SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE

IPC/ECA J-STD-002C
w/Amendment 1
NOVEMBER 2008
Supersedes J-STD-002C
December 2007

JOINT
INDUSTRY
STANDARD

Solderability Tests for

Component Leads,
Terminations, Lugs,
Terminals and Wires

®
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Notice IPC and ECA Standards and Publications are designed to serve the public interest
through eliminating misunderstandings between manufacturers and purchasers,
facilitating interchangeability and improvement of products, and assisting the
purchaser in selecting and obtaining, with minimum delay, the proper product for
his particular need. Existence of such Standards and Publications shall not in any
respect preclude any member or nonmember of IPC or ECA from manufacturing
or selling products not conforming to such Standards and Publications, nor shall
the existence of such Standards and Publications preclude their voluntary use by
those other than IPC or ECA members, whether the standard is to be used either
domestically or internationally.
Recommended Standards and Publications are adopted by IPC or ECA without
regard to whether their adoption may involve patents on articles, materials,
or processes. By such action, IPC or ECA do not assume any liability to any
patent owner, nor do they assume any obligation whatever to parties adopting
the Recommended Standard or Publication. Users are also wholly responsible for
protecting themselves against all claims of liabilities for patent infringement. The
material in this joint standard was developed by the IPC Component and Wire
Solderability Specification Task Group (5-23b) and the ECA Soldering Technology
Committee (STC).

For Technical Information Contact:

ECA IPC
2500 Wilson Boulevard 3000 Lakeside Drive, Suite 309S
Arlington, VA 22201 Bannockburn, IL 60015-1249
Phone (703) 907-8024 Phone (847) 615-7100
Fax (703) 875-8908 Fax (847) 615-7105

Please use the Standard Improvement Form shown at the end of this
document.

©Copyright 2008. The Electronic Components, Assemblies and Materials Association, Arlington, Virginia, and the IPC, Bannockburn, Illinois,
USA. All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of
these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright
Law of the United States.
 SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE

IPC/ECA J-STD-002C with Amendment 1

®

Solderability Tests
for Component Leads,
Terminations, Lugs,
Terminals and Wires

A joint standard developed by IPC Component and Wire

Solderability Specification Task Group (5-23b) of the Assembly
and Joining Processes Committee (5-20) and the Electronic
Components, Assemblies and Materials Association (ECA)
Soldering Technology Committee (STC)

October 24, 2008

Users of this publication are encouraged to participate in the

Supersedes:
development of future revisions.
J-STD-002C - December 2007
Amendment 1 - October 2008
J-STD-002B - February 2003 Contact:
J-STD-002A - October 1998
J-STD-002 - April 1992 ECA IPC
2500 Wilson Boulevard 3000 Lakeside Drive, Suite 309S
Arlington, VA 22201 Bannockburn, IL 60015-1249
Phone (703) 907-8024 Phone (847) 615-7100
Fax (703) 875-8908 Fax (847) 615-7105
 SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
November 2008 IPC/ECA J-STD-002C with Amendment 1

Acknowledgment
Any document involving a complex technology draws material from a vast number of sources. While the principal members
of the IPC Components and Wire Solderability Specification Task Group (5-23b) of the Assembly and Joining Processes
Committee (5-20) and the Electronic Components, Assemblies and Materials Association (ECA) Soldering Technology
Committee (STC) are shown below, it is not possible to include all of those who assisted in the evolution of this joint indus-
try standard. To each of them, the members and staffs of IPC and ECA Associations extend their gratitude.

IPC Assembly & Joining Component & Wire Solderability ECA Soldering
Processes Committee Specification Task Group Technology Committee
Chair Chair Chair
Leo P. Lambert David D. Hillman Douglas W. Romm
EPTAC Corporation Rockwell Collins Texas Instruments Inc.
Vice Chair Vice Chair
Renee J. Michalkiewicz Dennis Fritz
Trace Laboratories - East MacDermid, Inc.

IPC Component & Wire Solderability Specification Task Group and ECA Soldering Technology Committee

Dr. Donald Abbott, Sensata Laya Chen, Microtek (Changzhou) Shirley He, CEPREI
Technologies Laboratories Steven A. Herrberg, Raytheon
David C. Adams, Rockwell Collins Phillip Chen, L-3 Communications Systems Company
Dale Albright, Winslow Automation Electronic Systems Dr. Christopher Hunt, National
aka Six Sigma Dr. Beverley Christian, Research In Physical Laboratory
Greg Alexander, Ascentech, LLC Motion Limited Prakash Kapadia, Celestica
Francis Anglade, Metronelec Ted Coler, Vishay Dale International Inc.
Gail Auyeung, Celestica International David J. Corbett, Defense Supply Dr. Christian Klein, Robert Bosch
Inc. Center Columbus GmbH
Chris Ball, Valeo Inc. Charles Dal Currier, Ambitech Inc. Connie M. Korth, Kimball
Mary Carter Berrios, Kemet Gordon Davy, Best Manufacturing Electronics Group
Electronics Practices Center of Excellence Richard E. Kraszewski, Kimball
James D. Bielick, IBM Corporation Mary Dinh, Northrop Grumman Electronics Group
Joseph Biernacki, Stackpole Space Systems Division Vijay Kumar, Lockheed Martin
Electronics, Inc. Glenn Dody, Dody Consulting Missile & Fire Control
Christine Blair, STMicroelectronics Richard M. Edgar, Tec-Line Inc. Mark A. Kwoka, Intersil Corporation
Inc. Theodore Edwards, Dynaco Corp. Patrick Kyne, Defense Supply Center
Gerald Leslie Bogert, Bechtel Plant Robert Furrow, Alcatel-Lucent Columbus
Machinery, Inc. Gerald Gagnon, Bose Corporation Harjinder Ladhar, Solectron
Dr. Edwin Bradley, Motorola Inc. Corporation
Dr. Reza Ghaffarian, Jet Propulsion
Jason Bragg, Celestica International Laboratory Leo P. Lambert, EPTAC Corporation
Inc. Andrew Giamis, Andrew Corporation Michael Lauri, IBM
Dr. Peter Bratin, ECI Technology, Jean Gordon, Fairchild Carl Lindquist, SOC America, Inc.
Inc. Semiconductor Laird Macomber, Cornel Dubilier
Michael Cannon, TDK Hue T. Green, Lockheed Martin Electronics
Dennis Cantwell, Printed Circuits Space Systems Company James F. Maguire, Intel Corporation
Inc. Michael Griffith, KOA Speer Karun Malhotra, Murata Electronics
Thomas Carroll, Boeing Aircraft & Electronics, Inc. Jack McCullen, Intel Corporation
Missiles Gerald J. Griswold, Texas Len Metzger, Panasonic Industrial
Dr. Srinivas Chada, Medtronic Instruments, Inc. Company
Microelectronics Center Dr. Carol A. Handwerker, Purdue Renee J. Michalkiewicz, Trace
Calette Chamness, U.S. Army University Laboratories - East
Aviation & Missile Command

iii
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IPC/ECA J-STD-002C with Amendment 1 November 2008

Michael Milbrath, BH Electronics Jim R. Reed, Dell Inc. David Toomey, Vishay Sprague
Dr. Kil-Won Moon, NIST Chris Reynolds, AVX Corporation Sanford
David E. Moore, Defense Supply David Richardson, Vishay William Lee Vroom, Thomson
Center Columbus John H. Rohlfing, Delphi Electronics Consumer Electronics
Terry L. Munson, Foresite, Inc. and Safety Karl F. Wengenroth, Enthone Inc. -
Suzanne F. Nachbor, Honeywell William R. Russell, Raytheon Cookson Electronics
Aerospace Minneapolis Professional Services LLC George Wenger, Andrew Corporation
Graham Naisbitt, Gen3 Systems David F. Scheiner, Kester Robert Wettermann, BEST Inc.
Limited Jeff Seekatz, Raytheon Company Vicka White, Honeywell Inc.
Gary Nicholls, Enthone Inc. - William Sepp, Technic Inc. Keith Whitlaw, Consultant
Cookson Electronics Joseph L. Sherfick, NSWC Crane Maureen Williams, NIST
Benny Nilsson, Ericsson AB Lowell Sherman, Defense Supply Russell T. Winslow, Winslow
Debora L. Obitz, Trace Laboratories - Center Columbus Automation aka Six Sigma
East Bradley Smith, Allegro MicroSystems Jere Wittig, HFK Precision Metal
Gerard A. O’Brien, Solderability Inc. Stamping Corporation
Testing & Solutions, Inc. Paco Solis, Foresite, Inc. Linda Woody, Lockheed Martin
Stephen Olster, Mini-Systems, Inc. Roger Su, L-3 Communications Missile & Fire Control
Michael Paddack, Boeing Company Fujiang Sun, Huawei Technologies Yung-Herng Yau, Enthone Inc. -
Dr. J. Lee Parker, JLP Co., Ltd. Cookson Electronics
Mel Parrish, STI Electronics Keith Sweatman, Nihon Superior Co., Jason Young, Kemet Electronics
Bihari Patel, MacDermid, Inc. Ltd. Corporation
Michael Pavlov, ECI Technology, Inc. Michael Toben, Rohm and Haas Michael W. Yuen, Microsoft
Electronic Materials Corporation
John W. Porter, Multicore Solders
Ltd. Dr. Brian J. Toleno, Henkel Dr. Adam Zbrzezny, AMD
John M. Radman, Trace Corporation
Laboratories - East

iv
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November 2008 IPC/ECA J-STD-002C with Amendment 1

Table of Contents
1 SCOPE ........................................................................ 1 4 TEST PROCEDURES ................................................. 6
1.1 Scope ..................................................................... 1 4.1 Application of Flux ................................................ 6
1.2 Purpose .................................................................. 1 4.2 Visual Acceptance Criteria Tests ............................. 8
1.2.1 Shall and Should .................................................... 1 4.2.1 Test A – Tin/Lead Solder – Solder Bath/Dip and
1.2.2 Document Hierarchy ............................................... 1 Look Test (Leads, Wires, etc.) ................................ 8

1.3 Method Classification ............................................. 1 4.2.1.1 Apparatus ............................................................... 8

1.3.1 Visual Acceptance Criteria Tests ............................. 1 4.2.1.1.1 Solder Pot/Bath ...................................................... 8
1.3.2 Force Measurement Tests ........................................ 1 4.2.1.1.2 Dipping Device ...................................................... 8
1.4 Coating Durability .................................................. 2 4.2.1.2 Preparation ............................................................. 8
1.5 Referee Verification Solder Dip for Tests A, B, C, 4.2.1.3 Procedure ............................................................... 8
A1, B1, C1 ............................................................ 2 4.2.1.4 Evaluation .............................................................. 8
1.6 Limitations ............................................................. 2 4.2.1.4.1 Magnification .......................................................... 8
1.7 Contractual Agreement ............................................ 2 4.2.1.4.2 Accept/Reject Criteria ............................................. 9
4.2.2 Test B – Tin/Lead Solder – Solder Bath/Dip
2 APPLICABLE DOCUMENTS ..................................... 2 and Look Test (Leadless Components) .................. 10
2.1 Industry .................................................................. 2 4.2.2.1 Apparatus ............................................................. 10
2.1.1 IPC ........................................................................ 2 4.2.2.1.1 Solder Pot/Bath .................................................... 10
2.1.2 International Electrotechnical Commission ............... 2 4.2.2.1.2 Vertical Dipping Device ........................................ 10
2.2 Government ............................................................ 2 4.2.2.2 Preparation ........................................................... 10
2.2.1 Federal ................................................................... 2 4.2.2.3 Procedure ............................................................. 10
4.2.2.4 Evaluation ............................................................ 10
3 REQUIREMENTS ........................................................ 2
4.2.2.4.1 Magnification ........................................................ 10
3.1 Terms and Definitions ............................................. 2
4.2.2.4.2 Accept/Reject Criteria ........................................... 10
3.2 Materials ................................................................ 3
4.2.3 Test C – Tin/Lead Solder – Wrapped Wires
3.2.1 Solder .................................................................... 3 Test (Lugs, Tabs, Terminals, Large Stranded
Wires) .................................................................. 11
3.2.2 Flux ....................................................................... 3
4.2.3.1 Apparatus ............................................................. 11
3.2.2.1 Flux Maintenance ................................................... 3
4.2.3.1.1 Solder Pot/Bath .................................................... 11
3.2.3 Flux Removal ......................................................... 3
4.2.3.1.2 Dipping Device .................................................... 11
3.2.4 Standard Copper Wrapping Wires ........................... 3
4.2.3.2 Preparation ........................................................... 11
3.2.5 Water ..................................................................... 4
4.2.3.3 Procedure ............................................................. 11
3.3 Equipment .............................................................. 4
4.2.3.4 Evaluation ............................................................ 12
3.3.1 Steam Conditioning Apparatus ................................ 4
4.2.3.4.1 Magnification ........................................................ 12
3.3.2 Solder Vessel .......................................................... 4
4.2.3.4.2 Accept/Reject Criteria ........................................... 12
3.3.3 Optical Inspection Equipment ................................. 4
4.2.4 Test D – Tin/Lead or Lead-Free Solder – Resis-
3.3.3.1 Referee Magnification ............................................. 5 tance to Dissolution of Metallization Test ............. 13
3.3.4 Dipping Equipment ................................................. 5 4.2.4.1 Apparatus ............................................................. 13
3.3.5 Timing Equipment .................................................. 5 4.2.4.1.1 Solder Pot/Bath .................................................... 13
3.4 Preparation for Testing ............................................ 5 4.2.4.1.2 Dipping Device .................................................... 13
3.4.1 Specimen Preparation and Surface Condition ........... 5
4.2.4.1.3 Attitude (Angle of Immersion) .............................. 13
3.4.1.1 Steam Conditioning Categories ............................... 5 4.2.4.2 Preparation ........................................................... 13
3.4.2 Steam Conditioning ................................................ 5 4.2.4.3 Procedure ............................................................. 13
3.4.2.1 Post Conditioning Drying ....................................... 6 4.2.4.4 Evaluation ............................................................ 13
3.4.2.2 Equipment Maintenance .......................................... 6 4.2.4.4.1 Magnification ........................................................ 13
3.4.3 Surfaces to be Tested .............................................. 6 4.2.4.4.2 Accept/Reject Criteria ........................................... 13
3.5 Solder Bath Requirements ....................................... 6 4.2.5 Test S – Tin/Lead Solder – Surface Mount
3.5.1 Solder Temperatures ............................................... 6 Process Simulation Test ........................................ 14
3.5.2 Solder Contamination Control ................................. 6 4.2.5.1 Apparatus ............................................................. 14

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.2.5.1.1 Stencil/Screen ....................................................... 14 4.2.9.4.1 Magnification ........................................................ 18

4.2.5.1.2 Paste Application Tool .......................................... 14 4.2.9.4.2 Accept/Reject Criteria ........................................... 18
4.2.5.1.3 Test Substrate ....................................................... 14 4.3 Force Measurement Tests ...................................... 19
4.2.5.1.4 Tin/lead Reflow Equipment ................................... 14 4.3.1 Test E – Tin/Lead Solder – Wetting Balance
4.2.5.2 Preparation ........................................................... 14 Solder Pot Test (Leaded Components) ................... 19

4.2.5.3 Procedure ............................................................. 14 4.3.1.1 Apparatus ............................................................. 19

4.2.5.4 Evaluation ............................................................ 14 4.3.1.1.1 Dipping Device .................................................... 19
4.2.5.4.1 Magnification ........................................................ 14 4.3.1.2 Preparation ........................................................... 19
4.2.5.4.2 Accept/Reject Criteria ........................................... 14 4.3.1.3 Procedure ............................................................. 19
4.2.6 Test A1 – Lead-free Solder – Solder Bath/Dip 4.3.1.4 Evaluation ............................................................ 19
and Look Test (Leads, Wires, etc.) ........................ 15 4.3.1.4.1 Magnification ........................................................ 19
4.2.6.1 Apparatus ............................................................. 15 4.3.1.4.2 Accept/Reject Criteria ........................................... 19
4.2.6.1.1 Solder Pot/Bath .................................................... 15 4.3.1.4.3 Gauge Repeatability and Reproducibility
4.2.6.1.2 Dipping Device .................................................... 15 (GR&R) Protocol ................................................. 19

4.2.6.2 Preparation ........................................................... 15 4.3.2 Test F – Tin/Lead Solder – Wetting Balance

