ICX285AL

Diagonal 11 mm (Type 2/3) Progressive Scan CCD Image

Sensor with Square Pixel for B/W Cameras
Description
The ICX285AL is a diagonal 11 mm (Type 2/3) 20 pin DIP (Ceramic)
interline CCD solid-state image sensor with a square
pixel array. High sensitivity and low smear are
achieved through the adoption of EXview HAD CCD
technology. Progressive scan allows all pixels signals
to be output independently within approximately
1/15 second. Also, the adoption of high frame rate
readout mode supports 60 frames per second. This
chip features an electronic shutter with variable
charge-storage time which makes it possible to realize
full-frame still images without a mechanical shutter.
This chip is suitable for image input applications
such as still cameras which require high resolution,
etc.

Features
Progressive scan allows individual readout of the image signals from all pixels.
High horizontal and vertical resolution (both approximately 1024 TV-lines) still images without a mechanical
shutter
Supports high frame rate readout mode (effective 256 lines output, 60 frame/s)
Square pixel
Aspect ratio: 4:3
Horizontal drive frequency: 28.64 MHz Pin 1
High sensitivity, low smear 2
Low dark current, excellent anti-blooming characteristics
Continuous variable-speed shutter V
Horizontal register: 5.0 V drive

Device Structure 8
2
Interline CCD image sensor H 40
Pin 11
Image size: Diagonal 11 mm (Type 2/3)
Total number of pixels: 1434 (H) 1050 (V) approx. 1.50M pixels Optical black position
Number of effective pixels: 1392 (H) 1040 (V) approx. 1.45M pixels (Top View)
Number of active pixels: 1360 (H) 1024 (V) approx. 1.40M pixels
Chip size: 10.2 mm (H) 8.3 mm (V)
Unit cell size: 6.45 m (H) 6.45 m (V)
Optical black: Horizontal (H) direction: Front 2 pixels, rear 40 pixels
Vertical (V) direction: Front 8 pixels, rear 2 pixels
Number of dummy bits: Horizontal 20
Vertical 3
Substrate material: Silicon

* EXview HAD CCD is a trademark of Sony Corporation.

EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of
HAD (Hole-Accumulation-Diode) sensor.

Sony reserves the right to change products and specifications without prior notice. This information does not convery any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

1
E00Y42A27
 ICX285AL

Block Diagram and Pin Configuration (Top View)

GND

GND

V2B

V2A
V3

V4

V1
NC

NC

NC
10 9 8 7 6 5 4 3 2 1

Vertical register

Note)

Horizontal register Note) : Photo sensor

11 12 13 14 15 16 17 18 19 20
VOUT

VDD

RG

H2

H1

SUB

CSUB

VL

H1

H2

Pin Description
Pin No. Symbol Description Pin No. Symbol Description
1 V1 Vertical register transfer clock 11 VOUT Signal output
2 V2A Vertical register transfer clock 12 VDD Supply voltage
3 NC 13 RG Reset gate clock
4 V2B Vertical register transfer clock 14 H2 Horizontal register transfer clock
5 NC 15 H1 Horizontal register transfer clock
6 NC 16 SUB Substrate clock
7 V4 Vertical register transfer clock 17 CSUB Substrate bias*1
8 V3 Vertical register transfer clock 18 VL Protective transistor bias
9 GND GND 19 H1 Horizontal register transfer clock
10 GND GND 20 H2 Horizontal register transfer clock

*1
DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of
0.1F.

2
 ICX285AL

Absolute Maximum Ratings

Item Ratings Unit Remarks
VDD, VOUT, RG SUB 40 to +12 V
V2A, V2B SUB 50 to +15 V
Against SUB V1, V3, V4, VL SUB 50 to +0.3 V
H1, H2, GND SUB 40 to +0.3 V
CSUB SUB 25 to V
VDD, VOUT, RG, CSUB GND 0.3 to +22 V
Against GND V1, V2A, V2B, V3, V4 GND 10 to +18 V
H1, H2 GND 10 to +6.5 V
V2A, V2B VL 0.3 to +28 V
Against VL
V1, V3, V4, H1, H2, GND VL 0.3 to +15 V
*1
Voltage difference between vertical clock input pins to +15 V
Between input
H1 H2 6.5 to +6.5 V
clock pins
H1, H2 V4 10 to +16 V
Storage temperature 30 to +80 C
Performance guarantee temperature 10 to +60 C
Operating temperature 10 to +75 C
*1
+24 V (Max.) when clock width < 10 s, clock duty factor < 0.1%.
+16 V (Max.) is guaranteed for power-on and power-off.

