RW1500
SMT/BGA Rework Station

Manncorp
1610 Republic Road
Huntingdon Valley, PA 19006
215-830-1200
 
West Coast Office
858-490-6266

© 2015 Manncorp
www.manncorp.com
  

IMPORTANT
Intended Use
Use of Manncorp equipment in ways other than those described in the documentation supplied with
the equipment may result in injury to persons or damage to property. Some examples of unintended
use of equipment include:

• Using incompatible materials

• Making unauthorized modifications
• Removing or bypassing safety guards or interlocks
• Using incompatible or damaged parts
• Using unapproved auxiliary equipment
• Operating equipment in excess of maximum ratings
• Operating equipment in an explosive atmosphere

Regulations and Approvals

Make sure all equipment is rated and approved for the environment in which it is used. Any
approvals obtained for Manncorp equipment will be voided if instructions for installation, operation
and service are not followed.

Qualified Personnel
Equipment owners are responsible for making sure that Manncorp equipment is installed, operated
and serviced by qualified personnel. Qualified personnel are those employees or contractors who
are trained to safely perform their assigned tasks. They are familiar with all relevant safety rules and
regulations and are physically capable of performing their assigned tasks.

For service & support, contact:

East Coast: 215.830.1200 / West Coast: 858.490.6266 / Email: sales@manncorp.com / Web: www.manncorp.com
   Table of Contents
1 FEATURES & SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1 RW1500 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 RW1500 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 INSTALLATION AND GENERAL SAFETY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Installation Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 General Safety Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3 Machine Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.4 Machine Start-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 TOUCH SCREEN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Set Up Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.1 Set Up Mode Main Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1.2 Profile Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1.3 Temperature Setting Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2 Operation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2.1 Temperature Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2.2 Selecting Programs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4 BASIC OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1 Desolder Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2 Place Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.3 Solder Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5 TEMPERATURE SETTING RECOMMENDATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1 Leaded Soldering/Desoldering Processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1.1 IC/BGA size: 41*41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1.2 IC/BGA size: 38*38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1.3 IC/BGA size: 31*31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.2 Lead-Free Soldering/Desoldering Processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2.1 IC/BGA size: 41*41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2.2 IC/BGA size: 38*38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2.3 IC/BGA size: 31*31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

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1 Features & Specifications

1.1 RW1500 Specifications

PCB Specifications
PCB Size (Minimum) 15 mm x 20 mm (0.6" x 0.79")
PCB Size (Maximum) 470 mm x 550 mm (18.5" x 21.6")

PCB Thickness 0.8 mm - 3 mm (0.032" to 0.12")

Component Specifications
Component Size (Minimum) 2 mm x 2 mm (0.08" x 0.08")
Component Size (Maximum) 80 mm x 80 mm (3.15" x 3.15")

Minimum BGA Ball/QFP Lead Pitch 0.3 mm (0.012")

Placement Accuracy ±0.01 mm (0.0004")

Heating System
Component Heater (Top Side) Hot Air (800 W)
Component Heater (Bottom Side) Hot Air (800 W)
Under-Heater Rapid IR (5000 W)
Temperature Control K-Type Thermocouple; Closed Loop PID

Temperature Accuracy Within ±3˚

Utility/Facility Requirements
Main Power Source 220 V ± 10%/ Single Phase, 50/60 Hz
Total Power Consumption 6.6 KW Max.

Machine Dimensions 760 mm L x 850 mm W x 950 mm H

(30” L x 33.5” W x 37.4” H)
Compressed Air 90 psi (~5 cfm)

