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LM337L
SNVS780E – MAY 1998 – REVISED DECEMBER 2016

LM337L 3-Terminal Adjustable Regulator

1 Features Normally, only a single 1-µF solid tantalum output
capacitor is required unless the device is situated
•
1 Adjustable Output Down to 1.2 V more than 6 inches from the input filter capacitors, in
• Ensured 100-mA Output Current which case an input bypass is required. A larger
• Line Regulation Typically 0.01%/V output capacitor can be added to improve transient
• Load Regulation Typically 0.1% response. The adjustment pin can be bypassed to
achieve very high ripple rejection ratios, which are
• Current Limit Constant With Temperature difficult to achieve with standard 3-pin regulators.
• Eliminates the Need to Stock Many Voltages
Besides replacing fixed regulators, the LM337L is
• Standard 3-Pin Transistor Package useful in a wide variety of other applications. Because
• 80-dB Ripple Rejection the regulator is floating and monitors only the input-
• Output is Short Circuit Protected to-output differential voltage, supplies of several
hundred volts can be regulated as long as the
maximum input-to-output differential is not exceeded.
2 Applications
The LM337L makes a simple adjustable switching
• Industrial Power Supplies
regulator, a programmable output regulator, or by
• Factory Automation Systems connecting a fixed resistor between the adjustment
• Building Automation Systems and output, the LM337L can be used as a precision
• PLC Systems current regulator. Supplies with electronic shutdown
can be achieved by clamping the adjustment pin to
• Instrumentation ground, which programs the output to 1.2 V, where
• IGBT Drive Negative Gate Supplies most loads draw little current.
• Networking The LM337L is available in a standard TO-92
• Set-Top Boxes transistor package and a standard SO-8 surface
mount package. The LM337L is rated for operation
3 Description over a –25°C to 125°C range.
The LM337L is an adjustable 3-pin negative voltage For applications requiring output current in excess of
regulator capable of supplying 100 mA over a –1.2-V 0.5 A and 1.5 A, The LM137 series may be suitable.
to –37-V output range. The LM337L is easy to use For the positive complement, the LM117 and LM317L
and requires only two external resistors to set the series are options.
output voltage. Both line and load regulation are
better than standard fixed regulators. The LM337L is Device Information(1)
packaged in a standard, easy-to-use TO-92 transistor PART NUMBER PACKAGE BODY SIZE (NOM)
package.
SOIC (8) 3.91 mm × 4.90 mm
In addition to higher performance than fixed LM337L
TO-92 (3) 4.30 mm × 4.30 mm
regulators, the LM337L offers full overload protection.
Included on the chip are current limit, thermal (1) For all available packages, see the orderable addendum at
the end of the data sheet.
overload protection, and safe area protection. All
overload protection circuitry remains fully functional
even if the adjustment pin is disconnected.
1.2-V to 25-V Adjustable Regulator LM337L Available Packages
Pin 1. Output
2. Adjustment
3. Input

R2 3
1
+ + 2
C2 C1
1 µF
R1 TO-92 SOIC
ADJ
240 Ÿ
VIN VOUT
-VIN LM337L
1

Copyright © 2016, Texas Instruments Incorporated

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM337L
SNVS780E – MAY 1998 – REVISED DECEMBER 2016 www.ti.com

Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes.......................................... 6
2 Applications ........................................................... 1 8 Application and Implementation .......................... 8
3 Description ............................................................. 1 8.1 Application Information.............................................. 8
4 Revision History..................................................... 2 8.2 Typical Applications .................................................. 8
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 10
6 Specifications......................................................... 3 10 Layout................................................................... 10
6.1 Absolute Maximum Ratings ...................................... 3 10.1 Layout Guidelines ................................................. 10
6.2 ESD Ratings.............................................................. 3 10.2 Layout Example .................................................... 10
6.3 Recommended Operating Conditions....................... 3 11 Device and Documentation Support ................. 11
6.4 Thermal Information .................................................. 4 11.1 Documentation Support ........................................ 11
6.5 Electrical Characteristics........................................... 4 11.2 Receiving Notification of Documentation Updates 11
6.6 Typical Characteristics .............................................. 5 11.3 Community Resources.......................................... 11
7 Detailed Description .............................................. 6 11.4 Trademarks ........................................................... 11
7.1 Overview ................................................................... 6 11.5 Electrostatic Discharge Caution ............................ 11
7.2 Functional Block Diagram ......................................... 6 11.6 Glossary ................................................................ 11
7.3 Feature Description................................................... 6 12 Mechanical, Packaging, and Orderable
Information ........................................................... 11

