LM185-ADJ, LM285-ADJ, LM385-ADJ

www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013

LM185/LM285/LM385 Adjustable Micropower Voltage References

Check for Samples: LM185-ADJ, LM285-ADJ, LM385-ADJ

1FEATURES Careful design of the LM185 has made the device

tolerant of capacitive loading, making it easy to use in
•
2 Adjustable from 1.24V to 5.30V almost any reference application. The wide dynamic
• Operating Current of 10μA to 20mA operating range allows its use with widely varying
• 1% and 2% Initial Tolerance supplies with excellent regulation.
• 1Ω Dynamic Impedance The extremely low power drain of the LM185 makes it
• Low Temperature Coefficient useful for micropower circuitry. This voltage reference
can be used to make portable meters, regulators or
DESCRIPTION general purpose analog circuitry with battery life
approaching shelf life. Further, the wide operating
The LM185/LM285/LM385 are micropower 3-terminal current allows it to replace older references with a
adjustable band-gap voltage reference diodes. tighter tolerance part.
Operating from 1.24 to 5.3V and over a 10μA to
20mA current range, they feature exceptionally low The LM185 is rated for operation over a −55°C to
dynamic impedance and good temperature stability. 125°C temperature range, while the LM285 is rated
On-chip trimming is used to provide tight voltage −40°C to 85°C and the LM385 0°C to 70°C. The
tolerance. Since the LM185 band-gap reference uses LM185 is available in a hermetic TO package and a
only transistors and resistors, low noise and good LCCC package, while the LM285/LM385 are
long-term stability result. available in a low-cost TO-92 package, as well as
SOIC.

Connection Diagram

Figure 1. TO-92 Package Figure 2. TO Package

Bottom View Bottom View

Figure 3. SOIC Package Figure 4. 20-LCCC

Top View Top View

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com

Block Diagram

Typical Applications

Figure 5. 1.2V Reference

Figure 6. 5.0V Reference

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ

 LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013

Absolute Maximum Ratings (1) (2) (3)

Reverse Current 30mA
Forward Current 10mA
(4)
Operating Temperature Range
LM185 Series −55°C to 125°C
LM285 Series −40°C to 85°C
LM385 Series 0°C to 70°C
(5)
ESD Susceptibility 2kV
Storage Temperature −55°C to 150°C
Soldering Information
TO-92 Package (10 sec.) 260°C
TO Package (10 sec.) 300°C
SOIC Package
Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
See An-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications
apply only for the test conditions listed.
(2) Refer to RETS185H for military specifications.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For elevated temperature operation, see Table 1 and Thermal Characteristics.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.

Table 1. TJ(max) for Elevated Temperature Operation

DEVICE TJ(max) (°C)
LM185 150
LM285 125
LM385 100

Thermal Characteristics
Over operating free-air temperature range (unless otherwise noted)
Thermal Resistance TO-92 TO-46 SOIC
180°C/W (0.4″ leads)
θJA (Junction to Ambient) 440°C/W 165°C/W
170°C/W (0.125″ leads)
θJC (Junction to Case) N/A 80°C/W N/A

Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com

Electrical Characteristics (1)

LM185, LM285 LM385
LM185BX, LM285 LM385
LM185BY
LM385BX,
LM185B,
LM385BY Units
Parameter Conditions LM285BX,
Typ Typ (Limit)
LM285BY
Tested Design Tested Design Tested Design Tested Design
Limit Limit Limit Limit Limit Limit Limit Limit
(2) (3) (2) (3) (2) (3) (2) (3)

