Global Mixed-mode Technology Inc.

G913
150mA Low-Dropout Linear Regulators
Features General Description
„Low, 55µA No-Load Supply Current The G913 is a low supply current, low dropout linear
„Guaranteed 150mA Output Current regulator that comes in a space saving SOT23-5 pack-
„Dropout Voltage is 70mV @ 50mA Load age. The supply current at no-load is 55µA. In the
„Over-Temperature Protection and Short-Circuit shutdown mode, the maximum supply current is less
Protection than 1µA. Operating voltage range of the G913 is from
„Two Modes of Operation ---- 2.5V to 5.5V. The over-current protection limit is set at
Fixed Mode: 2.84V (G913A), 3.15V (G913B), 250mA typical and 150mA minimum. An overtem-
3.30V (G913C), 3.00V (G913D) perature protection circuit is built-in in the G913 to
Adjustable Mode: from 1.25V to 5.5V prevent thermal overload. These power saving fea-
„Max. Supply Current in Shutdown Mode < 1µA tures make the G913 ideal for use in the bat-
„Low Output Noise at 220µVRMS tery-powered applications such as notebook com-
„Stability with lost cost ceramic capacitors puters, cellular phones, and PDA’s.
The G913 has two modes of operation. When the SET
Applications pin is connected to ground, its output is a pre-set
value: 2.84V for G913A, 3.15V for G913B, and 3.30V
„Notebook Computers
for G913C, and 3.00V for G913D. There is no external
„Cellular Phones
components needed to decide the output voltage.
„PDAs
When an output other than the preset value is needed,
„Digital still Camera and Video Recorders
two external resistors should be used as a voltage
„Hand-Held Devices
„Bar Code Scanners
divider. The output voltage is then decided by the re-
sistor ratio. The G913 comes in a space saving
SOT23-5 package.

Ordering Information
TEMP. PIN-
PART MARKING VOLTAGE
RANGE PACKAGE
G913A 3A 2.84 -40°C~ +85°C SOT 23-5
G913B 3B 3.15 -40°C~ +85°C SOT 23-5
G913C 3C 3.30 -40°C~ +85°C SOT 23-5
G913D 3D 3.00 -40°C~ +85°C SOT 23-5

Pin Configuration

OUTPUT
IN OUT
VOLTAGE

＋C G913
SHDN 1 5 SET IN SHDN COUT
_ 1µF 1µF
BATTERY
GND SET

GND 2 G913
G963 Fixed mode
OUTPUT
IN 4 OUT IN OUT
3 VOLTAGE
R1
＋
SOT23-5
G913
SET
－ BATTERY CIN SHDN COUT
1µF R2
GND 1µF

Adjustable mode

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 Global Mixed-mode Technology Inc. G913
Absolute Maximum Ratings Continuous Power Dissipation (TA = +25°C)
VIN to GND……………………………………-0.3V to +7V SOT23-5……………………………………...…..520 mW
Output Short-Circuit Duration………………….….Infinite Operating Temperature Range………...-40°C to +85°C
SET to GND.……………………………..…..-0.3V to +7V Junction Temperature……………………….……+150°C
(1)
θJA ….…..…………….…………….…..…..240°C/Watt
SHDN to GND…………………..………….-0.3V to +7V
Storage Temperature Range………….-65°C to +160°C
SHDN to IN….…………………..…………..-7V to +0.3V Lead Temperature (soldering, 10sec)..…………+300°C
OUT to GND…………………………-0.3V to (VIN + 0.3V)
Note (1): See Recommended Minimum Footprint (Figure 3)

