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Mosfet

MOSFETs, or Metal Oxide Semiconductor Field Effect Transistors, are widely used for switching and amplifying electronic signals, characterized as voltage-controlled three-terminal devices. They are categorized into two main classes: Enhancement and Depletion types, which can be further divided into N-channel and P-channel variants. Each type has distinct operational principles and characteristics, including the formation of channels and the behavior of drain currents under varying gate and drain voltages.

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0% found this document useful (0 votes)
16 views19 pages

Mosfet

MOSFETs, or Metal Oxide Semiconductor Field Effect Transistors, are widely used for switching and amplifying electronic signals, characterized as voltage-controlled three-terminal devices. They are categorized into two main classes: Enhancement and Depletion types, which can be further divided into N-channel and P-channel variants. Each type has distinct operational principles and characteristics, including the formation of channels and the behavior of drain currents under varying gate and drain voltages.

Uploaded by

hp.hema31
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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MOSFET

Metal Oxide Semiconductor


Field Effect Transistor
Introduction

• MOSFETs are the most common type of Field Effect Transistor

• MOSFETs are used in switching or amplifying electronic signals

• MOSFETs are voltage-controlled device

• MOSFETs are three-terminal devices with Source (S), Drain (D), and Gate (G) terminals.

• MOSFETs have a very high switching speed

• There are 2 classes of MOSFETS : Enhancement and Depletion type

• These 2 classes are further divided as N-channel and P-channel


Types of MOSFET
N-channel
Enhancem
ent
MOSFET
N-channel Enhancement MOSFET
 It has P-type semiconductor material as body/substrate.

 Two N-type wells are diffused on the body/substrate.

 Two PN junctions are formed creating 2 depletion regions.

 A metal contact is created at the bottom and a terminal is taken out known as body/ substrate terminal.

 Same metal contacts are created on the top of N-type making source and drain terminals.

 There is a layer of Silicon Dioxide in between the 2 N-type well which act as a dielectric.

 A metal contact is created on the top of SiO2 layer and a terminal is taken out called Gate.

 Generally Source and body terminal are internally connected and is grounded.
N-channel Enhancement MOSFET

 Apply VGS between gate and source


terminal keeping gate at high potential
 Electrons will push towards the gate
terminal and accumulate there
 On increasing VGS electron-hole pairs are
formed pushing holes below and
accumulating more electrons near Gate
 When VGS reaches a threshold voltage, an
n-type channel is formed
N-channel Enhancement MOSFET

 Now on applying VDS keeping the drain at high


potential, the drain current will flow
 On increasing the value of VDS, the drain current
will increase
 VDS at which the channel is pinched-off and the
drain current stops rising is called pinch-off
voltage or saturation voltage
 At a pinch of voltage, the drain current is called the
saturation current
 Now to increase saturation current further increase
VGS
N-channel
Enhancemen
t MOSFET V-I
Characteristi
cs
N-channel
Depletion
MOSFET
N-channel
Depletion MOSFET
• N-type Channel is already present
• Thickness of channel increases on applying VGS keeping gate at
higher potential
• Now on applying VDS keeping drain at hight potential, drain current
will flow
• On increasing the value of VDS, drain current will increase
• On increasing VDS further the N-channel towards drain will become
narrow thus decreasing drain current
• VDS at which channel is pinched-off and drain current stop rising is
called pinch-off voltage or saturation voltage
• At pinch of voltage drain current is called saturation current
• Now to increase saturation current further increase VGS
N-channel
Depletion
MOSFET V-I
Characteris
tics
Important equations region wise
P-channel
Enhancem
ent
MOSFET
P-channel Enhancement MOSFET
• It has N-type semiconductor material as body/substrate

• Two P-type wells are diffused on the body/substrate

• Two PN junctions are formed creating 2 depletion regions

• A metal contact is created at the bottom and a terminal is taken out known as body/ substrate terminal

• Same metal contacts are created on the top of P-type making source and drain terminals

• There is a layer of Silicon Dioxide in between the 2 P-type well which act as a dielectric

• A metal contact is created on the top of SiO2 layer and a terminal is taken out called Gate

• Generally Source and body terminal are internally connected and is grounded
P-channel
Enhancement
MOSFET
• Apply VGS between gate and source terminal keeping gate at
low potential
• Holes will push towards the gate terminal and accumulate
there
• When VGS reaches a threshold voltage, an p type channel is
formed
• Now on applying VDS keeping drain at low potential, drain
current will flow
• On increasing the value of VDS, drain current will increase
• VDS at which channel is pinched-off and drain current stop
rising is called pinch-off voltage or saturation voltage
• At pinch of voltage drain current is called saturation current
• Now to increase saturation current further make VGS more
negetive
P-channel
Enhancemen
t MOSFET V-I
Characteristi
cs
P-channel
Depletion
MOSFET
P-channel
Depletion
MOSFET
• P-type Channel is already present
• Apply VDS keeping drain at low potential, drain
current will flow
• On increasing the value of VDS, drain current
will increase
• On increasing VDS further the P-channel
towards drain will become narrow thus
decreasing drain current
• VDS at which channel is pinched-off and drain
current stop rising is called pinch-off voltage or
saturation voltage
• At pinch of voltage drain current is called
saturation current
• Now to increase saturation current further
increase VGS
P-channel
Depletion
MOSFET V-I
Characteris
tics

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