LM27

www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013

LM27 SOT-23, ±3°C Accurate, 120°C-150°C Factory Preset Thermostat

Check for Samples: LM27

1FEATURES DESCRIPTION
2• Internal Comparator with Pin Selectable 2°C or The LM27 is a precision, single digital-output, low-
10°C Hysteresis power thermostat comprised of an internal reference,
DAC, temperature sensor and comparator. Utilizing
• No External Components Required factory programming, it can be manufactured with
• Open-drain or Push-pull Digital Output; different trip points as well as different digital output
Supports CMOS Logic Levels functionality. The trip point (TOS) can be preset at the
• Internal Temperature Sensor with VTEMP Output factory to any temperature in the range of +120°C to
+150°C in 1°C increments. The LM27 has one digital
Pin
output (OS/OS/US/US), one digital input (HYST) and
• VTEMP Output Allows After-assembly System one analog output (VTEMP). The digital output stage
Testing can be preset as either open-drain or push-pull. In
• Internal Voltage Reference and DAC for Trip- addition, it can be factory programmed to be active
point Setting HIGH or LOW. The digital output can be factory
programmed to indicate an over temperature
• Currently Available in 5-pin SOT-23 Plastic shutdown event (OS or OS) or an under temperature
Package shutdown event (US or US). When preset as an
• Excellent Power Supply Noise Rejection overtemperature shutdown (OS) it will go LOW to
indicate that the die temperature is over the internally
APPLICATIONS preset TOS and go HIGH when the temperature goes
below (TOS–THYST). Similarly, when preprogrammed
• Microprocessor Thermal Management as an undertemperature shutdown (US) it will go
• Appliances HIGH to indicate that the temperature is below TUS
• Portable Battery Powered Systems and go LOW when the temperature is above
(TUS+THYST). The typical hysteresis, THYST, can be set
• Fan Control to 2°C or 10°C and is controlled by the state of the
• Industrial Process Control HYST pin. A VTEMP analog output provides a voltage
• HVAC Systems that is proportional to temperature and has a
−10.7mV/°C output slope.
• Electronic System Protection
Currently, there are several standard parts available,
KEY SPECIFICATIONS see Table 1. For other part options, contact a Texas
Instruments Distributor or Sales Representative for
• Power Supply Voltage 2.7V to 5.5V information on minimum order qualification. The
• Power Supply Current 40μA (Max), 15μA (Typ) LM27 is currently available in a 5-lead SOT-23
• Hysteresis Temperature 2°C or 10°C (Typ) package.
• Temperature Trip Point Accuracy ±3°C (Max)

Simplified Block Diagram and Connection Diagram LM27CIM5-2HJ (140°C Trip-Point)

TOS
HYST OS
TOS- THYST
HYST
REF Temp. of
GND + Leads
TEMP -
SENSOR OS
VTEMP V+=2.7V
to 5.5V
LM27-2HJ

HYST=GND for 10oC Hysteresis

HYST=V+ for 2oC Hysteresis
VTEMP=(-3.552x10-6x(T-30)2)+(-10.69576x10-3x(T-30))+1.8386V

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2002–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM27
SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com

Table 1. Summary Table of Trip Point and Output Function Capabilities of Released Parts (1)
Orderable Device Trip Point Temperature (°C) Digital Output Function
LM27CIM5-ZHJ 120 Active-Low, Open-Drain, OS output
LM27CIM5-1HJ 130 Active-Low, Open-Drain, OS output
LM27CIM5-2HJ 140 Active-Low, Open-Drain, OS output

(1) Other device options have not been released to market, contact Texas Instruments for volume and other requirements for release.

