AP2182/ AP2192

1.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH

Description Pin Assignments

The AP2182 and AP2192 are integrated high-side power switches
( Top View )
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is GND 1 8 FLG1

available with both polarities of Enable input. They offer current and
IN 2 7 OUT1
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability EN1 3 6 OUT2

on the open-drain Flag output prevents false over-current reporting

EN2 4 5 FLG2
and does not require any external components.
SO-8
All devices are available in SO-8 and MSOP-8EP packages.
( Top View )
Features GND 1 8 FLG1

 Dual USB Port Power Switches IN 2 7 OUT1

 Over-Current and Thermal Protection
EN1 3 6 OUT2
 2.1A Accurate Current Limiting
 Reverse Current Blocking EN2 4 5 FLG2
 115mΩ On-Resistance
 Input Voltage Range: 2.7V - 5.5V MSOP-8EP
 0.6ms Typical Rise Time
 Very Low Shutdown Current: 1µA (Max)
 Fault Report (FLG) with Blanking Time (7ms typ) Applications
 ESD Protection: 3KV HBM, 300V MM
 Consumer Electronics – LCD TVs & Monitors, Game Machines
 Active High (AP2192) or Active Low (AP2182) Enable
 Communications – Set-Top-Boxes, GPS Systems, Smartphones
 Ambient Temperature Range -40°C to +85°C
 Computing – Laptops, Desktops, Servers, Printers, Docking
 SO-8 and MSOP-8EP (Exposed Pad): Available in ―Green‖
Stations, HUBs
Molding Compound (No Br, Sb)
 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
 Halogen and Antimony Free. “Green” Device (Note 3)
 UL Recognized, File Number E322375
 IEC60950-1 CB Scheme Certified

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

Typical Applications Circuit

AP2192 Enable Active High

Power Supply
IN OUT1 Load
2.7V to 5.5V
0.1mF 68mF
10k 10k 10mF 0.1mF

FLG1 OUT2 Load

FLG2 0.1mF 68mF
ON EN1
EN2 GND
OFF

AP2182/AP2192 1 of 17 May 2016

Document number: DS31569 Rev. 10 - 2 www.diodes.com © Diodes Incorporated
 AP2182/ AP2192

Available Options
Enable Pin Current Limit Recommended Maximum
Part Number Channel Continuous Load Current
(EN) (typ)
AP2182 2 Active Low 2.1A 1.5A
AP2192 2 Active High 2.1A 1.5A

Pin Descriptions

Pin Pin Number

Function
Name SO-8 MSOP-8EP
GND 1 1 Ground
IN 2 2 Voltage input pin
EN1 3 3 Switch 1 enable input, active low (AP2182) or active high (AP2192)
EN2 4 4 Switch 2 enable input, active low (AP2182) or active high (AP2192)
FLG2 5 5 Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered
OUT2 6 6 Switch 2 voltage output pin
OUT1 7 7 Switch 1 voltage output pin
FLG1 8 8 Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered
Exposed pad.
Exposed Tab — Exposed Tab It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.

Functional Block Diagram

FLG1
AP2182, AP2192 Thermal
Sense

Deglitch
EN1 Current
Driver
Limit

UVLO GND

Current
OUT1
Sense

IN

Current
OUT2
Sense

UVLO FLG2

Current
Driver
EN2 Limit
Deglitch

Thermal
Sense
GND

AP2182/AP2192 2 of 17 May 2016

Document number: DS31569 Rev. 10 - 2 www.diodes.com © Diodes Incorporated
 AP2182/ AP2192

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Symbol Parameter Rating Unit

ESD HBM Human Body Model ESD Protection 3 kV
ESD MM Machine Model ESD Protection 300 V
VIN Input Voltage 6.5 V
VOUT Output Voltage VIN +0.3 V
VEN , VFLG Enable Voltage 6.5 V
ILOAD Maximum Continuous Load Current Internal Limited A
TJ(MAX) Maximum Junction Temperature +150 °C
TST Storage Temperature Range (Note 4) -65 to +150 °C
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices.
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).

Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)

Symbol Parameter Min Max Unit

VIN Input Voltage 2.7 5.5 V
IOUT Output Current 0 1.5 A
VIL EN Input Logic Low Voltage 0 0.8 V
VIH EN Input Logic High Voltage 2 VIN V
TA Operating Ambient Temperature -40 +85 °C

AP2182/AP2192 3 of 17 May 2016

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 AP2182/ AP2192

Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)

Symbol Parameter Test Conditions Min Typ Max Unit

VUVLO Input UVLO RLOAD = 1kΩ 1.6 1.9 2.5 V
ISHDN Input Shutdown Current Disabled, IOUT = 0 - 0.5 1 µA
IQ Input Quiescent Current, Dual Enabled, IOUT = 0 - 100 160 µA
ILEAK Input Leakage Current Disabled, OUT Grounded - - 1 µA
IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN - 1 - µA
VIN = 5V, MSOP-8EP, -40°C ≤ TA ≤ +85°C - 115 150 mΩ
RDS(ON) Switch On-Resistance IOUT = 0.5A, SO-8, -40°C ≤ TA ≤ +85°C - 120 160 mΩ
VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA ≤+85°C - 140 180 mΩ
ISHORT Short-Circuit Current Limit Enabled into short circuit, CL = 68µF - 2.0 - A
ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.5V, CL = 68µF, -40°C ≤ TA ≤ +85°C 1.6 2.1 2.6 A
ITRIG Current Limiting Trigger Threshold VIN = VEN, Output Current Slew Rate (<100A/WS), CL = 68µF - 3.0 - A
VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V - - 0.8 V
VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 - - V
ISINK EN Input Leakage VEN = 5V - - 1 µA
TD(ON) Output Turn-On Delay Time CL=1µF, RLOAD = 10Ω - 0.05 - ms
TR Output Turn-On Rise Time CL=1µF, RLOAD = 10Ω - 0.6 1.5 ms
TD(OFF) Output Turn-Off Delay Time CL=1µF, RLOAD = 10Ω - 0.01 - ms
TF Output Turn-Off Fall Time CL=1µF, RLOAD = 10Ω - 0.05 0.1 ms
RFLG FLG Output FET On-Resistance IFLG =10mA - 30 50 Ω
TBLANK FLG Blanking Time CIN =10µF, CL = 68µF 4 7 15 ms
TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ - +140 - C
THYS Thermal Shutdown Hysteresis - - +25 - C
SO-8 (Note 5) - 110 - °C/W
θJA Thermal Resistance Junction-to-Ambient
MSOP-8EP (Note 6) - 60 - °C/W
Notes: 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.

AP2182/AP2192 4 of 17 May 2016

Document number: DS31569 Rev. 10 - 2 www.diodes.com © Diodes Incorporated
 AP2182/ AP2192

Typical Performance Characteristics

VEN 50% 50% VEN

50% 50%

TD(OFF) TD(OFF)
TR TR CL= 1µF
TF TF TA = +25°C
RL = 5Ω
TD(ON) 90% 90%
TD(ON) 90% 90%
VOUT VOUT
10% 10% 10% 10%

Figure 1 Voltage Waveforms: AP2182 (Left), AP2192 (Right)

All Enable Plots are for AP2192 Active High

Channel 1 Turn-On Delay and Rise Time Channel 1 Turn-Off Delay and Fall Time

VEN 1 VEN 1
5V/div 5V/div

CL= 1µF
VOUT 1 TA = +25°C
2V/div RL = 5Ω

VOUT 1 CL = 1µF
2V/div
TA = +25°C
RL = 5Ω

400µs/div 400µs/div

Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time

VEN 2 VEN 2
5V/div 5V/div

CL= 1µF
VOUT 2 TA = +25°C
2V/div RL = 5Ω

VOUT 2 CL= 1µF

2V/div TA = +25°C
RL = 5Ω

400µs/div 400µs/div

AP2182/AP2192 5 of 17 May 2016

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 AP2182/ AP2192

Typical Performance Characteristics (Cont.)