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress rat-
ings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of
the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Electrical Characteristics
(VIN =+3.6V, V SHDN =VIN, TA =TJ =+25°C, unless otherwise noted.) (Note 1)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Input Voltage (Note 2) VIN 2.5 5.5 V
Output Voltage Accuracy VOUT Variation from specified VOUT, IOUT=1mA -2 2 %
Adjustable Output Voltage Range (Note 3) VOUT VSET 5.5 V
Maximum Output Current 150 mA
Current Limit (Note 4) ILIM 250 mA
ILOAD = 0mA 55 120
Ground Pin Current IQ SET = GND µA
ILOAD = 50mA 145
IOUT = 1mA 2
Dropout Voltage (Note 5) VDROP IOUT = 50mA 70 mV
IOUT =150mA 230 300
SET=GND, VIN=V(STD)+0.1V,to 5.5V IOUT = 1mA 0.1 0.28
Line Regulation ∆VLNR %/V
SET tied to OUT, VIN=2.5V to 5.5V, IOUT = 1mA 0.08 0.4
SET tied to OUT 0.02 0.8
Load Regulation ∆VLDR IOUT = 0mA to 150mA %
SET = GND 1.0
VIN=4.2V,
Output Voltage Noise (10Hz to 100kHz) en COUT = 1µF 220 µVRMS
IOUT=150mA
SHUTDOWN
VIH Regulator enabled VIN-0.7
SHDN Input Threshold V
VIL Regulator shutdown 0.4
SHDN Input Bias Current I SHDN V SHDN = VIN TA = +25°C 0.003 0.1 µA
Shutdown Supply Current IQSHDN VOUT = 0V TA = +25°C 0.2 1 µA
SET INPUT
VIN = 2.5V to 5.5V, TA = +25°C 1.225 1.25 1.275
SET Reference Voltage (Note 3) VSET V
IOUT = 1mA TA = TMIN to TMAX 1.25
SET Input Leakage Current (Note 3) ISET VSET = 1.3V TA = +25°C 5 30 nA
THERMAL PROTECTION
Thermal Shutdown Temperature TSHDN 150 °C
Thermal Shutdown Hysteresis ∆TSHDN 15 °C

Note 1: Limits is 100% production tested at TA= +25°C. Low duty pulse techniques are used during test to
maintain junction temperature as close to ambient as possible.
Note 2: Guaranteed by line regulation test.
Note 3: Adjustable mode only.
Note 4: Not tested. For design purposes, the current limit should be considered 150mA minimum to 420mA maximum.
Note 5: The dropout voltage is defined as (VIN-VOUT) when VOUT is 100mV below the value of VOUT for VIN = VOUT +2V,
The performance of every G913 part, see “Typical Performance Characteristics”.

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 Global Mixed-mode Technology Inc. G913
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, COUT=1µF, G913B, TA=25 °C, unless otherwise noted.)

Output Voltage vs. Load Current Ground Current vs. Load Current
3.160 300

3.150 250

Ground Current (μA)

Output Voltage (V)

3.140 200

3.130 150

3.120 100

3.110 50

3.100
0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150

Load Current (mA) Load Current (mA)

Output Voltage vs. Load Current Supply Current vs. Input Voltage

3.50 130
120
3.00 110
No Load
Supply Current (μA)
Output Voltage (V)

100
2.50 ILOAD = 50mA
90
80
2.00
70
60
1.50
50
40 ILOAD = 0A
1.00
30
0.50 20
10
0.00 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6 7
Input Voltage (V) Input Voltage (V)

Dropout Voltage vs. Load Current Output Noise 10HZ to 100KHZ

300

250
Dropout Voltage (mV)

200

150

100

50

0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150

Load Current (mA)

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 Global Mixed-mode Technology Inc. G913
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, COUT=1µF, G913B, TA=25 °C, unless otherwise noted.)

Line Transient Load Transient

Load Transient Load Transient

Dropout Voltage vs. Load Current by G913 Dropout Voltage vs. Temperature
300 400
TA=25°C
350
250
Top to Bottom G913C
ILOAD=150mA
Dropout Voltage (mV)

300
Dropout Voltage (mV)

G913C
200 G913B
G913D 250

150 200

150 ILOAD=50mA
100
G913A
100
50
50 ILOAD=0mA

0 0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120

Load Current (mA) Junction Temperature TJ (℃)

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 Global Mixed-mode Technology Inc. G913
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, COUT=1µF, G913B, TA=25 °C, unless otherwise noted.)