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (May 2013) to Revision E Page

• Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,
Recommended Operating Conditions table, Typical Characteristics section, Detailed Description section, Application
and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Deleted DSBGA Package references throughout the data sheet .......................................................................................... 1
• Deleted soldering information rows from Absolute Maximum Ratings table .......................................................................... 3
• Added Thermal Information table ........................................................................................................................................... 4
• Changed RθJA values for D (SOIC) package From: 180 To: 111.3 and for LP (TO-92) package From: 160 To: 156.9 ........ 4

Changes from Revision C (May 2013) to Revision D Page

• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1

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5 Pin Configuration and Functions

D Package LP Package
8-Pin SOIC 3-Pin TO-92
Top View Bottom View

Pin Functions
PIN
I/O DESCRIPTION
NAME TO-92 SOIC
ADJ 1 4 — Adjust pin
NC — 5, 8 — No connection
VIN 3 2, 3, 6, 7 Input Input voltage pin for the regulator
VOUT 2 1 Output Output voltage pin for the regulator

6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
See
MIN MAX UNIT
Input-output voltage differential 40 V
Power dissipation Internally Limited
Storage temperature, Tstg –55 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2) ±1500 V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±1500
V may actually have higher performance.
(2) Human-body model, 1.5k Ω in series with 100 pF.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating junction temperature –25 125 °C

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6.4 Thermal Information

LM337L
THERMAL METRIC (1) D (SOIC) LP (TO-92) UNIT
8 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 111.3 156.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.1 80.2 °C/W
RθJB Junction-to-board thermal resistance 51.9 — °C/W
ψJT Junction-to-top characterization parameter 10.6 24.7 °C/W
ψJB Junction-to-board characterization parameter 51.3 136.2 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

6.5 Electrical Characteristics (1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Line regulation (2) TA = 25°C, 3 V ≤ |VIN – VOUT| ≤ 40 V 0.01 0.04 %/V
Load regulation (2) TA = 25°C, 5 mA ≤ IOUT ≤ IMAX 0.1% 0.5%
Thermal regulation TA = 25°C, 10-ms Pulse 0.04 0.2 %/W
Adjustment pin current 50 100 μA
Adjustment pin current change 5 mA ≤ IL ≤ 100 mA, 3 V ≤ |VIN – VOUT| ≤ 40 V 0.2 5 μA
3 V ≤ |VIN – VOUT| ≤ 40 V, 10 mA ≤ IOUT ≤ 100 mA, P ≤
Reference voltage 1.2 1.25 1.3 V
625 mW
(2)
Line regulation 3 V ≤ |VIN – VOUT| ≤ 40 V 0.02 0.07 %/V
Load regulation (2) 5 mA ≤ IOUT ≤ 100 mA 0.3% 1.5%
Temperature stability TMIN ≤ Tj ≤ TMAX 0.65%
|VIN – VOUT| ≤ 40 V 3.5 5 mA
Minimum load current
3 V ≤ |VIN – VOUT| ≤ 15 V 2.2 3.5 mA
3 V ≤ |VIN – VOUT| ≤ 13 V 100 200 320 mA
Current limit
|VIN – VOUT| = 40 V 25 50 120 mA
RMS output noise, % of VOUT TA = 25°C, 10 Hz ≤ f ≤ 10 kHz 0.003%
VOUT = –10 V, F = 120 Hz, CADJ = 0 65 dB
Ripple rejection ratio
CADJ = 10 μF 66 80 dB
Long-term stability TA = 125°C 0.3% 1%

(1) Unless otherwise specified, these specifications apply –25°C ≤ TJ ≤ 125°C for the LM337L; |VIN – VOUT| = 5 V and IOUT = 40 mA.
Although power dissipation is internally limited, these specifications are applicable for power dissipations up to 625 mW. IMAX is 100 mA.
(2) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specification for thermal regulation.

