IPC J-STD-001E-2010

Requirements for
Soldered Electrical and
Electronic Assemblies

A joint standard developed by the IPC J-STD-001 development team

including J-STD-001 Task Group (5-22a), J-STD-001 Task Group
Asia (5-22aCN) and J-STD-001 Task Group Nordic (5-22aND) of the
Assembly and Joining Processes Committees (5-20 and 5-20CN) of IPC

Supersedes:
J-STD-001D - February 2005
J-STD-001C - March 2000
J-STD-001B - October 1996
J-STD-001A - April 1992

Users of this publication are encouraged to participate in the

development of future revisions.
Contact:
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, IL 60015-1249
Phone ( 847) 615-7100
Fax (847) 615-7105

April 2010

IPC J-STD-001E-2010

Table of Contents
1

GENERAL ................................................................. 1

1.1
1.2

Scope ................................................................... 1
Purpose ................................................................ 1

1.3
1.4
1.4.1
1.5
1.5.1
1.5.2

Classification .......................................................
Measurement Units and Applications ................
Verification of Dimensions .................................
Definition of Requirements ................................
Hardware Defects and Process Indicators .........
Material and Process Nonconformance .............

1.6
1.7

General Requirements ........................................ 2

Order of Precedence ........................................... 3

1.7.1
1.7.2
1.7.3
1.8
1.8.1

Conflict ................................................................
Clause References ..............................................
Appendices ..........................................................
Terms and Definitions ........................................
Defect ..................................................................

1.8.2
1.8.3
1.8.4

Disposition .......................................................... 3
Electrical Clearance ............................................ 3
High Voltage ....................................................... 3

1.8.5
1.8.6
1.8.7

1
1
1
2
2
2

3
3
3
3
3

MATERIALS, COMPONENTS AND EQUIPMENT

REQUIREMENTS ...................................................... 6

3.1
3.2

Materials ............................................................. 6
Solder .................................................................. 7

3.2.1
3.2.2
3.3
3.3.1
3.4
3.5

Solder - Lead Free ..............................................

Solder Purity Maintenance .................................
Flux .....................................................................
Flux Application .................................................
Solder Paste ........................................................
Solder Preforms ..................................................

3.6
3.7

Adhesives ............................................................ 8
Chemical Strippers ............................................. 8

3.8

Components ........................................................ 8

3.8.1

Component and Seal Damage ............................ 8

3.8.2

Coating Meniscus ............................................... 8

3.9

Soldering Tools and Equipment ......................... 8

7
7
7
8
8
8

GENERAL SOLDERING AND ASSEMBLY

REQUIREMENTS ...................................................... 8

4.1

Electrostatic Discharge (ESD) ........................... 8

Manufacturer (Assembler) .................................. 3

Objective Evidence ............................................. 3
Process Control ................................................... 4

4.2

Facilities .............................................................. 8

4.2.1

Environmental Controls ...................................... 8

4.2.2

Temperature and Humidity ................................. 8

1.8.8
1.8.9
1.8.10
1.8.11

Process Indicator ................................................

Proficiency ..........................................................
Solder Destination Side ......................................
Solder Source Side .............................................

4
4
4
4

4.2.3

Lighting ............................................................... 9

4.2.4

Field Assembly Operations ................................ 9

4.3

Solderability ........................................................ 9

4.4

Solderability Maintenance .................................. 9

1.8.12
1.8.13
1.8.14
1.8.15

Supplier ...............................................................
User .....................................................................
Wire Overwrap ...................................................
Wire Overlap ......................................................

4
4
4
4

4.5

Removal of Component Surface Finishes ......... 9

4.5.1

Gold Removal ..................................................... 9

4.5.2

Other Metallic Surface Finishes Removal ......... 9

4.6

Thermal Protection ............................................. 9

1.9
1.10

Requirements Flowdown .................................... 4

Personnel Proficiency ......................................... 4

4.7

Rework of Nonsolderable Parts ......................... 9

4.8

Presoldering Cleanliness Requirements ........... 10

1.11
1.12

Acceptance Requirements .................................. 4

General Assembly Requirements ....................... 5

4.9

General Part Mounting Requirements ............. 10

4.9.1

Stress Relief ...................................................... 10

1.13
1.13.1
1.13.2

Miscellaneous Requirements .............................. 5

Health and Safety ............................................... 5
Procedures for Specialized Technologies .......... 5