Solder Pot Test (Leadless Components) ................. 22
4.2.6.3 Procedure ............................................................. 15
4.3.2.1 Apparatus ............................................................. 22
4.2.6.4 Evaluation ............................................................ 15
4.3.2.1.1 Dipping Device .................................................... 22
4.2.6.4.1 Magnification ........................................................ 15
4.3.2.2 Preparation ........................................................... 22
4.2.6.4.2 Accept/Reject Criteria ........................................... 15
4.3.2.3 Procedure ............................................................. 22
4.2.7 Test B1 – Lead-free Solder – Solder Bath/Dip
and Look Test (Leadless Components) .................. 16 4.3.2.4 Evaluation ............................................................ 22
4.2.7.1 Apparatus ............................................................. 16 4.3.2.4.1 Magnification ........................................................ 22
4.2.7.1.1 Solder Pot/Bath .................................................... 16 4.3.2.4.2 Accept/Reject Criteria ........................................... 22

4.2.7.1.2 Vertical Dipping Device ........................................ 16 4.3.2.4.3 Gauge Repeatability and Reproducibility
(GR&R) Protocol ................................................. 22
4.2.7.2 Preparation ........................................................... 16
4.3.3 Test G – Tin/Lead Solder – Wetting Balance
4.2.7.3 Procedure ............................................................. 16 Globule Test ......................................................... 23
4.2.7.4 Evaluation ............................................................ 16 4.3.3.1 Apparatus ............................................................. 23
4.2.7.4.1 Magnification ........................................................ 16 4.3.3.1.1 Dipping Device .................................................... 23
4.2.7.4.2 Accept/Reject Criteria ........................................... 16 4.3.3.2 Materials .............................................................. 23
4.2.8 Test C1 – Lead-free Solder – Wrapped Wires 4.3.3.2.1 Flux ..................................................................... 23
Test (Lugs, Tabs, Terminals, Large Stranded 4.3.3.2.2 Solder .................................................................. 23
Wires) .................................................................. 17
4.3.3.2.3 Test Specimen ...................................................... 23
4.2.8.1 Apparatus ............................................................. 17
4.3.3.3 Procedure ............................................................. 23
4.2.8.1.1 Solder Pot/Bath .................................................... 17
4.3.3.3.1 Temperature of the Solder .................................... 23
4.2.8.1.2 Dipping Device .................................................... 17
4.3.3.3.2 Fluxing ................................................................ 23
4.2.8.2 Preparation ........................................................... 17 4.3.3.3.3 Dipping Angle, Immersion Depth, and
4.2.8.3 Procedure ............................................................. 17 Immersion Rates ................................................... 23
4.2.8.4 Evaluation ............................................................ 17 4.3.3.3.4 Preheat ................................................................. 23
4.2.8.4.1 Magnification ........................................................ 17 4.3.3.4 Evaluation ............................................................ 23
4.2.8.4.2 Accept/Reject Criteria ........................................... 17 4.3.3.4.1 Magnification ........................................................ 23
4.2.9 Test S1 – Lead-free Solder – Surface Mount 4.3.3.4.2 Suggested Criteria ................................................ 23
Process Simulation Test ........................................ 18
4.3.4 Test E1 – Lead-free Solder – Wetting Balance
4.2.9.1 Apparatus ............................................................. 18 Solder Pot Test (Leaded Components) ................... 26
4.2.9.1.1 Stencil/Screen ....................................................... 18 4.3.4.1 Apparatus ............................................................. 26
4.2.9.1.2 Paste Application Tool .......................................... 18 4.3.4.1.1 Dipping Device .................................................... 26
4.2.9.1.3 Test Substrate ....................................................... 18 4.3.4.2 Preparation ........................................................... 26
4.2.9.1.4 Lead-Free Reflow Equipment ................................ 18 4.3.4.3 Procedure ............................................................. 26
4.2.9.2 Preparation ........................................................... 18 4.3.4.4 Evaluation ............................................................ 26
4.2.9.3 Procedure ............................................................. 18 4.3.4.4.1 Magnification ........................................................ 26
4.2.9.4 Evaluation ............................................................ 18 4.3.4.4.2 Accept/Reject Criteria ........................................... 26

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November 2008 IPC/ECA J-STD-002C with Amendment 1

4.3.4.4.3 Gauge Repeatability and Reproducibility Figure 4–3 Solder Dipping Depth for Through-
(GR&R) Protocol ................................................. 26 Hole Components ............................................. 9
4.3.5 Test F1 – Lead-free Solder – Wetting Balance Figure 4–4 Leadless Component Immersion Depth ........... 10
Solder Pot Test (Leadless Components) ................. 27 Figure 4–5 Illustration of Acceptable Solderable
4.3.5.1 Apparatus ............................................................. 27 Terminal ......................................................... 11
4.3.5.1.1 Dipping Device .................................................... 27 Figure 4–6 Illustration of Unsolderable Terminal .............. 11
4.3.5.2 Preparation ........................................................... 27 Figure 4–7 Illustration of Acceptable Solderable
4.3.5.3 Procedure ............................................................. 27 Stranded Wire ................................................ 11

4.3.5.4 Evaluation ............................................................ 27 Figure 4–8 Illustration of Partially Solderable Stranded

Wire Showing Incomplete Fillet ...................... 12
4.3.5.4.1 Magnification ........................................................ 27
Figure 4–9 Wetting Balance Apparatus ............................. 19
4.3.5.4.2 Accept/Reject Criteria ........................................... 27
Figure 4–10 Set A Wetting Curve ...................................... 20
4.3.5.4.3 Gauge Repeatability and Reproducibility
(GR&R) Protocol ................................................. 27 Figure 4–11 Set B Wetting Curve ...................................... 21
4.3.6 Test G1 – Lead-free Solder – Wetting Figure 4–12 Component and Dipping Angle (Directly
Balance Globule Test ............................................ 28 from IEC 60068-2-69) .................................... 25

4.3.6.1 Apparatus ............................................................. 28 Figure A-1 “J” Leaded Components ................................. 30

4.3.6.1.1 Dipping Device .................................................... 28 Figure A-2 Passive Components ....................................... 31
4.3.6.2 Materials .............................................................. 28 Figure A-3 Gull Wing Components .................................. 32
4.3.6.2.1 Flux ..................................................................... 28 Figure A-4 Leadless Chip Carrier ..................................... 33
4.3.6.2.2 Solder .................................................................. 28 Figure A-5 “L” Leaded Components ................................ 34
4.3.6.2.3 Test Specimen ...................................................... 28 Figure A-6 Through-Hole Components – Flat Pin ............. 35
4.3.6.3 Procedure ............................................................. 28 Figure A-7 Through-Hole Components – Round Pin ......... 36
4.3.6.3.1 Temperature of the Solder .................................... 28 Figure A-8 Exposed Pad Package ..................................... 37
4.3.6.3.2 Fluxing ................................................................ 28 Figure A-9 Bottom-Only Termination Component ............. 37
4.3.6.3.3 Dipping Angle, Immersion Depth, and Figure A-10 Area Array Component Critical Surface .......... 38
Immersion Rates ................................................... 28 Figure B-1 Defect Size Aid .............................................. 39
4.3.6.3.4 Preheat ................................................................. 28 Figure B-2 Types of Solderability Defects ........................ 40
4.3.6.4 Evaluation ............................................................ 28 Figure B-3 Aids in Evaluation of 5% Allowable Area
4.3.6.4.1 Magnification ........................................................ 28 of Pin Holes .................................................. 41

4.3.6.4.2 Suggested Criteria ................................................ 28 Figure B-4 Aid in Evaluation of 5% Allowable Area
of Pin Holes .................................................. 42
5 NOTES ....................................................................... 29 Figure B-5 Solderability Coverage Guide ......................... 43
5.1 Use of Activated Flux .......................................... 29 Figure C-1 Lead Periphery and Volume for a 132
5.2 Massive Components ............................................ 29 I/O PQFP ....................................................... 45
5.3 Sampling Plans ..................................................... 29 Tables
5.4 Safety Notes ......................................................... 29 Table 1–1 Steam Conditioning Categories for
5.5 Correction for Buoyancy ....................................... 29 Component Leads and Terminations .................. 2
5.6 Accelerated Steam Conditioning Limitations .......... 29 Table 3–1 Flux Compositions ........................................... 3
Table 3–2 Steam Temperature Requirements ...................... 4
Appendix A ...................................................................... 30
Table 3–3 Solderability Test Selection Component Type .... 5
Appendix B ...................................................................... 39
Table 3–4 Maximum Limits of Solder Bath Contaminant .. 6
Appendix C ...................................................................... 44
Appendix D ...................................................................... 46 Table 4–1 Stencil Thickness Requirements ...................... 14
Appendix E ...................................................................... 47 Table 4–2 Reflow Parameter Requirements ...................... 14
Appendix F ...................................................................... 48 Table 4–3 Stencil Thickness Requirements ...................... 18
Appendix G ..................................................................... 50 Table 4–4 Lead-free Reflow Parameter Requirements ...... 18
Appendix H ...................................................................... 53 Table 4–5 Wetting Balance Parameter and Suggested
Evaluation Criteria ......................................... 20
Figures
Table 4–6 Dipping Angle and Immersion Depth for
Figure 3–1 Example Reticle ............................................... 4 Components (Directly from IEC 60068-2-69) .. 24
Figure 4–1 Dipping Schematic ........................................... 8 Table 4–7 Wetting Parameters and Suggested
Figure 4–2 Solder Dipping Angle for Surface Mount Evaluation Criteria ......................................... 25
Leaded Components ......................................... 9 Table 3–1 Flux Compositions ......................................... 48

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November 2008 IPC/ECA J-STD-002C with Amendment 1

Solderability Tests for Component Leads,

Terminations, Lugs, Terminals and Wires

1 SCOPE 1.3.1 Visual Acceptance Criteria Tests

Test A – Solder Bath/Dip and Look Test (Leaded

1.1 Scope This standard prescribes test methods, defect Components and Stranded Wires) Tin/Lead Solder (para-
definitions, acceptance criteria, and illustrations for assess- graph 4.2.1)
ing the solderability of electronic component leads,
terminations, solid wires, stranded wires, lugs, and tabs. Test B – Solder Bath/Dip and Look Test (Leadless
This standard also includes a test method for the Resis- Components) Tin/Lead Solder (paragraph 4.2.2)
tance to Dissolution/Dewetting of Metallization. This Test C – Wrapped Wires Test (Lugs, Tabs, Hooked Leads,
standard is intended for use by both vendor and user. and Turrets) Tin/Lead Solder (paragraph 4.2.3)
Test D – Resistance to Dissolution/Dewetting of Metalli-
1.2 Purpose Solderability evaluations are made to verify
zation Test Tin/Lead Solder and Lead-free Solder (para-
that the solderability of component leads and terminations
graph 4.2.4)
meets the requirements established in this standard and to
determine that storage has had no adverse effect on the Test S – Surface Mount Process Simulation Test Tin/Lead
ability to solder components to an interconnecting sub- Solder (paragraph 4.2.5)
strate. Determination of solderability can be made at the
Test A1 – Solder Bath/Dip and Look Test (Leaded
time of manufacture, at receipt of the components by the
Components and Stranded Wires) Lead-free Solder (para-
user, or just before assembly and soldering.
graph 4.2.6)
The resistance to dissolution of metallization determina-
Test B1 – Solder Bath/Dip and Look Test (Leadless
tion is made to verify that metallized terminations will
Components) Lead-free Solder (paragraph 4.2.7)
remain intact throughout the assembly soldering pro-
cesses. Test C1 – Wrapped Wires Test (Lugs, Tabs, Hooked
Leads, and Turrets) Lead-free Solder (paragraph 4.2.8)
1.2.1 Shall and Should The word “shall” is used in the Test S1 – Surface Mount Process Simulation Test Lead-
text of this document wherever there is a requirement for free Solder (paragraph 4.2.9)
materials, preparation, process control or acceptance of a
soldered connection or a test method. The word “should”
1.3.2 Force Measurement Tests
reflects recommendations and is used to reflect general
industry practices and procedures for guidance only. Test E – Wetting Balance Solder Pot Test (Leaded
Components) Tin/Lead Solder (paragraph 4.3.1)
1.2.2 Document Hierarchy In the event of conflict, the Test F – Wetting Balance Solder Pot Test (Leadless
following decreasing order of precedence applies: Components) Tin/Lead Solder (paragraph 4.3.2)
1. Procurement as agreed between user and supplier. Test G – Wetting Balance Globule Test Tin/Lead Solder
2. Master drawing or master assembly drawing reflecting (paragraph 4.3.3)
the user’s detailed requirements. Test E1 – Wetting Balance Solder Pot Test (Leaded
3. When invoked by the customer or per contractual Components) Lead-free Solder (paragraph 4.3.4)
agreement, this document, J-STD-002.
Test F1 – Wetting Balance Solder Pot Test (Leadless
4. Other documents to extent specified by the customer. Components) Lead-free Solder (paragraph 4.3.5)
Test G1 – Wetting Balance Globule Test Lead-free Solder
1.3 Method Classification This standard describes
(paragraph 4.3.6)
methods by which component leads or terminations may
be evaluated for solderability. Test A, Test B, Test C, Test These methods (1.3.2) are included for evaluation pur-
D and Test S for tin/lead solder processes and Test A1, poses only. Data collected should be submitted to the IPC
Test B1, Test C1, Test D and Test S1 for lead-free solder Wetting Balance Task Group for correlation and analysis.
processes, unless otherwise agreed upon between vendor Tests E, F, G, E1, F1 and G1 shall not be used for
and user, are to be used for each application as a default. acceptance/rejection without user and vendor agreement.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

1.4 Coating Durability The following are guidelines, not 1.7 Contractual Agreement In cases where the stated
specification requirements, for determining the needed test parameters are inappropriate or insufficient, alternative
level of steam conditioning category assurance (see Table parameters may be agreed upon between vendor and user.
1–1). The Coating Durability guidelines describe three
broad usage sectors and are not intended to encompass all 2 APPLICABLE DOCUMENTS
possible product use scenarios. The user and vendor need
to agree on the coating durability requirements. Coating The following documents of the issue currently in effect
Durability Category 3 is the default condition for tin- form a part of this standard to the extent specified herein.
based finishes.
2.1 Industry
Category 1 — Minimum Coating Durability Intended for
surfaces that will be soldered within a short period of time
(e.g., up to six months) from the time of testing and are 2.1.1 IPC1
likely to experience a minimum of thermal exposures
IPC-T-50 Terms and Definitions
before soldering (see 5.6).
Category 2 — Typical Coating Durability Intended for IPC-TR-464 Accelerated Aging for Solderability Evalua-
surfaces that will be soldered after an extended time from tions and Addendum
the time of testing and which may see limited thermal
exposures before soldering (see 5.6). J-STD-004 Requirements For Soldering Fluxes
Category 3 – Enhanced Coating Durability (default for
J-STD-005 Requirements for Soldering Pastes
tin-based finishes) Intended for surfaces whose solderabil-
ity may become degraded from storage of longer than six
J-STD-006 Requirements for Electronic Grade Solder
months or from multiple thermal exposures (see 5.6).
Alloys and Fluxed and Non-Fluxed Solid Solder for
Table 1–1 Steam Conditioning Categories Electronic Soldering Applications
for Component Leads and Terminations
Category 1 Category 2 Category 3 IPC-TM-650 Test Methods Manual
No Steam 1 Hour ± 5 min. 8 hours ± 15 min.
Conditioning Steam Steam 2.1.2 International Electrotechnical Commission2
Requirements Conditioning Conditioning

1.5 Referee Verification Solder Dip for Tests A, B, C,

IEC 60068–2-69 Environmental testing – Part 2–69: Tests
A1, B1, C1 When the dipped portion of the termination
– Test Te: Solderability testing of electronic components
exhibits anomalies such as surface roughness, or dross, or for surface mounting devices (SMD) by the wetting
anomalies that may have been induced by improper solder balance method
dipping, a referee verification solder dip of the suspect
anomaly may be necessary. Upon reinspection, if the 2.2 Government
suspect anomaly has been removed, the anomaly will have
been verified as a non-rejectable cosmetic surface defect. 2.2.1 Federal
If the anomaly persists, regardless of area, it shall be
classified a rejectable solderability defect. This procedure (CID) A-A-59551 Wires, Electrical, Copper (Uninsulated)
may only be used on one component per lot. Continuous
need of Referee Verification Solder Dip procedure is an 3 REQUIREMENTS
indication of either improper testing procedure, examina-
tion interpretation, or of poor component quality.
3.1 Terms and Definitions The definition of terms shall
be in accordance with IPC-T-50. Terms repeated from
1.6 Limitations This standard shall not be construed as
IPC-T-50 are indicated by an asterisk (*).
a production procedure for the pre-tinning of leads and
terminations. Solderability testing of components is con- Dewetting* A condition that results when molten solder
sidered a destructive test and the tested component should coats a surface and then recedes to leave irregularly-
not be used for functional electrical evaluation. Compo- shaped mounds of solder that are separated by areas that
nents after such solderability testing, shall only be used are covered with a thin film of solder and with the basis
with agreement between the user and supplier (AABUS). metal not exposed.