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   1.2 RW1500 Features
Independent Heaters (Top, Bottom, Rapid IR Underheaters)
• The air supply for the top and bottom heaters is from an external pressurized air or nitrogen
supply. The air and nitrogen sources can be switched instantly via a selection in the RW1500
software.
• The top and bottom ceramic honeycomb heaters feature an integrated design with high-efficiency
heat conduction.
• The Rapid IR Underheater prevents board warpage and reduces stress on components and
solder joints adjacent to the rework site. It also reduces overall cycle times and maximum
temperature exposure and consists of 5 separate zones that, based on PCB size, can be
switched on or off to conserve power.
• Heaters feature high-precision K-type thermocouple and closed-loop, self-tuning PID
temperature control with ± 3 C accuracy.
• Thermal profiles divisible into as many as seven segments for both top and bottom heating with
programmable heating rate, target temperature, dwell time, and cooling. On board storage of up
to 50 programs.
• Four integrated thermocouple inputs for real-time temperature recording, profile analysis, and
fine-tuning

High-Definition, Split-Vision Optics

• 1.3 million pixel, split-vision CCD camera with 230x, push-button zoom and focus
• 15” 1080p LCD display with HDMI input for simultaneous, superimposed viewing of component
leads and PCB pads
• Independent upper and lower LED lighting adjustments for component and PCB
• High-precision, drift-free camera calibration translates to a positional/placement accuracy of
±0.01 mm between component alignment position (pickup head raised in Z-axis) and component
placement position (pickup head lowered in Z-axis).
• Joystick-controlled camera X-Y motion for convenient viewing of component leads to pads.
X-Y control allows zooming and panning of different parts of the device and board and one-touch
“Reset” button returns camera to home position.

Easy Operation Through Functional Design

• Convenient LCD touch screen controller and user interface that, when not being used, slides into
the system’s base for safe storage
• Password protected user privileges that separate operator and administrative/programming
functions
• High-precision, leadscrew-driven Z-axis motion controlled by Panasonic servo drive
• Versatile board holding system accommodates virtually any surface mount or mixed technology
PCB assembly up to 550 mm x 470 mm (21.6” x 18.5”).
  • Moveable X-Y gantry for heater and camera assemblies allows easy positioning above
component without having to adjust PCB holder. Locks securely when position is attained.
Integrated top and bottom heater assemblies allow simultaneous positioning in seconds with the
aid of a built-in laser pointer.

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• Screen printing functions via USB port for job/lot traceability
• Full range of heater nozzles available to solder/desolder components from 2 mm x 2 mm to 80
mm x 80 mm (0.08” x 0.08” to 3.15” x 3.15”)

Superior Safety Functions

• CE certification, emergency stop switch, and built n safeguards to automatically cut power, in the
event of abnormal conditions, to protect both operator and equipment
• End of cycle alarms for soldering and desoldering functions
• Double over-temperature protection
• Password protected user privileges to prevent arbitrary changes by untrained or unauthorized
personnel

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2 Installation and General Safety

2.1 Installation Requirements

To ensure operator safety and prevent possible damage, the rework station must be installed in
compliance with the following conditions:
• Keep machine away from flammable, explosive, or corrosive gas or liquid.
• Avoid moist locations—humidity should be below 90%.
• Ambient temperature should be between 60˚F and 104˚F (15˚C and 40˚C).
• Machine should be kept out of direct sunlight and out of the direct airflow path from air
conditioners, heaters, or fans.
• Area should be free of dust, fibers, and metal particles.
• Installation surface must be flat, vibration-free, and able to support the machine’s weight.
• The installation surface should be at least 36” x 36” (900 x 900 mm) with a relative level height of
29.5” to 33.5” (750 to 850 mm)
• Leave at least 1 foot (30 cm) between the back of the machine and the wall or other obstructions
to allow for proper heat dissipation.
• Do not place heavy objects on top of the machine.
• Make sure that any pre-wiring and connection of the equipment is performed by a qualified electrician.
• Prepare a properly grounded, 220V, single-phase power supply. The total power consumption is
6800W.
• Switch off power after use. If the machine will not be used for a long period of time, disable the power.