Bias Conditions
Item Symbol Min. Typ. Max. Unit Remarks
Supply voltage VDD 14.55 15.0 15.45 V
Protective transistor bias VL *2

Substrate clock SUB *3

Reset gate clock RG *3

DC characteristics
Item Symbol Min. Typ. Max. Unit Remarks
Supply current IDD 9 11 mA
*2
VL setting is the VVL voltage of the vertical clock waveform, or the same voltage as the VL power supply for the
V driver should be used.
*3
Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within
the CCD.

3
 ICX285AL

Clock Voltage Conditions

Waveform
Item Symbol Min. Typ. Max. Unit Remarks
diagram
Readout clock voltage VVT 14.55 15.0 15.45 V 1
VVH1, VVH2 0.05 0 0.05 V 2 VVH = (VVH1 + VVH2)/2
VVH3, VVH4 0.2 0 0.05 V 2
VVL1, VVL2,
7.3 7.0 6.7 V 2 VVL = (VVL3 + VVL4)/2
VVL3, VVL4
VV 6.5 7.0 7.35 V 2 V V = VVHn VVLn (n = 1 to 4)
Vertical transfer
VVH3 VVH 0.25 0.1 V 2
clock voltage
VVH4 VVH 0.25 0.1 V 2
VVHH 1.4 V 2 High-level coupling
VVHL 1.3 V 2 High-level coupling
VVLH 1.4 V 2 Low-level coupling
VVLL 0.8 V 2 Low-level coupling
VH 4.75 5.0 5.25 V 3
Horizontal transfer
VHL 0.05 0 0.05 V 3
clock voltage
VCR VH/2 V 3 Cross-point voltage
VRG 3.0 3.3 5.5 V 4
Reset gate VRGLH VRGLL 0.4 V 4 Low-level coupling
clock voltage
VRGL VRGLm 0.5 V 4 Low-level coupling
Substrate clock voltage VSUB 21.25 22.0 22.75 V 5

4
 ICX285AL

Clock Equivalent Circuit Constants

Item Symbol Min. Typ. Max. Unit Remarks

CV1 5600 pF
CV2A 6800 pF
Capacitance between vertical transfer clock and GND CV2B 22000 pF
CV3 8200 pF
CV4 22000 pF
CV12A 150 pF
CV12B 390 pF
CV2A3 270 pF
CV2B3 470 pF
Capacitance between vertical transfer clocks
CV14 2200 pF
CV34 330 pF
CV2A4 390 pF
CV2B4 560 pF
CH1 47 pF
Capacitance between horizontal transfer clock and GND
CH2 39 pF
Capacitance between horizontal transfer clocks CHH 74 pF
Capacitance between reset gate clock and GND CRG 4 pF
Capacitance between substrate clock and GND CSUB 1300 pF
R1, R3 30
Vertical transfer clock series resistor R2A, R2B 32
R4 20
Vertical transfer clock ground resistor RGND 60
Horizontal transfer clock series resistor RH 7.5
Reset gate clock ground resistor RRG 24

V4 RH RH
H1 H2
CV4 R4 RH CHH RH
CV12B CV34 H1 H2

CV41 CV2B4 CV2B

CH1 CH2
V1 R1 R2B V2B

CV1
Horizontal transfer clock equivalent circuit
CV12A CV2B3
RRG
RGND RG
CV3
CV2A4
CV2A3
R3 CRG
R2A
V2A CV2A V3

Vertical transfer clock equivalent circuit Reset gate clock equivalent circuit
5
 ICX285AL

Drive Clock Waveform Conditions

(1) Readout clock waveform

100%
90%

VVT M
2
10%
0% 0V
tr twh tf

(2) Vertical transfer clock waveform

V1 V3

VVHH VVHH VVHH VVHH

VVH VVH

VVHL
VVHL VVHL VVH3 VVHL
VVH1

VVLH VVL3VVLH

VVLL VVLL
VVL
VVL1 VVL

V2A, V2B V4

VVH2 VVHH VVHH

VVH VVHH VVHH VVH

VVHL VVHL
VVHL
VVHL VVH4

VVL2 VVL4
VVLH VVLH

VVLL VVLL
VVL VVL

VVH = (VVH1 + VVH2)/2

VVL = (VVL3 + VVL4)/2
VV = VVHn VVLn (n = 1 to 4)
6
 ICX285AL

(3) Horizontal transfer clock waveform

tr twh tf

H2
90%
VCR

VH
twl
VH
2
10%
H1 VHL
two

Cross-point voltage for the H1 rising side of the horizontal transfer clocks H1 and H2 waveforms is VCR.
The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two.