Reference IR = 100μA 1.240 1.252 1.265 1.270 1.240 1.252 1.255 1.265 1.270 V (max)
Voltage
1.255
1.228 1.215 1.205 1.228 1.215 1.215 1.205 V (min)
1.215
Reference IMIN< IR < 1mA 0.2 1 1.5 1 1.5 0.2 1 1.5 1 1.5 mV
Voltage (max)
1mA < IR < 20mA 4 10 20 10 20 5 15 25 15 25
Change with
Current
Dynamic IR = 100μA, f =
Output 100Hz
Impedance
IAC = 0.1 IR VOUT = 0.3 0.4
Ω
VREF
VOUT = 0.7 1
5.3V
Reference IR = 100μA
Voltage
mV
Change with 1 3 6 3 6 2 5 10 5 10
(max)
Output
Voltage
Feedback 13 20 25 20 25 16 30 35 30 35 nA (max)
Current
Minimum VOUT = VREF 6 9 10 9 10 7 11 13 11 13 μA
Operating (max)
VOUT = 5.3V 30 45 50 45 50 35 55 60 55 60
Current (see
curve)
Output IR = 100μA, 10Hz < f μVrms
Wideband < 10kHz
Noise
VOUT = VREF 50 50
VOUT = 5.3V 170 170
Average IR = 100μA X Suffix 30 30
Temperature
Y Suffix 50 50 ppm/°c
Coefficient
(4) (max)
All 150 150 150 150
Others
Long Term IR = 100μA, T = 1000 20 20 ppm
Stability Hr,
TA = 25°C ± 0.1°C

(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25°C. Unless otherwise
specified, all parameters apply for VREF < VOUT < 5.3V.
(2) Production tested.
(3) Not production tested. These limits are not to be used to calculate average outgoing quality levels.
(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures from TMIN
to TMAX, divided by TMAX − TMIN. The measured temperatures are −55, −40, 0, 25, 70, 85, 125°C.

4 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ

 LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013

Typical Performance Characteristics

Temperature Drift of 3
Representative Units Feedback Current

Figure 7. Figure 8.

Minimum Operating Current Reverse Characteristics

Figure 9. Figure 10.

Reverse Characteristics Forward Characteristics

Figure 11. Figure 12.

Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com

Typical Performance Characteristics (continued)

Output Noise Voltage Dynamic Output Impedance

Figure 13. Figure 14.

Response Time

Figure 15.

Temperature Coefficient Typical

LM185 (left), LM285 (center), LM385 (right)

Figure 16.

6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ

 LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013

TYPICAL APPLICATIONS

Figure 17. Precision 10V Reference Figure 18. Low AC Noise Reference

Figure 19. 25V Low Current Shunt Regulator Figure 20. 200 mA Shunt Regulator

Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com

Figure 21. Series-Shunt 20 mA Regulator Figure 22. High Efficiency Low Power Regulator

Figure 23. Voltage Level Detector Figure 24. Voltage Level Detector

Figure 25. Fast Positive Clamp Figure 26. Bidirectional Clamp

2.4V + ΔVD1 ±2.4V

8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ

 LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013

Figure 27. Bidirectional Adjustable Clamp Figure 28. Bidirectional Adjustable Clamp
±1.8V to ±2.4V ±2.4V to ±6V

Figure 29. Simple Floating Current Detector

Figure 30. Current Source

Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com

*D1 can be any LED, VF=1.5V to 2.2V at 3 mA. D1 may act as an indicator. D1 will be on if ITHRESHOLD falls below the
threshold current, except with I=O.

Figure 31. Precision Floating Current Detector

Figure 32. Centigrade Thermometer, 10mV/°C

Figure 33. Freezer Alarm

10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ

 LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013

Schematic Diagram

Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F – FEBRUARY 2000 – REVISED APRIL 2013 www.ti.com

REVISION HISTORY

Changes from Revision E (April 2013) to Revision F Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 11

12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated

Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ

 PACKAGE OPTION ADDENDUM

www.ti.com 30-Apr-2024

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LM185BH ACTIVE TO NDV 3 1000 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 ( LM185BH, LM185BH Samples
)
LM185BH/NOPB ACTIVE TO NDV 3 1000 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 ( LM185BH, LM185BH Samples
)
LM285BXZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green Call TI N / A for Pkg Type -40 to 85 LM285 Samples
BXZ
LM285BYM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285 Samples
BYM
LM285BYMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285 Samples
BYM
LM285BYZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green Call TI N / A for Pkg Type -40 to 85 LM285 Samples
BYZ
LM285M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285 Samples
M
LM285MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM285 Samples
M
LM285Z/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green Call TI N / A for Pkg Type -40 to 85 LM285 Samples
Z
LM385BM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385 Samples
BM
LM385BMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385 Samples
BM
LM385BXZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green Call TI N / A for Pkg Type 0 to 70 LM385 Samples
BXZ
LM385BYZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green Call TI N / A for Pkg Type 0 to 70 LM385 Samples
BYZ
LM385BZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green Call TI N / A for Pkg Type 0 to 70 LM385 Samples
BZ
LM385M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385 Samples
M
LM385MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM385 Samples
M
LM385Z/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green Call TI N / A for Pkg Type 0 to 70 LM385 Samples

