Dent Ial: Ssc338D/Ssc338Q High-Integrated Ip Camera Soc Processor
Dent Ial: Ssc338D/Ssc338Q High-Integrated Ip Camera Soc Processor
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SSC338D/SSC338Q
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High-Integrated IP Camera SoC
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SigmaStar Technology makes no representations or warranties including, for example but not limited to,
warranties of merchantability, fitness for a particular purpose, non-infringement of any intellectual property
right or the accuracy or completeness of this document, and reserves the right to make changes without further
notice to any products herein to improve reliability, function or design. No responsibility is assumed by
SigmaStar Technology arising out of the application or use of any product or circuit described herein; neither
does it convey any license under its patent rights, nor the rights of others.
SigmaStar is a trademark of SigmaStar Technology. Other trademarks or names herein are only for
identification purposes only and owned by their respective owners.
SSC338D/SSC338Q
High-Integrated IP Camera SoC Processor
Preliminary Product Brief Version 0.8
REVISION HISTORY
Revision No. Description Date
0.1 Initial release 01/17/2020
0.2 Added DLA function 03/02/2020
0.3 Updated Features 05/11/2020
Updated Mechanical Dimensions
0.4 Updated CA7 Spec. 05/29/2020
0.5 Updated Features 09/28/2020
Added Interface Characteristics and Thermal Resistance Data
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0.6 Added Minimum Order Quantity and Moisture Sensitivity Level 01/21/2021
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0.7 Updated audio spec. and I2C SDA Hold Time min. value 04/26/2021
Added Ambient Temperature during OTP programming
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0.8 Updated Recommended Operating Conditions 06/30/2021
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TABLE OF CONTENTS
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5. ELECTRICAL CHARACTERISTIC ................................................................................................. 12
5.1. Interface Characteristics ........................................................................................................... 12
5.2. Absolute Maximum Ratings ....................................................................................................... 13
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5.3. Recommended Operating Conditions ......................................................................................... 13
6. Thermal Resistance ................................................................................................................... 15
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6.1. Thermal simulation mode ......................................................................................................... 15
7. ORDERING GUIDE ..................................................................................................................... 16
7.1. Marking Information ................................................................................................................ 16
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1. CHIP OVERVIEW
The SSC338D/SSC338Q series products are highly integrated multimedia System-on-Chip (SoC) products for
high-resolution intelligent video recording applications like IP camera, CAR camera, and USB camera.
The chip includes a 32-bit dual-core RISC processor, advanced Image Signal Processor (ISP), high performance
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MJPEG/H.264/H.265 video encoder, Deep Learning Accelerator (DLA), Intelligent Video Engine (IVE), as well as
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high speed I/O interfaces like MIPI, and Ethernet.
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Advanced low-power, low-voltage architecture and optimized design flow are implemented to fulfill long time
usage applications. Hardwired AES/DES/3DES cipher engines are integrated to support secure boot,
authentication, and video/audio stream encryption in security system.
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The SSC338D/SSC338Q, powered by SigmaStar Technology, comes with a complete hardware platform and
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software SDK, allowing customers to speed up "Time-to-Market."
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2. BLOCK DIAGRAM
Figure 2-1 shows the major functional blocks of SSC338D/SSC338Q series chip.
Camera Module
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MIPI/
I2C
DVP
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Video Interface
ISP
GOP
Scalar
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MJPEG
Encoder
IVE
UART
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DMA
Pan/Tilt Motors
LDC
PWMs/GPIOs
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H.264/265 Security
DLA
Encoder
OTP
SPI
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PLL
L2: 256KB
EJTAG
Microphone
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Audio
Memory Controller
MCP
ADC/
DRAM
Driver
USB2.0
Audio
DAC
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Ethernet SD/SDIO
Flash SDIO slave
eMAC Controller
Controller
Ethernet ePHY
Serial Serial
eMMC
NOR NAND
3. FEATURES
High Performance Processor Core Flip, Mirror, and Rotation with 90 or 270
ARM Cortex-A7 Dual Core degree
Clock rate up to 1.2GHz Lens distortion correction (LDC/FishEye)
Neon and FPU Rolling shutter compensation
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Memory Management Unit for Linux support Fully programmable multi-function scaling
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DMA Engine engines
Image/Video Processor Advanced Color Engine
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Supports 8/10/12-bit parallel interface for Luma gain/offset adjustment
raw data input Supports 2D peaking with user definition
Supports MIPI interface with 2/4 data lanes filter
and 1 clock lane
Supports one MIPI interface
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Direct Luma Correction (DLC)
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Supports sensor interface with both parallel Black/White Level Extension (BLE/WLE)
and MIPI IHC/ICC/IBC for chroma adjustment
Supports 8/10-bit CCIR656 interface Histogram statistics
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Supports max. 4K (3840x2160) pixels video Spatial domain IIR filter to reduce noise
recording and image snapshot H.265/HEVC
Bad pixel compensation Supports H.265/HEVC main profile
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Temporal-domain Noise Reduction (3DNR) Supported Prediction Unit (PU) size: 32x32,
Bayer domain Spatial-domain Noise 16x16, 8x8
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Supports MJPEG up to 4K 20 fps encoding Supports BT.656 8-bit output with max.
