Features

• Low-voltage and Standard-voltage Operation

– 2.7 (VCC = 2.7V to 5.5V)
– 1.8 (VCC = 1.8V to 5.5V)
• Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),
1024 x 8 (8K) or 2048 x 8 (16K)
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility
•
•
Write Protect Pin for Hardware Data Protection
8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes
Two-wire
•
•
Partial Page Writes Allowed
Self-timed Write Cycle (5 ms max)
Serial EEPROM
• High-reliability
– Endurance: 1 Million Write Cycles 1K (128 x 8)
– Data Retention: 100 Years
• Automotive Devices Available 2K (256 x 8)
• 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead
SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages 4K (512 x 8)
• Die Sales: Wafer Form, Waffle Pack and Bumped Wafers
8K (1024 x 8)
Description 16K (2048 x 8)
The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial
electrically erasable and programmable read-only memory (EEPROM) organized as
128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many
industrial and commercial applications where low-power and low-voltage operation AT24C01A
are essential. The AT24C01A/02/04/08A/16A is available in space-saving 8-lead PDIP,
8-lead JEDEC SOIC, 8-lead Ultra Th in Mini-MAP (MLP 2 x3) , 5-lead SOT23 AT24C02(1)
(AT24C01A/AT24C02/AT24C04), 8-lead TSSOP, and 8-ball dBGA2 packages and is
accessed via a Two-wire serial interface. In addition, the entire family is available in AT24C04
2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.
8-lead TSSOP 8-lead SOIC
AT24C08A
Table 1. Pin Configuration
Pin Name Function A0 1 8 VCC A0 1 8 VCC
AT24C16A
A1 2 7 WP A1 2 7 WP
A0 - A2 Address Inputs A2 3 6 SCL A2 3 6 SCL
SDA Serial Data GND 4 5 SDA GND 4 5 SDA
Note: 1. Not Recommended for
SCL Serial Clock Input new design; Please
8-ball dBGA2 8-lead Ultra Thin Mini-MAP refer to 24C02B
WP Write Protect
(MLP 2x3) datasheet.
VCC 8 1 A0
NC No Connect
WP 7 2 A1 VCC 8 1 A0
GND Ground SCL 6 3 A2 WP 7 2 A1
VCC Power Supply SDA 5 4 GND SCL 6 3 A2
Bottom View SDA 5 4 GND

Bottom View
8-lead PDIP
5-lead SOT23
A0 1 8 VCC
SCL 1 5 WP
A1 2 7 WP
A2 3 6 SCL GND 2

GND 4 5 SDA SDA 3 4 VCC

0180Y–SEEPR–2/06

1
Absolute Maximum Ratings
Operating Temperature..................................–55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
Storage Temperature .....................................–65°C to +150°C age to the device. This is a stress rating only and
functional operation of the device at these or any
Voltage on Any Pin other conditions beyond those indicated in the
with Respect to Ground .................................... –1.0V to +7.0V operational sections of this specification is not
implied. Exposure to absolute maximum rating
Maximum Operating Voltage .......................................... 6.25V conditions for extended periods may affect device
reliability.
DC Output Current........................................................ 5.0 mA

Figure 1. Block Diagram

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 AT24C01A/02/04/08A/16A

Pin Description SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each
EEPROM device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is
open-drain driven and may be wire-ORed with any number of other open-drain or open-
collector devices.
DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device
address inputs that are hard wired for the AT24C01A and the AT24C02. As many as
eight 1K/2K devices may be addressed on a single bus system (device addressing is
discussed in detail under the Device Addressing section).
The AT24C04 uses the A2 and A1 inputs for hard wire addressing and a total of four 4K
devices may be addressed on a single bus system. The A0 pin is a no connect and can
be connected to ground.
The AT24C08A only uses the A2 input for hardwire addressing and a total of two 8K
devices may be addressed on a single bus system. The A0 and A1 pins are no connects
and can be connected to ground.
The AT24C16A does not use the device address pins, which limits the number of
devices on a single bus to one. The A0, A1 and A2 pins are no connects and can be
connected to ground.
WRITE PROTECT (WP): The AT24C01A/02/04/08A/16A has a Write Protect pin that
provides hardware data protection. The Write Protect pin allows normal Read/Write
operations when connected to ground (GND). When the Write Protect pin is connected
to VCC, the write protection feature is enabled and operates as shown in Table 2.