Channel 1 Turn-On Delay and Rise Time Channel 1 Turn-Off Delay and Fall Time

VEN 1 VEN 2
5V/div 5V/div

CL = 100µF
TA = +25°C
VOUT 1 VOUT 2 RL = 5Ω
2V/div 2V/div
CL = 100µF
TA = +25°C
RL = 5Ω

400µs/div 400µs/div

Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time

VEN 2 VEN 2
5V/div 5V/div

CL = 100µF
TA = +25°C
RL = 5Ω
VOUT 2 VOUT 2
2V/div 2V/div
CL = 100µF
TA = +25°C
RL = 5Ω

400µs/div 400µs/div

Channel 1 Short Circuit Current, Channel 2 Short Circuit Current,

Device Enabled Into Short Device Enabled Into Short

VEN 1 VEN 2
5V/div 5V/div

IOUT 1 IOUT 2
500mA/div 500mA/div
VIN = 5V VIN = 5V
TA = 25°C TA = +25°C
CL = 68µF CL = 68µF

500µs/div 500µs/div

AP2182/AP2192 6 of 17 May 2016

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 AP2182/ AP2192

Typical Performance Characteristics (Cont.)

Channel 1 Inrush Current Channel 2 Inrush Current

VEN 1 VEN 2
5V/div 5V/div

CL=100µF CL=470µF VIN = 5V CL=100µF CL=470µF VIN = 5V

TA = +25°C TA = +25°C
RL = 3.3Ω RL = 3.3Ω

IOUT 1 IOUT 2
500mA/div 500mA/div

CL=220µF CL=220µF

1ms/div 1ms/div

Channel 1 Channel 2
0.6 Ω Load Connected to Enabled Device 0.6 Ω Load Connected to Enabled Device
VIN = 5V VIN = 5V
TA = +25°C TA = +25°C
CL = 68µF CL = 68µF
VFLAG 1 VFLAG 2
2V/div 2V/div

IOUT 1 IOUT 2
1A/div 1A/div

2ms/div 2ms/div

Channel 1 Channel 2
Short Circuit with Blanking Time and Recovery Short Circuit with Blanking Time and Recovery

VOUT 1 VOUT 2
5V/div VIN = 5V 5V/div VIN = 5V
TA = +25°C TA = +25°C
CL = 68µF CL = 68µF
VFLAG 1 VFLAG 2
5V/div 5V/div

IOUT 1 IOUT 2
2A/div 2A/div

20ms/div 20ms/div

AP2182/AP2192 7 of 17 May 2016

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 AP2182/ AP2192

Typical Performance Characteristics (Cont.)

Channel 1 Power On Channel 2 Power On

VFLAG 1 VFLAG 2
5V/div 5V/div

TA = +25°C TA = +25°C
CL = 68µF CL = 68µF
RL = 3Ω RL = 3Ω
IOUT 1 IOUT2
500mA/div 500mA/div

VEN 1 VEN 2
5V/div 5V/div

VIN VIN
5V/div 5V/div

1ms/div 1ms/div

Channel 1 UVLO Increasing Channel 1 UVLO Decreasing

TA = +25°C
CL = 68µF
RL = 3Ω

VIN
VIN 2V/div
2V/div

TA = +25°C
CL = 68µF
IOUT 1 IOUT 1
RL = 3Ω
500mA/div 500mA/div

1ms/div 10ms/div

Channel 2 UVLO Increasing Channel 2 UVLO Decreasing

TA = +25°C
CL = 68µF
VIN VIN RL = 3Ω
2V/div 2V/div

TA = +25°C
IOUT I IOUT
CL = 68µF
500mA/div 500mA/div
RL = 3Ω

1ms/div 10ms/div

AP2182/AP2192 8 of 17 May 2016

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 AP2182/ AP2192

Typical Performance Characteristics (Cont.)