2.2 General Safety Information

The RW1500 rework station uses 220V AC power and can achieve operating temperatures as high
as 400˚C. To prevent operator injury or equipment damage, please abide by the following when
operating the unit:
• Do not allow fans or other air currents to be aimed directly at the equipment as they may distort
the temperature control systems and cause overheating.
• Keep all flammable gases and liquids far away from the machine due to risk of fire or explosion.
• To avoid burns, do not touch heater nozzles, the board holder, or other machine components
in high temperature areas of the machine either during or shortly after soldering or desoldering
operations. Use heat insulated gloves if necessary.
• PCBs and components will still be warm when the rework process is completed; use necessary
  protective measures when handling the board or components.
• Do not touch the touch screen surface with metal or sharp objects.
• Do not block the top and bottom hot air nozzles as it will cause overheating and damage to the
heaters and temperature control systems.
• After use, allow the unit to cool for at least 5 minutes before switching the machine off.

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• If liquid or foreign materials spill into the machine during operation, power the machine off
immediately. Unplug the machine from power and let the machine cool completely. Once the
machine has reached room temperature, clean up the spill or remove the debris. Make sure the
machine is completely dry before reconnecting power.

2.3 Machine Overview

16 Cooling Fan
01 Pickup Tray
02 LCD Display

05 Y Axis Micrometer
03 PCB Holder

10 Main
Power 06 Component
Lighting

07 PCB/Pad
Lighting

08 E-Stop

09 Start

11 Lighting

12 USB Port
26 N2 Input

31 Touch Screen
25 Pressure
27 Top Nozzle Pressure
Regulator 24 Thermocouples
28 Bottom Nozzle Pressure

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13 Top Heater/
14 Positioning Placement Head
Handle

15 Vacuum
Nozzle

18 Bottom Heater

32 Process
Camera

21 Focus-

20 Focus+ 17 IR
Preheaters
19 Joystick

04 X Axis
Micrometer

32 Theta Axis
Adjust CW/CCW

30 Bottom Nozzle Flowmeter

22 Zoom Out
23 Zoom In 29 Top Nozzle Flowmeter

No. Name Function

01 Pickup Tray Pickup components from this location prior to alignment and
placement
02 LCD Display Provides simultaneous, superimposed views of component leads
and PCB pads
03 PCB Holder Supports the PCB during rework operations

04 X-Axis Micrometer Adjusts the position of the PCB (pads) in the X-axis.

05 Y- Axis Micrometer Adjusts the position of the PCB (pads) in the Y-axis.
 
06 Component Lighting Component lighting, brightness adjustment

07 PCB/Pad Lighting PCB/Pad lighting, brightness adjustment

08 E-Stop Emergency stop button; cuts power to heaters, motors, displays

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 09 Start Must be depressed to start running the machine

10 Main power Main power on/off switch

11 Lighting Turns utility lighting on/off

12 USB Port Use to connect flash drive for data import/export

13 Top Heater/Placement Housing containing top heater assembly and vacuum pickup/
Head placement head
14 Positioning Handle Used to move the top heater/placement head into position
in the X- and Y- axes over the component; locking/unlocking
mechanism built-in
15 Vacuum Nozzle Used to pick up and place the component (heater nozzle not shown)

16 Cooling Fan Blows cool air across the PCB after soldering

17 IR Preheaters Preheats entire PCB to prevent warpage and reduce cycle times;
4 switches activate/deactivate heater zones
18 Bottom Heater Applies bottom heating when soldering/desoldering components

19 Joystick Moves CCD camera for viewing of component and leads

20 Focus+ Adjusts the display focus (increases focal length)

21 Focus- Adjusts the display focus (decreases focal length)

22 Zoom out Zoom out to view larger area of the component package

23 Zoom in Zoom in to see more detail of pads and leads

24 Thermocouple Inputs Connect up to four external thermocouple probes and measure the
actual temperature at different locations on the board or component;
view recorded temperature profiles on the LCD touchscreen
25 Pressure Regulator For connection of clean, dry air supply (approx. 90 psi, 70-140 L/M)