Table 2. Write Protect

Part of the Array Protected
WP Pin
Status 24C01A 24C02 24C04 24C08A 24C16A

Full (1K) Full (2K) Full (4K) Full (8K) Full (16K)
At VCC
Array Array Array Array Array

At GND Normal Read/Write Operations

Memory Organization AT24C01A, 1K SERIAL EEPROM: Internally organized with 16 pages of 8 bytes each,
the 1K requires a 7-bit data word address for random word addressing.
AT24C02, 2K SERIAL EEPROM: Internally organized with 32 pages of 8 bytes each,
the 2K requires an 8-bit data word address for random word addressing.
AT24C04, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each,
the 4K requires a 9-bit data word address for random word addressing.
AT24C08A, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each,
the 8K requires a 10-bit data word address for random word addressing.
AT24C16A, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes
each, the 16K requires an 11-bit data word address for random word addressing.

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Table 3. Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V
Symbol Test Condition Max Units Conditions
CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V
CIN Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V
Note: 1. This parameter is characterized and is not 100% tested.

Table 4. DC Characteristics
Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +1.8V to +5.5V
(unless otherwise noted)
Symbol Parameter Test Condition Min Typ Max Units
VCC1 Supply Voltage 1.8 5.5 V
VCC2 Supply Voltage 2.7 5.5 V
VCC3 Supply Voltage 4.5 5.5 V
ICC Supply Current VCC = 5.0V READ at 100 kHz 0.4 1.0 mA
ICC Supply Current VCC = 5.0V WRITE at 100 kHz 2.0 3.0 mA
ISB1 Standby Current VCC = 1.8V VIN = VCC or VSS 0.6 3.0 µA
ISB2 Standby Current VCC = 2.5V VIN = VCC or VSS 1.4 4.0 µA
ISB3 Standby Current VCC = 2.7V VIN = VCC or VSS 1.6 4.0 µA
ISB4 Standby Current VCC = 5.0V VIN = VCC or VSS 8.0 18.0 µA
ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 µA
ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 µA
VIL Input Low Level(1) –0.6 VCC x 0.3 V
VIH Input High Level(1) VCC x 0.7 VCC + 0.5 V
VOL2 Output Low Level VCC = 3.0V IOL = 2.1 mA 0.4 V
VOL1 Output Low Level VCC = 1.8V IOL = 0.15 mA 0.2 V
Note: 1. VIL min and VIH max are reference only and are not tested.

4 AT24C01A/02/04/08A/16A
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 AT24C01A/02/04/08A/16A

Table 5. AC Characteristics
Applicable over recommended operating range from TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +2.7V to +5.5V,
CL = 1 TTL Gate and 100 pF (unless otherwise noted)
1.8-volt 2.7, 5.0-volt
Symbol Parameter Min Max Min Max Units
fSCL Clock Frequency, SCL 100 400 kHz
tLOW Clock Pulse Width Low 4.7 1.2 µs
tHIGH Clock Pulse Width High 4.0 0.6 µs
(1)
tI Noise Suppression Time 100 50 ns
tAA Clock Low to Data Out Valid 0.1 4.5 0.1 0.9 µs
Time the bus must be free before
tBUF 4.7 1.2 µs
a new transmission can start(1)
tHD.STA Start Hold Time 4.0 0.6 µs
tSU.STA Start Setup Time 4.7 0.6 µs
tHD.DAT Data In Hold Time 0 0 µs
tSU.DAT Data In Setup Time 200 100 ns
tR Inputs Rise Time(1) 1.0 0.3 µs
tF Inputs Fall Time(1) 300 300 ns
tSU.STO Stop Setup Time 4.7 0.6 µs
tDH Data Out Hold Time 100 50 ns
tWR Write Cycle Time 5 5 ms
Write
Endurance(1) 5.0V, 25°C, Byte Mode 1M 1M
Cycles
Note: 1. This parameter is characterized.