1. www.ipc.org
2. www.iec.ch

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November 2008 IPC/ECA J-STD-002C with Amendment 1

Dissolution of Component Metallization (Leaching) The The user’s specific production solder paste product may
loss or removal of metallization from an area on the basis be used for Test S1 upon agreement between user and
or substrate material after immersion in molten solder. supplier.
Equilibrium Wetting The degree of wetting in which the
3.2.2 Flux The flux for tin/lead solderability tests shall
forces of wetting are in equilibrium with the forces of
be a standard activated rosin flux #1 having a composition
gravity.
of 25% ± 0.5% by weight of colophony and 0.15% ±
Note: This wetting is visible when the wetting balance 0.01% by weight diethylammonium hydrochloride (CAS
curve flattens out and approaches zero slope (see Figure 660-68-4), in 74.85% ± 0.5% by weight of isopropyl
4–10). alcohol (see Table 3–1).
Nonwetting, Solder* The partial adherence of molten The flux for lead-free solderability tests shall be standard
solder to a surface that it has contacted while leaving activated rosin flux #2 having a composition of 25% ±
some basis metal exposed. 0.5% by weight of colophony and 0.39% ± 0.01% by
weight diethylammonium hydrochloride (CAS 660-68-4),
Pinhole* An imperfection in the form of a small hole that in 74.61% ± 0.5% by weight of isopropyl alcohol (see
penetrates through a layer of material. Table 3–1).
Solderability* The ability of a metal to be wetted by
Table 3–1 Flux Compositions
molten solder.
Composition by
Solder Connection Pinhole* A small hole that penetrates Weight Percent
from the surface of a solder connection to a void of Constituent Flux #1 Flux #2
indeterminate size within the solder connection. Colophony 25 ± 0.5 25 ± 0.5
Diethylammonium Hydrochlo- 0.15 ± 0.01 0.39 ± 0.01
Wetting, Solder* The formation of a relatively uniform,
ride (CAS 660-68-4)
smooth, unbroken, and adherent film of solder to a basis
Isopropyl Alcohol (IPA) (CAS Balance Balance
metal. 67-63-0)
Weight of Chlorine as % of 0.2 0.5
3.2 Materials All chemicals shall be of commercial Solids
grade or better. Fresh solvents shall be used as often as is
necessary to preclude contamination. Appendix E: Informative Annex contains a listing of
industry test flux product sources.

3.2.1 Solder For tin/lead testing, the solder composition The flux to be used in preparing the standard copper
shall be Sn60Pb40 or Sn63Pb37 per J-STD-006. The wrapping wires (see 3.2.4) for tests C and C1 shall
composition of the solder, including contamination levels, conform to J-STD-004, Type ROL1. This flux shall be
shall be maintained during testing per 3.5.2. restricted to the preparation of the standard wrapping
wires and shall not be used in performing the solderabil-
The composition of the tin/lead solder paste to be used in ity tests for any of the methods herein.
Test S shall be Sn60Pb40 or Sn63Pb37 for tin/lead per
J-STD-005, mesh size of -325/+500, flux type ROL1. The 3.2.2.1 Flux Maintenance Standard activated rosin
solder paste shall meet the storage and shelf life require- fluxes #1 and #2 shall be covered when not in use and
ments of the manufacturer’s specification. The user’s discarded after eight hours or the flux shall be maintained
specific production solder paste product may be used for to a specific gravity of 0.843 ± 0.005 at 25 ± 2°C [77 ±
Test S upon agreement between user and supplier. 3.6°F] and discarded after one week of use.
For lead-free testing, the solder composition shall be
3.2.3 Flux Removal Material used for cleaning flux from
Sn96.5Ag3.0Cu0.5 (SAC305) per J-STD-006. Other lead-
leads and terminations before solderability evaluations
free solder alloys may be used upon agreement between
shall be capable of removing visible flux residues (see
user and vendor.
5.4). The cleaned surface shall exhibit no mechanical
The composition of the lead-free solder paste to be used damage.
in Test S1 shall be Sn96.5Ag3.0Cu0.5 (SAC305) per
J-STD-005, mesh size of -325/+500, flux type to be 3.2.4 Standard Copper Wrapping Wires The standard
agreed upon between user and vendor. The solder paste wrapping wires specified in 4.2.3.2 shall be fabricated
shall meet the storage and shelf life requirements of the from type S, soft or drawn and annealed, uncoated in
manufacturer’s specification. Other lead-free solder pastes accordance with (CID) A-A-59551 and prepared per the
may be used upon agreement between user and vendor. following process.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

The nominal diameter of the wrapping wires shall be 0.6 Table 3–2 Steam Temperature Requirements
mm [0.023 in]. The preparation of the wrapping wires Altitude Average Local Steam Tempera-
shall be as follows: Boiling Point °C ture Limits °C
0–305 m 100 93 ± 3
a. Straighten and cut wires into convenient lengths (50
305–610 m 99 92 ± 3
mm [1.9 in] minimum).
610–914 m 98 91 ± 3
b. Degrease by immersion in an appropriate cleaner (e.g.,
914–1219 m 97 90 ± 3
isopropyl alcohol) for two minutes.
1219–1524 m 96 89 ± 3
c. Clean in fluoroboric acid 10% HBF4 (by volume), in
1524–1829 m 95 88 ± 3
water, for five minutes at room temperature with
agitation. Use caution in handling. solder vessel shall be of adequate dimensions to accom-
d. Rinse acid off as follows: modate the specimens and contain sufficient solder to
1. Two nonheated water rinses (deionized or distilled). maintain the solder temperature during testing, and to
prevent exceeding the contamination levels (see 3.5.1 and
2. Two isopropyl alcohol rinses.
3.5.2). A minimum of 750 grams of solder should be used.
3. Air dry. Note: Precautions should be taken to avoid solder vessel
e. Immerse in flux J-STD-004, Type ROL1. damage due to metal erosion when using Lead-free solder
f. Dip in molten solder for five seconds at 245 ± 5°C alloys.
[473 ± 9°F] for tin/lead solder alloy. Dip in molten
solder for five seconds at 255 ± 5°C [491± 9°F] for 3.3.3 Optical Inspection Equipment All test methods
lead-free solder alloy. requiring visual inspection shall use microscope(s)
capable of 10X magnification (see individual test meth-
To remove or dissolve the residual flux, wash or rinse per ods), equipped with reticles, or equivalent, for measure-
3.2.3. ment. An example of a reticle is shown in Figure 3–1.
Standard wrapping wires will be stored in a clean, Shadowless lighting shall be suitable for proper inspec-
covered container if not used immediately. The usable life tion.
of the standard wrapping wires shall not exceed 30 days
after coating.
20 15 10 5 0
3.2.5 Water The water to be used for steam condition-
ing purposes shall be distilled or deionized. 0

3.3 Equipment The following equipment applies to 5

more than one of the solderability test methods shown in
this standard. Equipment that is specific to any of the test 10
methods is described in the specific Clause 4 paragraphs
detailing the method.
15
3.3.1 Steam Conditioning Apparatus The steam condi-
20
tioning chamber shall be constructed of non-corrodible
materials such as borosilicate glass, quartz glass, stainless
25
steel or PTFE. The specimen holder shall be non-reactive
to prevent galvanic corrosion. The container should be
insulated. The steam temperature at the conditioning level 30
shall be maintained per the requirements of Table 3–2.
35
A safe means to prevent excessive pressure and a means
of maintaining adequate water level shall be provided. 40
Neither shall cause the vapor to cool below the specified
temperature. Condensate shall drip freely back to the 45
water. Care should be taken to minimize contact between
the condensate and the specimens.
50
IPC-002c-3-1
3.3.2 Solder Vessel A thermostatically controlled static
solder vessel shall be used for all applicable tests. The Figure 3–1 Example Reticle

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November 2008 IPC/ECA J-STD-002C with Amendment 1

3.3.3.1 Referee Magnification Referee magnification Special preparation of leads or terminations, such as
shall be 30X. For fine pitch leaded parts (0.5 mm [0.020 bending or reorientation before test, shall be specified in
in] pitch or less) the referee magnification shall be 70X. the applicable procurement document. If the insulation on
Referee conditions shall only be used to accept a product stranded wire must be removed, it shall be done in a
that has been rejected at the inspection magnification. manner so as not to loosen or damage the individual
strands of the wires.
3.3.4 Dipping Equipment Solder dipping devices shall
be mechanical/electro-mechanical and capable of control- 3.4.1.1 Steam Conditioning Categories The user shall
ling the immersion/emersion rates, dwell time and immer- specify to the vendor, as part of the purchase agreement,
sion depth as specified in 4.2.1 to 4.2.9. Sample holding the required coating durability (see 1.4). Accelerated
fixtures shall be designed to avoid trapping any excess steam conditioning shall be performed per Table 1–1.
flux in the fixture and to minimize heat loss and assure Solderability testing shall be performed per the appropri-
reproducibility of test results. ate test in Table 3–3.

3.3.5 Timing Equipment Timing equipment shall be

3.4.2 Steam Conditioning Before the application of flux
automated, where applicable, and accurate to the limits of
and subsequent solderability testing, all specimens desig-
the test method.
nated Category 2 and 3 Coating Durability shall be
conditioned in the device and under the conditions
3.4 Preparation for Testing
described in 3.3.1 at a steam temperature which is 7°C
[12.6°F] below the local boiling point (see Table 3–2).
3.4.1 Specimen Preparation and Surface Condition All
component leads or terminations shall be tested in the All components to be tested shall be placed into the steam
condition that they would normally be in at the time of conditioning chamber such that no specimens have their
assembly soldering. The specimen surfaces to be tested leads or terminations touching, and that condensation
shall be handled in such a manner as to not cause forming will drain away from the lead or terminations to
contamination, nor shall the leads or terminations being the package body, e.g., ‘‘Dead Bug’’ for dual-inline
tested be wiped, cleaned, scraped or abraded. packages.
Table 3–3 Solderability Test Selection Component Type
Surface Mount
Through-
Wrapped Hole Gull
Test Method Wires Mount Leadless J-Lead Wing
Visual Acceptance Criteria Tests
A – Dip & Look Test (Leaded Components) Tin/Lead Solder
X X X
A1 – Dip & Look Test (Leaded Components) Lead-free Solder
B – Dip & Look Test (Leadless Components) Tin/Lead Solder
X
B1 – Dip & Look Test (Leadless Components) Lead-free Solder
C – Wrapped Wires Test Tin/Lead Solder
X
C1 – Wrapped Wires Test Lead-free Solder
D – Resistance to Dissolution of Metallization Test (Tin/Lead
X X X
and Lead-free Solder)
S – Surface Mount Process Simulation Test Tin/Lead Solder
X X X
S1 – Surface Mount Process Simulation Test Lead-free Solder
Force Measurement Tests
E – Wetting Balance Solder Pot Test (Leaded Components)
Tin/Lead Solder
X X X
E1 – Wetting Balance Solder Pot Test (Leaded Components)
Lead-free solder
F – Wetting Balance Solder Pot Test (Leadless Components)
Tin/Lead Solder
X
F1 – Wetting Balance Solder Pot Test (Leadless Components)
Lead-free solder
G – Wetting Balance Globule Test Tin/Lead Solder
X X X
G1 – Wetting Balance Globule Test Lead-free solder

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Specimens shall not be stacked in a manner which Table 3–4 Maximum Limits of Solder Bath Contaminant
restricts their surface exposure to steam nor shall they be Maximum Con-
placed closer than 10 mm [0.39 in] from the outer Maximum Con- tamination Weight
taminant Weight Percentage Limit
chamber walls, and shall not touch the inner container Percentage Limit Lead-free
walls. In addition, no portion of the specimen shall be Contaminant Sn Pb Alloys (1,2) Alloys (3,4)
less than 40 mm [1.57 in] above the water level. Copper 0.300 1.000
Gold 0.200 0.200
3.4.2.1 Post Conditioning Drying After steam condi- Cadmium 0.005 0.005
tioning is complete, specimens shall be immediately Zinc 0.005 0.005
removed from the chamber and ambient air dried. Solder- Aluminum 0.006 0.006
ability testing shall be performed within 72 hours of
Antimony 0.500 0.500
removal from the chamber.
Iron 0.020 0.020
Arsenic 0.030 0.030
3.4.2.2 Equipment Maintenance Before use, the steam
Bismuth 0.250 0.250
conditioning apparatus shall have been cleaned with
Silver 0.100 4.000
deionized or distilled water or hydrogen peroxide to
remove any accumulated residues. This cleaning should be Nickel 0.010 0.010
accomplished within five working days of the condition- Lead N/A 0.100
ing period. Notes:
1. The tin content of the solder shall be maintained within ± 1% of the
nominal alloy being used. Tin content shall be tested at the same
frequency as testing for copper/gold contamination. The balance of the
3.4.3 Surfaces to be Tested The critical areas of leads
bath shall be lead and/or the items listed above.
or terminations intended to be soldered shall be evaluated 2. The total of copper, gold, cadmium, zinc, and aluminum contaminants
for solderability per the test method (see appendix A). shall not exceed 0.4%. Not applicable to lead-free alloys.
3. The tin content of the solder shall be maintained within ± 1% of the
This shall include both the bottom termination and nominal alloy being used. Tin content shall be tested at the same
castellation on chip carriers and on all surfaces intended frequency as testing for copper/silver concentration. The balance of the
to be soldered on discrete devices. Through-hole leads bath shall be the items listed above.
4. Maximum contamination limits are applicable for Sn96.5Ag3.0Cu0.5
that are tested by Method A shall have a 25 mm [0.98 in] (SAC305) per J-STD-006. Other lead-free solder alloy contamination
portion, or the whole lead if less than 25 mm [0.98 in], limits may be used upon agreement between user and vendor.
evaluated for solderability (see 4.2.1.4). Test methods
NOTE: An operating day consists of any eight-hour
shall be selected per Table 3–3.
period, or any portion thereof, during which the solder is
Surfaces to be tested by Method D shall be completely liquefied and used.
immersed in molten solder during dipping (see 4.2.4).
If contamination exceeds the limits specified in Table 3–4,
then the solder shall be changed and the intervals between
3.5 Solder Bath Requirements analysis shall be shortened. A sampling plan shall be
developed, implemented, and documented, demonstrating
3.5.1 Solder Temperatures Tin/lead solderability testing solder contamination limit process control.
shall be done at a solder temperature of 245 ± 5°C [473 ±
9°F]. Lead-free solderability testing shall be done at a 4 TEST PROCEDURES
solder temperature of 255 ± 5°C [491 ± 9°F]. A
temperature of 260 ± 5°C [500 ± 9°F] shall be used for 4.1 Application of Flux Flux per 3.2.2 shall be used.
Test Method D for both tin/lead or lead-free solder alloys. Leads and terminations shall have flux applied uniformly
and to cover the surfaces to be tested. The flux shall be at
room temperature. This section, 4.1, shall apply to all of
3.5.2 Solder Contamination Control The solder in sol-
the following tests: A, B, C, D, E, F, G, A1, B1, C1, E1,
der baths used for solderability testing shall be chemically
F1 and G1 but shall not apply to both tests S and S1,
or spectrographically analyzed or replaced each 30 oper-
which require the use of solder paste and not a separate
ating days. The levels of contamination and Sn content
flux.
must be within those shown in Table 3–4. The intervals
between analysis may be lengthened if the test results Axial, radial, and multiple leaded components intended
indicate that the contamination limits are not being for through-hole mounting shall have their leads
approached. The composition of the lead-free solder, immersed into the flux approximately perpendicular to the
including contamination levels, shall be maintained during flux surface. Leaded or leadless components intended for
testing with the silver and copper element levels adjusted surface mounting shall have their leads or terminations
for alloy requirements. immersed at an angle between 20° and 45° to the flux

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November 2008 IPC/ECA J-STD-002C with Amendment 1

surface. The surfaces to be tested shall be immersed in may be (but are not required to be) blotted from the
the flux for 5 to 10 seconds. Any droplets of flux that may surface. The specimens being tested shall be allowed to
form shall be removed by blotting, taking care not to dry for 5 to 20 seconds before solder immersion, but shall
remove the flux coating from the surfaces to be tested. not be allowed to dwell above solder-pot (no preheat)
For small passive surface mount devices, the flux droplets before actual dipping action.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.2 Visual Acceptance Criteria Tests b) 255 ± 5°C [491 ± 9°F] for lead-free solder testing.