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Deep Learning Accelerator 75MHz clock rate (single clock edge)
Pure hardwired accelerator Supports BT.656 YUV422 format and
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Supports various video analysis functions like progressive mode
FD/FR, human detection, MD/OD, object Security Engines
tracking, etc. Supports AES/DES/3DES/RSA/SHA-I/SHA-256
Audio Processor
One stereo ADC for microphone input
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Supports secure booting
Real Time Clock (RTC)
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2-pin DMIC input Built-in RTC working with 32.768 KHz crystal
One mono DAC for lineout Alarm interrupt for wakeup
Supports 8K/16K/32KHz/48KHz sampling rate Tick time interrupt (millisecond)
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Compliant with standard, dual and quad SPI Supports max. 11 PWM outputs
Flash memory components Three generic UARTs and one fast UART with
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Compatible with SD spec. 2.0, data bus 1/4 Two SPI masters
bit mode Four I2C Masters
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Supports eMMC 4.3 interface Built-in SAR ADC with 4-channel analog
SDIO 2.0 Interface inputs for different kinds of applications
Compatible with SDIO spec. 2.0, data bus Supports internal temperature sensor
1/4 bit mode Operating Voltage Range
Compatible with SD spec. 2.0, data bus 1/4 Core: Typ. 0.9V
bit mode I/O: 1.8/3.3V
USB Interface DRAM: 1.5V (DDR3) or 1.35V (DDR3L)
One USB 2.0 configurable host or device Power Consumption: TBD
− Host mode supports EHCI specification Package
− Device mode supports up to 8 endpoints QFN with 128 pins, 12.3mm x 12.3mm
Supports suspend/hibernation/wake-up Moisture Sensitivity Level: 3
power saving mode
4. PACKAGE DESCRIPTION
SE_XTAL_OUT
AVDD_XTAL
XTAL_OUT
SR0_IO19
SR0_IO18
SR0_IO17
SR0_IO16
SR0_IO14
SR0_IO10
SR0_IO09
SR0_IO08
SR0_IO07
SR0_IO06
SR0_IO05
SR0_IO04
SR0_IO03
SR0_IO02
SR0_IO01
SR0_IO11
SR0_IO00
VDDP_2A
XTAL_IN
VDDP_0
GPIO15
GPIO14
GPIO13
GPIO12
SPI_CZ
GPIO9
GPIO8
VDD
VDD
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128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
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SPI_CK 1 96 VDD
SPI_DI 2 95 GPIO1
Pin 1
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SPI_DO 3 94 GPIO0
SPI_WPZ 4 93 FUART_RTS
SPI_HLD 5 92 FUART_CTS
SD0_GPIO0 6 91 FUART_TX
SD0_CDZ
SD0_D1
SD0_D0
7
8
9
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89
88
FUART_RX
VDDP_1
VDD
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SD0_CLK 10 87 VDD
XXXXX
XXXXXXXX
SSC338D/SSC338Q
SD0_CMD 11 86 XTAL_OUT_32K
SD0_D3 12 85 XTAL_IN_32K
SD0_D2 13 84 AVDD_RTC
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I2S0_MCLK 14 83 RESET
I2S0_BCK 15 82 NC_0
I2S0_WCK 16 81 NC_1
I2S0_DI 17 80 NC_2
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I2S0_DO 18 79 NC_4
I2C0_SCL 19 78 NC_5
I2C0_SDA 20 77 SAR_GPIO3
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ETH_LED0 21 76 SAR_GPIO2
ETH_LED1 22 75 SAR_GPIO1
VDD 23 74 SAR_GPIO0
AVDD_ETH 24 73 DVDD_NODIE
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ETH_RN 25 72 AVDD_PM_SPI
ETH_RP 26 71 PM_SPI_HLD
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ETH_TN 27 70 PM_SPI_WPZ
ETH_TP 28 69 PM_SPI_DO
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AVDD3P3_USB 29 68 PM_SPI_DI
USB2_DM 30 67 PM_SPI_CK
USB2_DP 31 66 PM_SPI_CZ
AVDD_AUD 32 65 AVDD_NODIE
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
PM_UART_TX
VDDIO_DATA
VDDIO_DATA
AVDD_PLL
VDDIO_MCLK
AUD_VAG
AUD_MICIN0
AUD_MICCM0
AUD_MICIN1
AUD_MICCM1
AUD_LINEOUT_L0
PM_UART_RX1
PM_UART_TX1
PM_GPIO0
PM_GPIO4
PM_GPIO5
PM_GPIO6
PM_GPIO7
PM_GPIO8
PM_GPIO1
PM_GPIO2
PM_GPIO3
AUD_VRM_ADC
VDD
VDD
DVDD_DDR
DVDD_DDR_RX
PM_UART_RX
AVDDIO_DRAM
AVDDIO_DRAM
PM_I2CM_SCL
PM_I2CM_SDA
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PM_UART_TX O Debug UART Transmit Data Output with Pull 51
Up Resistor /
Slave I2C Serial Data
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PM_UART_RX1 I PM_UART1 Receive Data Input with Pull Up 52
Resistor in Power Manage group domain
PM_UART_TX1 O PM_UART1 Transmit Data Output with Pull Up 53
System Interface
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Resistor in Power Manage group domain
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XTAL_IN I 24MHz Crystal Input 117
GPIO Interface
PM GPIO Interface
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Input/Output 2
PM_GPIO3 I/O Power Manage Group General Purpose 59
Input/Output 3
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PM_GPIO4 I/O Power Manage Group General Purpose 60
Input/Output 4
PM_GPIO5 I/O Power Manage Group General Purpose 61
PM_GPIO6 I/O
Input/Output 5 fid
Power Manage Group General Purpose 62
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Input/Output 6
PM_GPIO7 I/O Power Manage Group General Purpose 63
Input/Output 7
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Master I2C Interface