4.10

Hole Obstruction .............................................. 10

4.11

Metal-Cased Component Isolation ................... 10

4.12

Adhesive Coverage Limits ............................... 10

APPLICABLE DOCUMENTS .................................... 5

4.13

2.1
2.2
2.3

EIA ...................................................................... 5
IPC ...................................................................... 5
Joint Industry Standards ..................................... 6

Mounting of Parts on Parts (Stacking of

Components) ..................................................... 10

4.14

Connectors and Contact Areas ......................... 10

4.15

Handling of Parts .............................................. 10

2.4

ASTM ................................................................. 6

4.15.1

Preheating ......................................................... 10

Electrostatic Discharge Association ................... 6

4.15.2

Controlled Cooling ........................................... 10

2.5

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IPC J-STD-001E-2010

April 2010

4.15.3
4.15.4
4.16
4.16.1
4.16.2

Drying/Degassing ............................................. 10
Holding Devices and Materials ........................ 11
Machine (Nonreflow) Soldering ....................... 11
Machine Controls ............................................. 11
Solder Bath ....................................................... 11

4.17
4.17.1
4.18
4.18.1
4.18.2
4.18.3

Reflow Soldering .............................................. 11

Intrusive Soldering (Paste-in-Hole) ................. 11
Solder Connection ............................................ 11
Exposed Surfaces .............................................. 12
Solder Connection Defects ............................... 12
Partially Visible or Hidden Solder
Connections ...................................................... 12
Heat Shrinkable Soldering Devices ................. 12

4.19

WIRES AND TERMINAL CONNECTIONS ............. 12

6.2.1
6.2.2

Solder Application ............................................ 21

Through-Hole Component Lead Soldering ..... 21

6.3
6.3.1

Unsupported Holes ........................................... 22

Lead Termination Requirements for
Unsupported Holes ........................................... 22

SURFACE MOUNTING OF COMPONENTS .......... 23

7.1
7.1.1

Surface Mount Device Lead Forming ............. 23

Lead Deformation Limits ................................. 23

7.1.2

Flat Pack Parallelism ........................................ 23

7.1.3

Surface Mount Device Lead Bends ................. 24

7.1.4

Flattened Leads ................................................. 24

7.1.5

Dual-in-Line Packages (DIPs) ......................... 24

7.1.6

Parts Not Configured for Surface Mounting ... 24

7.2

Leaded Component Body Clearance ............... 24

5.1

Wire and Cable Preparation ............................. 12

7.2.1

Axial-Leaded Components ............................... 24

5.1.1
5.1.2
5.1.3

Insulation Damage ............................................ 12

Strand Damage ................................................. 13
Tinning of Stranded Wire ................................. 13

7.3

Parts Configured for Butt Lead Mounting ...... 24

7.4

Hold Down of Surface Mount Leads .............. 24

7.5

Soldering Requirements ................................... 24

5.2
5.3

7.5.1

Misaligned Components ................................... 24

7.5.2

Unspecified and Special Requirements ............ 24

5.3.1

Solder Terminals ............................................... 13

Bifurcated, Turret and Slotted Terminal
Installation ........................................................ 13
Shank Damage .................................................. 13

7.5.3

Bottom Only Terminations ............................... 26

5.3.2
5.3.3
5.3.4
5.3.5
5.3.6

Flange Damage .................................................

Flared Flange Angles ........................................
Terminal Mounting - Mechanical ....................
Terminal Mounting - Electrical ........................
Terminal Soldering ...........................................

7.5.4

Rectangular or Square End Chip

Components - 1, 3 or 5 Side Termination ....... 27

7.5.5

Cylindrical End Cap Terminations ................... 28

7.5.6

Castellated Terminations .................................. 29

7.5.7

Flat Gull Wing Leads ....................................... 30

5.4
5.4.1

Mounting to Terminals ..................................... 15

General Requirements ...................................... 15

7.5.8

Round or Flattened (Coined) Gull

Wing Leads ....................................................... 31

7.5.9

J Leads .......................................................... 32

5.4.2
5.4.3
5.4.4
5.4.5
5.4.6

Bifurcated and Turret Terminals ......................