26 N2 Input For connection of high-purity N2 supply (approx. 90 psi, 70-140 L/M)

27 Top Nozzle Air/ Regulator and gauge used to control top nozzle air or nitrogen
N2 Pressure supply pressure
28 Bottom nozzle Air/ Regulator and gauge used to control bottom nozzle air or
N2 Pressure nitrogen supply pressure
29 Top Nozzle Air/ Controls flow rate of air or nitrogen through top nozzle
N2 flowmeter
30 Bottom Nozzle Air/ Controls flow rate of air or nitrogen through bottom nozzle
N2 flowmeter
31 Touch Screen LCD touchscreen control panel

32 Theta Axis Adjust Rotates the component clockwise or counter clockwise

CW/CCW
33 Process Camera Used to project magnified view of rework site on LCD display
(optional)

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   2.4 Machine Start-Up
1. Turn on the main power switch on the left side of the machine.

2. Make sure the Emergency Stop button is in its raised position.

3. Open the drawer on the front of the unit to access the touchscreen.

4. The joystick is used to move the camera when aligning the component. It is used in conjunction
with the zoom and focus buttons to view different parts of the component and to obtain close-
up views of leads and pads. On the top of the joystick, there is a reset button that will return the
camera to its home position.

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3 Touch Screen Operation

When the RW1500 is first powered on, the Startup screen will display.

The RW1500 has two modes: Operation and Set Up.

Operation Program files can be selected and the machine can be run, but program
parameters cannot be changed or edited.

Set Up Program parameters can be set/changed.

3.1 Set Up Mode

To enter Set Up mode, touch the Set Up button, then input the default password: 8888 on the virtual
keypad that appears.

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   3.1.1 Set Up Mode Main Screen
Upon entering the Set Up mode, the Set Up Mode Main Screen is displayed.

Back Press to return back to the startup screen.

Start Press to automatically begin operation according to the selected
working mode (either “Solder,” “Place,” or “Desolder”).
Stop Press to stop and return to the origin.
Hold Press to keep heating at current temperature.
Alignment Position Displays the Z-axis position of the pickup head (relative to the home
position) at which the head picks up the component from the pickup
tray for alignment.
Mounting Position Displays the Z-axis position of the pickup head (relative to the home
position) at which the component is placed on the pads on the PCB.
Profile check Press to enter the screen “Profile Check”. Please see the details in
Section 3.1.2 “ Profile check”.
Temp. Setting Press to enter the screen for temperature parameters setting. Please
see the details in Section 5 “Temp. Setting”.
Control Press to enter “Control Setting”. Please see the details in section 6
“Control Setting”.
Air (N2): Displays which gas source (Air or N2) has been selected. Pressing
 
this button switches the source.
“T”: Displays the name of the current program.
Solder (Place, Desolder): Displays the chosen working mode; either “Solder,” “Place,” or
“Desolder.” Please see the details in Section 7 “Working Modes
Introduction”.

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Height Displays the current Z-axis position of the pickup head (relative to
home position).
Top Temperature Displays the real-time temperature measured by the thermocouple for
the top heater. Also displayed in red on the graph.
Bottom Temperature Displays the real-time temperature measured by the thermocouple for
the bottom heater. Also displayed in yellow on the graph.
IR Temperature Displays the real-time temperature profile measured by the
thermocouple for the IR preheater. Also displayed in green on the
graph.
Top Setting Displays the set temperature of the top heater.
Bottom Setting Displays the set temperature of the bottom heater.
Run Time Time elapsed from the start of the process. Time accrues until either
the process completes or the operator presses Stop.
Save to USB When a USB device is attached to the connector on the front of the
touchscreen drawer, pressing this button will allow a screenshot to be
saved to the attached device.

3.1.2 Profile Check

To obtain the best soldering quality and to prevent damage to the PCB or components, you can use
thermocouples to measure temperatures at various locations around the rework site. The RW1500
can read temperatures from up to four thermocouples connected to the inputs on the front control
panel. The data from the thermocouple inputs can be viewed and analyzed using the Profile Check
screen.
To access the Profile Check screen, press the Profile Check button on the Main Screen.