4.2.1 Test A – Tin/Lead Solder – Solder Bath/Dip and

4.2.1.2 Preparation Specimen preparation shall be in
Look Test (Leads, Wires, etc.) This test is for solder
accordance with 3.4.
bath/dip and look testing of leaded components, solid
wires, and stranded wires greater than 0.254 mm [0.01 in]
minimum. 4.2.1.3 Procedure

a. Dross and burned flux shall be skimmed from the

4.2.1.1 Apparatus
surface of the molten solder immediately before dip-
4.2.1.1.1 Solder Pot/Bath A solder vessel that meets the ping.
requirements of 3.3.2 shall be used. The solder shall meet b. The fluxed specimen shall be immersed in the molten
the requirements of 3.2.1. Solder bath temperatures and solder to within 1.27 mm [0.050 in] of the component
solder contamination control shall be in accordance with body or to the seating plane (whichever is further from
3.5.1 and 3.5.2. the component body) for through-hole leaded compo-
4.2.1.1.2 Dipping Device A mechanical or electrome- nents (see Figure 4–3).
chanical dipping device similar to the device shown in c. Immerse and withdraw at 25 ± 6 mm [0.984 ± 0.24 in]
Figure 4–1 shall be used unless otherwise agreed to per second and dwell for 5 +0/-0.5 seconds (see 5.2).
between user and vendor. The rate of immersion, dwell d. After withdrawal, the solder shall be allowed to
time, and rate of withdrawal shall be within the test limits solidify by air cooling while the specimen is main-
defined in 4.2.1.3. Perpendicularity of through-hole com- tained in the test attitude.
ponent leads to solder surface shall be maintained. Leaded
surface mount components shall be immersed at between e. Before examination, all leads shall have all visible flux
20° and 45° (or 90° if agreed upon) to the solder surface residues removed per 3.2.3.
(see Figure 4–2). This angle shall remain consistent for
any given component type. Wobble, vibration and other 4.2.1.4 Evaluation
extraneous movements shall be minimized.
4.2.1.4.1 Magnification Parts shall be examined at 10X
*NOTE: The solder temperature in the Solder Station as using the equipment specified in 3.3.3. For fine pitch
seen in Figure 4-1 shall be: leaded parts (0.5 mm [0.020 in] pitch or less) the
a) 245 ± 5°C [473 ± 9°F] for tin/lead solder testing, or inspection magnification shall be 30X.

Stop
Start

Termination
to be tested

Dwell Dwell

Flux Solder
Station Station*

IPC-002c-4-1

Figure 4–1 Dipping Schematic

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November 2008 IPC/ECA J-STD-002C with Amendment 1

20-45° 90°
Molten Solder Surface
IPC-002c-4-2

Figure 4–2 Solder Dipping Angle for Surface Mount Leaded Components

1.27 mm 1.27 mm
[0.050 in] [0.050 in]
DIP
Molten Solder Surface

IPC-002c-4-3

Figure 4–3 Solder Dipping Depth for Through-Hole Components

4.2.1.4.2 Accept/Reject Criteria All leads shall exhibit surfaces. Anomalies other than dewetting, nonwetting, and
a continuous solder coating free from defects for a pin holes are not cause for rejection (see Appendices A
minimum of 95% of the critical area of any individual and B). Exposed terminal metal is allowable on surface
lead. For exposed pad packages the exposed pad surfaces mount components at the toe end and on the vertical
shall exhibit a continuous solder coating free from defects surfaces that are either unplated or sheared during
for a minimum of 80% of the critical area of those component fabrication.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.2.2 Test B – Tin/Lead Solder – Solder Bath/Dip and b. The fluxed specimen shall be immersed in the molten
Look Test (Leadless Components) This test is for solder solder 0.10 mm [0.0039 in] minimum (see Figure 4–4).
bath/dip and look testing of leadless components. Immerse and withdraw at 25 ± 6 mm [0.984 ± 0.24 in]
per second and dwell for 5 +0/-0.5 seconds. Massive
4.2.2.1 Apparatus components may require a longer molten solder dwell
4.2.2.1.1 Solder Pot/Bath A solder vessel that meets the time (see 5.2).
requirements of 3.3.2 shall be used. The solder shall meet c. After withdrawal, the solder shall be allowed to
the requirements of 3.2.1. Solder bath temperatures and solidify by air cooling while the specimen is main-
solder contamination control shall be in accordance with tained in the test attitude.
3.5.1 and 3.5.2. d. Before examination, all terminations shall have all
visible flux residues removed per 3.2.3.
4.2.2.1.2 Vertical Dipping Device A mechanical or
electro-mechanical dipping device similar to the device 4.2.2.4 Evaluation
shown in Figure 4–1 shall be used unless otherwise 4.2.2.4.1 Magnification Parts shall be examined at 10X
agreed to between user and vendor. The rate of immer- using the equipment specified in 3.3.3. For fine pitch
sion, dwell time, and rate of withdrawal shall be within termination parts (0.5 mm [0.020 in] pitch or less) the
the test limits defined in 4.2.2.3. Surface mount leadless inspection magnification shall be 30X.
components shall be immersed at an angle to the solder 4.2.2.4.2 Accept/Reject Criteria All terminations shall
surface of 20°- 45° and 90° for discrete chip components exhibit a continuous solder coating free from defects for a
and exposed pad packages. Other immersion angles may minimum of 95% of the critical area of any individual
be used if agreed upon between vendor and user. termination. For exposed pad packages, the exposed pad
surfaces shall exhibit a continuous solder coating free
4.2.2.2 Preparation Specimen preparation shall be in
from defects for a minimum of 80% of the critical area of
accordance with 3.4.
those surfaces. Anomalies other than dewetting, nonwet-
ting, and pin holes are not cause for rejection (see
4.2.2.3 Procedure
Appendices A and B). Exposed terminal metal is allow-
a. Dross and burned flux shall be skimmed from the able on surface mount components at the toe end and on
surface of the molten solder immediately before dip- the vertical surfaces that are either unplated or sheared
ping. during component fabrication.

Leadless Chip Carriers Discrete Chip Components

20° - 45°
>
_ 0.10 mm Molten Solder Surface
[>
_ 0.00394 in]

IPC-002c-4-4

Figure 4–4 Leadless Component Immersion Depth

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November 2008 IPC/ECA J-STD-002C with Amendment 1

4.2.3 Test C – Tin/Lead Solder – Wrapped Wires Test

(Lugs, Tabs, Terminals, Large Stranded Wires) This test
is for wrapped wires testing of lugs, tabs, terminals,
stranded wires greater than 1.016 mm [0.040 in] diameter,
and solid wires greater than 1.143 mm [0.045 in]
diameter.

4.2.3.1 Apparatus

4.2.3.1.1 Solder Pot/Bath A solder vessel that meets the

requirements of 3.3.2 shall be used. The solder shall meet
the requirements of 3.2.1. Solder bath temperatures and
solder contamination control shall be in accordance with
3.5.1 and 3.5.2.
IPC-002c-4-5
4.2.3.1.2 Dipping Device A mechanical or electrome-
Figure 4–5 Illustration of Acceptable Solderable Terminal
chanical dipping device similar to the device shown in
Figure 4–1 shall be used unless otherwise agreed to
between user and vendor. The rate of immersion, dwell
time, and rate of withdrawal shall be within the test limits
defined in 4.2.3.3. Wobble, vibration, and other extraneous
movements shall be minimized.

4.2.3.2 Preparation Specimen preparation shall be in

accordance with 3.4.
a. For application of standard solderable wires for lugs,
tabs, terminals, stranded wires greater than 1.016 mm
[0.040 in] diameter, and solid wires greater than 1.143
mm [0.045 in] diameter all specimens shall have a
wrap of 1.5 turns of the standard wires around the
IPC-002c-4-6
portion of the specimen to be tested.
b. The standard wrapping wires as described in 3.2.4, Figure 4–6 Illustration of Unsolderable Terminal
shall be wrapped in such a manner so that it will not
move during the solder dip. Examples of this wrap are
shown in Figures 4–5 through 4–8.
c. Special instructions concerning the portion of the
specimens to be wrapped shall be specified in the
individual specification, if necessary.
d. For lugs and tabs designed to accept wires smaller than
0.6 mm [0.024 in] diameter, the standard copper
wrapping wires specified in 3.2.4 shall be the same
size for which the lugs and tabs are designed.

4.2.3.3 Procedure

a. The flux shall be at ambient (room) temperature and IPC-002c-4-7

per 3.2.2.
Figure 4–7 Illustration of Acceptable Solderable Stranded
b. Terminations shall be immersed in the flux to the Wire
minimum depth necessary to cover the surface to be
tested.
c. The surface to be tested shall be immersed for 5 to 10 e. Immerse and withdraw at a rate of 25 ± 6 mm [0.984
seconds and allowed to drain for 10 to 60 seconds. ± 0.24 in] per second and dwell for 7 ± 0.50 seconds.
d. The dross and burned flux shall be skimmed from the f. The part shall be attached to a dipping device and the
surface of the molten solder just before immersing the flux-covered terminations immersed once in the molten
terminations in the solder. solder to the same depth specified in 4.2.3.3b.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.2.3.4 Evaluation

4.2.3.4.1 Magnification Parts shall be examined at 10X

using the equipment specified in 3.3.3.

4.2.3.4.2 Accept/Reject Criteria The criteria for accept-

able solderability of lugs, tabs, terminals, stranded wires
greater than 1.016 mm [0.040 in] diameter, solid wire
greater than 1.143 mm [0.045 in] diameter are:

a. A minimum of 95% of the total length of fillet between

wrap wires and termination shall be tangent to the
surface of the termination and be free of anomalies
such as pinholes.
IPC-002c-4-8
b. A ragged or interrupted tangency line indicates a
Figure 4–8 Illustration of Partially Solderable Stranded
Wire Showing Incomplete Fillet
defect.

g. After the dipping process, the part shall be allowed to In case of dispute, the percent of fillet-length with defects
cool in air. shall be determined by their actual measurement. See
h. Before examination, all terminations shall have all Figure B-4 in Appendix B that serves as an aid in the
visible flux residue removed per 3.2.3. evaluation of the 5% allowable defects.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

4.2.4 Test D – Tin/Lead or Lead-Free Solder – Resis- 4.2.4.2 Preparation Specimen preparation shall be in
tance to Dissolution of Metallization Test This test is to accordance with 3.4.
reveal a susceptibility to loss of solderability due to
either: 4.2.4.3 Procedure

a. Dissolution of metallization over unsolderable base a. Dross and burned flux shall be skimmed from the
material (as indicated by loss of wetting), or surface of the molten solder immediately before dip-
ping.
b. Accumulation of impurities from the basis metal (as
indicated by dewetting). b. The flux-covered component metallization shall be
immersed only once in the molten solder to a minimum
4.2.4.1 Apparatus depth to completely cover the termination being tested.
c. The angle of immersion shall be between 20° and 45°.
4.2.4.1.1 Solder Pot/Bath A solder vessel that meets the
requirements of 3.3.2 shall be used. The solder shall meet d. Immerse and withdraw at a rate of 25 ± 6 mm [0.984
the requirements of 3.2.1. Solder bath temperatures and ± 0.24 in] per second and dwell for 30 +/- 5 seconds.
solder contamination control shall be in accordance with
4.2.4.4 Evaluation
3.5.1 and 3.5.2.
4.2.4.4.1 Magnification Parts shall be examined at 10X
4.2.4.1.2 Dipping Device A mechanical or electrome- using the equipment specified in 3.3.3. For fine pitch
chanical dipping device similar to the device shown in components (0.5 mm [0.020 in] pitch or less) the
Figure 4–1 shall be used unless otherwise agreed to inspection magnification shall be 30X.
between user and vendor. The rate of immersion, dwell
4.2.4.4.2 Accept/Reject Criteria The criteria for accept-
time, and rate of withdrawal shall be within the test limits
defined in 4.2.4.3. able resistance to leaching/dewetting shall be no more
than 5% of the solderable metallization exhibiting exposed
4.2.4.1.3 Attitude (Angle of Immersion) All components underlying, non-wettable base metal or metallization
shall be dipped using a vertical motion to ensure layers or portions of the ceramic substrate after exposure
complete immersion of the surfaces to be soldered. to molten solder.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.2.5 Test S – Tin/Lead Solder – Surface Mount Pro- 4.2.5.2 Preparation Specimen preparation shall be in
cess Simulation Test This test simulates actual surface accordance with 3.4.
mount component performance in a reflow process.
4.2.5.3 Procedure

4.2.5.1 Apparatus a. Place solder paste (per 3.2.1) onto stencil/screen and
print the terminal pattern onto the test substrate by
4.2.5.1.1 Stencil/Screen A stencil or screen with pad
wiping paste over the stencil/screen in one smooth
geometry openings that is appropriate for the terminals
motion using rubber or metal squeegee.
being tested shall be used. Unless otherwise agreed upon
between vendor and user, the nominal stencil thickness b. Remove the stencil/screen carefully to avoid smearing
shall be per Table 4–1. the paste print.
c. Verify a paste print equivalent in geometry to the
Table 4–1 Stencil Thickness Requirements terminal of the device to be tested.
Nominal Stencil
d. Place the terminals of the component being tested on
Thickness Component Lead Pitch
the solder paste print.
0.10 mm [0.00394 in] <0.508 mm [<0.020 in]
0.15 mm [0.00591 in] 0.508–0.635 mm [0.020–0.025 in]
e. Verify component placement by appropriate magnifica-
tion.
0.20 mm [0.00787 in] >0.635 mm [>0.025 in]
f. Place test substrate on applicable reflow equipment and
4.2.5.1.2 Paste Application Tool A rubber or metal
conduct reflow process.
squeegee device shall be used to distribute paste across g. After reflow, carefully remove substrate with compo-
stencil/screen. nent(s) and allow to cool to room temperature.
h. Remove component(s) from substrate. Component
4.2.5.1.3 Test Substrate A ceramic substrate 0.635 mm
leads may adhere slightly to substrate due to flux
[0.025 in] nominal thickness shall be used for testing.
residue.
Other non-wettable substrates may be used if agreed upon
between vendor and user. i. Before examination, all leads shall have all visible flux
residues removed per 3.2.3. Care should be exercised
4.2.5.1.4 Tin/lead Reflow Equipment An IR/convection in flux residue removal process to not damage leads.
reflow oven, vapor phase reflow system, or oven capable
of reaching the reflow temperature of the tin/lead paste 4.2.5.4 Evaluation
shall be used. Unless otherwise agreed upon between 4.2.5.4.1 Magnification Parts shall be examined at 10X
vendor and user the reflow parameters shall be per Table using the equipment specified in 3.3.3. For fine pitch
4–2. leaded/termination parts (0.5 mm [0.020 in] pitch or less)
the inspection magnification shall be 30X.
Table 4–2 Reflow Parameter Requirements
4.2.5.4.2 Accept/Reject Criteria All leads shall exhibit
Temperature Time a continuous solder coating free from defects for a
Vapor Phase 215–219°C 30–60 seconds minimum of 95% of the critical area of any individual
Reflow [419–426°F] dwell at reflow
lead. For exposed pad packages the exposed pad surfaces
150–170°C 50–70 seconds shall exhibit a continuous solder coating free from defects
IR/Convection [302–338°F] Preheat
Reflow
for a minimum of 80% of the critical area of those
215–230°C 50–70 seconds
[419–446°F] Reflow surfaces. Anomalies other than dewetting, nonwetting, and
pin holes are not cause for rejection (see Appendices A
215–230°C 2–5 minutes (until
Oven and B). Exposed terminal metal is allowable on surface
[419–446°F] reflow is assured)
Note: Table 4–2 reflow parameter values are for solderability testing mount components at the toe end and on the vertical
purposes and are not related to moisture sensitivity level reflow test surfaces that are either unplated or sheared during
parameters.
component fabrication.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

