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WaferProber
Electroglas2001XProber
TheElectroglasAutomaticWaferProbingSystemisaprecisioninstrumentwhichmoveswafersthrough
thetestprocessquickly,accurately,andsafely.Theinstrumentoperatesinaspecificsequencewhich
combinespreprogrammedinstructionsandoperatorcontrolguidedbymenusandprompts.Atypical
2000XSerieswaferprobershowingsomeoptions.
Thehartofthe2000SeriesproberistheElectroglaslinearreluctancesteppermotor,anelectromagneticX
Ypositioningsystemconsistingofaplatenandtravelingforcer,orpositioner.MountedontheforcerisaZ
stagesupportingachucktopwhichtransportsthewaferforprobing.TheZstagehasa200milrange.The
forceroperatesinboththeXandYaxisindependentlyorsimultaneously.
Theforcerissupportedbyacushionofairandmovesoverthewafflepatternferromagneticsurfaceofthe
plateninstepsof1micron(.039mils).Becauseallbearingisprovidedbyairandalldrivepulsesare
magnetic,errorcausedbywearingofpartsinconventionalmechanicalpositioneriseliminated.
The2000Seriesproberismicroprocessorcontrolledmovementmodesandparametersareprogrammedby
keyboard.Entryproceduresarerequiredprimarilyforsetup.Oncetheparametersandmodesareset,wafer
probingbecomesautomaticwithlittleoperatorintervention.Allparameterandoperatingodeentriesareto
CMOSRAMwithlithiumbattery(averagelife,2years).Ifpowerisinterrupted,thereisnolossof
operatingstatus.
AsofProberVision2softwareREVDB,asetofMachineDependentVariables(MDVs)inbatterybacked
RAMisretainedwiththeparticularprober.Thesearenotoverwrittenbydownloadofsetupfilesgenerated
onanotherprober.OnthepresentEPROManddisksystem,thefirst32Kbytesofmemoryarebattery
backed.A6KbytessectionofthisbatterybackedRAMisreservedexclusivelyfortheMDVs.Inorderto
ensuretheintegrityandvalidityofthedatacontainedinthenonvolatilememory,aCyclicRedundancy
Code(CRC)isgeneratedontheMDVsegment.TheCRCischeckedonpowerup.
OperationoftheBaseUnitfollowsfourgeneralsteps:
1)LOAD2)ALIGN3)PROBE4)UNLOAD
Underoperatorcontrol,thewaferiscoarsealigned,vacuumlockedontheChuckAssembly,and
transportedtoapredeterminedlocationforfinalprecisionalignment.
Dependingonprogramming,theprobercanthenperformanyofseveralprobingoperationssuchas
scanning,testing,orexamination.Specificdiecanbeprobed,ortheentirewafercanbeprobedaccordingto
chosenpattern.Inaddition,diemaybeinkedduringtheprobetoindicatewhichdonotmeettestcriteria.
Aftertheprobingoperation,theChuckAssemblyautomaticallyisreturnedtotheloadareaforunlading.
WAFERPROERBASEUNIT
TheBaseUnitisanindependentwaferprobingunitwhichperformsmanualload,semiautomaticalignment,
automaticprobe,andmanualunloadoperations.Itincludesfourassemblies:
1)BaseAssembly
4)Power/ControlAssembly(PCM)
2)MonitorConsole
3)OperatorConsole
5)PowerSupplyModule(PSM)
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WaferProber
TheElectroglasmodel1034Xistheworld'smostpopularwaferprober.ItincorporatesgreaterX,
Y,andZaxisperformance,andmoreinnovativeelectronic/mechanicalfeaturesthananyother
proberavailable.Itsproductionorientedoperatorcontrolsandcleanstylingresultfrom
Electroglas'twentyyearsexperienceinthedesignandmanufactureofhighspeedprobers.
