LM117, LM317-N
www.ti.com SNVS774P – MAY 2004 – REVISED OCTOBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Power dissipation Internally Limited
Input-output voltage differential −0.3 40 V
Metal package (soldering, 10 seconds) 300 °C
Lead temperature
Plastic package (soldering, 4 seconds) 260 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
7.2 ESD Ratings
VALUE UNIT
Electrostatic (1)
V(ESD) Human-body model (HBM) ±3000 V
discharge
(1) Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±3000 V may actually have higher
performance.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating temperature (LM117) −55 150 °C
Operating temperature (LM317-N) 0 125 °C
7.4 Thermal Information, LM117
LM117
NDS NDT
THERMAL METRIC (1) UNIT
(TO-3) (TO)
2 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance (2) 39 186 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 2 21 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) No heatsink.
Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM117 LM317-N