4.2.6 Test A1 – Lead-free Solder – Solder Bath/Dip and b. The fluxed specimen shall be immersed in the molten
Look Test (Leads, Wires, etc.) This test is for solder solder to within 1.27 mm [0.050 in] of the component
bath/dip and look testing of leaded components, solid body or to the seating plane (whichever is further from
wires, and stranded wires greater than 0.254 mm [0.01 in] the component body) for through-hole leaded compo-
minimum. nents (see Figure 4–3).
c. Immerse and withdraw at 25 ± 6 mm [0.984 ± 0.24 in]
4.2.6.1 Apparatus
per second and dwell for 5 +0/-0.5 seconds (see 5.2).
4.2.6.1.1 Solder Pot/Bath A solder vessel that meets the
d. After withdrawal, the solder shall be allowed to
requirements of 3.3.2 shall be used. The solder shall meet
solidify by air cooling while the specimen is main-
the requirements of 3.2.1. Solder bath temperatures and
tained in the test attitude.
solder contamination control shall be in accordance with
3.5.1 and 3.5.2. e. Before examination, all leads shall have all visible flux
residues removed per 3.2.3.
4.2.6.1.2 Dipping Device A mechanical or electrome-
chanical dipping device similar to the device shown in
4.2.6.4 Evaluation
Figure 4–1 shall be used unless otherwise agreed to
between user and vendor. The rate of immersion, dwell 4.2.6.4.1 Magnification Parts shall be examined at 10X
time, and rate of withdrawal shall be within the test limits using the equipment specified in 3.3.3. For fine pitch
defined in 4.2.6.3. Perpendicularity of through-hole com- leaded parts (0.5 mm [0.020 in] pitch or less) the
ponent leads to solder surface shall be maintained. Leaded inspection magnification shall be 30X.
surface mount components shall be immersed at between
20° and 45° (or 90° if agreed upon) to the solder surface 4.2.6.4.2 Accept/Reject Criteria All leads shall exhibit
(see Figure 4–2). This angle shall remain consistent for a continuous solder coating free from defects for a
any given component type. Wobble, vibration and other minimum of 95% of the critical area of any individual
extraneous movements shall be minimized. lead. For exposed pad packages the exposed pad surfaces
shall exhibit a continuous solder coating free from defects
4.2.6.2 Preparation Specimen preparation shall be in for a minimum of 80% of the critical area of those
accordance with 3.4. surfaces. Anomalies other than dewetting, nonwetting, and
pin holes are not cause for rejection (see Appendices A
4.2.6.3 Procedure
and B). Exposed terminal metal is allowable on surface
a. Dross and burned flux shall be skimmed from the mount components at the toe end and on the vertical
surface of the molten solder immediately before dip- surfaces that are either unplated or sheared during
ping. component fabrication.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.2.7 Test B1 – Lead-free Solder – Solder Bath/Dip and b. The fluxed specimen shall be immersed in the molten
Look Test (Leadless Components) This test is for solder solder 0.10 mm [0.0039 in] minimum (see Figure 4–4).
bath/dip and look testing of leadless components. Immerse and withdraw at 25 ± 6 mm [0.984 ± 0.24 in]
per second and dwell for 5 +0/-0.5 seconds. Massive
4.2.7.1 Apparatus components may require a longer molten solder dwell
time (see 5.2).
4.2.7.1.1 Solder Pot/Bath A solder vessel that meets the
requirements of 3.3.2 shall be used. The solder shall meet c. After withdrawal, the solder shall be allowed to
the requirements of 3.2.1. Solder bath temperatures and solidify by air cooling while the specimen is main-
solder contamination control shall be in accordance with tained in the test attitude.
3.5.1 and 3.5.2. d. Before examination, all terminations shall have all
visible flux residues removed per 3.2.3.
4.2.7.1.2 Vertical Dipping Device A mechanical or
electro-mechanical dipping device similar to the device 4.2.7.4 Evaluation
shown in Figure 4–1 shall be used unless otherwise
4.2.7.4.1 Magnification Parts shall be examined at 10X
agreed to between user and vendor. The rate of immer-
using the equipment specified in 3.3.3. For fine pitch
sion, dwell time, and rate of withdrawal shall be within
termination parts (0.5 mm [0.020 in] pitch or less) the
the test limits defined in 4.2.7.3. Surface mount leadless
inspection magnification shall be 30X.
components shall be immersed at an angle to the solder
surface of 20°- 45° and 90° for discrete chip components 4.2.7.4.2 Accept/Reject Criteria All terminations shall
and exposed pad packages. Other immersion angles may exhibit a continuous solder coating free from defects for a
be used if agreed upon between vendor and user. minimum of 95% of the critical area of any individual
termination. For exposed pad packages, the exposed pad
4.2.7.2 Preparation Specimen preparation shall be in
surfaces shall exhibit a continuous solder coating free
accordance with 3.4. from defects for a minimum of 80% of the critical area of
those surfaces. Anomalies other than dewetting, nonwet-
ting, and pin holes are not cause for rejection (see
4.2.7.3 Procedure
Appendices A and B). Exposed terminal metal is allow-
a. Dross and burned flux shall be skimmed from the able on surface mount components at the toe end an on
surface of the molten solder immediately before dip- the vertical surfaces that are either unplated or sheared
ping. during component fabrication.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

4.2.8 Test C1 – Lead-free Solder – Wrapped Wires Test wrapping wires specified in 3.2.4 shall be the same
(Lugs, Tabs, Terminals, Large Stranded Wires) This test size for which the lugs and tabs are designed.
is for wrapped wires testing of lugs, tabs, terminals,
4.2.8.3 Procedure
stranded wires greater than 1.016 mm [0.040 in] diameter,
and solid wires greater than 1.143 mm [0.045 in] a. The flux shall be at ambient (room) temperature per
3.2.2.
diameter.
b. Terminations shall be immersed in the flux to the
minimum depth necessary to cover the surface to be
4.2.8.1 Apparatus
tested.
4.2.8.1.1 Solder Pot/Bath A solder vessel that meets the c. The surface to be tested shall be immersed for 5 to 10
requirements of 3.3.2 shall be used. The solder shall meet seconds and allowed to drain for 10 to 60 seconds.
the requirements of 3.2.1. Solder bath temperatures and d. The dross and burned flux shall be skimmed from the
solder contamination control shall be in accordance with surface of the molten solder just before immersing the
3.5.1 and 3.5.2. terminations in the solder.
e. Immerse and withdraw at a rate of 25 ± 6 mm [0.984
4.2.8.1.2 Dipping Device A mechanical or electrome- ± 0.24 in] per second and dwell for 7 ± 0.50 seconds.
chanical dipping device similar to the device shown in
f. The part shall be attached to a dipping device and the
Figure 4–1 shall be used unless otherwise agreed to
flux-covered terminations immersed once in the molten
between user and vendor. The rate of immersion, dwell
solder to the same depth specified in 4.2.8.3b.
time, and rate of withdrawal shall be within the test limits
defined in 4.2.8.3. Wobble, vibration, and other extraneous g. After the dipping process, the part shall be allowed to
movements shall be minimized. cool in air.
h. Before examination, all terminations shall have all
visible flux residue removed per 3.2.3.
4.2.8.2 Preparation Specimen preparation shall be in
accordance with 3.4. 4.2.8.4 Evaluation
4.2.8.4.1 Magnification Parts shall be examined at 10X
a. For application of standard solderable wires for lugs, using the equipment specified in 3.3.3.
tabs, terminals, stranded wires greater than 1.016 mm
4.2.8.4.2 Accept/Reject Criteria The criteria for accept-
[0.040 in] diameter, and solid wires greater than 1.143
able solderability of lugs, tabs, terminals, stranded wires
mm [0.045 in] diameter, all specimens shall have a
greater than 1.016 mm [0.040 in] diameter, solid wires
wrap of 1.5 turns of the standard wires around the
greater than 1.143 mm [0.045 in] diameter are:
portion of the specimen to be tested.
a. A minimum of 95% of the total length of fillet between
b. The standard wrapping wires as described in 3.2.4 wrap wires and termination shall be tangent to the
shall be wrapped in such a manner so that it will not surface of the termination and be free of anomalies
move during the solder dip. Examples of this wrap are such as pinholes.
shown in Figures 4–5 through 4–8.
b. A ragged or interrupted tangency line indicates a
c. Special instructions concerning the portion of the defect.
specimens to be wrapped shall be specified in the In case of dispute, the percent of fillet-length with defects
individual specification, if necessary. shall be determined by their actual measurement. See
d. For lugs and tabs designed to accept wires smaller than Figure B-4 in Appendix B that serves as an aid in the
0.6 mm [0.024 in] diameter, the standard copper evaluation of the 5% allowable defects.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.2.9 Test S1 – Lead-free Solder – Surface Mount 4.2.9.2 Preparation Specimen preparation shall be in
Process Simulation Test This test simulates actual sur- accordance with 3.4.
face mount component performance in a reflow process.
4.2.9.3 Procedure

4.2.9.1 Apparatus a. Place solder paste (see 3.2.1) onto stencil/screen and
print the terminal pattern onto the test substrate by
4.2.9.1.1 Stencil/Screen A stencil or screen with pad
wiping paste over the stencil/screen in one smooth
geometry openings that is appropriate for the terminals
motion using rubber or metal squeegee.
being tested shall be used. Unless otherwise agreed upon
between vendor and user the nominal stencil thickness b. Remove the stencil/screen carefully to avoid smearing
shall be per Table 4–3. the paste print.
c. Verify a paste print equivalent in geometry to the
Table 4–3 Stencil Thickness Requirements terminal of the device to be tested.
Nominal Stencil Component Lead Pitch
d. Place the terminals of the component being tested on
Thickness
the solder paste print.
0.10 mm [0.00394 in] <0.508 mm [<0.020 in]
0.15 mm [0.00591 in] 0.508–0.635 mm [0.020–0.025 in]
e. Verify component placement by appropriate magnifica-
tion.
0.20 mm [0.00787 in] >0.635 mm [>0.025 in]
f. Place test substrate on applicable reflow equipment and
4.2.9.1.2 Paste Application Tool A rubber or metal
conduct reflow process.
squeegee device shall be used to distribute paste across g. After reflow, carefully remove substrate with compo-
stencil/screen. nent(s) and allow to cool to room temperature.
h. Remove component(s) from substrate. Component
4.2.9.1.3 Test Substrate A ceramic substrate 0.635 mm
leads may adhere slightly to substrate due to flux
[0.025 in] nominal thickness shall be used for testing.
residue.
Other non-wettable substrates may be used if agreed upon
between vendor and user. i. Before examination, all leads shall have all visible flux
residues removed per 3.2.3. Care should be exercised
4.2.9.1.4 Lead-Free Reflow Equipment An IR/convec- in flux residue removal process to not damage leads.
tion reflow oven, vapor phase reflow system, or oven
capable of reaching the reflow temperature of the lead- 4.2.9.4 Evaluation
free paste shall be used. Unless otherwise agreed upon 4.2.9.4.1 Magnification Parts shall be examined at 10X
between vendor and user the reflow parameters shall be using the equipment specified in 3.3.3. For fine pitch
per Table 4–4. leaded/termination parts (0.5 mm [0.020 in] pitch or less)
the inspection magnification shall be 30X.
Table 4–4 Lead-free Reflow Parameter Requirements
4.2.9.4.2 Accept/Reject Criteria All leads shall exhibit
Temperature Time a continuous solder coating free from defects for a
Vapor Phase 217–240°C 45–90 seconds minimum of 95% of the critical area of any individual
Reflow [423–464°F] dwell at reflow
lead. For exposed pad packages, the exposed pad surfaces
150–180°C 60–120 seconds shall exhibit a continuous solder coating free from defects
IR/Convection [302–356°F] Preheat
Reflow
for a minimum of 80% of the critical area of those
230–250°C 30–60 seconds
[446–482°F] Reflow surfaces. Anomalies other than dewetting, nonwetting, and
pin holes are not cause for rejection (see Appendices A
230–250°C 2–5 minutes (until
Oven and B). Exposed terminal metal is allowable on surface
[446–482°F] reflow is assured)
Note: Table 4–4 reflow parameter values are for solderability testing mount components at the toe end and on the vertical
purposes and are not related to moisture sensitivity level reflow test surfaces that are either unplated or sheared during
parameters.
component fabrication.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

4.3 Force Measurement Tests c. Dross and burned flux shall be skimmed from the
surface of the molten solder immediately before dip-
4.3.1 Test E – Tin/Lead Solder – Wetting Balance ping.
Solder Pot Test (Leaded Components) This test is for
d. The flux covered termination shall be immersed only
wetting balance testing of leaded components. once in the molten solder to a depth of 0.10 mm
[0.0039 in].
4.3.1.1 Apparatus A solder meniscus force measuring
e. The angle of immersion shall be 20° – 45° (see Figure
device (wetting balance) which includes a temperature
4–2).
controlled solder pot containing solder per 3.2.1 and
maintained per 3.5.1 and 3.5.2 shall be used. The f. Immerse and withdraw at 1 mm – 5 mm [0.04 - 0.20
equipment shall have a means of recording force as a in] per second and dwell for 5 +0/-0.5 seconds.
function of time, such as a chart recorder, data logger, or Massive components may require a longer solder dwell
computer (see Figure 4–9). time (see 5.2).

4.3.1.1.1 Dipping Device A mechanical or electrome- 4.3.1.4 Evaluation

chanical dipping device incorporated in the wetting 4.3.1.4.1 Magnification Parts shall be examined at 10X
balance shall be used. The device shall be preset to using the equipment specified in 3.3.3. For fine pitch
produce an immersion and emersion rate as specified in leaded/termination parts (0.5 mm [0.020 in] pitch or less)
4.3.1.3. The specimen dwell time is controlled to the time the inspection magnification shall be 30X.
specified in 4.3.1.3. A device to sense contact of the 4.3.1.4.2 Accept/Reject Criteria Suggested criteria for
lead(s) with the molten solder bath shall also be part of solderability evaluation for Test E are listed in Table 4–5.
the fixture or instrument. Figures 4–10 and 4–11 illustrate the suggested criteria of
Table 4–5. In addition, the area of the test sample with
4.3.1.2 Preparation Specimen preparation shall be in fresh solder adhesion shall be greater than the area that
accordance with 3.4. was immersed in the solder bath (i.e., the component shall
exhibit positive wicking beyond its immersion depth).
4.3.1.3 Procedure
4.3.1.4.3 Gauge Repeatability and Reproducibility (GR&R)
a. Flux per 3.2.2 shall be used. The flux shall be at Protocol Appendix H contains a suggested GR&R
ambient (room) temperature. protocol that may be used by the supplier and user to
b. Leads and terminations shall have flux applied uni- ensure that the respective wetting balance equipment are
formly and to cover the surfaces to be tested. correctly calibrated.

LVDT Signal Chart

(Transducer) Conditioner Recorder

Clamp
Relative
Motion Test
Specimen

Solder
Bath Heater

Controls
IPC-002c-4-9

Figure 4–9 Wetting Balance Apparatus

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Table 4–5 Wetting Balance Parameter and Suggested Evaluation Criteria

Suggested Criteria1
Parameter Description Set A Set B
T0 Time to buoyancy corrected zero ≤1 second ≤2 seconds
F2 Wetting force at two seconds from 50% of maximum theoretical Positive value at or before
start of test wetting force at or before two two seconds
seconds2
F5 Wetting force at five seconds from No less than 90% of the F2 No less than 90% of the F2
start of test Value Value
AA Integrated value of area of the wetting Area calculated using sample > zero (0)
curve from start of test buoyancy and 50% maximum
theoretical force3
1. This suggested criteria has been established as a two-tier evaluation format with Set A being more stringent. Components meeting Set A suggested criteria
are applicable to a larger soldering process window than components meeting Set B suggested criteria. It should be recognized that components meeting
Set B suggested criteria may be completely acceptable to a larger process window but the user must determine which criteria set best integrates into their
process.
2. See Appendix C for the method of calculating the maximum theoretical force.
3. See Appendix D for the method of calculation. (It is suggested that this method of calculation be programmed into the software used for control of the wetting
balance test equipment.)