Connection Diagram

1 5
HYST OS, OS, US
or US
2
LM27
GND

3 4
VTEMP V+

PIN DESCRIPTIONS
Pin Number Pin Name Function Connection
1 HYST Hysteresis control, digital input GND for 10°C or V+ for 2°C
2 GND Ground, connected to the back side of System GND
the die through lead frame.
3 VTEMP Analog output voltage proportional to Leave floating or connect to a high impedance node.
temperature
4 V+ Supply input 2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR
information see NOISE CONSIDERATIONS.
5 (1) OS Overtemperature Shutdown open-drain Controller interrupt, system or power supply shutdown;
active low thermostat digital output pull-up resistor ≥ 10kΩ
OS Overtemperature Shutdown totem-pull Controller interrupt, system or power supply shutdown
active high thermostat digital output
US Undertemperature Shutdown open- System or power supply shutdown; pull-up resistor ≥ 10kΩ
drain active low thermostat digital
output
US Undertemperature Shutdown totem- System or power supply shutdown
pull active high thermostat digital
output

(1) Pin 5 functionality and trip point setting are programmed during LM27 manufacture.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM27

 LM27
www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013

Absolute Maximum Ratings (1)

Input Voltage 6.0V
Input Current at any pin (2) 5mA
Package Input Current (2) 20mA
Package Dissipation at TA = 25°C (3) 500mW
Vapor Phase (60 seconds) 215°C
Soldering Information (4) SOT23 Package
Infrared (15 seconds) 220°C
Storage Temperature −65°C to + 150°C
Human Body Model 2500V
ESD Susceptibility (5)
Machine Model 250V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA.
The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input
current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PD = (TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device,
TJmax = 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted refer to Table 2
(4) See http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.
(5) The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.

Table 2.
Package Type θJA
SOT23-5, DBV 250°C/W

Operating Ratings (1)

Specified Temperature Range TMIN ≤ TA ≤ TMAX
LM27CIM −40°C ≤ TA ≤ +150°C
Positive Supply Voltage (V+) +2.7V to +5.5V
Maximum VOUT +5.5V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: LM27
LM27
SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com

LM27 Electrical Characteristics

The following specifications apply for V+ = 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified.
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C unless otherwise specified.
Parameter LM27CIM Units
Symbol Conditions Typical (1)
Limits (2) (Limits)
Temperature Sensor
Trip Point Accuracy (Includes VREF, DAC, +120°C<TA<+150°C ±3 °C (max)
Comparator Offset, and Temperature
Sensitivity errors)
Trip Point Hysteresis HYST = GND 10 °C
HYST = V+ 2 °C
VTEMP Output Temperature Sensitivity −10.82 mV/°C
VTEMP Temperature Sensitivity Error to −30°C ≤ TA ≤ 150°C, 2.7V ≤ ±3 °C (max)
Equation: V+ ≤ 5.5V
VO = (−3.552×10−6×(T−30)2+ −55°C ≤ TA ≤ 150°C, 4.5V ≤ ±3 °C (max)
(−10.695×10−3×(T−30))+ 1.8386V (1) V+ ≤ 5.5V
TA = 25°C ±2.5 °C (max)
VTEMP Load Regulation Source ≤ 1 μA 0.070 mV
Sink ≤ 40 μA 0.7 mV (max)
VTEMP Line Regulation +2.7V ≤ V+ ≤ +5.5V, −0.2 mV/V
−30°C ≤ TA ≤ +120°C
IS Supply Current 15 22 µA (max)
40 µA (max)
Digital Output and Input
IOUT(“1”) Logical “1” Output Leakage Current (3) V+ = +5.0V 0.001 1 µA (max)
VOUT(“0”) Logical “0” Output Voltage IOUT = +1.2mA and 0.4 V (max)
V+≥2.7V; IOUT = +3.2mA
and V+≥4.5V (4)
VOUT(“1”) Logical “1” Push-Pull Output Voltage ISOURCE = 500µA, V+ ≥ 2.7V 0.8 × V+ V (min)
ISOURCE = 800µA, V+≥4.5V V+ − 1.5 V (min)
+
VIH HYST Input Logical ”1“ Threshold Voltage 0.8 × V V (min)
VIL HYST Input Logical ”0“ Threshold Voltage 0.2 × V+ V (max)

(1) Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
(2) Limits are ensured to AOQL (Average Outgoing Quality Level).
(3) The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the
current for every 15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C.
(4) Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the
LM27 would increase by 1.28mW when IOUT=3.2mA and VOUT=0.4V. With a thermal resistance of 250°C/W, this power dissipation
would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point
accuracy specification.