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0180Y–SEEPR–2/06
Device Operation CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-
nal device. Data on the SDA pin may change only during SCL low time periods (see
Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop
condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition
which must precede any other command (see Figure 5 on page 8).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition.
After a read sequence, the stop command will place the EEPROM in a standby power
mode (see Figure 5 on page 8).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the
EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has
received each word. This happens during the ninth clock cycle.
STANDBY MODE: The AT24C01A/02/04/08A/16A features a low-power standby mode
which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the
completion of any internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2-
wire part can be reset by following these steps:
1. Clock up to 9 cycles.
2. Look for SDA high in each cycle while SCL is high.
3. Create a start condition.

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 AT24C01A/02/04/08A/16A

Bus Timing
Figure 2. SCL: Serial Clock, SDA: Serial Data I/O®

Write Cycle Timing

Figure 3. SCL: Serial Clock, SDA: Serial Data I/O

SCL

SDA 8th BIT ACK

WORDn
(1)
twr
STOP START
CONDITION CONDITION

Note: 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.

Figure 4. Data Validity

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Figure 5. Start and Stop Definition

Figure 6. Output Acknowledge

8 AT24C01A/02/04/08A/16A
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 AT24C01A/02/04/08A/16A

Device Addressing The 1K, 2K, 4K, 8K and 16K EEPROM devices all require an 8-bit device address word
following a start condition to enable the chip for a read or write operation (refer to Figure
7).
The device address word consists of a mandatory one, zero sequence for the first four
most significant bits as shown. This is common to all the EEPROM devices.
The next 3 bits are the A2, A1 and A0 device address bits for the 1K/2K EEPROM.
These 3 bits must compare to their corresponding hard-wired input pins.
The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a
memory page address bit. The two device address bits must compare to their corre-
sponding hard-wired input pins. The A0 pin is no connect.
The 8K EEPROM only uses the A2 device address bit with the next 2 bits being for
memory page addressing. The A2 bit must compare to its corresponding hard-wired
input pin. The A1 and A0 pins are no connect.
The 16K does not use any device address bits but instead the 3 bits are used for mem-
ory page addressing. These page addressing bits on the 4K, 8K and 16K devices
should be considered the most significant bits of the data word address which follows.
The A0, A1 and A2 pins are no connect.
The eighth bit of the device address is the read/write operation select bit. A read opera-
tion is initiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is
not made, the chip will return to a standby state.

Write Operations BYTE WRITE: A write operation requires an 8-bit data word address following the
device address word and acknowledgment. Upon receipt of this address, the EEPROM
will again respond with a zero and then clock in the first 8-bit data word. Following
receipt of the 8-bit data word, the EEPROM will output a zero and the addressing
device, such as a microcontroller, must terminate the write sequence with a stop condi-
tion. At this time the EEPROM enters an internally timed write cycle, t WR , to the
nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will
not respond until the write is complete (see Figure 8 on page 11).
PAGE WRITE: The 1K/2K EEPROM is capable of an 8-byte page write, and the 4K, 8K
and 16K devices are capable of 16-byte page writes.
A page write is initiated the same as a byte write, but the microcontroller does not send
a stop condition after the first data word is clocked in. Instead, after the EEPROM
acknowledges receipt of the first data word, the microcontroller can transmit up to seven
(1K/2K) or fifteen (4K, 8K, 16K) more data words. The EEPROM will respond with a zero
after each data word received. The microcontroller must terminate the page write
sequence with a stop condition (see Figure 9 on page 11).
The data word address lower three (1K/2K) or four (4K, 8K, 16K) bits are internally
incremented following the receipt of each data word. The higher data word address bits
are not incremented, retaining the memory page row location. When the word address,
internally generated, reaches the page boundary, the following byte is placed at the
beginning of the same page. If more than eight (1K/2K) or sixteen (4K, 8K, 16K) data
words are transmitted to the EEPROM, the data word address will “roll over” and previ-
ous data will be overwritten.

9
0180Y–SEEPR–2/06
 ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a
start condition followed by the device address word. The read/write bit is representative of the
operation desired. Only if the internal write cycle has completed will the EEPROM respond
with a zero allowing the read or write sequence to continue.