Channel 1 Enabled and Shorted with Channel 2 Disabled Channel 1 Disabled and Channel 2 Enabled

VOUT 1
5V/div VEN 1
5V/div

VOUT 2 VOUT 1
5V/div 5V/div

VFLAG 1 VEN 2
5V/div TA = +25°C 5V/div TA = +25°C
CL = 68µF CL = 68µF

IOUT 2 VOUT 2
500mA/div 5V/div

100ms/div 50ms/div

Turn-On Time vs. Input Voltage Turn-Off Time vs. Input Voltage

850 55

750 50 CL = 1µF
RL = 10Ω
Turn-Off Time (ms)

TA = +25°C
Turn-On Time (ms)

650 45

550 40

450 35
CL = 1µF
RL = 10Ω
350 TA = +25°C 30

250 25
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V) Input Voltage (V)

Rise Time vs. Input Voltage Fall Time vs. Input Voltage

650 25

600
24

550
Fall Time (ms)

23
Rise Time (ms)

500
22
450
CL = 1µF 21 CL = 1µF
400 RL = 10Ω RL = 10Ω
TA = +25°C TA = +25°C
20
350

300 19
2 2.5 3 3.5 4 4.5 5 5.5 6 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V) Input Voltage (V)

AP2182/AP2192 9 of 17 May 2016

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 AP2182/ AP2192

Typical Performance Characteristics (Cont.)

Supply Current, Output Enabled vs. Ambient Temperature Supply Current, Output Disabled vs. Ambient Temperature

52 0.9

Supply Current, Output Disabled (mA)

Supply Current, Output Enabled (mA)

VIN =5.5V
0.8
VIN=5.0V VIN =5.0V
47 0.7

VIN=5.5V 0.6
42 VIN =3.3V
0.5

0.4
37
0.3
VIN=2.7V
0.2
32
VIN=3.3V VIN =2.7V
0.1

27 0.0
-60 -40 -20 0 20 40 60 80 100 -60 -40 -20 0 20 40 60 80 100

Ambient Temperature (°C) Ambient Temperature (°C)

Static Drain-Source On-State Resistance vs. Ambient Short-Circuit Output Current vs. Ambient Temperature
Temperature
2.60
180

Short-Circuit Output Current (A)

VIN =2.7V CL=100µF
Static Drain-Source On-State

170 2.50

160 VIN=2.7V VIN=3.3V VIN=5.0V

Resistance (m)

150 2.40

140
2.30
130 VIN =3.3V
120
2.20
110

100 2.10
90 VIN =5V VIN=5.5V
80 2.00
-60 -40 -20 0 20 40 60 80 100 -60 -40 -20 0 20 40 60 80 100

Ambient Temperature (°C) Ambient Temperature (°C)

Undervoltage Lockout vs. Ambient Temperature Threshold Trip Current vs. Input Voltage

2.15 3.24

3.22
Threshold Trip Current (A)
Undervoltage Lockout (V)

2.10
3.20
UVLO Rising
3.18
2.05

3.16

2.00 TA = +25°C
3.14
CL = 68µF
UVLO Falling
3.12
1.95
3.10

1.90 3.08
-60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3

Ambient Temperature (°C) Input Voltage (V)

AP2182/AP2192 10 of 17 May 2016

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 AP2182/ AP2192

Typical Performance Characteristics (Cont.)

Current Limit Response vs. Peak Current

45

40
Current Limit Response (ms)

35 VIN = 5V
TA = +25°C
30 CL = 68µF,
25

20

15

10

0
0 2 4 6 8 10 12
Peak Current (A)

AP2182/AP2192 11 of 17 May 2016

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 AP2182/ AP2192

Application Information
Power Supply Considerations
A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity
of the device to short-circuit transients.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2182/AP2192 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.

In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT.

In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2182/AP2192 is capable of delivering current up
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at ILIMIT.

FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2182/AP2192 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.

Power Dissipation and Junction Temperature

The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2

Finally, calculate the junction temperature:

TJ = PD x RJA + TA
Where:
TA = Ambient Temperature C
RJA = Thermal Resistance
PD = Total Power Dissipation

Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2182/AP2192 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.

AP2182/AP2192 12 of 17 May 2016

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 AP2182/ AP2192

Application Information (Cont.)

Under-Voltage Lockout (UVLO)
The Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V,
even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.

Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.

Power Supply Downstream

USB Ports
3.3V 5V
D+
AP2182
D-
2 7
IN OUT1 VBUS
0.1mF 0.1mF 68mF
GND
8
FLG1
3 D+
USB EN1
Controller 5 D-
FLG2 6
4 OUT2 VBUS
EN2
GND 0.1mF 68mF
GND
1

Figure 2 Typical Two-Port USB Host / Self-Powered Hub

Generic Hot-Plug Applications

In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2182/AP2192, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2182/AP2192 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.

By placing the AP2182/AP2192 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.

AP2182/AP2192 13 of 17 May 2016

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 AP2182/ AP2192

Ordering Information

13” Tape and Reel

Part Number Package Code Packaging
Quantity Part Number Suffix
AP21X2SG-13 S SO-8 2,500/Tape & Reel -13
AP21X2MPG-13 MP MSOP-8EP 2,500/Tape & Reel -13

Marking Information

(1) SO-8
( Top view )

8 7 6 5
Logo
2 : 2 Channel
Part Number AP21X X G : Green
8 : Active Low YY : Year : 08, 09,10~
9 : Active High YY WW X X
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
1 2 3 4

(2) MSOP-8EP

( Top view )

8 7 6 5
A~Z : Green
Logo YWXE MSOP-8EP
Y : Year : 0~9
Part Number AP21X X W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
8 : Active Low 52 and 53 week
9 : Active High 2 : 2 Channel
1 2 3 4

AP2182/AP2192 14 of 17 May 2016

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 AP2182/ AP2192

Package Outline Dimensions (All dimensions in mm.)

Please see http://www.diodes.com/package-outlines.html for the latest version.

(1) Package type: SO-8

SO-8
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
 0 8
All Dimensions in mm

(2) Package type: MSOP-8EP

D MSOP-8EP
Dim Min Max Typ
A - 1.10 -
A1 0.05 0.15 0.10
4X
10
°
A2 0.75 0.95 0.86
D1
A3 0.29 0.49 0.39
0.25

x
E E2 b 0.22 0.38 0.30
Gauge Plane c 0.08 0.23 0.15
y Seating Plane D 2.90 3.10 3.00
D1 1.60 2.00 1.80
a

4X L E 4.70 5.10 4.90

10
°
1
8Xb E1 2.90 3.10 3.00
e
E3 Detail C E2 1.30 1.70 1.50
A1 E3 2.85 3.05 2.95
A3
c e - - 0.65
A A2 L 0.40 0.80 0.60
a 0° 8° 4°
D E1 x - - 0.750
See Detail C y - - 0.750
All Dimensions in mm

AP2182/AP2192 15 of 17 May 2016

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 AP2182/ AP2192

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

(1) Package type: SO-8

Dimensions Value (in mm)

X 0.60
Y 1.55
C1 C1 5.4
C2 1.27
C2

(2) Package type: MSOP-8EP

X C

G Y Value
Dimensions
(in mm)
C 0.650
G 0.450
Y2 X 0.450
Y1
X1 2.000
X1
Y 1.350
Y1 1.700
Y2 5.300

AP2182/AP2192 16 of 17 May 2016

Document number: DS31569 Rev. 10 - 2 www.diodes.com © Diodes Incorporated
 AP2182/ AP2192

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2016, Diodes Incorporated

www.diodes.com

AP2182/AP2192 17 of 17 May 2016

Document number: DS31569 Rev. 10 - 2 www.diodes.com © Diodes Incorporated