Equalibrium Wetting Force

Force / mm AA
( N / mm)

F2 F5

T ime (sec.)

Buoyancy Corrected Zero Axis

T0
IPC-002c-4-10

Figure 4–10 Set A Wetting Curve

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November 2008 IPC/ECA J-STD-002C with Amendment 1

Force / mm
( N / mm)
AA

F2

F5
0 Time (sec.)

T0

Buoyancy Corrected Zero Axis

IPC-002c-4-11

Figure 4–11 Set B Wetting Curve

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.3.2 Test F – Tin/Lead Solder – Wetting Balance d. After application of the flux and post dip dwell, the
Solder Pot Test (Leadless Components) This test is for specimen shall be mounted on the test equipment.
wetting balance testing of leadless components. e. Dross and burned flux shall be skimmed from the
surface of the molten solder immediately before dip-
4.3.2.1 Apparatus A solder meniscus force measuring
ping.
device (wetting balance) which includes a temperature
controlled solder pot containing solder per 3.2.1 and f. The flux covered termination shall be immersed only
maintained per 3.5.1 and 3.5.2 shall be used. The once in the molten solder to a depth of 0.10 mm
equipment shall have a means of recording force as a [0.0039 in] minimum.
function of time, such as a chart recorder, data logger, or g. The angle of immersion shall be per Figure 4–4.
computer (see Figure 4–9). h. A full curve shall be recorded using the equipment
4.3.2.1.1 Dipping Device A mechanical or electrome-
specified in 4.3.2.1.
chanical dipping device incorporated in the wetting
4.3.2.4 Evaluation
balance shall be used. The device shall be preset to
produce an immersion and emersion rate as specified in 4.3.2.4.1 Magnification Parts shall be examined at 10X
4.3.2.3. The specimen dwell time is controlled to the time using the equipment specified in 3.3.3. For fine pitch
specified in 4.3.2.3. termination parts (0.5 mm [0.020 in] pitch or less) the
inspection magnification shall be 30X.
4.3.2.2 Preparation Specimen preparation shall be in
4.3.2.4.2 Accept/Reject Criteria Suggested criteria for
accordance with 3.4.
solderability evaluation for Test F are listed in Table 4–5.
Figures 4–10 and 4–11 illustrate the suggested criteria of
4.3.2.3 Procedure
Table 4–5. In addition, the area of the test sample with
a. Flux per 3.2.2 shall be used and shall be at ambient fresh solder adhesion shall be greater than the area that
(room) temperature. was immersed in the solder bath (i.e., the component shall
b. Leads and terminations shall have flux applied uni- exhibit positive wicking beyond its immersion depth).
formly and to cover the surfaces to be tested. 4.3.2.4.3 Gauge Repeatability and Reproducibility (GR&R)
c. Immerse and withdraw at 1 mm – 5 mm [0.04 in – Protocol Appendix H contains a suggested GR&R
0.20 in] per second and dwell for 5 +0/-0.5 seconds. protocol that may be used by the supplier and user to
Massive components may require a longer solder dwell ensure that the respective wetting balance equipment are
time (see 5.2). correctly calibrated.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

4.3.3 Test G – Tin/Lead Solder – Wetting Balance 4.3.3.3.2 Fluxing A very small amount of flux is care-
Globule Test This test is for wetting balance globule fully applied to the surface or lead to be tested and the
testing of components. solder globule using a clean cotton tip or bud. No excess
4.3.3.1 Apparatus A solder meniscus force measuring flux shall be ready to drip off the fluxed part or the excess
device (wetting balance) which includes a temperature flux must be drained off by carefully touching the lowest
controlled vertical, cylindrical iron shaft shrunk fit into an point on the surface to be tested with a piece of clean
aluminum housing on which is placed a specific sized chemical lab filter paper. For this testing, ideally a small
piece of solder. Examples are: a 200 mg piece of solder amount of flux should be kept in a small container that is
for a 4 mm diameter globule block, a 100 mg piece of only opened to immerse the cotton tip to wet it with flux.
solder for a 3.2 mm diameter globule block, a 25 mg The cotton tips should be thrown away and replaced with
piece of solder for a 2 mm globule block or a 5 mg piece fresh ones every 5 to 10 tests, with all tests done in the
for a 1 mm globule block. The molten solder globule same testing interval. If testing is interrupted for more
should ideally be replaced after each solderability test, but than a few minutes, then a new tip should be used.
may be re-used for very small components that do not
remove more than 1% of the solder volume per solder test 4.3.3.3.3 Dipping Angle, Immersion Depth, and Immer-
for up to 5 tests. The equipment shall have a means of sion Rates The appropriate clip shall be chosen to hold
recording force as a function of time, such as a chart the part as specified in Table 4–6 and illustrated in Figure
recorder, data logger or computer. 4–12. Without contaminating the surfaces to be tested, the
specimen is mounted in the appropriate clip or other
4.3.3.1.1 Dipping Device A mechanical or electrome-
chanical dipping device incorporated in the wetting device supplied by the solderability tester manufacturer
balance shall be used. The device shall be preset to and carefully attached to the machine so as to not damage
produce an immersion and emersion rate as specified in the transducer or dislodge the component from its orien-
4.3.3.3.3. The specimen dwell time is controlled to the tation in the clip or other holder. The distance between the
time specified in 4.3.3.3.3. solderable surface of the sample and the solder globule
should be fixed. An immersion speed between 1
4.3.3.2 Materials
mm/second and 5 mm/second [0.039 in/second and 0.20
4.3.3.2.1 Flux The flux used shall be in accordance with in/second] should ensure that most test specimens are
3.2.2. fully immersed. A dwell time of 5 seconds shall be used.
4.3.3.2.2 Solder The solder shall be in accordance with A dwell time of 10 seconds may be necessary for large
3.2.1. Other alloys may be used upon agreement between components or components with high thermal mass (see
user and other parties. 5.2).
4.3.3.2.3 Test Specimen The test specimen shall either
4.3.3.3.4 Preheat The decision to use preheat should be
be a full component or a lead that has been carefully
removed from the component. Ideally the cross-section of by prior agreement between user and supplier (AABUS).
the component to be dipped is either rectangular, square
or round, to facilitate calculation of the theoretical 4.3.3.4 Evaluation
maximum wetting force. Ideally no burr should be present
but, if they are, generally they will be on the components 4.3.3.4.1 Magnification Magnifications of up to 100X
used in production and should not be removed, as they may be necessary, for example, to examine components
may actually be the cause of the poor solderability. No smaller than 0402 chip components.
cleaning of the specimen is allowed. Conditioning, if any,
4.3.3.4.2 Suggested Criteria Prior to any post-test
must be agreed to by the tester and other party in
examination, all specimens shall have the flux removed
advance.
using a cleaning agent in accordance with 3.2.3. The area
4.3.3.3 Procedure of the test sample with fresh solder adhesion shall be
4.3.3.3.1 Temperature of the Solder The temperature greater than the area that was immersed in the solder
of the solder is to be stabilized at the required temperature globule, (i.e. the component shall exhibit positive wetting
for the test before commencing the test. This temperature beyond its immersion depth). In addition, Table 4–7 lists
shall be per 3.5.1. suggested criteria.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Table 4–6 Dipping Angle and Immersion Depth for Components (Directly from IEC 60068-2-69)
Dipping Figure (See Immersion Pin size Globule
a
Component angle b Fig. 4–12) depth (mm) (mm) weight (mg) Remarks
1005 (0402) Horizontal or
2A, 2B 2 25
1608 (0603) Vertical
Capacitors 0.10
2012 (0805) 3.2 or 4 100 or 200
Horizontal 2A
3216 (1206) 4 200
1005 (0402) Vertical 2B
2 25
1608 (0603) 2A, 2B
Resistors Horizontal or 0.10
2012 (0805) 3.2 or 4 100 or 200
Vertical 2A,2B,2H c
3216 (1206) 4 200
Tantalum
Case sizes c
capacitors, Vertical 2H 0.10 4 200
Ad,B,C,D
LEDs
SOT 23, 25,
26, 323, 343, 2D 0.10 2 25
353, 363
SOT 89, 0.20 1 outer pin
SOT 223, 523 only
2F
Gull wing 20 – 45 0.25
diode
Leaded SMD
Remove
Any SOIC sufficient
VSO QFP, 2D 0.20 4 200
leads to
SOP avoid
bridging
between
PLCC, SOJ Horizontal 2E 0.10 tested
leads
Caution
c
QFN Vertical 2H 0.10 2 25 from
bridging
Cylindrical Horizontal or
2A, 2B 0.25 4 200
SMD Vertical
SOD 80 Vertical 2B 0.20 4 200
Only
peripheral
balls can
Any BGA, CSP be tested,
Horizontal 2G 0.10 1 10
or LGA e and only
test down
to 1.0 mm
pitch
Not recommended for sizes below 1005 (0402).
Bath method is preferred for capacitors 3216 (1206) size.
The recommended dwell time is 5s, except for SOT 89 and SOT 223 components where 10s is recommended.
For Figure 2B, rightward offset distance from the crest of the solder globule shall be 0% to 15% of the pin diameter and shall
avoid leftward offset.
a
Component names in parentheses, dimensions are expressed in Imperial.
b
Orientation of the specimen terminals or leads toward the solder surface.
c
Figure 2H is applicable to the components which do not have electrode toward the solder surface when Figure 2B is applied.
d
This test may only be applicable with certain test equipment.
e
This test is recommended only for those balls and bumps that will not melt at the respective temperature and are not
designed to melt during reflow operation.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

2 A - Horizontal 2 B - Vertical 2 C - 20°-45° 2 D - 20°-45°

2 E - Horizontal 2 F - 20°-45° 2G 2 H - Vertical

IPC-002c-4-12

Figure 4–12 Component and Dipping Angle (Directly from IEC 60068-2-69)

Table 4–7 Wetting Parameters and Suggested Evaluation Criteria

Suggested Criteria
Parameter Description Set A Set B
T0 Time to buoyancy corrected ≤1 second ≤2 seconds
zero
F2 Wetting force at 2 seconds ≥50% maximum theoretical wetting Positive value at or before 2 sec-
from start of test force at or before 2 seconds onds
F5 Wetting force at 5 seconds At or above the positive value of F2 At or above the value of F2
from start of test
AA Integrated value of area of the ≥area calculated using sample buoy- > zero (0)
wetting curve from start of the ancy and 50% maximum theoretical
test force
F2 Wetting force at 2 seconds ≥25% maximum theoretical wetting
from start of test force at or before 2 seconds
F5 Wetting force at 5 seconds At or above 90% of F2 value
from start of test

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.3.4 Test E1 – Lead-free Solder – Wetting Balance d. The flux covered termination shall be immersed only
Solder Pot Test (Leaded Components) This test is for once in the molten solder to a depth of 0.10 mm
wetting balance testing of leaded components. [0.0039 in].
4.3.4.1 Apparatus A solder meniscus force measuring e. The angle of immersion shall be 20° – 45° (see Figure
device (wetting balance) which includes a temperature 4–2).
controlled solder pot containing solder per 3.2.1 and f. Immerse and withdraw at 1 mm – 5 mm [0.04 - 0.20
maintained per 3.5.1 and 3.5.2 shall be used. The in] per second and dwell for 5 +0/-0.5 seconds.
equipment shall have a means of recording force as a Massive components may require a longer solder dwell
function of time, such as a chart recorder, data logger, or time (see 5.2).
computer (see Figure 4–9).
4.3.4.1.1 Dipping Device A mechanical or electrome- 4.3.4.4 Evaluation
chanical dipping device incorporated in the wetting
balance shall be used. The device shall be preset to 4.3.4.4.1 Magnification Parts shall be examined at 10X
produce an immersion and emersion rate as specified in using the equipment specified in 3.3.3. For fine pitch
4.3.4.3. The specimen dwell time is controlled to the time leaded/termination parts (0.5 mm [0.020 in] pitch or less)
specified in 4.3.4.3. A device to sense contact of the the inspection magnification shall be 30X.
lead(s) with the molten solder bath shall also be part of
4.3.4.4.2 Accept/Reject Criteria Suggested criteria for
the fixture or instrument.
solderability evaluation for Test E1 are listed in Table
4.3.4.2 Preparation Specimen preparation shall be in 4–5. Figures 4–10 and 4–11 illustrate the suggested
accordance with 3.4. criteria of Table 4–5. In addition, the area of the test
sample with fresh solder adhesion shall be greater than
4.3.4.3 Procedure the area that was immersed in the solder bath (i.e., the
a. Flux per 3.2.2 shall be used. The flux shall be at component shall exhibit positive wicking beyond its
ambient (room) temperature. immersion depth).
b. Leads and terminations shall have flux applied uni- 4.3.4.4.3 Gauge Repeatability and Reproducibility (GR&R)
formly and to cover the surfaces to be tested. Protocol Appendix H contains a suggested GR&R
c. Dross and burned flux shall be skimmed from the protocol that may be used by the supplier and user to
surface of the molten solder immediately before dip- ensure that the respective wetting balance equipment are
ping. correctly calibrated.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

4.3.5 Test F1 – Lead-free Solder – Wetting Balance d. After application of the flux and post dip dwell, the
Solder Pot Test (Leadless Components) This test is for specimen shall be mounted on the test equipment.
wetting balance testing of leadless components. e. Dross and burned flux shall be skimmed from the
surface of the molten solder immediately before dip-
4.3.5.1 Apparatus A solder meniscus force measuring
ping.
device (wetting balance) which includes a temperature
controlled solder pot containing solder per 3.2.1 and f. The flux covered termination shall be immersed only
maintained per 3.5.1 and 3.5.2 shall be used. The once in the molten solder to a depth of 0.10 mm
equipment shall have a means of recording force as a [0.0039 in] minimum.
function of time, such as a chart recorder, data logger, or g. The angle of immersion shall be per Figure 4–4.
computer (see Figure 4–9). h. A full curve shall be recorded using the equipment
4.3.5.1.1 Dipping Device A mechanical or electrome-
specified in 4.3.5.1.
chanical dipping device incorporated in the wetting
4.3.5.4 Evaluation
balance shall be used. The device shall be preset to
produce an immersion and emersion rate as specified in 4.3.5.4.1 Magnification Parts shall be examined at 10X
4.3.5.3. The specimen dwell time is controlled to the time using the equipment specified in 3.3.3. For fine pitch
specified in 4.3.5.3. termination parts (0.5 mm [0.020 in] pitch or less) the
inspection magnification shall be 30X.
4.3.5.2 Preparation Specimen preparation shall be in
4.3.5.4.2 Accept/Reject Criteria Suggested criteria for
accordance with 3.4.
solderability evaluation for Test F1 are listed in Table 4–5.
Figures 4–10 and 4–11 illustrate the suggested criteria of
4.3.5.3 Procedure
Table 4–5. In addition, the area of the test sample with
a. Flux per 3.2.2 shall be used and shall be at ambient fresh solder adhesion shall be greater than the area that
(room) temperature. was immersed in the solder bath (i.e., the component shall
b. Leads and terminations shall have flux applied uni- exhibit positive wicking beyond its immersion depth).
formly and to cover the surfaces to be tested. 4.3.5.4.3 Gauge Repeatability and Reproducibility (GR&R)
c. Immerse and withdraw at 1 mm – 5 mm [0.04 in – Protocol Appendix H contains a suggested GR&R proto-
0.20 in] per second and dwell for 5 +0/-0.5 seconds. col that may be used by the supplier and user to ensure
Massive components may require a longer solder dwell that the respective wetting balance equipment are cor-
time (see 5.2). rectly calibrated.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