Read Read operations are initiated the same way as write operations with the exception that the
read/write select bit in the device address word is set to one. There are three read operations:
Operations
current address read, random address read and sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the last
address accessed during the last read or write operation, incremented by one. This address
stays valid between operations as long as the chip power is maintained. The address “roll
over” during read is from the last byte of the last memory page to the first byte of the first page.
The address “roll over” during write is from the last byte of the current page to the first byte of
the same page.
Once the device address with the read/write select bit set to one is clocked in and acknowl-
edged by the EEPROM, the current address data word is serially clocked out. The
microcontroller does not respond with an input zero but does generate a following stop condi-
tion (see Figure 10 on page 12).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data
word address. Once the device address word and data word address are clocked in and
acknowledged by the EEPROM, the microcontroller must generate another start condition.
The microcontroller now initiates a current address read by sending a device address with the
read/write select bit high. The EEPROM acknowledges the device address and serially clocks
out the data word. The microcontroller does not respond with a zero but does generate a fol-
lowing stop condition (see Figure 11 on page 12).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a ran-
dom address read. After the microcontroller receives a data word, it responds with an
acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment
the data word address and serially clock out sequential data words. When the memory
address limit is reached, the data word address will “roll over” and the sequential read will con-
tinue. The sequential read operation is terminated when the microcontroller does not respond
with a zero but does generate a following stop condition (see Figure 12 on page 12).

10 AT24C01A/02/04/08A/16A
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 AT24C01A/02/04/08A/16A

Figure 7. Device Address

MSB

8K

16K

Figure 8. Byte Write

Figure 9. Page Write

(* = DON’T CARE bit for 1K)

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0180Y–SEEPR–2/06
Figure 10. Current Address Read

Figure 11. Random Read

(* = DON’T CARE bit for 1K)

Figure 12. Sequential Read

12 AT24C01A/02/04/08A/16A
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 AT24C01A/02/04/08A/16A

AT24C01A Ordering Information(1)

Ordering Code Package Operation Range
AT24C01A-10PU-2.7(2) 8P3
AT24C01A-10PU-1.8(2) 8P3
AT24C01A-10SU-2.7(2) 8S1
AT24C01A-10SU-1.8(2) 8S1
Lead-free/Halogen-free/
AT24C01A-10TU-2.7(2) 8A2
Industrial Temperature
AT24C01A-10TU-1.8(2) 8A2
(–40°C to 85°C)
AT24C01A-10TSU-1.8(2) 5TS1
AT24C01AU3-10UU-1.8(2) 8U31
AT24C01AY1-10YU-1.8(2) (Not recommended for new design) 8Y1
AT24C01AY6-10YH-1.8(3) 8Y6
AT24C01A-W1.8-11(4) Die Sale Industrial Temperature
(–40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.

Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6 8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1 8-ball, die Ball Grid Away Package (dBGA2)
Options
–2.7 Low-voltage (2.7V to 5.5V)
–1.8 Low-voltage (1.8V to 5.5V)

13
0180Y–SEEPR–2/06
AT24C02 Ordering Information(1)
Ordering Code Package Operation Range
(2)
AT24C02-10PU-2.7 8P3
AT24C02-10PU-1.8(2) 8P3
AT24C02N-10SU-2.7(2) 8S1
AT24C02N-10SU-1.8(2) 8S1 Lead-free/Halogen-free/
AT24C02-10TU-2.7(2) 8A2 Industrial Temperature
AT24C02-10TU-1.8(2) 8A2 (–40°C to 85°C)
AT24C02Y1-10YU-1.8(2) 8Y1
AT24C02-10TSU-1.8(2) 5TS1
AT24C02U3-10UU-1.8(2) 8U3-1
AT24C02-W2.7-11(3) Die Sale Industrial Temperature
(–40°C to 85°C)
Notes: 1. This device is not recommended for new design. Please refer to AT24C02B datasheet. For 2.7V devices used in the 4.5V to
5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.

Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1 8-ball, die Ball Grid Away Package (dBGA2)
Options
–2.7 Low-voltage (2.7V to 5.5V)
–1.8 Low-voltage (1.8V to 5.5V)

14 AT24C01A/02/04/08A/16A
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 AT24C01A/02/04/08A/16A

AT24C04 Ordering Information(1)

Ordering Code Package Operation Range
(2)
AT24C04-10PU-2.7 8P3
AT24C04-10PU-1.8(2) 8P3
AT24C04N-10SU-2.7(2) 8S1
AT24C04N-10SU-1.8(2) 8S1
AT24C04-10TU-2.7(2) 8A2 Lead-free/Halogen-free/
AT24C04-10TU-1.8(2) 8A2 Industrial Temperature
AT24C04Y1-10YU-1.8(2) (Not recommended for new design) 8Y1 (–40°C to 85°C)
AT24C04Y6-10YH-1.8(3) 8Y6
AT24C04-10TSU-1.8(2) 5TS1
AT24C04U3-10UU-1.8(2) 8U3-1
AT24C04-W1.8-11(4) Die Sale Industrial Temperature
(–40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.

Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6 8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1 8-ball, die Ball Grid Away Package (dBGA2)
Options
–2.7 Low-voltage (2.7V to 5.5V)
–1.8 Low-voltage (1.8V to 5.5V)

15
0180Y–SEEPR–2/06
AT24C08A Ordering Information(1)
Ordering Code Package Operation Range
(2)
AT24C08A-10PU-2.7 8P3
AT24C08A-10PU-1.8(2) 8P3
AT24C08AN-10SU-2.7(2) 8S1
AT24C08AN-10SU-1.8(2) 8S1 Lead-free/Halogen-free/
AT24C08A-10TU-2.7(2) 8A2 Industrial Temperature
AT24C08A-10TU-1.8(2) 8A2 (−40°C to 85°C)
AT24C08AY1-10YU-1.8(2) (Not recommended for new design) 8Y1
AT24C08AY6-10YH-1.8(3) 8Y6
AT24C08AU2-10UU-1.8(2 8U2-1
AT24C08A-W1.8-11(4) Die Sale Industrial Temperature
(–40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.

Package Type
8P3 8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6 8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
8U2-1 8-ball, die Ball Grid Array Package (dBGA2)
Options
−2.7 Low Voltage (2.7V to 5.5V)
−1.8 Low Voltage (1.8V to 5.5V)

16 AT24C01A/02/04/08A/16A
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 AT24C01A/02/04/08A/16A

AT24C16A Ordering Information(1)

Ordering Code Package Operation Range
(2)
AT24C16A-10PU-2.7 8P3
AT24C16A-10PU-1.8(2) 8P3
AT24C16AN-10SU-2.7(2) 8S1
AT24C16AN-10SU-1.8(2) 8S1 Lead-free/Halogen-free/
AT24C16A-10TU-2.7(2) 8A2 Industrial Temperature
AT24C16A-10TU-1.8(2) 8A2 (−40°C to 85°C)
AT24C16AY1-10YU-1.8(2) (Not recommended for new design) 8Y1
AT24C16AY6-10YH-1.8(3) 8Y6
AT24C16AU2-10UU-1.8(2) 8U2-1
Industrial Temperature
AT24C16A-W1.8-11(3) Die Sale
(−40°C to 85°C)
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.

Package Type
8P3 8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6 8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
8U2-1 8-ball, die Ball Grid Array Package (dBGA2)
Options
−2.7 Low Voltage (2.7V to 5.5V)
−1.8 Low Voltage (1.8V to 5.5V)

17
0180Y–SEEPR–2/06
Packaging Information

8P3 – PDIP

1
E

E1

Top View c
eA

End View

COMMON DIMENSIONS
D (Unit of Measure = inches)
e
D1 SYMBOL MIN NOM MAX NOTE
A2 A
A – – 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
b2 L D1 0.005 – – 3
b3 E 0.300 0.310 0.325 4
4 PLCS b E1 0.240 0.250 0.280 3
e 0.100 BSC
Side View
eA 0.300 BSC 4
L 0.115 0.130 0.150 2

Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE DRAWING NO. REV.
2325 Orchard Parkway 8P3, 8-lead, 0.300" Wide Body, Plastic Dual
8P3 B
R San Jose, CA 95131 In-line Package (PDIP)

18 AT24C01A/02/04/08A/16A
0180Y–SEEPR–2/06
 AT24C01A/02/04/08A/16A

8S1 – JEDEC SOIC

E E1

N L

∅
Top View
End View
e B
COMMON DIMENSIONS
A
(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A1 A 1.35 – 1.75
A1 0.10 – 0.25
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.00
D
E1 3.81 – 3.99
E 5.79 – 6.20
Side View e 1.27 BSC
L 0.40 – 1.27
∅ 0˚ – 8˚

Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.