4 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM27

 LM27
www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013

Part Number Template

The series of digits labeled xyz in the part number LM27CIM-xyz, describe the set point value and the function of
the output as follows:
The place holders xy describe the set point temperature as shown in the following table.

x (10x) y (1x) Temperature (°C)

- H 0
- J 1
- K 2
- L 3
- N 4
- P 5
- R 6
- S 7
- T 8
- V 9
Z - 12
1 - 13
2 - 14
3 - 15

The value of z describes the assignment/function of the output as shown in the following table:

Open-Drain/ Push-
Active-Low/High OS/US Value of z Digital Output Function
Pull
0 0 0 J Active-Low, Open-Drain, OS output
0 0 1 K Active-Low, Open-Drain, US output
1 1 0 L Active-High, Push-Pull, OS output
1 1 1 N Active-High, Push-Pull, US output

For example:
• the part number LM27CIM5-2SJ has TOS = 147°C, and programmed as an active-low open-drain
overtemperature shutdown output.
• the part number LM27CIM5-ZLN has TUS = 123°C, and programmed as an active-high, push-pull
undertemperature shutdown output.
Active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more
information.
Note: Currently, there are several standard parts available, see Table 1. For other part options, contact a Texas
Instruments Distributor or Sales Representative for information on minimum order qualification

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: LM27
LM27
SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com

FUNCTIONAL DESCRIPTION

LM27 OPTIONS — Output Pin Options Block Diagrams

HYST OS HYST US
HYST HYST
REF REF
GND + GND -
TEMP - TEMP +
SENSOR SENSOR
VTEMP V+ VTEMP V+
LM27__J LM27__K

Figure 1. LM27-_ _J Figure 2. LM27-_ _K

HYST V+ OS HYST V+ US
HYST HYST
REF REF
+ -
GND GND
TEMP - TEMP +
SENSOR SENSOR
VTEMP V+ VTEMP V+
LM27__L LM27__N

Figure 3. LM27-_ _L Figure 4. LM27-_ _N

The LM27 can be factory programmed to have a trip point anywhere in-between 120°C to 150°C.

Applications Hints

AFTER-ASSEMBLY PCB TESTING

The LM27's VTEMP output allows after-assembly PCB testing by following a simple test procedure. Simply
measuring the VTEMP output voltage will verify that the LM27 has been assembled properly and that its
temperature sensing circuitry is functional. The VTEMP output has very weak drive capability that can be
overdriven by 1.5mA. Therefore, one can simply force the VTEMP voltage to cause the digital output to change
state, thereby verifying that the comparator and output circuitry function after assembly. Here is a sample test
procedure that can be used to test the LM27CIM5X-2HJ which has a 140°C trip point.
1. Turn on V+ and measure VTEMP. Then calculate the temperature reading of the LM27 using the equation:
VO = (−3.552×10−6×(T−30)2) + (−10.69576×10−3×(T−30)) + 1.8386V (2)
or
1.8386 - VTEMP
T = -1475.49 + 2.2668 x 106 +
3.552 x 10-6 (3)
2. Verify that the temperature measured in step one is within (±3°C + error of reference temperature sensor) of
the ambient/board temperature. The ambient/board temperature (reference temperature) should be
measured using an extremely accurate calibrated temperature sensor, which is in close proximity to and
mounted on the same PCB as the LM27 perhaps even touching the GND lead of the LM27 if possible. The
LM27 will sence the board temperature not the ambient temperature (see MOUNTING CONSIDERATIONS)
3.
(a) Observe that OS is high.
(b) Drive VTEMP to ground.
(c) Observe that OS is now low.
(d) Release the VTEMP pin.
(e) Observe that OS is now high.
4.
(a) Observe that OS is high.
(b) Drive VTEMP voltage down gradually.
(c) When OS goes low, note the VTEMP voltage.
(d) VTEMPTrig = VTEMP at OS trigger (HIGH->LOW)
(e) Calculate Ttrig using Equation 3.

