protective liner covering the top of the cap to protect the sensor from
foreign material during the assembly process. It must be removed by the customer just before mounting the
cover glass.

DS11786 - Rev 15 page 25/36

 VL53L1
Laser safety

9 Laser safety

This product contains a laser emitter and corresponding drive circuitry. The laser output is designed to meet
Class 1 laser safety limits under all reasonably foreseeable conditions including single faults in compliance with
IEC 60825-1:2014.
Do not increase the laser output power by any means. Do not use any optics to focus the laser beam.
Caution: Use of controls or adjustments, or performance of procedures other than those specified herein may result in
hazardous radiation exposure.

Figure 20. Class 1 laser label

This product complies with:

• IEC 60825-1:2014
• 21 CFR 1040.10 and 1040.11, except for conformance with IEC 60825-1:2014 as described in the laser
notice number 56, dated May 8, 2019.
• EN 60825-1:2014 including EN 60825-1:2014/A11:2021
• EN 50689:2021, however STMicroelectronics does not guarantee compliance with the requirement of
clause 5 from EN50689 regarding child appealing products. If designing a child appealing product, contact
STMicroelectronics' technical application support.

DS11786 - Rev 15 page 26/36

 VL53L1
Packing and labeling

10 Packing and labeling

10.1 Product marking

A two line product marking is applied on the backside of the module (on the substrate). The first line is the silicon
product code, and the second line, the internal tracking code.

10.2 Inner box labeling

The labeling follows the STMicroelectronics' standard packing acceptance specification.
The following information is on the inner box label:
• Assembly site
• Sales type
• Quantity
• Trace code
• Marking
• Bulk ID number

10.3 Packing
At the customer/subcontractor level, it is recommended to mount the device in a clean environment to avoid
foreign material deposition.
To help avoid any foreign material contamination at product assembly level the modules are shipped in a tape and
reel format with a protective liner, starting from production version (cut1.1).
The packing is vacuum-sealed and includes a desiccant.

DS11786 - Rev 15 page 27/36

 VL53L1
Packing and labeling

10.4 Tape outline drawing

Figure 21. Tape outline drawing

DS11786 - Rev 15 page 28/36

 VL53L1
Handling, moisture, and reflow precautions

11 Handling, moisture, and reflow precautions

11.1 Shock precaution

Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject
to excessive shock, it must be rejected even if no apparent damage is visible. For example, if it is dropped on the
floor, or if a tray/reel of units is dropped on the floor.

11.2 Part handling

Handling must be done with nonmarring, ESD, safe carbon, plastic, or Teflon™ tweezers. Ranging modules are
susceptible to damage or contamination. The customer is advised to use a clean assembly process after
removing the tape from the parts, and until a protective cover glass is mounted.

11.3 Compression force

A maximum compressive load of 25 N should be applied on the module.

11.4 Moisture sensitivity level

Moisture sensitivity is level 3 (MSL) as described in JEDEC JSTD-020-C.
For devices that are classified to the levels defined in JEDEC JSTD-020-C, JEDEC JSTD-033-C provides:
• Manufacturers and users with standardized methods for handling, packing, and shipping.
• Standardized methods for using moisture/reflow and process sensitive devices.

DS11786 - Rev 15 page 29/36

 VL53L1
Handling, moisture, and reflow precautions

11.5 Pb-free solder reflow process

Table 22. Recommended solder profile and Figure 22. Solder profile show the recommended and maximum
values for the solder profile.
Customers have to tune the reflow profile depending on the PCB, solder paste, and material used. We expect
customers to follow the recommended reflow profile, which is specifically tuned for the VL53L1 package.
If a customer must perform a reflow profile, which is different from the recommended one, the new profile must be
qualified by the customer at their own risk. This is especially true for peaks >240°C. In any case, the profile must
be within the “maximum” profile limit described in JEDEC JSTD-020-C and in Table 22. Recommended solder
profile.
Note: Temperatures mentioned in the table below are measured at the top of the VL53L1 package.