4.3.6 Test G1 – Lead-free Solder – Wetting Balance 4.3.6.3.2 Fluxing A very small amount of flux is care-
Globule Test This test is for lead-free solder wetting fully applied to the surface or lead to be tested and the
balance globule testing of components. solder globule using a clean cotton tip or bud. No excess
flux shall be ready to drip off the fluxed part or the excess
4.3.6.1 Apparatus A solder meniscus force measuring
flux must be drained off by carefully touching the lowest
device (wetting balance) which includes a temperature
controlled vertical, cylindrical iron shaft shrunk fit into an point on the surface to be tested with a piece of clean
aluminum housing on which is placed a specific sized chemical lab filter paper. For this testing, ideally a small
piece of solder. Examples are: a 200 mg piece of solder amount of flux should be kept in a small container that is
for a 4 mm diameter globule block, a 25 mg piece for a 2 only opened to immerse the cotton tip to wet it with flux.
mm globule block or a 6.25 mg piece for a 1 mm globule The cotton tips should be thrown away and replaced with
block. The molten solder globule should ideally be fresh ones every 5 to 10 tests, with all tests done in the
replaced after each solderability test, but may be re-used same testing interval. If testing is interrupted for more
for very small components that do not remove more than than a few minutes, then a new tip should be used.
1% of the solder volume per solder test for up to 5 tests.
4.3.6.3.3 Dipping Angle, Immersion Depth, and Immer-
The equipment shall have a means of recording force as a
sion Rates The appropriate clip shall be chosen to hold
function of time, such as a chart recorder, data logger or
the part as specified in Table 4–6 and illustrated in Figure
computer.
4–12. Without contaminating the surfaces to be tested, the
4.3.6.1.1 Dipping Device A mechanical or electrome- specimen is mounted in the appropriate clip or other
chanical dipping device incorporated in the wetting device supplied by the solderability tester manufacturer
balance shall be used. The device shall be preset to and carefully attached to the machine so as to not damage
produce an immersion and emersion rate as specified in the transducer or dislodge the component from its orien-
4.3.6.3.3. The specimen dwell time is controlled to the tation in the clip or other holder. The distance between the
time specified in 4.3.6.3.3. solderable surface of the sample and the solder globule
should be fixed. An immersion speed between 1
4.3.6.2 Materials
mm/second and 5 mm/second [0.039 in/second and 0.20
4.3.6.2.1 Flux The flux used shall be in accordance with in/second] should ensure that most test specimens are
3.2.2. fully immersed. A dwell time of 5 seconds shall be used.
4.3.6.2.2 Solder The solder alloy shall be in accordance A dwell time of 10 seconds may be necessary for large
with 3.2.1. Other alloys may be used upon agreement components or components with high thermal mass (see
between user and other parties. 5.2).
4.3.6.2.3 Test Specimen The test specimen shall either 4.3.6.3.4 Preheat The decision to use preheat should be
be a full component or a lead that has been carefully as agreed upon between the user and supplier, prior to
removed from the component. Ideally the cross-section of testing.
the component to be dipped is either rectangular, square
or round, to facilitate calculation of the theoretical
4.3.6.4 Evaluation
maximum wetting force. Ideally no burr should be present
but, if they are, generally they will be on the components 4.3.6.4.1 Magnification Magnifications of up to 100X
used in production and should not be removed, as they may be necessary, for example, to examine components
may actually be the cause of the poor solderability. No smaller than 0402 chip components.
cleaning of the specimen is allowed. Conditioning, if any,
must be agreed to by the tester and other party, in 4.3.6.4.2 Suggested Criteria Prior to any post-test
advance. examination, all specimens shall have the flux removed
using a cleaning agent in accordance with 3.2.3. The area
4.3.6.3 Procedure of the test sample with fresh solder adhesion shall be
4.3.6.3.1 Temperature of the Solder The temperature greater than the area that was immersed in the solder
of the solder is to be stabilized at the required temperature globule, (i.e. the component shall exhibit positive wetting
for the test before commencing the test. This temperature beyond its immersion depth). In addition, Table 4–7 lists
shall be per 3.5.1. suggested criteria.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

5 NOTES another, it is necessary to correct for the variability in

specimen sizes, in particular width and thickness. This is
5.1 Use of Activated Flux This standard specifies a done by correcting for the volume of the sample
rosin-based flux with a very specific quantity of activator. immersed in the solder. The following formula may be
The intent of requiring the use of a specific quantity of used to calculate the buoyant force correction:
flux activator is to reduce the variability of test results that
were seen with pure rosin flux, enable the solderability Fb = d (d1 or d2) gn V
testing of non-tin component lead metallizations, and where:
provide a realistic solderability testing safety factor by
d1 = Density of solder at 245°C (8150 kg/m3) for
keeping the amount of activator both fixed and less than
Sn60/Pb40 Alloy
that used for production soldering. The benefit of using
this specified activated solderability testing flux composi- d2 = Density of solder at 255°C (7410 kg/m3) for SAC305
tion was demonstrated by extensive testing, as reported in Alloy
the J-STD-002B Activated Solderability Test Flux Ratio- gn = Acceleration of gravity (9.810 m/s2)
nale Committee Letter. V = Immersed volume in m3 (width x thickness x
immersion depth)
5.2 Massive Components Large components that have
terminations with high heat sinking capacity may require The calculated buoyant force will be in Newtons and will
longer dwell times to be applied to the dip test ( for be normalized for wetted perimeter and expressed as
example: Tests A, B, C, E and F) to allow for the slower micro-Newtons/mm. As shown in Figures 4–10 and 4–11,
heat up time. In such cases an agreement to increase the using the convention that wetting force is positive upward,
dwell time will be required between the user and vendor. all measurements need to be buoyancy corrected for the
This agreement must also state the specific dwell time to times as well as the forces to be more accurate.
be used.
5.6 Accelerated Steam Conditioning Limitations The
5.3 Sampling Plans Sampling plans shall identify the accelerated steam conditioning of solderable coatings has
number of components to be randomly selected from a been, and continues to be, the subject of intense investi-
given lot. All leads/terminations of the components gation (see IPC-TR-464). Compared to other conditioning
selected shall be tested for solderability. Each lead of a methods, steam conditioning satisfactorily accelerates the
component must pass for the component to pass. The degradation of tin and tin/lead surfaces in a manner
selection and disposition of solderability test specimens similar to natural aging. The degradation mechanisms of
shall be per the individual component specification. It surface oxidation and Cu/Sn intermetallic growth are both
may be necessary to bend back one out of every two or enhanced by the heat and humidity of steam. Properly
two out of every three leads for some test methods. These applied tin and tin/lead coatings can withstand the steam
leads would obviously not be counted. conditioning environment well beyond the eight hours
specified and may survive natural aging well beyond 12
5.4 Safety Notes Isopropyl alcohol is flammable. Care months. Due to the combined effects of specific geometry,
must be taken in both usage and storage to keep the storage environment, and material systems, it is not
isopropyl alcohol from sparks or flames. See the Material possible to accurately predict storage life. As a result, this
Safety Data Sheets (MSDS) for all solvents. All chemicals specification indicates a storage life overlap for coating
shall be handled per appropriate data sheets, and disposed durability Category 1 and Category 3, and an open-ended
of per local regulations. limit for coating durability Category 3. For coatings other
than tin or tin-lead (Category 2), data do not exist to
5.5 Correction for Buoyancy For the wetting balance to support steam conditioning longer than the one hour
obtain wetting force values that are relatable to one specified.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Appendix A
Critical Component Surfaces

“J” Leaded Components

View 1

T = Lead
Thickness

2 xT

View 2
C
Se
ati
ng
Pla
ne

2x
T
C

B A

Critical Area = Surface “A” (Equal to 2 x Lead Thickness)

IPC-002c-a-1

Figure A-1 “J” Leaded Components

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November 2008 IPC/ECA J-STD-002C with Amendment 1

IPC-002c-a-2

Figure A-2 Passive Components

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Gull Wing Components

View 1

T = Lead
Thickness

1 xT
Seating Plane

View 2

Se
ati
ng
Pla
ne

1x
T

B A (Underside)

Critical Area = Surface “A” (Underside of Lead) up to 1 x T

IPC-002c-a-3

Figure A-3 Gull Wing Components

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November 2008 IPC/ECA J-STD-002C with Amendment 1

IPC-002c-a-4

Figure A-4 Leadless Chip Carrier

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IPC/ECA J-STD-002C with Amendment 1 November 2008

“L” Leaded Components

View 1
T = Lead Thickness

F
Seating Plane

F = Minimum Fillet Height = The Lesser of:

a) The solder fillet thickness on the
underside of the lead + 0.25 x H or
b) 0.5mm [0.0197in].

View 2
H

B
Excluded
Se F
ati
ng
Pla
ne

C
A (Underside)

1x
T

Critical Area = Surface “A” (Underside of Lead) up to 1 x T

IPC-002c-a-5

Figure A-5 “L” Leaded Components

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November 2008 IPC/ECA J-STD-002C with Amendment 1

IPC-002c-a-6

Figure A-6 Through-Hole Components – Flat Pin

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IPC/ECA J-STD-002C with Amendment 1 November 2008

IPC-002c-a-7

Figure A-7 Through-Hole Components – Round Pin

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November 2008 IPC/ECA J-STD-002C with Amendment 1

C, Terminal Sides, not

Critical Area = Surface A intended to be a wettable
(Terminal Undersides) surface by design
and Surface B (Exposed Pad)

A, Terminal Underside. B, Exposed Pad.

Length L, Width W Length L, Width W

IPC-002c-a-8

Figure A-8 Exposed Pad Package

B, Terminal Side, not

Critical Area = Surface A intended to be a wettable
(Terminal Undersides) surface by design

A, Terminal Underside.
Length L, Width W

IPC-002c-a-9

Figure A-9 Bottom-Only Termination Component

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IPC/ECA J-STD-002C with Amendment 1 November 2008

IPC-002c-a-10

Figure A-10 Area Array Component Critical Surface

[Critical Surface: Each soldersphere shall have incorporated the solderpaste deposit (uniform, smooth solder with no dewetted
areas)]. With Tests S and S1 – Surface Mount Process Simulation, the component leads shall be wetted in a consistent and unified
manner, with no evidence of surface oxidation anomalies.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

Appendix B
Evaluation Aids

B.1 Evaluation Aids for Tests A, C, A1 and C1 size defects are also listed. Combinations of these sizes
can also be totaled easily (see Figure B-1).
B.2 Round Leads The measurement of defects or the
estimation of defect area percentage of the lead total In considering areas not covered by a continuous, new
surface area, is more difficult with round leads than it is solder coating and referring to the defined defects illus-
with flat surface rectangular leads. For example, in trated in Figure B-2, the visible areas of dewetting and
viewing a cylindrical surface such as a round lead, a nonwetting are applicable directly.
round diameter-sized defect when flat appears oval shaped An example of what constitutes 5% of the dipped area is:
and narrower in width than the visible surface of the lead six defects of 0.813 mm [0.032 in] diameter in a 25.4 mm
in the transverse direction, which is half of its circumfer- [1.0 in] length of a 0.813 mm [0.032 in] diameter (No. 20
ence. AWG) wires (see Figures B-3, B-4 and B-5}.
To aid the solderability test inspector in estimating the
lead surface percentage after solderability testing, a guide B.3 Square Terminations Square terminations shall
sheet for different diameter leads is shown in Figure B-3. meet the requirements of the solderability coverage guide
When 25.4 mm [1.0 in] of the lead surface of a 0.5 mm shown in Figure B-5.
[0.02 in] diameter lead is inspected for solder coverage,
10 diameter size defects equal 5% of the total lead surface B.4 Castellated Terminations Castellated terminations
area. Numbers of half diameter size and quarter diameter shall meet the same criterion as round leads.

Example "A"
0.51 mm Dia.
Size Area

Example "B"
1/2 of Dia.
Size Area Example "C"
1/4 of Dia.
Size Area
Body

0.51 mm Dia. Lead

On 0.51 mm Dia. Total of 10 Example "A" Areas - 5% of Lead Area

Lead 25.4 mm of Total of 40 Example "B" Areas - 5% of Lead Area
Solder Coated Length
Total of 160 Example "C" Areas - 5% of Lead Area

IPC-002c-b-1

Figure B-1 Defect Size Aid

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IPC/ECA J-STD-002C with Amendment 1 November 2008

a) Dewetting b) Nonwetting

c) Pinholes IPC-002c-b-2c

Figure B-2 Types of Solderability Defects

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November 2008 IPC/ECA J-STD-002C with Amendment 1

TERMINAL
_ROUND_LEAD
SCALE: 10X
CRITICAL AREA 5% DEFECTIVE
AFTER THE MANNER OF MIL. STD. 202
METHOD 208 FIGURE 208-7
20 UNITS OF 400 DISTRIBUTED RANDOMLY

.020 DIA X 1.00

.032 DIA X 1.00

.040 DIA X 1.00

REF: EIA 10X LEGEND: INVISIBLE

TO OPPOSITE
VISIBLE

CRITICAL AREA ENTIRE 25 mm LG. SURFACE STARTING AT 1.3 mm FROM BODY

IPC-002c-b-3

Figure B-3 Aids in Evaluation of 5% Allowable Area of Pin Holes

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IPC/ECA J-STD-002C with Amendment 1 November 2008

IPC-002c-b-4

Figure B-4 Aid in Evaluation of 5% Allowable Area of Pin Holes

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November 2008 IPC/ECA J-STD-002C with Amendment 1

3 Percent Defects

5 Percent Defects

8 Percent Defects

IPC-002c-b-5

Figure B-5 Solderability Coverage Guide

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Appendix C
Calculation of Maximum Theoretical Force

Maximum theoretical force is calculated using the proce- t = Lead height (nominal) = 0.1524 mm
dure of Klein Wassink.1 d = Immersion depth = 0.3 mm
Force (Max. Theoretical) = (γ) (P) (cosine β) – (d)(g) 1 = Lead length immersed on bottom side at 20° angle
(V) = [0.4P – 0.08V] mN and 0.3 mm depth = 0.877 mm
where: m = Lead length immersed on top side at 20° angle and
0.3 mm depth = 0.458 mm
P = the perimeter of the test specimen in millimeters, i.e.,
k = Length of solder/lead/air interface along lead side =
the length in millimeters of the solder/printed board or
0.446 mm
coupon pad (or hole)/air interface as measured at maxi-
mum depth of immersion. 2k + 2w = Total length per lead of solder periphery =
0.892 + 0.508 = 1.4 mm
V= The volume in cubic millimeters of the test specimen
that resides below the solder/board air interface as P = Total length of periphery per side (33 leads) = 46.2
measured at the maximum depth of immersion. mm
γ = Surface tension of solder = 0.4 mN/mm Hence:
γ = Surface tension of Pbfree solder = 0.5 mN/mm Total volume immersed per lead = 0.254 X 0.1524 X
α = Immersion angle of the board to the horizontal 0.458 + 0.5(0.1524 X 0.254 X 0.419) = 0.0177 + 0.0081
surface, i.e., α = 45° = 0.0258 mm3
β = Wetting angle of solder to the board under optimal Therefore for an 132 I/O QFP, the maximum theoretical
conditions, i.e., β = 0 and therefore the cosine β = 1 wetting force is:
d = Density of solder at 235°C, = 8120 kg/m3 for
For 33 leads (one side of an 132 I/O QFP) = 33 x 0.0258
Sn60/Pb40 Alloy
mm3 = 0.85
d = Density of solder at 255°C = 7410 kg/m3 for SAC305
Maximum Force = (0.4 x 46.2) – (0.08 x 0.85) = 18.41
Alloy
mN
g = Gravitational constant = 9.8 x 103 mm/s2
And, for a part of 46.2 mm total periphery:
Periphery and volumes are to be calculated using the Maximum Force per length of interface = 399 µN/mm
nominal values provided by the device supplier in the
The force measured on a part in the Set A criteria must
package drawing and the angles and depths of immersion
therefore be greater than 9.2 mN or 200 µN/mm at F2.
as described in the specification above. The TOTAL
periphery and volume, i.e., the sum of all leads being Note: All forces are referenced to the corrected zero axis
immersed, is to be used in this calculation. and not the zero force line except for the Appendix D
calculation (parameter AA).
Figure C-1 depicts a sample calculation for 132 I/O QFP.
1. R. J. Klein Wassink, ‘‘Soldering in Electronics,’’ 2nd
Where:
Edition, Electrochemical Publications, Ayr, Scotland,
w = Lead width (nominal) = 0.254 mm 1989, pp 308–309

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November 2008 IPC/ECA J-STD-002C with Amendment 1

m α
Solder Bath Surafce

d
t=0.1524 l
w=0.254

IPC-002c-c-1

Figure C-1 Lead Periphery and Volume for a 132 I/O PQFP

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Appendix D
Calculation of Integrated Value
of Area of the Wetting Curve