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To view profile data points, simply touch the screen at the desired location and the data from the
selected time and temperature coordinates will be displayed in the temperature indicator fields
described below
Top Displays the temperature measured by the thermocouple for the top heater
(displayed in red on the graph) at the selected time.
Bottom Displays the temperature measured by the thermocouple for the bottom
heater (displayed in yellow on the graph) at the selected time.
TC1 Displays the temperature measured by the thermocouple connected to
thermocouple input #1 (displayed in green on the graph) at the selected time.
TC2 Displays the temperature measured by the thermocouple connected to
thermocouple input #2 (displayed in light-blue on the graph) at the selected time.
TC3 Displays the temperature measured by the thermocouple connected to
thermocouple input #3 (displayed in purple on the graph) at the selected time.
TC4 Displays the temperature measured by the thermocouple connected to
thermocouple input #4 (displayed in orange on the graph) at the selected time.
Preheat 1 The temperatures (in °C) entered in the two dark blue boxes to the right of
“Preheat1” define the range within which the thermocouple temperatures
will be timed. For example, if 150°C to 180°C is entered, the colored
“Time” boxes to the right will display the length of time (in seconds) that the
temperature (at the thermocouple of the corresponding color) was within that
temperature range. Note: This function can also be used to measure soak
temperatures or any other important temperature range.
Soldering The temperatures (in °C) entered in the two dark blue boxes to the right of
“Soldering” define the range within which the thermocouple temperatures
will be timed. For example, if 220°C to 230°C is entered, the colored
“Time” boxes to the right will display the length of time (in seconds) that the
temperature (at the thermocouple of the corresponding color) was within that
temperature range. Note: This function can also be used to measure time
above liquidus, maximum component temperature or any other important
temperature range.
(Preheat) Time Displays the time duration (in seconds) that the temperature (at the
thermocouple of the corresponding color; either TC1, TC2, TC3, or TC4) was
within the specified temperature range.
(Soldering) Time Displays the time duration (in seconds) that the temperature (at the
thermocouple of the corresponding color; either TC1, TC2, TC3, or TC4) was
within the specified temperature range.
Air (N2): Displays the gas source (Air or N2) that is being used.
Save to USB When a USB device is attached to the connector on the front of the
  touchscreen drawer, pressing this button will allow a screenshot to be saved
to the attached device.
Excel When a USB device is attached to the connector on the front of the
touchscreen drawer, pressing this button will allow the data to be saved in
.csv format that will allow importing into Excel or other spreadsheet software.
Back Press to return back to the Main Screen.

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3.1.3 Temperature Setting Screen

Pressing the “Temp. Setting” button on the Main Screen will cause the Temperature Setting screen
to be displayed as shown below.

Temperature settings for the top and bottom hot air heaters and the IR underheater are entered in this
screen. Each set of temperature settings for different rework operations can be divided into as many as
six different segments. Each segment is assigned a column of the table and at the top of each column,
these are labeled: Preheat1, Preheat2, Soak, Soldering1, Soldering2, and Cooling. The various data
entry fields, controls, and displays of the Temperature Setting screen are described below:
Top Temp. The top heater’s set temperature during each segment of the program.
Top Time Once the set temperature for the top heater is reached in a segment, this is
the duration that temperature will be held.
Top Rate The rate at which the temperature of the top heater increases to reach the
set temperature for each segment. 3˚C/sec is recommended.
Bottom Temp. The bottom heater’s set temperature during each segment of the program.
Bottom Time Once the set temperature for the bottom heater is reached in a segment, this
is the duration the bottom heater will be held at that temperature.
Bottom Rate The rate at which the temperature of the bottom heater increases to reach
the set temperature for each segment. 3˚C/sec is recommended.
  IR Temp. The set temperature for the IR preheater during each segment of the
program.
Alignment Position The set height, relative to the home position, at which the head goes to pick
up the component from the pickup tray for alignment.