Table 22. Recommended solder profile

Parameters Recommended Maximum Unit

Minimum temperature (TS min) 130 150

°C
Maximum temperature (TS max) 200 200

Time ts (TS min to TS max) 90-110 60-120 s

Temperature (TL) 217 217 °C

Time (tL) 55-65 55-65 s

Ramp up 2 3 °C/s
Temperature (Tp-10) 250 °C

Time (tp-10) — 10 s

Ramp up 3 °C/s
Peak temperature (Tp) 240 245 °C
Time to peak 300 300 s
Ramp down (peak to TL) -4 -6 °C/s

Figure 22. Solder profile

Note: The component should be limited to a maximum of three passes through this solder profile.
Note: As the VL53L1 package is not sealed, only a dry reflow process should be used (such as convection reflow).
Vapor phase reflow is not suitable for this type of optical component.
Note: The VL53L1 is an optical component and should be treated carefully. This would typically include using a ‘no-
wash’ assembly process.

DS11786 - Rev 15 page 30/36

 VL53L1
Package information

12 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

DS11786 - Rev 15 page 31/36

 VL53L1
Ordering information

13 Ordering information

Table 23. Order codes

Order codes Package Packing Minimum order quantity

VL53L1CBV0FY/1 Optical LGA12 with liner Tape and reel 3600 pcs

DS11786 - Rev 15 page 32/36

 VL53L1
Ordering information

Revision history
Table 24. Document revision history

Date Version Changes

Updated Figure 17. Outline drawing (1/3), Figure 18. Outline drawing (2/3),
and Figure 19. Outline drawing (3/3).
29-Nov-2022 13
Updated Section 10.4: Tape outline drawing.
Added a note at the end of Section 11.5: Pb-free solder reflow process.
Updated Features and Description sections.
25-Apr-2024 14 Updated maximum value of VIH in Section 6.5: Digital input and output.
Updated Section 9: Laser safety.
Features section: Added "eye safety".
Updated master/slave to controller/target.
Added Section 5: Thermal characteristics, including a maximum AMR of
125°C.
09-Aug-2024 15
Table 13. Recommended operating conditions: Removed ambient
temperature data.
Updated Section 10: Packing and labeling.
Added Section 11: Handling, moisture, and reflow precautions.

DS11786 - Rev 15 page 33/36

 VL53L1
Contents

Contents
1 Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2.1 Technical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3 Device pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.4 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 System functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 Firmware state machine description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 Customer manufacturing calibration flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4 Device programming and control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.5 Description of operating “preset” modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.6 Digital processing and reading the results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.7 Reading the results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.8 Power sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.9 Ranging sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.10 Handshake management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Control interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
4.1 I²C interface - timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.2 I²C interface - reference registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
5.1 Absolute maximum rating (TSTG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.2 Ambient operating temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
6.1 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.3 Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.4 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.5 Digital input and output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7 Ranging performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
7.1 Measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.2 Minimum ranging distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.3 Ranging and scanning modes: Multiobject detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.4 Ranging and scanning modes: Full FoV performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

DS11786 - Rev 15 page 34/36

 VL53L1
Contents

7.5 Range and scanning modes: Partial FoV performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.5.1 Optical center definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.5.2 Partial FoV performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.6 Lite mode performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.7 Autonomous mode performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8 Outline drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
9 Laser safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
10 Packing and labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
10.1 Product marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.2 Inner box labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.3 Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.4 Tape outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
11 Handling, moisture, and reflow precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
11.1 Shock precaution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11.2 Part handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11.3 Compression force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11.4 Moisture sensitivity level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11.5 Pb-free solder reflow process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
12 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
13 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

DS11786 - Rev 15 page 35/36

 VL53L1

IMPORTANT NOTICE – READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names
are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2024 STMicroelectronics – All rights reserved

DS11786 - Rev 15 page 36/36