Highspeed,frictionfreemotion
Attheheartofthemodel1034XistheexclusiveElectroglasXYmotionsystem,featuringfast,
simpleoperationandlowmaintenancerequirements.Theunique,frictionlessairbearing,linear
reluctance,solidstatehighspeedmotionsystemoffersfast,accurateXYpositioningwith
extrememechanicalsimplicity.
ProgrammedandcontrolledXandYmotionisproducedwithonlyonemovingpart,a'forcer',
whichcarriestheZstage.Conversionofrotarymotiontolinearmotionthroughleadscrewsand
relatedmechanicalhardwareiscompletelyeliminated.
Theelectromagneticforcermovessmoothlyandquietlyoveraferromagneticplatenona
frictionlessairbearing.Thereisnowearandteartoaffectsystemperformance,overallreliability
oraccuracy,andnorquirementforperiodicoverhaulandreplacementorparts.Precise,digitally
controlledacceleration/decelerationisachievedwithanaccuracyof+.0005in(.127mm)over5
or6inch(127or152mm)stagetravel.
Operatororientedcontrol
The1034Xisdesignedtogivesemiconductormanufacturesaproberofsignificantlygreater
throughputcapacity,byreducingwaferloadandalignmenttimeandbyimprovingthemanual
proberfunctions.
Inthemodel1034X,wafersareloadedandunloadedoutsidetheproberingareawithout
disturbingtheproberingoroptics.Whenloaded,wafersarerapidlyalignedonanydeviceinthe
matrixareaviaautomaticgrosspositioning,manualormotorizedThetaalignment,anda
multifunctionjoystickthatprovidestwentyseparatemanualcommandsinasinglecontrol.
Inaddition,safetyinterlocksallowindexingandjogmovementswhileleavingthechuckinthe
upposition.Theoperatorisfreetocommandstagemovementwithoutfirstloweringthechuck.
Internalproberelectronicsautomaticallylowerthechuck,initiatestagemovement,andraisethe
chuckoncestagemovementincompleted.ThisexclusiveElectroglasfeaturesavessignificant
operatoralignmenttime.
Tofurthersimplifyoperation,the1034Xisequippedwithanindicatingpanelthatconstantly
advisesthestatusofallproberfunctions.Atoneglance,direction,checkandproberstatusare
immediatelyknownbytheoperator.
Inchandmetricindexing
Toeliminatecostlyconversions,the1034Xprovidesbothinchandmetricindexingasstandard
equipment.Thedesiredindexmodeisselectedbysimplypushingaswitch.Thisfeaturealso
includesaselectablealignmentforvariouswafersizes.Youcanselectonetofiveinchwafers
(25mmto127mm)andthe1034Xwilllimititsalignmentscandistancetotheselectedwafer
size.Longalignmentscandistancesnolongermustbetoleratedonsmallwafers.,andthewafer
willalwaysremaininviewwhilealignmentisaccomplished.
Simple,multifunctionaljoystickcontrol
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WaferProber
Toreduceoperatorfatigueandimproveproductivity,the1034Xisdesignedwithallmanual
commandsforX,Y,andZmotionconvenientlycombinedinasinglejoystickcontrol.Athree
positionrotaryswitchonthejoystickselectsthemodeofstagemotion:JOG,INDEX,orSCAN.
Movementofthestickinanydirectionactivatesthatmodeineither"singleslow"(firstposition),
or"multifast"(secondposition)speeds.Thisallowstwentyseparatestagecommandsinone
control.Abuttonontopofthejoystickactivatesthemultifastcondition.
Allproberelatedelementsononecasting
Tominimizevibrationattheprobepointinterface,allproberelatedelementshavebeenmounted
onasingle,rigid,internalcasting.Thisincludesthevacuumchuck,X,Y,Z,andThetadrive
assemblies,proberingsupportstand,andmicroscopesupports.Bystructurallytyingthese
elementstogether,andvibrationsinherenttothesystemareeliminatedandoverallprobetipto
wafermovementisreducedtoaninsignificantlevel.