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6.6 Typical Characteristics

140 5.37
Input-Output Voltage Differential (V)

120 5.36

100 5.35

80 5.34

IQ (mA)
60 5.33

40 5.32

20 5.31

0 5.3
0 5 10 15 20 25 0 5 10 15 20 25 30 35 40
Current (mA) D001
Input-Output Voltage Differential (V) D001
Figure 1. Current Limit Figure 2. Minimum Operating Current

Figure 3. Line Transient Response Figure 4. Load Transient Response

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7 Detailed Description

7.1 Overview
The LM337L devices are adjustable 3-terminal negative-voltage regulators capable of supplying 100 mA over an
output voltage range of –1.2 V to –37 V. They are exceptionally easy to use, requiring only two external resistors
to set the output voltage and one output capacitor for frequency compensation. In addition, LM337L offers full
overload protection. Included on the chip are current limit, thermal overload protection and safe area protection.
All overload protection circuitry remains fully functional even if the adjustment terminal is disconnected. The
LMx37 devices serve a wide variety of applications, including local on-card regulation, programmable output-
voltage regulation, and precision current regulation.

7.2 Functional Block Diagram

OUTPUT

IADJ

+ Over temp
& over
current
protection
+ 1.25 V
ADJUST

INPUT
Copyright © 2016, Texas Instruments Incorporated

7.3 Feature Description

7.3.1 Output Voltage Adjustment
The Adjustment (ADJ) pin serves as a voltage adjustment reference for the output. The ADJ pin can be attached
to a resistor divider circuit to adjust the output voltage level. The reference voltage VADJ will typically be 1.25 V
higher than VO.

7.4 Device Functional Modes

7.4.1 Protection Diodes
When external capacitors are used with any IC regulator, it is sometimes necessary to add protection diodes to
prevent the capacitors from discharging through low current points into the regulator. Most 10-μF capacitors have
low enough internal series resistance to deliver 20-A spikes when shorted. Although the surge is short, there is
enough energy to damage parts of the IC. When an output capacitor is connected to a negative output regulator
and the input is shorted, the output capacitor pulls current out of the output of the regulator. The current depends
on the value of the capacitor, the output voltage of the regulator, and the rate at which VIN is shorted to ground.
The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs
when either the input, or the output, is shorted. Figure 15 shows the placement of the protection diodes.

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Device Functional Modes (continued)

When CL is larger than 20 μF, D1 protects the LM337L in case the input supply is shorted.
When C2 is larger than 10 μF and −VOUT is larger than −25V, D2 protects the LM337L in case the output is shorted.

Figure 5. Regulator With Protection Diodes

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SNVS780E – MAY 1998 – REVISED DECEMBER 2016 www.ti.com

8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM337L is a negative output linear regulator with high accuracy and a wide temperature range. An output
capacitor can be added to further improve transient response, and the ADJ pin can be bypassed to achieve very
high ripple-rejection ratios. The device's functionality can be utilized in many different applications that require
negative voltage supplies, such as bipolar amplifiers, operational amplifiers, and constant current regulators.

8.2 Typical Applications

8.2.1 1.2-V to 25-V Adjustable Regulator

R2
+ +
C2 C1
1 µF
R1
ADJ
240 Ÿ
VIN VOUT
-VIN LM337L

Copyright © 2016, Texas Instruments Incorporated

Full output current not available at high input-output voltages

†C1 = 1-μF solid tantalum or 10-μF aluminum electrolytic required for stability
*C2 = 1-μF solid tantalum is required only if regulator is more than 4″ from power supply filter capacitor

Figure 6. 1.2-V to 25-V Adjustable Regulator Diagram

8.2.1.1 Design Requirements

The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an
output capacitor for load regulation. An input capacitor is needed if the device is more than 4 in. from the filter
capacitors.

8.2.1.2 Detailed Design Procedure

The output voltage is set based on the selection of the two resistors (R1 and R2) as shown in Equation 1.
§ R2 ·
VOUT 1.25 V ¨ 1 ¸
© 240 : ¹
(1)

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Typical Applications (continued)

8.2.1.3 Application Curve

Figure 7. Dropout Voltage across Load Current at 25°C (∆Vout < 100 mV

8.2.2 Regulator With Trimmable Output Voltage

R2
3.92 Ÿ
± 1%
+ 1 µf
SOLID
R1 R3 R4 R5
TANTALUM
249 Ÿ 3.9 Ÿ 8.2 Ÿ 16 Ÿ
1% 5% 5% 5%
ADJ
VOUT
LM337L -22 V

-VIN (-25 V TO -40 V)

Copyright © 2016, Texas Instruments Incorporated

Figure 8. Regulator with Trimmable Output Voltage Diagram

8.2.2.1 Design Requirements

This design uses five resistors with two being used for a voltage divider circuit and the other three used for
trimming the output voltage. The benefit is lower cost as compared to using a trim pot. An output capacitor is
needed to improve load regulation.