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   Mounting Position The set height, relative to the home position, at which the head places the
component on the PCB pads.
BGA X Size The component width. By entering this value, the RW1500 knows the offset
from the home position to the center of the component package in the X-axis.
BGA Y Size The component length. By entering this value, the RW1500 knows the offset
from the home position to the center of the component package in the Y-axis.
Prog. No. The RW1500 holds up to 50 programs (sets of temperature settings) in
its internal memory. This number represents the position number that the
program occupies.
Name Shows the name of the current program.
Save Clicking this button saves the current program and any changes that have
been made to internal memory.
+ Pressing this button causes the temperature settings for the next program in
memory to be displayed.
Select The temperature settings for the displayed program, will not be loaded for
use until this button is pressed. When a program is selected, its Program
Name will appear in the yellow field on the Main Screen.
- Pressing this button causes the temperature settings for the previous
program in memory to be displayed.
Motion On/Off Activates or deactivates head up/down motion.
High/Low The “High” speed and “Low” speed up and down controls are used to
program the Alignment Position and the Mounting Position.
Height Displays the current height of the head relative to the home position.
Back Returns you to the main Set Up screen.

Setting or Changing Parameters

To set or change parameters (temperature, time, rate, etc.), press the blue box for the desired
parameter. The virtual keyboard will appear on the screen. Type the value you want and press OK to
input the data.
Note 1: The total run time for each program is determined by the sum of the durations for the top
heater and supersede the durations of the bottom and IR heaters. Even if the duration of the bottom
and IR heaters is longer than the top heater, the process cycle will end when the total run time of the
top heater has elapsed.
Note 2: Section ? of this manual includes recommended leaded and lead-free soldering and
desoldering parameter settings for some sample component sizes. Please note that these are for
reference only and are only to be used as a starting point for developing custom programs suited to
your own applications. The use of thermocouples to test the actual temperatures of the PCB and
components (using test samples) is always recommended.
Warning: Manncorp is not responsible for damage to PCBs and components resulting from the use
  of these temperature settings!

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   3.2 Operation Mode
To enter Operation Mode, touch the Operation button on the Startup Screen. The Operation Mode
Main Screen will be displayed. No password input is required for Operation Mode.

The Operation Mode Main Screen is almost identical to the Set Up Mode Main Screen except that
the “Temp. Setting” button changes to “Temp. Parameter” and a “Select Prog.” button appears below
the “Hold” button on the right side of the screen. The Temperature Parameter and Select Program
screens are described in the sections that follow. All other functions in the Operation Mode Main
Screen are the same as those described in Section 3.1 for the Set Up Mode Main Screen.
Note: In Operation Mode, the user can view, select, and load programs for use, but cannot change
temperature settings.

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3.2.1 Temperature Parameters

To access the Temperature Parameters screen, press the “Temp. Parameter” button on the Operation
Mode Main Screen. The Temperature Parameters screen will be displayed as shown below.

The Temperature Parameters screen displays the program number, name, and the parameter
settings for each of the heaters and each segment of the currently loaded program. It also displays
the alignment position, mounting position, and size of the component. It is almost identical to the
Temperature Setting screen, but does not allow the settings to be changed. The ability to view the
parameters is useful to ensure the proper program has been selected and loaded. Pressing the
“Back” button returns the operator to the Operation Mode Main Screen.

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3.2.2 Selecting Programs

When the “Select Prog.” button is pressed, a screen showing a listing of all the saved program files is
displayed as shown below. Each Program Name has an associated number.

The “PgDn” and “PgUp” buttons can be used to scroll through the list of programs. To load a
program, simply press the number of the desired program and it will be loaded for use. Press
the “Back” button to exit the program selection function and go back to the Operation Mode Main
Screen. The name of the selected (and now loaded) program will appear in the yellow field on the
Main Screen.