Turn on Response Time Turn off Response Time

Shutdown Pin Delay Shutdown Response Time

Shutdown Pin Delay Shutdown Response Time

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 Global Mixed-mode Technology Inc. G913
Typical Performance Characteristics
(VIN= +3.6V, CIN=1µF, COUT=1µF, G913B, TA=25 °C, unless otherwise noted.)

Shutdown Supply Current SHDN Input Bias Current vs. Temperature

1.00 0.20

0.80 G913C G913C

SHDN Input Bias Current ( μA)

Shutdown Supply Current ( μA)

0.60
0.10
0.40

0.20

0.00 0.00

-0.20

-0.40
-0.10
-0.60

-0.80

-1.00 -0.20
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120

Junction Temperature TJ (℃) Junction Temperature TJ (℃)

SET Input Leakage Current vs. Temperature SET Reference Voltage vs. Temperature
60 1.260
55
G913C
50 G913C
SET Input Leakage Current (nA)

1.255
SET Reference Voltage (V)

ILOAD=1mA VIN=5.5V
45
40
35 1.250

30
25 1.245
VIN=3.6V
20
15
1.240
10 VIN=2.5V
5
0 1.235
-5
-10 1.230
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120

Junction Temperature TJ (℃) Junction Temperature TJ (℃)

Output Voltage vs. Temperature Ground Current vs. Temperature

3.340 100
G913C
3.330 ILOAD=1mA G913C
80 ILOAD=0A
Ground Current ( μ A)
Output Voltage (V)

3.320 VIN=5.5V
60
VIN=3.6V
3.310

40
3.300
VIN=3.4V
20
3.290

3.280 0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120

Junction Temperature TJ (℃) Junction Temperature TJ (℃)

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 Global Mixed-mode Technology Inc. G913
Pin Description
PIN NAME FUNCTION
Active-Low Shutdown Input. A logic low reduces the supply current to less than 1µA. Connect to IN for normal
1 SHDN
operation.
Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board ground plane to
2 GND
maximize thermal dissipation.
3 IN Regulator Input. Supply voltage can range from +2.5V to +5.5V. Bypass with 1µF to GND
Regulator Output. Fixed or adjustable from 1.25V to +5.5V. Sources up to 150mA. Bypass with a 1µF,
4 OUT
＜0.2Ω typical ESR capacitor to GND.
Feedback Input for Setting the Output Voltage. Connect to GND to set the output voltage to the preset
5 SET
2.84V or 3.15V or 3.30V or 3.00V. Connect to an external resistor divider for adjustable-output operation.

Detailed Description action, the error amplifier, output PMOS, and the volt-
age divider effectively form a unity-gain amplifier with
The block diagram of the G913 is shown in Figure 1. It the feedback voltage force to be the same as the
consists of an error amplifier, 1.25V bandgap refer- 1.25V bandgap reference. The output voltage, VOUT, is
ence, PMOS output transistor, internal feedback volt- then given by the following equation:
age divider, mode comparator, shutdown logic, over VOUT = 1.25 (1 + R1/R2). (1)
current protection circuit, and over temperature protec- Alternatively, the relationship between R1 and R2 is
tion circuit. given by:
The mode comparator compares the SET pin voltage R1 = R2 (VOUT /1.25 + 1). (2)
with an internal 120mV reference. If the SET pin volt- For the reasons of reducing power dissipation and
age is less than 120mV, the internal feedback voltage loop stability, R2 is chosen to be 100KΩ. For G913A,
divider’s central tap is connected to the non-inverting R1 is 128KΩ, and the pre-set VOUT is 2.84V. For
input of the error amplifier. The error amplifier com- G913B, R1 is 152KΩ, and the pre-set VOUT is 3.15V.
pares non-inverting input with the 1.25V bandgap ref- For G913C, R1 is 164KΩ, and the pre-set VOUT is
erence. If the feedback voltage is higher than 1.25V, 3.30V. For G913D, R1 is 140KΩ, and the pre-set VOUT
the error amplifier’s output becomes higher so that the is 3.00V.
PMOS output transistor has a smaller gate-to-source When external voltage divider is used, as shown in
voltage (VGS). This reduces the current carrying capa- Figure 2, the SET pin voltage will be larger than
bility of the PMOS output transistor, as a result the 600mV. The non-inverting input of the amplifier will be
output voltage decreases until the feedback voltage is connected to the external voltage divider. However,
equal to 1.25V. Similarly, when the feedback voltage the operation of the feedback loop is the same, so that
is less than 1.25V, the error amplifier causes the out- the conditions of Equations 1 and 2 are still true. The
put PMOS to conductor more current to pull the feed- output voltage is still given by Equation 1.
back voltage up to 1.25V. Thus, through this feedback