8.2.2.2 Detailed Design Procedure

This design will trim the output voltage to within 1% of –22 V. The parallel combination of R1, R3, R4 and R5
serve as the bottom resistance and R2 as the top resistance in the voltage divider that sets the output voltage.
Trim Procedure:
• If VOUT is –23.08 V or larger, do not use R3, otherwise leave it in.
• Then if VOUT is –22.47 V or bigger, do not use R4, otherwise leave it in.
• Then if VOUT is –22.16 V or bigger, do not use R5, otherwise leave it in.
This will trim the output to well within 1% of –22 VDC, without any of the expense or trouble of a trim pot (see LB-
46). This technique can be used at any output voltage level.

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9 Power Supply Recommendations

The input supply to the LM337L must be kept at a voltage level such that its maximum input to output differential
voltage rating is not exceeded. The minimum dropout voltage must also be met with extra headroom when
possible to keep the LM337L in regulation. TI recommends an input capacitor, especially when the input pin is
placed more than 4 in. away from the power-supply filter capacitor.

10 Layout

10.1 Layout Guidelines

Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.
Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the
feedback loop from VOUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can
be placed at the ADJ pin and must be placed as close as possible to the IC. In cases when VIN shorts to ground,
an external diode must be placed from VIN to VOUT to divert the surge current into the output capacitor and
protect the IC. Similarly, in cases when a large bypass capacitor is placed at the ADJ pin and VOUT shorts to
ground, an external diode must be placed from VOUT to ADJ to provide a path for the bypass capacitor to
discharge. These diodes must be placed close to the corresponding IC pins to increase their effectiveness.

10.2 Layout Example

Figure 9. LM337L Layout Example

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation
For related documentation see the following:
• LM317L-N 3-Terminal Adjustable Regulator (SNOSBW2)
• LM117, LM317-N Wide Temperature Three-Pin Adjustable Regulator (SNVS774)
• LM317L-N 3-Terminal Adjustable Regulator (SNVS775)

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LM337LM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -25 to 100 LM337 Samples
LM
LM337LMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -25 to 100 LM337 Samples
LM
LM337LZ/NOPB OBSOLETE TO-92 LP 3 TBD Call TI Call TI -25 to 100 LM337
LZ

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 4-Dec-2024

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-May-2024

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM337LMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-May-2024

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM337LMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-May-2024

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM337LM/NOPB D SOIC 8 95 495 8 4064 3.05

Pack Materials-Page 3
 PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1

.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]

4X (0 -15 )

4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4

.005-.010 TYP
[0.13-0.25]

4X (0 -15 )

SEE DETAIL A
.010
[0.25]

.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.

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 EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X

SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK

EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

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 EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55] SYMM

1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

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 PACKAGE OUTLINE
LP0003A SCALE 1.200 SCALE 1.200
TO-92 - 5.34 mm max height
TO-92

5.21
4.44

EJECTOR PIN
OPTIONAL
5.34
4.32

(1.5) TYP

(2.54) SEATING
2X NOTE 3 PLANE
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN

0.43
2X 0.55 3X
3X 0.35
2.6 0.2 0.38
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION
TO STRAIGHT LEAD OPTION

2.67
3X
2.03 4.19
3.17
3 2 1

3.43 MIN

4215214/B 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.

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 EXAMPLE BOARD LAYOUT
LP0003A TO-92 - 5.34 mm max height
TO-92

FULL R
0.05 MAX (1.07) TYP
ALL AROUND METAL 3X ( 0.85) HOLE
TYP TYP

2X
METAL
(1.5) 2X (1.5)

2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
(2.54)
OPENING

LAND PATTERN EXAMPLE

STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X

0.05 MAX ( 1.4) 2X ( 1.4)

ALL AROUND METAL
TYP 3X ( 0.9) HOLE

METAL

2X
1 2 3 SOLDER MASK
(R0.05) TYP
(2.6) OPENING
SOLDER MASK
OPENING (5.2)

LAND PATTERN EXAMPLE

FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X

4215214/B 04/2017

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 TAPE SPECIFICATIONS
LP0003A TO-92 - 5.34 mm max height
TO-92

13.7
11.7

32
23

(2.5) TYP 0.5 MIN

16.5
15.5

11.0 9.75
8.5 8.50

19.0
17.5

2.9 6.75 3.7-4.3 TYP

TYP
2.4 5.95
13.0
12.4

FOR FORMED LEAD OPTION PACKAGE

4215214/B 04/2017

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