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I2C0_SCL O Non-PM Domain I2C 0 Master I2C Clock 19
I2C0_SDA I/O Non-PM Domain I2C 0 Master I2C Data 20
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PM_I2CM_SCL O PM Domain I2C Master I2C Clock 54
PM_I2CM_SDA
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Signal Positive
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ETH_TN O 10/100M Ethernet Differential Pair of 27
Transmitter Signal Negative
ETH_TP O 10/100M Ethernet Differential Pair of 28
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Transmitter Signal Positive
ETH_LED0 O 10/100M Ethernet LED0 Control 21
ETH_LED1 O
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Driven Active When Linked
10/100M Ethernet LED1 Control
Driven Active When Linked in 100 Base-TX and
22
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Blinking When Transmitting or Receiving Data
SD 2.0 Card Interface
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Test Interface
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NC_2 I/O RTC Test Pin (NC) 80
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NC_4 I/O RTC Test Pin (NC) 79
NC_5 I/O RTC Test Pin (NC) 78
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Power pins
VDD
VDDP_0
Core Power Digital Core Power
3.3V Power
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Digital Input/Output Power for Domain 0
23, 45, 47, 87, 88,
96, 115, 120
127
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VDDP_1 1.8/3.3V Digital Input/Output Power for Domain 1 89
Power
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GND)
DVDD_DDR Core Power Digital Power for DDR TX 44
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D A
128
Pin 1 corner
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Bottom View
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33 64
L Millimeter Inch
32 65
Symbol
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e -- 0.35 -- -- 0.014 --
1 96
128 97
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5. ELECTRICAL CHARACTERISTIC
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Input Current, High IIH -1.0 uA
Input Current, Low IIL 1.0 uA
Input Capacitance 5 pF
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DIGITAL OUTPUTS
Output Voltage, High VOH VDDP-0.1Note V
Output Voltage, Low
SAR ADC Input
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0.1
3.3
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AUDIO OUTPUTS
Line-Out 2.54 Vp-p
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AVDD*_DRAM
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PM IO Power Supply Voltage AVDD_NODIE -0.3 3.63 V
3.3V Analog Power Supply Voltage AVDD* -0.3 3.63 V
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0.9V Analog Power Supply Voltage AVDDL* -0.3 1.26 V
Storage Temperature TSTG -40 150 °C
Note:
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Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a
stress rating only and does not imply functional operation of device. Exposure to absolute maximum ratings for
extended periods may affect device reliability.
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5.3. Recommended Operating Conditions
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VDDP_1
Digital Input/Output Power for Domain 1 1.62 1.8 1.98 V
Digital Input/Output Power for Domain 2A
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during OTP 0 125 °C
programming
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6. THERMAL RESISTANCE
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PCB dimensions: 76.2 x 114.3 (mm x mm)
PCB thickness: 1.6 (mm)
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Part Number Package Thermal Resistance
(°C/W)
PCB Layer fid θJA θJC
7. ORDERING GUIDE
Part Number Temperature Range Package Description Package Option Minimum Order Quantity
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SSC338D/SSC338Q
Part Number
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Lot Number
Operation Code A
Operation Code B
Date Code (YYWW)
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DISCLAIMER
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SIGMASTAR TECHNOLOGY RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE
TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. NO
RESPONSIBILITY IS ASSUMED BY SIGMASTAR TECHNOLOGY ARISING OUT OF THE APPLICATION
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OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY
LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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Electrostatic charges accumulate on both test equipment and human body and can discharge
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without detection. SSC338D/SSC338Q comes with ESD protection circuitry; however, the device
may be permanently damaged when subjected to high energy discharges. The device should be
handled with proper ESD precautions to prevent malfunction and performance degradation.
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