IN

SHDN

－
OVER CURRENT P
ERROR
PROTECT & DYNAMIC
AMP
SHUTDOWN FEEDBACK
LOGIC ＋
OUT

SET

－ R1
OVER TEMP. 1.25V
PROTECT Vref ＋
＋
120mV R2
MODE COMPARATOR －
GND

Figure 1. Functional Diagram

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 Global Mixed-mode Technology Inc. G913
Where (TJ–TA) is the temperature difference the G913 die
OUTPUT
and the ambient air,θJA, is the thermal resistance of the
VOLTAGE
IN OUT chosen package to the ambient air. For surface mount
R1 device, heat sinking is accomplished by using the heat
＋ spreading capabilities of the PC board and its copper
G913
SET traces. In the case of a SOT23-5 package, the thermal
－ BATTERY CIN SHDN RL
1µF R2
COUT resistance is typically 240oC/Watt. (See Recommended
GND 1µF
Minimum Footprint) [Figure 3] Refer to Figure 4 is the
G913 valid operating region (Safe Operating Area) & refer
to Figure 5 is maximum power dissipation of SOT 23-5.
The die attachment area of the G913’s lead frame is
Figure 2. Adjustable Output Using External connected to pin 2, which is the GND pin. Therefore, the
Feedback Resistors GND pin of G913 can carry away the heat of the G913
die very effectively. To improve the power dissipation,
Over Current Protection
connect the GND pin to ground using a large ground
The G913 use a current mirror to monitor the output cur-
plane near the GND pin.
rent. A small portion of the PMOS output transistor’s cur-
rent is mirrored onto a resistor such that the voltage Applications Information
across this resistor is proportional to the output current. Capacitor Selection and Regulator Stability
This voltage is compared against the 1.25V reference. Normally, use a 1µF capacitor on the input and a 1µF
Once the output current exceeds the limit, the PMOS capacitor on the output of the G913. Larger input capaci-
output transistor is turned off. Once the output transistor is tor values and lower ESR provide better supply-noise
turned off, the current monitoring voltage decreases to rejection and transient response. A higher- value input
zero, and the output PMOS is turned on again. If the over capacitor (10µF) may be necessary if large, fast tran-
current condition persist, the over current protection circuit sients are anticipated and the device is located several
will be triggered again. Thus, when the output is shorted inches from the power source.
to ground, the output current will be alternating between 0
and the over current limit. The typical over current limit of Power-Supply Rejection and Operation from Sources
the G913 is set to 250mA. Note that the input bypass Other than Batteries
capacitor of 1µF must be used in this case to filter out the The G913 is designed to deliver low dropout voltages and
input voltage spike caused by the surge current due to the low quiescent currents in battery powered systems.
inductive effect of the package pin and the printed circuit Power-supply rejection is 42dB at low frequencies. As the
board’s routing wire. Otherwise, the actual voltage at the frequency increases above 20kHz, the output capacitor is
IN pin may exceed the absolute maximum rating. the major contributor to the rejection of power-supply
noise.
Over Temperature Protection When operating from sources other than batteries, im-
To prevent abnormal temperature from occurring, the prove supply-noise rejection and transient response by
G913 has a built-in temperature monitoring circuit. When increasing the values of the input and output capacitors,
it detects the temperature is above 150oC, the output and using passive filtering techniques.
transistor is turned off. When the IC is cooled down to
below 135oC, the output is turned on again. In this way, Load Transient Considerations
the G913 will be protected against abnormal junction The G913 load-transient response graphs show two
temperature during operation. components of the output response: a DC shift of the
output voltage due to the different load currents, and the
Shutdown Mode transient response. Typical overshoot for step changes in
When the SHDN pin is connected a logic low voltage, the load current from 0mA to 100mA is 12mV. Increasing
the G913 enters shutdown mode. All the analog circuits the output capacitor's value and decreasing its ESR at-
are turned off completely, which reduces the current tenuates transient spikes.
consumption to only the leakage current. The output is
Input-Output (Dropout) Voltage
disconnected from the input. When the output has no
A regulator's minimum input-output voltage differential (or
load at all, the output voltage will be discharged to ground
dropout voltage) determines the lowest usable supply
through the internal resistor voltage divider.
voltage. In battery-powered systems, this will determine
Operating Region and Power Dissipation the useful end-of-life battery voltage. Because the G913
Since the G913 is a linear regulator, its power dissipation use a P-channel MOSFET pass transistor, their dropout
is always given by P = IOUT (VIN – VOUT). The maximum voltage is a function of RDS(ON) multiplied by the load cur-
power dissipation is given by: rent.
PD(MAX) = (TJ–TA)/θJA,=150oC-25oC/240oC/W= 520mW