Swingawaycasting
Formaintenanceandservicing,themodel1034Xofferstheultimateinaccessibility.Cover
castingcanbetakenoffwithoutremovingasinglescrew.Theentirerightsideoftheprober
moduleishingedtoswingcompletelyclearofinteriorcomponents.Inaddition,itsentirelogic
cardcagecanberemovedin30secondswithouttools.theinteriorofthepowermoduleisjustas
easytoreach.Itsswingawaytopcoverallowsfreeaccesstoallcomponents.
Separatepowermodule
Theproberandpowermodulesareseparatetoprovideconvenientmaintenance.
Quickchangeproberingassembly
Proberingassembliesareeasytochange.Theoversizedringplate(withextraroomforspecial
testcircuitry)issuspendedonthreeprecisionalignmentposts.Ringsincorporate"quickrelease"
knobsforinstantreplacement.Adjustableproberinginserts,fixedpointprobecardarrays,or
specialtestheadsmaybemountedeasilyontheflatplanarsurfaceofeach1034Xassembly.
Builtininking
Thebuiltindelayedinkingsystemeliminatestheneedforexternalaccessoryboxes.Itprovides
foroneedgesensorandsixinkers.Inkersareprogrammablefor"onebehind"or"twobehind"as
wellasconventional"inplace"inking.
Externalcontrolandcoordinatereportingoptions
Electroglasoffersoptionsforthe1034Xtofacilitatetestsiteprobing,wafermapping,andonline
computercontrolthroughIEEE488andRS232interfaces.Separatedatasheetsarepublishedfor
theseoptionsandshouldberequestedseparately.
Accessoriesandoptions
Accessoriesincluderinginserts,probeheads,inkers,edgesensors,probetips,extendercables,
TVoptics,specialoptics,illuminators,planarizer,R&Kadapters,magneticinkers,workstation
tables,highfrequencyhardware,conversionkits,andvariouschucktopsizes.
Zstageoptions
Highspeedmotordrivenprogrammable,highspeedmotordriven,andpneumaticZstagesare
availableon1034Xprobers.
Highspeed,fastZaxiscycletypesareusedtoreducemeantimebetweendeviceindexing.They
areusefulinprobetestapplicationswheremaximumdevicethroughputisdesired.Thestrokeof
thehighspeedZstageisfixedat.016inch(.406mm).Probecontactovertraveliscontrolledby
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WaferProber
settingtheheightoftheprobecardcarrier.
TheprogrammableZstageprovidesnotonlyhighspeedZaxiscycletimebutanadaptive
functionaswelltocontrolaftercontactZtravel.Whenusedinconjunctionwithanedgesensor,
theaxisstrokecanbeprogrammedtoprovideconstantovertravelregardlessofvariationsin
waferthickness.Thedesiredovertravelmaybeselectedinonemil(oroptionallyonehalfmil)
increments,resultinginuniformprobepressuretoanydieonthewafersurface,acondition
criticaltoobtaininghighestpossibleyields.Inaddition,a"shortstroke"featureofthe1mil
incrementprogrammableZlimitsthedownstroketo.006inches(.152mm)belowprobecontact,
furtherdecreasingcycletime.
ProgrammableZstagesareavailablewithhightorquemotorsandheavydutybearingsto
accommodate1)theextramassoftemperaturecontrolledchucks2)thecumulativepressureof
highdensityprobeapplicationsand3)theincreasedloadbearingrequirementattheperimeterof
5inch(127mm)wafers.
HighspeedandprogrammableZstagesareavailablewithmanualormotorizedThetacontrol,
andThetalimit.
ThepneumaticZstageisrecommendedforapplicationsinwhichunusuallyhighmassishandled,
Zaxistimeisnotcritical,andprogrammableovertravelisnotrequired.ThepneumaticZstage
comeswithmanualThetacontrolonly.
Requiredutilities
Electrical:110VAC,60HZ,1phase,1kw,220VAC,50HZ,1phase,1kw
Air:2.5cfmat85psi
Compressedairmustbefilteredto5micronmaximum,freefromwaterandothercontaminants.
Vacuum:18to25inchesHg,457to635mmHg
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