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4 Basic Operation

4.1 Desolder Function

To desolder a component:
1. Place the PCB securely in the board holder.
2. Using the zone switches on the right side of the IR underheater, make sure the zones that will
provide adequate heating to the underside of the PCB are active.
3. Make sure the vacuum pickup nozzle installed is of a size that will provide adequate vacuum to
lift the component when it has been desoldered.
4. Install the desired hot air nozzle onto the magnetic collar on the bottom of the upper heater
assembly.
5. Grasp the handle on the left side of the upper heater assembly. When grasping the handle,
notice that a pressure switch built into the handle will both unlock the entire heater assembly and
will switch on the laser pointer.
6. While still grasping the handle and using the laser pointer as a guide, position the upper heater
assembly over the center of the component to be desoldered. Make sure the pointer is aimed as
close to the precise center of the device as possible.
7. Release the handle to lock the position of the heater assembly. The bottom heater is
automatically positioned below the component underneath the board.
8. Make sure the proper program containing the proper time and temperature settings has been
loaded.
9. Press the function button (Solder/Place/Desolder) on the Main Screen until “Desolder” is visible.
10. Make sure the camera is in the home position. If it is not, press “Stop” on the Main Screen so
that it goes to the home position.
11. Click “Start” on the Main Screen to desolder the component. The machine will automatically
lower the upper heater to the proper position above the component and the desoldering process
will begin. At the end of the cycle, the component will automatically be lifted from the PCB and
placed in the pickup tray

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   4.2 Place Function

The Place Function is used to automatically pick up a component from the pickup tray, subsequently
pause to allow the operator to align the component leads to the pads on the PCB, and then
resume to automatically place and solder the component on the PCB. To align, place, and solder a
component using the Place Function:

1. Make sure the PCB is held securely in the board holder and that the component pads have been
properly cleaned and prepared for placement and soldering of the component.
2. Using the zone switches on the right side of the IR underheater, make sure the zones that will
provide adequate heating to the underside of the PCB are active.
3. Make sure the vacuum pickup nozzle installed is of a size that will provide adequate vacuum to
lift the component from the pickup tray, hold it while it is being aligned, and then continue holding
it until it is placed on the PCB.
4. Install the desired hot air nozzle onto the magnetic collar on the bottom of the upper heater
assembly.
5. Grasp the handle on the left side of the upper heater assembly. When grasping the handle,
notice that a pressure switch built into the handle will both unlock the entire heater assembly and
will switch on the laser pointer.
6. While still grasping the handle and using the laser pointer as a guide, position the upper heater
assembly over the center of the rework site on the PCB. Make sure the pointer is aimed as close
to the center of the component footprint as possible.
7. Release the handle to lock the position of the heater assembly. The bottom heater is
automatically positioned below the rework site underneath the board.
8. Make sure the proper program containing the proper time and temperature settings has been
loaded.
9. Press the function button (Solder/Place/Desolder) on the Main Screen until “Place” is visible.
10. Press “Start” on the Main Screen so that the camera and pickup tray move out to the pickup
position.
11. Place the component in the proper orientation into the guides on the pickup tray.
12. Press the Set/Reset button on the joystick to pick up the component from the pickup tray. After
the component is picked up, the tray will retract to its starting position and the component will be
positioned over the alignment camera.
13. Adjust the top and bottom lighting as necessary to obtain the best view of the component leads
and the pads on the PCB.
14. Use the X- and Y-axis micrometers on the PCB holder and the theta-axis controls on the control
panel to align the component leads to the pads on the PCB. Use the joystick to move the
camera, and the zoom and focus adjustments on the control panel, to examine the four corners
of the component and the PCB footprint to ensure precise alignment.
  15. When satisfied with the alignment of the component, press the Set/Reset button on the
joystick. The camera will retract to its starting position, the upper heater assembly will lower the
component and place it on the PCB, and the soldering process will begin. When soldering is
complete, the alarm will sound and the upper heater assembly will return to its home position.

