Reference Books
1. Basic VLSI Design by Douglas A. Pucknell
2. Design of VLSI Systems- A Practical Introduction by Linda E.M. Brackendary
                          Introduction to Microelectronics
 Integrated Circuits (ICs): Resistors, Capacitors, Transistors. Many transistors in one chip.
• SSI - Small Scale Integration                      MSI - Medium Scale Integration
• LSI - Large Scale Integration                      VLSI - Very Large Scale Integration
• ULSI - Ultra Large Scale Integration               GLSI - Giant Large Scale Integration
A Brief History/Microelectronics Evolution
        Why VLSI/Miniaturization required in electronics?
• low size, weight and volume
• low cost (because cost depends upon size, manufacturing cost, maintenance
  cost etc.)
• reduced design time and complexity (realization of complex circuits using
  discrete devices are difficult and costly too)
• higher speed
• high degree of reliability, repeatability
• lower static power dissipation and sophisticated designs can be made
                                 Moore’s Law
Gordon Moore: co-founder of Intel
1st Law:
• The number of transistors per chip roughly doubles in every two years.
• The number of transistors per chip would grow exponentially.
 2nd Law:
• The cost of a semiconductor chip fabrication doubles every four years.
• The cost of a semiconductor chip fabrication increases exponentially over time.
Moore’s Law
                                      VLSI Design Approaches
There are three approaches to implementing digital design:
1st Approach – Off the self. The chips are available “ off the self” from manufacturers.
        • designer is limited to the integrated circuits on offer
        • availability of specific functions influences the resulting design
2nd Approach – Full custom design. The chip design is completely depends on designer.
        • total control over the chip function including the specification of the content of each layer manufactured
        • associated overheads of the design time, development and manufacturing cost
3rd Approach – Semi custom design.
        • design in the form of the uncommitted logic array ( ULA)
        • designer specify the cell interconnection and the cell configuration to provide a user-specified function
Full Custom Design/Top down Design Hierarchy
                               Choice of VLSI Technology
 Choice of materials:
       • Low cost
       • Availability
       • Insulating property
Si/SoS/Ge/GaAs
Why Si is better than others?/ Why Si technology is most popular?
 GeO2 – is partially soluble
GaAs – does not form a oxide, have higher mobility but high integration levels are difficult to
 achieve
                               Choice of VLSI Technology
 BJT, MOS (pMOS, nMOS), CMOS, BiCMOS
BJT
       • Base current limits integration density
       • More static power dissipation
MOS – low power allows very high integration
                                Choice of VLSI Technology
 Why MOS not BJT in integration?
                     Features              BJT              MOS
     Spped                                More               Less
     Area                                 More               Less
     Power dissipation                    More               Less
     No. of Steps (MASKs)                 More               Less
     Processing                          Complex            Simple
     Repeatability                         No                Yes
     Dynamic storage capacity              No                Yes
                          Choice of VLSI Technology
NMOS or CMOS?
                     NMOS                         CMOS
                 One transistor               Two transistor
                   Less area                    More area
                   Low speed                    High speed
            High power dissipation         Low power dissipation
                 Complexity few               Less complexity
                  Less reliable                More reliable
                        Choice of VLSI Technology
Speed-Power Product:
BJT – Speed = 10ns, Power = 2mW, Speed*Power = 20 pJ
MOS – Speed = 40ns, Power = 10nW, Speed*Power = 0.0004 pJ
Choice of VLSI Technology
          EE 4121
VLSI Design and Technology
                Lecture 4: Stick Diagram
Department of Electrical and Electronic Engineering (EEE)
 Khulna University of Engineering & Technology (KUET)
• Design Rules: Design rules are a set of geometrical specifications that dictate the
  design of the layout
Exact geometric information is known
Chips or IC are specified with mask sets.
Area is known.
• Circuit design with all dimensions is Layout
• Designer :
      minimize complexity
      Utilize area
      Workable chip
      Reliable (proper functioning)
• Process Engineer:
      Controllable
      reproducible
• Mask Layout: Representation of IC or stick diagram in terms of planar
  geometric shapes or masks or set of masks is called mask layout.
• Properties of Mask Layout:
minimum size/width – to avoid opening or breaking
minimum spacing – to avoid shorting
minimum overlapping – for proper functioning
minimum surrounding – contact cuts
• What is HDL?
• HDL stands for Hardware Description Language. It is a programming language
  that is used to describe, simulate, and create hardware like digital circuits (ICS).
  HDL is mainly used to discover the faults in the design before implementing it in
  the hardware.
• In computer engineering, a hardware description language (HDL) is a specialized
  computer language used to describe the structure and behavior of electronic
  circuits, and most commonly, digital logic circuits
Entity
• The Entity is used to specify the input and output ports of the circuit. An Entity
  usually has one or more ports that can be inputs (in), outputs (out), input-
  outputs (inout), or buffer.
• An Entity may also include a set of generic values that are used to declare
  properties of the circuit.