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 Global Mixed-mode Technology Inc. G913
Layout Guide The output capacitor also must be located a distance
An input capacitance of ≅ 1µF is required between the of not more than 1cm from output to a clean analog
G913 input pin and ground (the amount of the capaci- ground. Because it can filter out the output spike
tance may be increased without limit), This capacitor caused by the surge current due to the inductive effect
must be located a distance of not more than 1cm from of the package pin and the printed circuit board’s
the input and return to a clean analog ground. routing wire. Figure 6 is adjustable mode of G913 PCB
layout. Figure 7 is a PCB layout of G913 fixed mode.
Input capacitor can filter out the input voltage spike
caused by the surge current due to the inductive effect
of the package pin and the printed circuit board’s
routing wire. Otherwise, the actual voltage at the IN
pin may exceed the absolute maximum rating.

Figure 3. Recommended Minimum Footprint

Safe Operating Area of G913 [Power Dissipation Limit] Maximum Power Dissipation of SOT-23-5
200 0.7

Still Air
Maximum Recommended Output Current 0.6 1oz Copper on SOT-23-5 Package

150 Mounted on recommend mimimum footprint (RθJA=240°C/W)

0.5
Power Dissipation (W)
Output Current (mA)

TA=25℃
0.4
100 TA=55℃
0.3
TA=85℃
TA=25°C,Still Air
50 1oz Copper on SOT-23-5 Package
0.2
Mounted on recommended mimimum footprint (RθJA=240°C/W) Figure 4 Safe Operating Area
0.1

0 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 25 35 45 55 65 75 85 95 105 115 125
Input-Output Voltage Differential VIN-VOUT (V) Amibent Temperature TA (°C)
Note : VIN(max) <=5.5V
Figure 4 Safe Operating Area Figure 5 Power Dissipation vs. Temperature

Figure 6. Adjustable Mode Figure 7. Fixed Mode

*Distance between pin & capacitor must no more than 1cm *Distance between pin & capacitor must no more than 1cm

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 Global Mixed-mode Technology Inc. G913
Package Information
D C

E H

θ1
e1
e

A
A2

A1
b

Note:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ±0.1000 mm (4mil) unless otherwise specified
3. Coplanarity: 0.1000mm
4. Dimension L is measured in gage plane

DIMENSIONS IN MILLIMETERS
SYMBOLS
MIN NOM MAX
A 1.00 1.10 1.30
A1 0.00 ----- 0.10
A2 0.70 0.80 0.90
b 0.35 0.40 0.50
C 0.10 0.15 0.25
D 2.70 2.90 3.10
E 1.40 1.60 1.80
e ----- 1.90(TYP) -----
e1 ----- 0.95 -----
H 2.60 2.80 3.00
L 0.37 ------ -----
θ1 1º 5º 9º

Taping Specification

Feed Direction
SOT23-5 Package Orientation

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