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Basic Fabrication

The document covers fundamental concepts in the fabrication and processing industry, focusing on silicon as a preferred material, the formation of native oxide, and the differences between material types. It details wafer manufacturing processes, including the Czochralski and float-zone methods, and discusses lithography techniques such as photolithography and the use of photoresists. Additionally, it addresses thermal oxidation of silicon and the significance of SiO2 in microelectronics.

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10 views2 pages

Basic Fabrication

The document covers fundamental concepts in the fabrication and processing industry, focusing on silicon as a preferred material, the formation of native oxide, and the differences between material types. It details wafer manufacturing processes, including the Czochralski and float-zone methods, and discusses lithography techniques such as photolithography and the use of photoresists. Additionally, it addresses thermal oxidation of silicon and the significance of SiO2 in microelectronics.

Uploaded by

217
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Basics of Fabrication & Processing Industry

1. Why is silicon the most preferred material in the fabrication industry?


2. What is meant by native oxide, and how does it form on silicon wafers?
3. Differentiate between crystalline, polycrystalline, and amorphous materials.
4. What is Crystalline defect? Explain point defects and line defects.
5. What are Miller indices, and why are they important in silicon wafer orientation? Find
Millar indices math.
6. What is meant by integrated circuit (IC) batch fabrication?
7. Why is the purity of semiconductor materials critical in device fabrication?

Wafer Manufacturing

8. What is the role of the Czochralski process in monocrystalline wafer


fabrication?
9. Why is the float-zone process preferred for high-purity silicon wafers?
10. What is the purpose of the Czochralski (CZ) process?
11. Explain the role of dopants during crystal growth.
12. What is the difference between metallurgical-grade and electronic-grade silicon?
13. Why is oxygen contamination a concern in CZ-grown silicon?
14. Describe the full wafer manufacturing process from sand to silicon wafers.
15. Describe the full wafer manufacturing process from sand to monocrystal silicon Boule.
16. Describe the full wafer manufacturing process from Boule to Wafer.

Lithography Techniques

17. What is the purpose of photolithography in semiconductor fabrication?


18. How do positive and negative photoresists differ in behavior and usage?
19. Compare PMMA and SU-8.
20. Compare contact and projection exposure tools.
21. What is the contrast ratio ?
22. What are the typical components of a photoresist ? And its main parameters.
23. What is the aim of post exposure bake in lithography ? (1pt) Explain the behavior of a contrast
enhancement material in lithography.
24. Explain the full photolithography process from wafer preparation to development.
25. Compare photolithography and electron beam lithography in terms of resolution and
application.
26. Explain Contact, proximity, and projection exposure tools with advantage and disadvantage.

Oxidation

27. Explain the process of thermal oxidation of silicon, including the key equations,
applications.
28. Explain the key variables in oxidation, related math from multiple oxidations.
29. Compare dry and wet thermal oxidation.
30. Explain why SiO2 is so important in microelectronics and microsystems technology and what it is
used for.
31.

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