DS90UB971-Q1

SNLS750 – DECEMBER 2023

DS90UB971-Q1 FPD-Link IV 7.55-Gbps Serializer With CSI-2 Interface for 8MP+

Cameras, RADAR & Other Sensors

1 Features 2 Applications
• AEC-Q100 Qualified for Automotive Applications: • Automotive Driver Assistance Systems (ADAS)
– Device temperature: -40 to 115°C ambient – Surround View Systems (SVS)
operating temperature range specified for – Camera Monitor Systems (CMS)
electrical performance – Forward Vision Cameras (FC)
• 7.55 Gbps (6 Gbps Video Payload) Supports High- – Driver Monitoring Systems (DMS)
Speed Sensors Including 8MP+ Imagers – Rear-View Cameras (RVC)
• Power-over-Coax (PoC) Compatible Transceiver – Automotive Satellite RADAR & LIDAR Modules
• Single MIPI D-PHY Port with 4 Lanes – Time-of-Flight (ToF) Sensors
– Compliant to MIPI D-PHY v2.1 • Security and Surveillance Cameras
– 1 Clock Lane and 1, 2, or 4 Configurable Data • Industrial and Medical Imaging
Lanes
3 Description
– Up to 1.5 Gbps/Lane, 6 Gbps/Port
– Supports Polarity Pin Inversion (p/n) The DS90UB971-Q1 serializer represents the first
– 16 Virtual Channels generation in FPD-Link IV serializers and is designed
• Single Port MIPI CSI-2 Receiver to support ultra-high-speed raw data sensors
– Compliant to MIPI CSI-2 v2.1 including 8MP+ Imagers, satellite RADAR, LIDAR,
– Supports Multiple Data Types and Multi- and Time-of-Flight (ToF) sensors. The chip delivers
Exposure an 7.55-Gbps forward channel and an ultra-low
• Advanced Data Protection and Diagnostics latency, 47.1875-Mbps bidirectional control channel
Including CRC Data Protection, Sensor Data and supports power over a single coax (PoC) or
Integrity Check, I2C Write Protection, Voltage and STP cable. The DS90UB971-Q1 features advanced
Temperature Measurement, Programmable Alarm data protection and diagnostic features to support
and Line Fault Detection ADAS and automotive functional safety. Together
• Flexible Programmable Output Clock Generator with a companion deserializer, the DS90UB971-Q1
• Supports Single-Ended Coaxial or Shielded- delivers precise multi-camera sensor clock and
Twisted-Pair (STP) Cable sensor synchronization.
• Ultra-Low Latency Bidirectional I2C and GPIO The DS90UB971-Q1 is fully AEC-Q100 qualified with
Control Channel Enables ISP Control From ECU a wide temperature range of –40°C to 115°C. The
• Single 1.8-V Power Supply serializer comes in a small 5-mm × 5-mm VQFN
• Compatible with DS90UB9702-Q1, DS90UB954- package for space-constrained sensor applications.
Q1, DS90UB936-Q1, DS90UB960-Q1,
DS90UB962-Q1 Deserializers Device Information
• Pin Compatible with DS90UB953-Q1, PART NUMBER PACKAGE (1) BODY SIZE (NOM)
DS90UB953A-Q1, DS90UB935-Q1, DS90UB951- DS90UB971-Q1 VQFN (32) 5.00 mm × 5.00 mm
Q1 Serializers
(1) For all available packages, see the orderable addendum at
• Small 5-mm × 5-mm VQFN Package and Solution the end of the data sheet.
Size for Compact Sensor Module Designs
MIPI CSI-2 MIPI CSI-2

D3P/N D3P/N
DS90UB971-Q1 Compatible Image Signal
D
D2P/N Serializer Deserializer D
D2P/N Processor (ISP) or
Graphics
Imager D1P/N D1P/N Processor or
FPD-Link IV
Sensor or Display
D0P/N (over Coax or STP) D0P/N
Processor
DOUT+/- RIN+/-
CLKP/N CLKP/N

I2C I2C
HS GPIO HS GPIO

Typical Application

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DS90UB971-Q1
SNLS750 – DECEMBER 2023 www.ti.com

4 Device and Documentation Support

4.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Notifications to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.
4.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
4.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

4.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: DS90UB971-Q1

 PACKAGE OPTION ADDENDUM

www.ti.com 23-Dec-2023

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

DS90UB971RHBRQ1 ACTIVE VQFN RHB 32 3000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 115 UB971Q Samples

DS90UB971RHBTQ1 ACTIVE VQFN RHB 32 250 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 115 UB971Q Samples

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 23-Dec-2023

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 28-Dec-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS90UB971RHBRQ1 VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q2
DS90UB971RHBTQ1 VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.1 8.0 12.0 Q2

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 28-Dec-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS90UB971RHBRQ1 VQFN RHB 32 3000 367.0 367.0 35.0
DS90UB971RHBTQ1 VQFN RHB 32 250 210.0 185.0 35.0

Pack Materials-Page 2
 GENERIC PACKAGE VIEW
RHB 32 VQFN - 1 mm max height
5 x 5, 0.5 mm pitch PLASTIC QUAD FLATPACK - NO LEAD

Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4224745/A

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 PACKAGE OUTLINE
RHB0032U SCALE 3.000
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

5.1 B
A
4.9

PIN 1 INDEX AREA

5.1
4.9

0.1 MIN

(0.13)

SECTION A-A
TYPICAL
A-A 30.000

1.0 C
0.8
SEATING PLANE
0.05 3.7 0.1
0.00 0.08 C
2X 3.5
(0.2) TYP
9 16 EXPOSED
THERMAL PAD
28X 0.5
8
17 (0.16) TYP

2X
33
A A SYMM
3.5

0.3
32X
0.2
24 0.1 C A B
1
0.05 C

PIN 1 ID 32 25
(45 X 0.3) SYMM
(0.25) 0.5
32X
TYP 0.3
4225709/C 01/2021

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

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 EXAMPLE BOARD LAYOUT
RHB0032U VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

( 3.7)

SYMM

32 25
32X (0.6)

1 24

32X (0.25)
(0.97)

28X (0.5)
(0.63)
33 TYP SYMM

(4.8)

( 0.2) TYP
VIA

8 17

(R0.05)
TYP

9 16
(0.63) TYP (0.97)

(4.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:18X
0.07 MAX 0.07 MIN
ALL AROUND ALL AROUND

SOLDER MASK
METAL EDGE OPENING

EXPOSED METAL
SOLDER MASK EXPOSED
METAL METAL UNDER
OPENING SOLDER MASK

NON SOLDER MASK

SOLDER MASK
DEFINED
DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4225709/C 01/2021

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.

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 EXAMPLE STENCIL DESIGN
RHB0032U VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

9X ( 1.06)
(R0.05) TYP (1.26)
32 25
32X (0.6)

1 24

32X (0.25)

(1.26)
28X (0.5)

SYMM
33

(4.8)

METAL
TYP

8 17

(R0.05) TYP

9 16
SYMM

(4.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 33:

74% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X

4225709/C 01/2021

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

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