The area is calculated using the maximum theoretical 2. The test specimen essentially attains the full maximum
force (see Figure 4.18 or 4.19). Therefore, the area is theoretical force as it crosses the zero line at two (2)
given as: seconds and holds that value for the duration of the test,
i.e., three (3) seconds.
Area = Wetting force x time – Buoyancy x time
V = Total Volume = 0.4 mm3
Area = (3.0 sec. x Max. Theoretical Force) – 2.0 sec (ρ)
(g) V Maximum Theoretical Force: 3.97 mN
Area = (3.0 sec. x Max. Theoretical Force) – 2.0 sec x – Area = (3.0 sec. x 3.97mN) – (2.0 sec. x 0.08 (kg/mm3 x
(8.12 x 10-6 kg/mm3 x 9.8 x 103 mm/s2 x V) mm/s2) x 0.4 mm3) = 11.91 mN x seconds – 0.064
(kg-mm/sec)
The value V is the volume of the test specimen immersed
in the solder bath as calculated in Appendix C. The Since F= ma, then mN = kg x mm/sec2 or kg =
maximum theoretical force is calculated as per Appendix mNsec2/mm
C. The following assumptions are made: Area = 11.91 mN x seconds – 0.064 (mNsec2/mm) x
(mm/sec)
1. The maximum buoyancy force holds for the whole two
(2) seconds contributing a negative area of: the buoyancy Area = 11.91 mN x seconds – 0.064 mN x seconds
force times two (2) seconds. Area = 11.85 mN x seconds

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November 2008 IPC/ECA J-STD-002C with Amendment 1

Appendix E
Informative Annex

E.1 Test Equipment Sources The equipment sources ability Testing and Solutions Inc., 18 Wildrose Dr.,
described below represent those currently known to the Edgewood, KY 41017, (859) 331–0598, www.wettingbal-
industry. Users of this document are urged to submit ance.com
additional source names as they become available, so that
this list can be kept as current as possible. E.1.4 Steam Conditioning Equipment
H&H Engineering, Inc., 3612 Wood Duck Circle, Stock-
E.1.1 Tests A, B, C, D, A1, B1, C1, D1
ton, CA 95206
GEN3 Systems Limited (Formerly Concoat Systems) Unit
B2, Armstrong Mall, Southwood Business Park, Farnbor- Metronelec, 54, Route de Sartrouville – Le Montreal
ough, Hampshire GU14 0NR England. 011 44 12 5252 78232 Le PECO Cedex, France (USA Distributor: Solder-
1500 www.gen3systems.com ability Testing and Solutions Inc., 18 Wildrose Dr.,
Edgewood, KY 41017, (859) 331–0598 www.wettingbal-
HMP Soldermatics, P.O. Box 948, Canon City, CO 81215, ance.com
(719) 275–1531
Mountaingate Engineering Inc., Campbell, CA 95008,
Malcomtech 26200 Industrial Blvd, Hayward CA 64545, (408) 866–5100
(510)293–0580, www.malcomtech.com
Robotic Process Systems Inc., 23301 E. Mission Ave.,
Reef Engineering, Unit 6, Bancrofts Road, South Liberty Lake, WA 99019, (509) 891–1680
Woodham Ferrers, Essex CM3 5UQ 01245 328123
Zentek Scientific Systems, 3520 Yale Way, Fremont, CA
Robotic Process Systems Inc., 23301 E. Mission Ave., 94538, (510) 651–1581
Liberty Lake, WA 99019, (509)891–1680
E.1.5 Grid Reticles
E.1.2 Tests E, F, E1 & F1
Bender Associates, 5030 South Mill Avenue, Suite C-2,
Convey AB, Harpsundsvagen 113, S-12458 Bandhagen,
Tempe, AZ 85252, (602) 820–0900
Sweden 46 (0) 8 99 66 25
GEN3 Systems Limited (Formerly Concoat Systems) Unit E.2 Test Flux Product Sources The Test Flux product
B2, Armstrong Mall, Southwood Business Park, Farnbor- sources described below represent those currently known
ough, Hampshire GU14 0NR England. 011 44 12 5252 to the industry. Users of this document are urged to
1500 www.gen3systems.com submit additional product source names as they become
Malcomtech 26200 Industrial Blvd, Hayward CA 64545, available, so that this list can be kept as current as
(510) 293–0580, www.malcomtech.com possible.

Metronelec, 54, Route de Sartrouville – Le Montreal AIM Solder {www.aimsolder.com} – Standard Flux #1
78232 Le PECO Cedex, France (USA Distributor: Solder- Product ID: RMA 202–25
ability Testing and Solutions Inc., 18 Wildrose Dr., Alpha Metals {www.alphametals.com} – Standard Flux
Edgewood, KY 41017, (859) 331–0598, www.wettingbal- #2
ance.com
GEN3 Systems Limited {www.gen3systems.com} – Prod-
Robotic Process Systems Inc., 23301 E. Mission Ave., uct ID’s: SMNA – Standard Flux #1: Actiec 2 / –
Liberty Lake, WA 99019, (509)891–1680 Standard Flux #2: Actiec 5

E.1.3 Tests G & G1 Kester {www.kester.com} – Standard Flux #1 Product ID:

182
GEN3 Systems Limited (Formerly Concoat Systems) Unit
B2, Armstrong Mall, Southwood Business Park, Farnbor- Qualitek International, Inc. {www.qualitek.com} – Stan-
ough, Hampshire GU14 0NR England. 011 44 12 5252 dard Flux #1Product ID: 285–25
1500 www.gen3systems.com
Solderability Testing and Solutions Inc. {www.wettingbal-
Metronelec, 54, Route de Sartrouville – Le Montreal ance.com} – Standard test flux 0.2% and Standard test
78232 Le PECO Cedex, France (USA Distributor: Solder- flux 0.5%

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Appendix F
J-STD-002/J-STD-003 Activated Solderability
Test Flux Rationale Committee Letter

The current J-STD-002/J-STD-003 specification includes a 2) Reduced Solderability Test Variability

departure in the test flux methodology used in past The J-STD-002/003 solderability committees enlisted the
solderability testing. The table in paragraph 3.2.2 Flux is: assistance of Dr. Carol Handwerker and the resources of
Table 3–1 Flux Compositions the National Institute of Standards & Technology (NIST)
to investigate/compare a standard activated flux composi-
Composition by
Weight Percent tion versus the “R type” flux composition. A detailed
Constituent Flux #1 Flux #2 statistical analysis by Bill Russell, Raytheon Systems, and
NIST statisticians revealed the use of a standard activated
Colophony 25 ± 0.5 25 ± 0.5
flux composition greatly reduced the amount of solderabil-
Diethylammonium Hydrochlo-
0.15 ± 0.01 0.39 ± 0.01 ity test variation. One of the major goals of the
ride (CAS 660-68-4)
Isopropyl Alcohol (IPA) (CAS
J-STD-002/003 solderability committees is to develop test
Balance Balance methods and standards which promote consistency across
67-63-0)
Weight of Chlorine as % of the industry.
0.2 0.5
Solids 3) Concerns of a Loss of Solderability Assessment Safety
Margin
The J-STD-002/J-STD-003 committees understood that
any proposed change to the use of ROL0 (formerly The two major historical rationale for using an “R type”
designated type R) would be heavily scrutinized and flux: 1) colophony or rosin contains only naturally
would require test data showing the applicability of using occurring flux activator constituents and thus is not
a standard activated flux composition. The J-STD-002/J- subjected to the problems/complications of chemistry
STD-003 committees have spent significant resources formulas by the flux supplier; 2) it was an accepted
working this flux change issue, discussing the chemistry industry acknowledged fact that, if a component or printed
details and conducting multi-company Design of Experi- wiring board surface was found to have acceptable
ment investigations. The J-STD-002 committee chairmen, solderability test results using “R type” flux, then the
Dave Hillman [Rockwell Collins], Doug Romm [Texas more active flux formulations used in the assembly
Instruments], Mark Kwoka [Intersil] and Jack McCullen process would produce acceptable solder process results.
[Intel], feel that the committee has compiled a significant This solderability assessment safety margin was a self
data set and have held thorough topic discussions support- imposed, industry consensus decision. The J-STD-002/003
ing the proposed flux material change. The four rationales committees understood the historical relevance behind the
for proposing/supporting the flux change are summarized decision to use “R type” flux and had an equally strong
below: desire to maintain a solderability assessment safety cush-
ion. However, committees fielded a number of industry
1) A Proactive Solderability Testing Approach to The inputs to reassess the solderability flux composition based
Implementation of Non-Tin Finishes on the technology improvements in surface finishes,
A number of industry studies (1996 NEMI Surface improvements in the flux chemistry formulations from
Finishes Task Group Report, 1997 NCMS Lead-Free flux suppliers, and the desire to not have excessive safety
Solder Project, 2000 National Physical Laboratory CMMT margins which would impact cost and schedule in a
(A) 284 Report) have shown that an incompatibility of “R non-value added manner. The committees conducted a
type” flux with non-tin surface finishes such as palladium, number of tests (Wenger, Kwoka, ACI) demonstrating,
organic solderability preservatives (OSPs), and immersion using a specific standard level of activation on real world,
gold. The introduction of these various metallic surface industry supplied component and printed wiring board
finishes on components and printed wiring boards is no cases, that the occurrence of a “false acceptable” solder-
longer the exception but has/is quickly becoming the ability test result was extremely low. There was no case
norm. The use of a “R type” flux containing only that exhibited a “pass ROL1 test – fail ROL0 test – Fail
naturally occurring activators has resulted in producing during board assembly” sequence. In fact, the use of both
“false negative” solderability test results which impact ROL1 and ROL0 are more likely to create a “false reject
both the component/board fabricator and the assembler “dip and look solderability test result when compared to
negatively in terms of cost and schedule. board level soldering performance.

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November 2008 IPC/ECA J-STD-002C with Amendment 1

4) Standardization of Solderability Test Flux Composition compatibility of flux composition requirements between
on a Global Scale the J-STD-002/003 specification and the IEC specifica-
A second major goal of the J-STD-002/003 solderability tions is a win-win situation for electronics assemblers and
committees is to develop test methods and standards component/printed wiring board fabricators.
which promote global standardization for the electronics A number of the major flux chemistry suppliers have been
industry. The standard activated flux composition selected queried on the electronics industry’s ability to purchase
and tested by the committees has been utilized in the the standard activated flux composition, and a positive
International Electrotechnical Commission (IEC) 60068- response was received. If you have any questions please
2-20 Soldering specification. The IEC specification is contact the IPC Technical Staff to obtain additional
successfully utilized for solderability testing. Having answers/clarification.

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Appendix G
Graphical Representations: Progression of Solder Wetting
Curve Parameters As Measured By Wetting Balance Testing

Understanding Wetting Curves

Time 0

F1
F2

0
T1 Time (s) T2
Buoyancy

Force (mN)

Understanding Wetting Curves

Time 0

F1
F2

0
T1 Time (s) T2
Buoyancy

Force (mN)

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November 2008 IPC/ECA J-STD-002C with Amendment 1

Understanding Wetting Curves

Time 0 Ta

F1
F2

Ta

0
T1 Time (s) T2
Buoyancy

Force (mN)

Understanding Wetting Curves

Time 0 Ta Tb

F1
F2

Ta Tb

0
T1 Time (s) T2
Buoyancy

Force (mN)

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IPC/ECA J-STD-002C with Amendment 1 November 2008

Understanding Wetting Curves

Time 0 Ta Tb T2

Fmax
2/
F1
3 Fmax F2

Ta Tb

0
Time (s)
Time to 2/ Fmax

T1 T2
Buoyancy
3

Force (mN)

The net of the parameters measured from the progression of the five steps
encountered during the wetting balance testing, as highlighted above:

Force (mN)
Typical Wetting Curve
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
F1 F2
0
Buoyancy
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
0 1 2 3 4 5
Time (s)

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November 2008 IPC/ECA J-STD-002C with Amendment 1

Appendix H
Test Protocol for Wetting Balance Gauge Repeatability and
Reproducibility (GR&R) Using Copper Foil Coupons
1. All coupons for these tests shall be prepared individu- d. Immerse the sample immediately into DI water and
ally just prior to testing. Do NOT batch clean the gently agitate for 20 seconds.
samples. e. Blot the sample dry as in step ‘‘b’’ above.
2. Copper foil of 35 microns nominal thickness (‘‘1 oz’’ 8. Dip sample into the ‘‘standard activated flux’’ nor-
copper) shall be used for the test. mally used for solderability testing for 5 seconds.
3. The copper foil shall have NO surface treatment and 9. Holding the samples vertically, blot to remove excess flux.
is expected to have an oxidized appearance upon 10. Place sample into tool holder.
receipt from the supplier. Do not use the copper foil if
it is bright and shiny. This is indicative of surface anti 11. Run the test.
tarnish treatments being used. Surface treatments/ 12. Repeat ten times for each foil width and each test
preservatives can interfere with the ability to make a person. It is recommended that three people should be
consistent ‘‘known good coupon’’ necessary for this used for the GR&R study.
test. 13. For ease of data manipulation it is recommended to
4. The copper foil coupons shall be die cut to ensure convert the wetting forces obtained into mN/mm of
repeatability of the samples being tested and shall be the coupon’s wettable length (perimeter). For
of the following width dimensions; example, the 10 mm wide coupon has a total wettable
length (perimeter) = [(2 x 10 mm) + (2 x 0.035 mm)]
a. 2 mm
= 20.07 mm.
b. 5 mm
14. For the ‘‘standard activated’’ flux of nominal 0.2%
c. 10 mm activation, the wetting force used for the calculations
5. Create a file for each foil width and for each shall be 0.31 mN/mm. If a more active flux is being
individual person that is involved performing the used, a large sample shall be run to obtain the mean
GR&R. value and this used for the calculations.
6. Test parameters shall be: 15. Calculate the standard deviation for each of the foil
widths and the people running the test.
a. Solder temperature shall be the as recommended
for the alloy and the specification being used, i.e., 16. Multiply the standard deviation value by 6 (this
for SnPb and ANSI-J-STD-003 it shall be 235 ºC, represents the plus - minus 3 standard deviations of a
for ANSI-J-STD-002 it shall be 245 ºC. For SAC normal distribution)
305 it shall be 255 ºC, regardless of the specifica- 17. Divide this number by 0.31 and multiply by 100 to
tion. obtain a percentage value.
b. Immersion depth shall be 0.4 mm. 18. Tabulate the three values per person.
c. Immersion speed shall be 2 mm/sec. 19. For an acceptable GR&R, the values obtained should
be below 10%.
d. Dwell time in the solder shall be 10 seconds.
20. There should be excellent R&R results with the 10
e. Immersion angle shall be 90 degrees incident to mm coupon the first time this protocol is performed
the solder. with an increasing spread from test person to test
f. No preheat shall be used. person when using the smaller coupons. The test may
7. Sample preparation for the ‘‘known good coupon’’ need to be repeated or individuals may require some
shall be as follows: ‘‘practice time’’ prior to running the full GR&R.
a. Use a tweezers to immerse a foil sample into a 21. In addition to testing the individual, this protocol also
beaker of Acetone and gently agitate for 20 tests the machine and will show linearity and any bias
seconds. if it exists. Because the wetting forces have been
normalized to mN/mm, the readings for each coupon
b. Remove sample and blot both sides dry with ‘‘Kim width should be the same. If they are clearly different
wipes’’ or other suitable lab tissue. but the standard deviations produced by the individual
c. Again using a tweezers, immerse the above sample test people are below 10%, then there is a problem
into a 20% v/v Nitric acid/DI water solution and with the wetting balance and the equipment manufac-
gently agitate for 20 seconds. turer should be notified.

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Standard Improvement Form IPC/ECA J-STD-002C

The purpose of this form is to provide the Individuals or companies are invited to If you can provide input, please complete
Technical Committee of IPC with input submit comments to IPC. All comments this form and return to:
from the industry regarding usage of will be collected and dispersed to the IPC
the subject standard. appropriate committee(s). 3000 Lakeside Drive, Suite 309S
Bannockburn, IL 60015-1249
Fax 847 615.7105
E-mail: answers@ipc.org

1. I recommend changes to the following:

Requirement, paragraph number
Test Method number , paragraph number

The referenced paragraph number has proven to be:

Unclear Too Rigid In Error
Other

2. Recommendations for correction:

3. Other suggestions for document improvement:

Submitted by:

Name Telephone

Company E-mail

Address

City/State/Zip Date
 SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE

Association Connecting Electronics Industries

3000 Lakeside Drive, Suite 309 S

Bannockburn, IL 60015
847-615-7100 tel
847-615-7105 fax
www.ipc.org