10/7/03
TITLE DRAWING NO. REV.
1150 E. Cheyenne Mtn. Blvd. 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Colorado Springs, CO 80906 8S1 B
R
Small Outline (JEDEC SOIC)

19
0180Y–SEEPR–2/06
8A2 – TSSOP

3 2 1

Pin 1 indicator
this corner

E1 E

L1

N
L
Top View End View
COMMON DIMENSIONS
(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A D 2.90 3.00 3.10 2, 5

b E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
A – – 1.20

e A2 A2 0.80 1.00 1.05

b 0.19 – 0.30 4
D
e 0.65 BSC
Side View L 0.45 0.60 0.75
L1 1.00 REF

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H. 5/30/02
TITLE DRAWING NO. REV.
2325 Orchard Parkway 8A2, 8-lead, 4.4 mm Body, Plastic
8A2 B
R San Jose, CA 95131 Thin Shrink Small Outline Package (TSSOP)

20 AT24C01A/02/04/08A/16A
0180Y–SEEPR–2/06
 AT24C01A/02/04/08A/16A

8Y1 – MAP

PIN 1 INDEX AREA

1 2 3 4

PIN 1 INDEX AREA

E1

D D1

8 7 6 5

A1 b e
E

Top View End View Bottom View

COMMON DIMENSIONS
(Unit of Measure = mm)
A
SYMBOL MIN NOM MAX NOTE
A – – 0.90
A1 0.00 – 0.05
D 4.70 4.90 5.10
Side View
E 2.80 3.00 3.20
D1 0.85 1.00 1.15
E1 0.85 1.00 1.15
b 0.25 0.30 0.35
e 0.65 TYP
L 0.50 0.60 0.70

2/28/03
TITLE DRAWING NO. REV.
2325 Orchard Parkway 8Y1, 8-lead (4.90 x 3.00 mm Body) MSOP Array Package
San Jose, CA 95131 8Y1 C
R
(MAP) Y1

21
0180Y–SEEPR–2/06
8Y6 − Mini-MAP (MLP 2x3 mm)

A D2 b
(8X)

Pin 1
Index
Area

E2
E

Pin 1 ID

L (8X)

D
e (6X)
A2 A1
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

D 2.00 BSC
E 3.00 BSC
D2 1.40 1.50 1.60
E2 - - 1.40
A - - 0.60
A1 0.0 0.02 0.05
A2 - - 0.55
A3 0.20 REF
L 0.20 0.30 0.40
e 0.50 BSC
b 0.20 0.25 0.30 2

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
8/26/05
TITLE DRAWING NO. REV.
2325 Orchard Parkway
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map, 8Y6 C
R San Jose, CA 95131 Dual No Lead Package (DFN) ,(MLP 2x3)

22 AT24C01A/02/04/08A/16A
0180Y–SEEPR–2/06
 AT24C01A/02/04/08A/16A

5TS1 – SOT23
e1

5 4 C

E1 E C
L

L1

1 2 3
Top View End View

A2 A

Seating
Plane A1
e

D
Side View COMMON DIMENSIONS
(Unit of Measure = mm)

NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing SYMBOL MIN NOM MAX NOTE
MO-193, Variation AB, for additional information. A – – 1.10
2. Dimension D does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end. A1 0.00 – 0.10
Dimension E1 does not include interlead flash or protrusion. Interlead A2 0.70 0.90 1.00
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions c 0.08 – 0.20 4
D and E1 are determined at the outermost extremes of the plastic body D 2.90 BSC 2, 3
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body. E 2.80 BSC 2, 3
4. These dimensions apply to the flat section of the lead between 0.08 mm E1 1.60 BSC 2, 3
and 0.15 mm from the lead tip.
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar L1 0.60 REF
protrusion shall be 0.08 mm total in excess of the "b" dimension at e 0.95 BSC
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead e1 1.90 BSC
shall not be less than 0.07 mm. b 0.30 – 0.50 4, 5

6/25/03
TITLE DRAWING NO. REV.
1150 E. Cheyenne Mtn. Blvd. 5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
R Colorado Springs, CO 80906 Small Outline Package (SHRINK SOT) PO5TS1 A

23
0180Y–SEEPR–2/06
8U2 – dBGA2

Pin 1 Mark
this corner
D

Top View

- Z -

8 1 COMMON DIMENSIONS
#

(Unit of Measure = mm)