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   4.3 Solder Function

The Solder Function is used when you wish to selectively solder a component that has already been
placed on the PCB. To Solder a component:

1. Place the PCB securely in the board holder.

2. Using the zone switches on the right side of the IR underheater, make sure the zones that will
provide adequate heating to the underside of the PCB are active.
3. Install the desired hot air nozzle onto the magnetic collar on the bottom of the upper heater
assembly.
4. Grasp the handle on the left side of the upper heater assembly. When grasping the handle,
notice that a pressure switch built into the handle will both unlock the entire heater assembly and
will switch on the laser pointer.
5. While still grasping the handle and using the laser pointer as a guide, position the upper heater
assembly over the center of the component to be soldered. Make sure the pointer is aimed as
close to the precise center of the device as possible.
6. Release the handle to lock the position of the heater assembly. The bottom heater is
automatically positioned below the component underneath the board.
7. Make sure the proper program containing the proper time and temperature settings has been
loaded.
8. Press the function button (Solder/Place/Desolder) on the Main Screen until “Solder” is visible.
9. Make sure the camera is in the home position. If it is not, press “Stop” on the Main Screen so
that it goes to the home position.
10. Click “Start” on the Main Screen to Solder the component. The machine will automatically lower
the upper heater to the proper position above the component and the soldering process will
begin. When soldering is complete, the alarm will sound and the upper heater assembly will
return to its home position.

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5 Temperature Setting Recommendations

Note: This section includes recommended leaded and lead-free soldering and desoldering
parameter settings for some sample component sizes. Please note that these are for reference
only and are only to be used as a starting point for developing custom programs suited to your own
applications. The use of thermocouples to test the actual temperatures of the PCB and components
(using test samples) is always recommended.
Warning: Manncorp is not responsible for damage to PCBs and components resulting from the use
of these temperature settings!

5.1 Leaded Soldering/Desoldering Processes

5.1.1 IC/BGA size: 41*41
Preheat 1 Preheat 2 Soak Soldering 1 Soldering 2 Cooling
Top Temp. 160 185 210 235 240 225
Time 30 30 35 40 20 15
Bottom Temp. 160 185 210 235 240 225
Time 30 30 35 40 20 15
Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0
IR 180

5.1.2 IC/BGA size: 38*38

Preheat 1 Preheat 2 Heating Welding 1 Welding 2 Cooling
Top Temp. 160 185 210 225 235 215
Time 30 30 35 40 20 15
Bottom Temp. 160 185 210 225 235 215
Time 30 30 35 40 20 15
Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0
IR 185

5.1.3 IC/BGA size: 31*31

Preheating Insulation Heating Welding 1 Welding 2 Cooling
Top Temp. 160 180 200 215 225 215
Time 30 30 35 40 20 15
  Bottom Temp. 160 180 200 215 225 215
Time 30 30 35 40 20 15
Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0
IR 180

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   5.2 Lead-Free Soldering/Desoldering Processes
5.2.1 IC/BGA size: 41*41
Preheat 1 Preheat 2 Soak Soldering 1 Soldering 2 Cooling
Top Temp. 165 190 225 245 255 240
Time 30 30 35 55 25 15
Bottom Temp. 165 190 225 245 255 240
Time 30 30 35 55 25 15
Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0
IR 210

5.2.2 IC/BGA size: 38*38

Preheat 1 Preheat 2 Soak Soldering 1 Soldering 2 Cooling
Top Temp. 165 190 225 245 250 235
Time 30 30 35 45 25 15
Bottom Temp. 165 190 225 245 250 235
Time 30 30 35 45 25 15
Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0
IR 210

5.2.3 IC/BGA size: 31*31

Preheat 1 Preheat 2 Soak Soldering 1 Soldering 2 Cooling
Top Temp. 165 190 220 240 245 235
Time 30 30 35 40 20 15
Bottom Temp. 165 190 220 240 245 235
Time 30 30 35 40 20 15
Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0
IR 210

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