ECEN 5843 Microelectronic Fabrication: SPRING 2017
ECEN 5843 Microelectronic Fabrication: SPRING 2017
MICROELECTRONIC FABRICATION
SPRING 2017
CRN: 21365
Instructor: Weili Zhang Office: ES 312
Phone: 744-7297 E-mail: weili.zhang@okstate.edu
Class Hours: TR 9:00 – 10:15 am
Office Hours: TR 3:30 – 4:30 pm; or by appointment
Classroom: ATRC 002M, Cleanroom Studio
Website: http://wezhang.okstate.edu/
Textbook: Peter V. Zant, Microchip Fabrication, 6th edition, 2014, McGraw Hill, ISBN 978-0-07-
182101-8
References: Richard C. Jaeger, Introduction to microelectronic fabrication, 2002, Addison-Wesley
Gary S. May, and Simon M. Sze, Fundamentals of semiconductor fabrication, 2004, John
Wiley & Sons
Marc J. Madou, Fundamentals of microfabrication, 1997, Boca Raton
Course Topics: Evolution of Semiconductor Industry
Contamination Control & Cleanroom
Vacuum Systems
Semiconductor Materials
Manufacturing Wafers
Photo Lithography
Film Deposition
Etching: Wet Etching, Dry Etching
Oxidation: Modeling, Wet Oxidation, Dry Oxidation
Doping: Diffusion, Ion Implantation
Packaging: Dicing, Bonding
Formation of Semiconductor Devices and Circuits
Advanced Lithographic Techniques
Cutting edge MicroFabrication
THz Microchips
Grades: Quizzes: 25%
Laboratory: 30%
Paper & Presentation: 15%
Final Examination: 30%
Scale: 0-59% = F; 60-69% = D; 70-79% = C; 80-89% = B; 90-100% = A
No student may earn credits for both ECEN5843 and ECEN4010 MicroFabrication
Paper: Proposal due 2/28; Paper due 4/18
Everyone needs different topic; First come – first served; Basics, current fabrication pro-
cess & perspective/actual topics
~ 10 pages
Late papers: Subtract 10% per day
Copy from Internet: 0 points for paper/presentation
Paper Topics: Nanoimprint lithography
Plasmonic nanolithography
Immersion lithography
EUV lithography
Nanotechnology
Cutting edge MEMS (Micro Electro-Mechanical Systems)
Laser microfabrication & micromachining
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New copper technology
Progress of ion implantation
Specific processing innovations
Biochips
Photonic crystals
Plasmonic crystals
Metamaterials (negative index materials or left-handed materials)
Novel terahertz transmitters/receivers
Tri-gate transistors
Terahertz transistors
Cutting edge laser diodes
New superconducting devices
GaN wafer and devices
Devices & design: RAM, DRAM, ASIC, DSP, microprocessor, etc.
Data storage devices
Micro sensors
Micro robotics
New semiconductor/wafer materials
Presentation: Oral - 12 minutes (10 min presentation; 2 min questions) or Poster
PPT/Multimedia (optional, grade for content)
Interview with at least one company (current topics/problems)
References (IEEE Format, incl. literatures, websites, and any other external resources)
Each presenter gets feedback from audience
Copy from Internet: 0 points for paper/presentation
Quizzes: Three in-class exams will be given during the semester. They are based on material cov-
ered in class and noncomprehensive. The format will vary, some combination of multiple-
choices, short problems, short answers, and essay questions might be included. The dates
of the three exams are given in the class schedule.
Final Exam: 5/05 8:30-10:20 am, ATRC 002M
Written exam covering lectures, and presentations
Laboratory: Groups at 3-6 students
6 Lab projects will be conducted in ATRC cleanroom and chiprooms
Everyone fabricates his/her own microchips
Grades for each step of fabrication process
Unsafe handling of chemicals: 0 points for lab
Improper handling of cleanroom equipment: 0 points for lab
Participation: Keep up with class discussions, and laboratory projects
Bring your textbook to class
Attendance: Absent in safety lesson: 0 points for lab
Arrive after roll has been taken will be counted absent unless you notify me after class
An extra point on your final average by having no absence
Academic Integrity: Academic dishonesty (cheating) will not be tolerated. Everything a student submitted must
be his/her own work. Anyone suspected of academic dishonesty will be referred to the
proper University authority as explained in Oklahoma State University Student Rights and
Responsibilities Governing Student Behavior. Examples of academic dishonesty include:
Soliciting answers from a fellow student during a quiz or examination;
Looking or glancing at another student’s paper during a quiz or examination;
Removing a page or pages from an examination booklet either before, during, or after an
examination;
Using a programmable calculator during an examination;
Modifying or altering a withdrawal slip.
Disabled Students: If any member of this class feels that he/she has a disability and needs special accommoda-
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tions of any nature whatsoever, I will work with you and the Office of Disabled Student
Services, 315 Student Union, to provide reasonable accommodations to ensure that you
have a fair opportunity to perform in this class. Please advise me of such disability and the
desired accommodations at some point before, during, or immediately after the first sched-
uled class period.
Deadlines: Copy of student ID and work/course schedule: 1/24
Proposal: 2/28
Paper: 4/18
Final Examination: 5/05 8:30-10:20 am
CLASS SCHEDULE
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