Slotted Terminals ..............................................
Hook Terminals ................................................
Pierced or Perforated Terminals .......................
Cup and Hollow Cylindrical Terminals ...........

7.5.10

Butt/I Connections (Not Permitted for

Class 3 Products) .............................................. 33

7.5.11

Flat Lug Leads .................................................. 34

7.5.12

Tall Profile Components Having Bottom

Only Terminations ............................................ 35

5.5

Soldering to Terminals ..................................... 19

7.5.13

Inward Formed L-Shaped Ribbon Leads ........ 36

5.5.1

Cup and Hollow Cylindrical Terminals ........... 19

7.5.14

Surface Mount Area Array Packages ............... 37

7.5.15

Bottom Termination Components (BTC) ........ 39

7.5.16

Components with Bottom Thermal Plane

Terminations (D-Pak) ....................................... 40

7.5.17

Flattened Post Connections .............................. 41

7.6

Specialized SMT Terminations ........................ 41

13
14
14
14
15

16
18
18
19
19

THROUGH-HOLE MOUNTING AND

TERMINATIONS ...................................................... 20

6.1

Through-Hole Terminations - General ............. 20

6.1.1

Lead Forming ................................................... 20

6.1.2

Lead Deformation Limits ................................. 20

6.1.3

Termination Requirements ............................... 20

6.1.4

Lead Trimming ................................................. 21

8.1

Cleanliness Exemptions .................................... 42

6.1.5

Interfacial Connections ..................................... 21

8.2

Ultrasonic Cleaning .......................................... 42

6.1.6

Coating Meniscus In Solder ............................. 21

8.3

Post-Solder Cleanliness .................................... 42

Supported Holes ............................................... 21

8.3.1

Particulate Matter ............................................. 42

6.2
viii

CLEANING PROCESS REQUIREMENTS ............. 42

April 2010

IPC J-STD-001E-2010

12

REWORK AND REPAIR ....................................... 49

8.3.2

Flux Residues and Other Ionic or Organic

Contaminants .................................................... 42

8.3.3

Post-Soldering Cleanliness Designator ............ 42

12.1
12.2

Rework .............................................................. 49
Repair ................................................................ 49