(4) Reset gate clock waveform

tr twh tf

VRGH
RG waveform

twl
VRG
Point A

VRGLH
VRGL
VRGLL
VRGLm

VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG.
In addition, VRGL is the average value of VRGLH and VRGLL.
VRGL = (VRGLH + VRGLL)/2
Assuming VRGH is the minimum value during the interval twh, then:
VRG = VRGH VRGL
Negative overshoot level during the falling edge of RG is VRGLm.

(5) Substrate clock waveform

100%
90%

M
VSUB
M
2
10%
VSUB 0%
tr twh tf

(A bias generated within the CCD)

7
 ICX285AL

Clock Switching Characteristics (Horizontal drive frequency: 28.64 MHz)

twh twl tr tf
Item Symbol Unit Remarks
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
Readout clock VT 2.8 3.0 0.5 0.5 s During readout
V1, V2, When using
Vertical transfer clock 15 250 ns
V3, V4 CXD3400N
transfer clock

H1 10 12.5 10 12.5 5 7.5 5 7.5

rf rf 2ns
Horizontal

During imaging ns
H2 10 12.5 10 12.5 5 7.5 5 7.5
During parallel- H1 0.01 0.01
s
serial conversion H2 0.01 0.01
Reset gate clock RG 4 8 24 2 2 ns
During drain
Substrate clock SUB 3.5 3.9 0.5 0.5 s
charge

two
Item Symbol Unit Remarks
Min. Typ. Max.
Horizontal transfer
H1, H2 8 10 ns
clock

Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics)

1.0

0.9

0.8

0.7
Relative Response

0.6

0.5

0.4

0.3

0.2

0.1

0
400 500 600 700 800 900 1000
Wave Length [nm]

8
 ICX285AL

Image Sensor Characteristics (Ta = 25C)

Measurement
Item Symbol Min. Typ. Max. Unit Remarks
method
Sensitivity 1 S1 1040 1300 mV 1 1/30 s accumulation
Sensitivity 2 S2 4000 mV 2 1/30 s accumulation
Saturation signal Vsat 850 mV 3 Ta = 60C
110 100 Progressive scan mode
Smear Sm dB 4
98 88 High frame rate readout mode
20 Zone 0 and I
Video signal shading SH % 5
25 Zone 0 to II'
Dark signal Vdt 11 mV 6 Ta = 60C, 15 frame/s
Dark signal shading Vdt 4 mV 7 Ta = 60C, 15 frame/s, *1
Lag Lag 0.5 % 8
*1
Excludes vertical dark signal shading caused by vertical register high-speed transfer.

Zone Definition of Video Signal Shading

1392 (H)
16 16

V 8
10
H H
8 8
1040 (V)

8
Zone 0, I
Zone II, II'

V Ignored region
10 Effective pixel region

Measurement System

CCD signal output [*A]

CCD C.D.S AMP S/H Signal output [*B]

Note) Adjust the amplifier gain so that the gain between [*A] and [*B] equals 1.

9
 ICX285AL

Image Sensor Characteristics Measurement Method

Readout modes

The diagram below shows the output methods for the following two readout modes.

Progressive scan mode High frame rate readout mode

16 16
15 15

14 14

13 13
12 12

11 11

10 10
9 9

8 8

7 7
6 6

5 5

4 4
3 3

2 2

1 1

VOUT VOUT

Note) Blacked out portions in the diagram indicate pixels which are not read out.
Output starts from line 1 in high frame rate readout mode.

1. Progressive scan mode

In this mode, all pixel signals are output in non-interlace format in 1/15 s.
All pixel signals within the same exposure period are read out simultaneously, making this mode suitable for
high resolution image capturing.