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 30-Apr-2024

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
Z

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-May-2024

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM285BYMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM285MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385BMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-May-2024

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM285BYMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM285MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM385BMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM385MX/NOPB SOIC D 8 2500 367.0 367.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-May-2024

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM285BYM/NOPB D SOIC 8 95 495 8 4064 3.05
LM285M/NOPB D SOIC 8 95 495 8 4064 3.05
LM385BM/NOPB D SOIC 8 95 495 8 4064 3.05
LM385M/NOPB D SOIC 8 95 495 8 4064 3.05

Pack Materials-Page 3
 PACKAGE OUTLINE
NDV0003H SCALE 1.250
TO-CAN - 2.67 mm max height
TRANSISTOR OUTLINE

4.95
4.55

0.76 MAX 2.67 MAX

UNCONTROLLED LEAD DIA

0.64 MAX
(MIL/AERO)
1.397 MAX
(COMMERCIAL)

3X
12.7 MIN

0.483
3X
0.407

5.32-5.56
2

1 3

45
( 2.54)
1.16
0.92
1.22
0.72

4219876/B 09/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-46.

www.ti.com
 EXAMPLE BOARD LAYOUT
NDV0003H TO-CAN - 2.67 mm max height
TRANSISTOR OUTLINE

(2.54)

0.07 MAX ( 1.2)

ALL AROUND METAL
3
3X ( 0.7) VIA

SOLDER MASK
OPENING
(1.27)
1
(R0.05) TYP

2X ( 1.2)
2 METAL
0.07 MAX
TYP 2X
SOLDER MASK
OPENING

LAND PATTERN EXAMPLE

NON-SOLDER MASK DEFINED
SCALE:12X

4219876/B 09/2024

www.ti.com
 PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1

.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]

4X (0 -15 )

4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4

.005-.010 TYP
[0.13-0.25]

4X (0 -15 )

SEE DETAIL A
.010
[0.25]

.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.

www.ti.com
 EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X

SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK

EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55] SYMM

1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
LP0003A SCALE 1.200 SCALE 1.200
TO-92 - 5.34 mm max height
TO-92

5.21
4.44

EJECTOR PIN
OPTIONAL
5.34
4.32

(1.5) TYP

(2.54) SEATING
2X NOTE 3 PLANE
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN

0.43
2X 0.55 3X
3X 0.35
2.6 0.2 0.38
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION
TO STRAIGHT LEAD OPTION

2.67
3X
2.03 4.19
3.17
3 2 1

3.43 MIN

4215214/B 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.

www.ti.com
 EXAMPLE BOARD LAYOUT
LP0003A TO-92 - 5.34 mm max height
TO-92

FULL R
0.05 MAX (1.07) TYP
ALL AROUND METAL 3X ( 0.85) HOLE
TYP TYP

2X
METAL
(1.5) 2X (1.5)

2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
(2.54)
OPENING

LAND PATTERN EXAMPLE

STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X

0.05 MAX ( 1.4) 2X ( 1.4)

ALL AROUND METAL
TYP 3X ( 0.9) HOLE

METAL

2X
1 2 3 SOLDER MASK
(R0.05) TYP
(2.6) OPENING
SOLDER MASK
OPENING (5.2)

LAND PATTERN EXAMPLE

FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X

4215214/B 04/2017

www.ti.com
 TAPE SPECIFICATIONS
LP0003A TO-92 - 5.34 mm max height
TO-92

13.7
11.7

32
23

(2.5) TYP 0.5 MIN

16.5
15.5

11.0 9.75
8.5 8.50

19.0
17.5

2.9 6.75 3.7-4.3 TYP

TYP
2.4 5.95
13.0
12.4

FOR FORMED LEAD OPTION PACKAGE

4215214/B 04/2017

www.ti.com
 IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2024, Texas Instruments Incorporated