8.3.4

Cleaning Option ................................................ 42

12.3

Post Rework/Repair Cleaning .......................... 49

8.3.5

Test for Cleanliness .......................................... 42

8.3.6

Testing ............................................................... 43

PCB REQUIREMENTS ........................................... 43

Appendix A

Guidelines for Soldering Tools and

Equipment ............................................ 51

Appendix B

Minimum Electrical Clearance Electrical Conductor Spacing ............ 53

9.1

Printed Circuit Board Damage ......................... 43

9.1.1

Blistering/Delamination .................................... 43

9.1.2

Weave Exposure/Cut Fibers ............................. 44

9.1.3

Haloing .............................................................. 44

Figure 1-1

Overwrap .......................................................... 4

9.1.4

Land Separation ................................................ 44

Figure 1-2

Overlap ............................................................. 4

9.1.5

Land/Conductor Reduction in Size .................. 44

Figure 4-1

Hole Obstruction ............................................. 10

9.1.6

Flexible Circuitry Delamination ...................... 44

Figure 4-2

Acceptable Wetting Angles ............................. 11

Figure 5-1

Flange Damage .............................................. 14

Figure 5-2

Flare Angles .................................................... 14

Figure 5-3

Terminal Mounting - Mechanical .................... 14

Figures

9.1.7

Flexible Circuitry Damage ............................... 44

9.1.8

Burns ................................................................. 44

9.1.9

Solder on Gold Contacts .................................. 44

Figure 5-4

Terminal Mounting - Electrical ........................ 14

9.1.10

Measles ............................................................. 44

Figure 5-5

Insulation Clearance Measurement ................ 15

9.2

Marking ............................................................. 44

Figure 5-6

Service Loop for Lead Wiring ......................... 15

9.3

Bow and Twist (Warpage) ................................ 44

Figure 5-7

Stress Relief Examples .................................. 15

10

COATING, ENCAPSULATION AND STAKING

(ADHESIVE) .......................................................... 45

Figure 5-8

Continuous Runs ............................................ 16

Figure 5-9

Wire and Lead Wrap Around .......................... 16

Figure 5-10

Side Route Connections and Wrap on

Bifurcated Terminal ......................................... 17

10.1

Conformal Coating ........................................... 45

10.1.1

Application ........................................................ 45

Figure 5-11

Top and Bottom Route Terminal Connection . 18

10.1.2

Performance Requirements .............................. 45

Figure 5-12

Hook Terminal Connections ............................ 18

10.1.3

Conformal Coating Inspection ......................... 46

Figure 5-13

Pierced or Perforated Terminal Wire Wrap .... 19

10.1.4

Rework of Conformal Coating ........................ 46

Figure 5-14

Solder Height .................................................. 19

10.2

Encapsulation .................................................... 46

Figure 6-1

Lead Bends .................................................... 20

10.2.1

Application ........................................................ 46

Figure 6-2

Lead Trimming ................................................ 21

10.2.2

Performance Requirements .............................. 46

Figure 6-3

Vertical Fill Example ....................................... 22

Figure 7-1

Surface Mount Device Lead Forming ............ 23

Figure 7-2

Surface Mount Device Lead Forming ............ 23

Figure 7-3

Bottom Only Terminations .............................. 26

Figure 7-4

Rectangular or Square End Chip

Components ................................................... 27

Figure 7-5

Cylindrical End Cap Terminations .................. 28

Figure 7-6

Castellated Terminations ................................ 29

Figure 7-7

Flat Gull Wing Leads ...................................... 30

Figure 7-8

Round or Flattened (Coined) Gull

Wing Leads ..................................................... 31

10.2.3

Rework of Encapsulant Material ..................... 46

10.2.4

Encapsulant Inspection ..................................... 46

10.3

Staking (Adhesive) ........................................... 46

10.3.1

Staking .............................................................. 47

10.3.2

Staking (Inspection) .......................................... 47

11

PRODUCT ASSURANCE ...................................... 48

11.1

Hardware Defects Requiring Disposition ........ 48

11.2

Inspection Methodology ................................... 48

11.2.1

Process Verification Inspection ........................ 48

Figure 7-9

J Leads ........................................................ 32

11.2.2

Visual Inspection .............................................. 48

Figure 7-10

Butt/I Connection ............................................ 33

Figure 7-11

Flat Lug Leads ................................................ 34

Figure 7-12

Tall Profile Components Having Bottom

Only Terminations ........................................... 35

11.2.3

Sampling Inspection ......................................... 48

11.3

Process Control Requirements ......................... 48

11.3.1

Opportunities Determination ............................ 49

Figure 7-13

Inward Formed L-Shaped Ribbon Lead ......... 36

11.4

Statistical Process Control ................................ 49

Figure 7-14

BGA Solder Ball Spacing ............................... 37

ix

IPC J-STD-001E-2010

April 2010

Figure 7-15

Bottom Termination Component ..................... 39

Figure 7-16

Bottom Thermal Plane Termination ................ 40

Figure 7-17

Flattened Post Termination ............................. 41

Tables

Table 7-4

Dimensional Criteria - Rectangular or

Square End Chip Components 1, 3 or 5 Side Termination ................................ 27

Table 7-5

Dimensional Criteria - Cylindrical End

Cap Terminations .............................................. 28

Table 7-6

Dimensional Criteria - Castellated

Terminations ...................................................... 29

Table 1-1

Design and Fabrication Specification ................. 3

Table 7-7

Dimensional Criteria - Flat Gull Wing Leads .... 30

Table 3-1

Maximum Limits of Solder Bath Contaminant .... 7

Table 7-8

Table 5-1

Allowable Strand Damage ................................ 13

Dimensional Criteria - Round or Flattened

(Coined) Gull Wing Leads ................................. 31

Table 5-2

Terminal Soldering Requirements ..................... 15

Table 7-9

Dimensional Criteria - J Leads ...................... 32

Table 5-3

Turret and Straight Pin Wire Placement ........... 16

Table 7-10 Dimensional Criteria - Butt/I Connections ......... 33

Table 5-4

AWG 30 and Smaller Wire Wrap

Requirements .................................................... 17

Table 7-11 Dimensional Criteria - Flat Lug Leads .............. 34

Table 5-5

Bifurcated Terminal Wire Placement Side Route ........................................................ 17