2. High frame rate readout mode

All effective areas are scanned in approximately 1/60 s by reading out two out of eight lines (1st and 4th lines,
9th and 12th lines, and so on). The vertical resolution is approximately 256 TV-lines.
This readout mode emphasizes processing speed over vertical resolution.

10
 ICX285AL

Measurement conditions

(1) In the following measurements, the substrate voltage is set to the value indicated on the device, and the
device drive conditions are at the typical values of the progressive scan mode, bias and clock voltage condi-
tions.

(2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black level (OB) is used as the reference for the signal output, which is taken as the value measured at point
[*B] of the measurement system.

Definition of standard imaging conditions

(1) Standard imaging condition I:

Use a pattern box (luminance: 706 cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern
for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0 mm) as an IR cut filter and
image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard
sensitivity testing luminous intensity.

(2) Standard imaging condition II:

This indicates the standard imaging condition I with the IR cut filter removed.

(3) Standard imaging condition III:

Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use
a testing standard lens with CM500S (t = 1.0 mm) as an IR cut filter. The luminous intensity is adjusted to the
value indicated in each testing item by the lens diaphragm.

1. Sensitivity 1
Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of
1/100 s, measure the signal output (VS1) at the center of the screen, and substitute the value into the following
formula.
100
S1 = VS1 [mV]
30
2. Sensitivity 2
Set to standard imaging condition II. After selecting the electronic shutter mode with a shutter speed of
1/500 s, measure the signal output (VS2) at the center of the screen, and substitute the value into the following
formula.
500
S2 = VS2 [mV]
30
3. Saturation signal
Set to standard imaging condition III. After adjusting the luminous intensity to 20 times the intensity with the
average value of the signal output, 200 mV, measure the minimum value of the signal output.

4. Smear
Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, first adjust the luminous intensity
to 500 times the intensity with the average value of signal output, 200 mV. Then after the readout clock is
stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the
maximum value (Vsm [mV]) of the signal output and substitute the value into the following formula.
Vsm 1 1
Sm = 20 log [dB] (1/10 V method conversion value)
200 500 10

11
 ICX285AL

5. Video signal shading

Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so
that the average value of the signal output is 200 mV. Then measure the maximum (Vmax [mV]) and minimum
(Vmin [mV]) values of the signal output and substitute the values into the following formula.

SH = (Vmax Vmin)/200 100 [%]

6. Dark signal
Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and the
device in the light-obstructed state, using the horizontal idle transfer level as a reference.

7. Dark signal shading

After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark
signal output and substitute the values into the following formula.

Vdt = Vdmax Vdmin [mV]

8. Lag
Adjust the signal output generated by strobe light to 200 mV. After setting the strobe light so that it strobes
with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula.

Lag = (Vlag/200) 100 [%]

VD

Light

Strobe light timing

Signal output 200 mV Vlag (lag)

Output

12
 Drive Circuit

5.0V

15V

7V 100k

0.1 0.1

1/35V
1 20

XSUB 2 19
0.1 1 2 3 4 5 6 7 8 9 10
XV4 3 18

NC
NC
NC

V1
V4
V3

V2A
V2B
GND
GND

4 17

5 16 ICX285
CXD3400N (BOTTOM VIEW)
(TOP VIEW)
XV2 6 15

H2
H1
VL
CSUB
SUB
H1
H2
RG
VDD
VOUT

XSG2B 7 14

13
20 19 18 17 16 15 14 13 12 11
XSG2A 8 13

XV3 9 12

XV1 10 11
0.1

3.3/20V

3.3/ 0.1 1M 0.01

16V
XSUB
2SC4250

4.7k
H2
1/20V CCD OUT
H1
0.1
RG
ICX285AL
 14
V2A
VD

V4
V3
V2B
V1
HD

OUT
CCD

1040
1
2
1063
1068
"a"

1
2
3
4
1 5
2 6
3 7
4 8
5 9
Drive Timing Chart (Vertical Sync) Progressive Scan Mode

6 10
7 11
8 12
1 13
2
3
4
5
6
7
8
9 21
10
1031
1032 1044
1040 1052
1
2
1063
1068
1
1
2
ICX285AL
 Drive Timing Chart (Vertical Sync "a" Enlarged) Progressive Scan Mode

H1

1
1

56
56

392
392

1790
1790
70 nsec (2 bits)
HD

27.9 sec (800 bits)

V1 3.5 sec (100 bits)