Øb
7 2 0 . 1 5 M Z X Y
SYMBOL MIN NOM MAX NOTE
#

0 . 0 8 M Z

D 5.10
6 3 D1 1.43 TYP
#

d E 3.25
5 4
#

E1 1.25 TYP
D1 e 0.75 TYP
d 0.75 TYP
A2
E1 e A
A 0.90 REF

A1 A1 0.49 0.52 0.55

Bottom View A2 0.35 0.38 0.41
Side View Øb 0.47 0.50 0.53

Notes: 1. These drawings are for general information only. No JEDEC Drawing to refer to for additional information.
2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum Z.
02/04/02

TITLE DRAWING NO. REV.

1150 E. Cheyenne Mtn. Blvd. 8U2, 8-ball 0.75 pitch, Die Ball Grid Array
R Colorado Springs, CO 80906 Package (dBGA) AT24C512 (AT19870) 8U2 A

24 AT24C01A/02/04/08A/16A
0180Y–SEEPR–2/06
 AT24C01A/02/04/08A/16A

8U3-1 – dBGA2

D
1. b

A1
PIN 1 BALL PAD CORNER
A2
Top View
A

PIN 1 BALL PAD CORNER Side View

1 2 3 4
(d1)

8 7 6 5
e
COMMON DIMENSIONS
(Unit of Measure = mm)
(e1)
SYMBOL MIN NOM MAX NOTE
Bottom View A 0.71 0.81 0.91
8 SOLDER BALLS
A1 0.10 0.15 0.20
A2 0.40 0.45 0.50
b 0.20 0.25 0.30
D 1.50 BSC
1. Dimension “b” is measured at the maximum solder ball diameter.
E 2.00 BSC
This drawing is for general information only. e 0.50 BSC
e1 0.25 REF
d 1.00 BSC
d1 0.25 REF

6/24/03
TITLE DRAWING NO. REV.
1150 E. Cheyenne Mtn. Blvd. 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
R Colorado Springs, CO 80906 Small Die Ball Grid Array Package (dBGA2) PO8U3-1 A

25
0180Y–SEEPR–2/06
 Atmel Corporation Atmel Operations
2325 Orchard Parkway Memory RF/Automotive
San Jose, CA 95131, USA 2325 Orchard Parkway Theresienstrasse 2
Tel: 1(408) 441-0311 San Jose, CA 95131, USA Postfach 3535
Fax: 1(408) 487-2600 Tel: 1(408) 441-0311 74025 Heilbronn, Germany
Fax: 1(408) 436-4314 Tel: (49) 71-31-67-0
Fax: (49) 71-31-67-2340
Regional Headquarters Microcontrollers
Europe 2325 Orchard Parkway 1150 East Cheyenne Mtn. Blvd.
Atmel Sarl San Jose, CA 95131, USA Colorado Springs, CO 80906, USA
Route des Arsenaux 41 Tel: 1(408) 441-0311 Tel: 1(719) 576-3300
Case Postale 80 Fax: 1(408) 436-4314 Fax: 1(719) 540-1759
CH-1705 Fribourg
Switzerland La Chantrerie Biometrics/Imaging/Hi-Rel MPU/
Tel: (41) 26-426-5555 BP 70602 High Speed Converters/RF Datacom
Fax: (41) 26-426-5500 44306 Nantes Cedex 3, France Avenue de Rochepleine
Tel: (33) 2-40-18-18-18 BP 123
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Room 1219 Tel: (33) 4-76-58-30-00
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Hong Kong Tel: (33) 4-42-53-60-00
Tel: (852) 2721-9778 Fax: (33) 4-42-53-60-01
Fax: (852) 2722-1369
1150 East Cheyenne Mtn. Blvd.
Japan Colorado Springs, CO 80906, USA
9F, Tonetsu Shinkawa Bldg. Tel: 1(719) 576-3300
1-24-8 Shinkawa Fax: 1(719) 540-1759
Chuo-ku, Tokyo 104-0033
Japan Scottish Enterprise Technology Park
Tel: (81) 3-3523-3551 Maxwell Building
Fax: (81) 3-3523-7581 East Kilbride G75 0QR, Scotland
Tel: (44) 1355-803-000
Fax: (44) 1355-242-743

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www.atmel.com/literature

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0180Y–SEEPR–2/06