Table 7-12 Dimensional Criteria - Tall Profile

Components Having Bottom Only
Terminations ...................................................... 35

Table 5-6

Staking Requirements of Side Route Straight

Through Connections - Bifurcated Terminals ... 17

Table 7-13 Dimensional Criteria - Inward Formed

L-Shaped Ribbon Leads ................................... 36

Table 5-7

Bifurcated Terminal Wire Placement Bottom Route .................................................... 18

Table 7-14 Dimensional Criteria - Ball Grid Array

Components with Collapsing Balls ................... 37

Table 5-8

Hook Terminal Wire Placement ........................ 18

Table 5-9

Pierced/Perforated Wire Placement .................. 19

Table 7-15 Ball Grid Array Components with

Noncollapsing Balls ........................................... 38

Table 5-10 Solder Requirements Wire to Post ................... 19

Table 7 16 Column Grid Array ............................................ 38

Table 6-1

Lead Bend Radius ............................................ 20

Table 7-17 Dimensional Criteria - BTC ............................... 39

Table 6-2

Protrusion of Leads in Supported Holes ........... 21

Table 6-3

Protrusion of Leads in Unsupported Holes ....... 21

Table 7-18 Dimensional Criteria - Bottom Thermal

Plane Terminations ............................................ 40

Table 6-4

Supported Holes with Component Leads,

Minimum Acceptable Conditions ....................... 22

Table 6-5

Unsupported Holes with Component Leads,

Minimum Acceptable Conditions ....................... 22

Table 7-19 Dimensional Criteria Flattened

Post Connections .............................................. 41
Table 8-1

Designation of Surfaces to be Cleaned ............ 42

Table 8-2

Cleanliness Testing Designators ....................... 42

Table 7-1

SMT Lead Forming Minimum Lead Length ...... 23

Table 10-1 Coating Thickness ............................................. 45

Table 7-2

Surface Mount Components ............................. 25

Table 7-3

Dimensional Criteria - Bottom Only

Terminations ...................................................... 26

Table 11-1 Magnification Aid Applications for Solder

Connections ...................................................... 48

Table 11-2 Magnification Aid Applications - Other .............. 48

April 2010

IPC J-STD-001E-2010

Requirements for Soldered

Electrical and Electronic Assemblies
1 GENERAL
1.1 Scope This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic
assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques. For a more complete understanding of this documents recommendations and requirements, one may
use this document in conjunction with IPC-HDBK-001, IPC-A-610 and IPC-HDBK-610.
1.2 Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and
electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality
levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component
placement or for applying flux and solder used to make the electrical connection.
1.3 Classification This standard recognizes that electrical and electronic assemblies are subject to classifications by
intended end-item use. Three general end-product classes have been established to reflect differences in producibility, complexity, functional performance requirements, and verification (inspection/test) frequency. It should be recognized that there
may be overlaps of equipment between classes.

The user (see 1.8.13) is responsible for defining the product class. The product class should be stated in the procurement
documentation package.
CLASS 1

General Electronic Products

Includes products suitable for applications where the major requirement is function of the completed assembly.
CLASS 2

Dedicated Service Electronic Products

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired
but not critical. Typically the end-use environment would not cause failures.
CLASS 3

High Performance Electronic Products

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be
tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life
support or other critical systems.
1.4 Measurement Units and Applications All dimensions and tolerances, as well as other forms of measurement (temperature, weight, etc.) in this standard are expressed in SI (System International) units (with Imperial English equivalent
dimensions provided in brackets). Dimensions and tolerances use millimeters as the main form of dimensional expression;
micrometers are used when the precision required makes millimeters too cumbersome. Celsius is used to express temperature. Weight is expressed in grams.
1.4.1 Verification of Dimensions Actual measurement of specific part mounting and solder fillet dimensions and determination of percentages are not required except for referee purposes. For the purposes of determining conformance to this
specification, all specified limits in this standard are absolute limits as defined in ASTM E29.