140

98

V2A
1 126

15
V2B
1 126

182

V3
1 126

1 210

V4
ICX285AL
 Drive Timing Chart (Horizontal Sync) Progressive Scan Mode

392
412
430

1790
1
56
CLK

H1

H2

RG

SHP

SHD
1 210

16
V1 1 84 1 42

1 42 1 168

V2A 1 126

1 42 1 168

V2B 1

1 126 1 84

1 126
V3
1 210

V4 126

1 126

105 1 105
SUB
ICX285AL
 17
V2A
VD

V4
V3
V2B
V1
HD

OUT
CCD

1020
1025 260
1028 261
1033 262
1036 263
264
265
266
267
"a"

1
1 2
4 3
1 4
4 5
9 6
12 7
17 8
20 9
25 10
11
12
13
1020
1025 260
1028 261
Drive Timing Chart (Vertical Sync) High Frame Rate Readout Mode

1033 262
1036 263
264
265
266
267
"a"

1
1 2
4 3
1 4
4 5
9 6
12 7
17 8
20 9
25 10
11
12
13
1020
1025 260
1028 261
1033 262
1036 263
264
265
266
267
1
1 2
4 3
1 4
4 5
9 6
12 7
17 8
ICX285AL
 Drive Timing Chart (Vertical Sync "a" Enlarged) High Frame Rate Readout Mode

H1

1
1

56
56

392
392

1790
1790
70 nsec (2 bits)
HD

27.9 sec (800 bits) 3.5 sec (100 bits)

V1

V2A

18
V2B

V3

V4

84 10 10 10 10 10 10 10 10
ICX285AL
 Drive Timing Chart (Horizontal Sync) High Frame Rate Readout Mode

392
412
430

1790
1
56
CLK

H1

H2

RG

SHP

SHD

1 50 1 50 1 50 1 50

19
V1
1 20 1 30 1 30 1 30

1 10 1 50 1 50 1 50
V2A
1 30 1 30 1 30 1 30

1 10 1 50 1 50 1 50
V2B
1 30 1 30 1 30 1 30

1 30 1 50 1 50 1 50
V3
1 30 1 30 1 30 1 30

1 50 1 50 1 50 1 50
V4
1 30 1 30 1 30

1 126
SUB
105 1
ICX285AL
 ICX285AL

Notes on Handling

1) Static charge prevention

CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.

2) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.

3) Dust and dirt protection

Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operation as required, and use them.
a) Perform all assembly operations in a clean room (class 1000 or less).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air
is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving
to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic
protection. Do not reuse the tape.

4) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding
the normal using condition, consult our company.

5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in
such conditions.

6) CCD image sensors are precise optical equipment that should not be subject to too much mechanical shocks.

20
 Package Outline Unit: mm

20 pin DIP (800mil)

C
31.0 0.4
27.0 0.3

0 to 9
+ 0.25 20 11
2-2.50 0

A D

~
~
6.0

20.32
2-

5.0
0

20.2 0.3
3.
B

R
2-

(AT STAND OFF)

+ 0.15
2.00 0
(Reference Hole) 1 10
0.35 13.15 0.5 + 0.15
2.00 0 2.5

0.25
26.0 0.25 (Elongated Hole)

1Pin Index

3.2 0.3

21
1. "A" is the center of the effective image area.
2. The straight line B which passes through the center of the reference hole and the elongated

1.0
hole is the reference axis of vertical direction (V).

2.54 0.46 3. The straight line C which passes through the center of the reference hole at right angle to vertical
reference line B is the reference axis of horizontal direction (H).
1.27

5.5 0.2
4. The bottom D is the height reference.(Two points are specified.)
0.3 M
5. The center of the effective image area specified relative to the reference hole
is (H, V) = (13.15, 5.0) 0.15mm.
PACKAGE STRUCTURE
6. The angle of rotation relative to the reference line B is less than 1
PACKAGE MATERIAL Ceramic
7. The height from the bottom D to the effective image area is 1.46 0.15mm.
LEAD TREATMENT GOLD PLATING
LEAD MATERIAL 8. The tilt of the effective image area relative to the bottom D is less than 60m.
42 ALLOY
PACKAGE MASS 5.90g 9. The thickness of the cover glass is 0.75mm and the refractive index is 1.5.

DRAWING NUMBER AS-A11(E)

ICX285AL

Sony Corporation
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