6 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM27

 LM27
www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013

5.
(a) Gradually raise VTEMP until OS goes HIGH. Note VTEMP.
(b) Calculate THYST using Equation 3.

VTEMP LOADING
The VTEMP output has very weak drive capability (1 µA source, 40 µA sink). So care should be taken when
attaching circuitry to this pin. Capacitive loading may cause the VTEMP output to oscillate. Simply adding a resistor
in series as shown in Figure 6 will prevent oscillations from occurring. To determine the value of the resistor
follow the guidelines given in Table 3. The same value resistor will work for either placement of the resistor. If an
additional capacitive load is placed directly on the LM27 output, rather than across CLOAD, it should be at least a
factor of 10 smaller than CLOAD.

Table 3. Resistive compensation for capacitive loading of VTEMP

CLOAD R (Ω)
≤100pF 0
1nF 8200
10nF 3000
100nF 1000
≥1µF 430

Resistor placement for capacitive loading compensation of VTEMP

Heavy Capacitive
OS/OS/US/
Load, Cable/Wiring HYST
US
GND LM27
VTEMP V+
CLOAD
0.1PF
R

Figure 5. R in series with capacitor

Heavy Capacitive
OS/OS/US/
Load, Cable/Wiring HYST
US
R GND LM27
VTEMP V+

CLOAD 0.1Pf

Figure 6. R in series with signal path

NOISE CONSIDERATIONS
The LM27 has excellent power supply noise rejection. Listed below is a variety of signals used to test the LM27
power supply rejection. False triggering of the output was not observed when these signals where coupled into
the V+ pin of the LM27.
• square wave 400kHz, 1Vp-p
• square wave 2kHz, 200mVp-p
• sine wave 100Hz to 1MHz, 200mVp-p
Testing was done while maintaining the temperature of the LM27 one degree centigrade way from the trip point
with the output not activated.

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Links: LM27
LM27
SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com

MOUNTING CONSIDERATIONS
The LM27 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued
or cemented to a surface. The temperature that the LM27 is sensing will be within about +0.06°C of the surface
temperature to which the LM27's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature measured would
be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity, the backside of the LM27 die is directly attached to the GND pin (pin 2).
The temperatures of the lands and traces to the other leads of the LM27 will also affect the temperature that is
being sensed.
Alternatively, the LM27 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LM27 and accompanying wiring and circuits must be
kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy
paints or dips are often used to ensure that moisture cannot corrode the LM27 or its connections.
The junction to ambient thermal resistance (θJA) is the parameter used to calculate the rise of a part's junction
temperature due to its power dissipation. For the LM27 the equation used to calculate the rise in the die junction
temperature is as follows:
TJ = TA + 4JA(V+IQ + (V+ - VTEMP)IL_TEMP + VDOIDO)
(4)
+
where TA is the ambient temperature, V is the power supply voltage, IQ is the quiescent current, IL_TEMP is the
load current on the VTEMP output, VDO is the voltage on the digital output, and IDO is the load current on the digital
output. Since the LM27's junction temperature is the actual temperature being measured, care should be taken
to minimize the load current that the LM27 is required to drive.
The tables shown in Table 4 summarize the thermal resistance for different conditions and the rise in die
temperature of the LM27 without any loading on VTEMP and a 10k pull-up resistor on an open-drain digital output
with a 5.5V power supply.

Table 4. Thermal resistance (θJA) and temperature rise due to self heating (TJ−TA)
SOT23-5 SOT23-5
no heat sink small heat sink
θJA TJ−TA θJA TJ−TA
(°C/W) (°C) (°C/W) (°C)
Still Air 250 0.11 TBD TBD
Moving Air TBD TBD TBD TBD

Typical Applications
12V
System Fan
Sanyo Denki
109R0612T4H12
HYST OS
GND LM27
+5V
VTEMP V+ 10k

0.1PF

The fan's control pin has internal pull-up. The 10k pull-down sets a slow fan speed. When the output of the LM27
goes low, the fan will speed up.

Figure 7. Two Speed Fan Speed Control

8 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM27

 LM27
www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013

5V

HYST OS
GND LM27 R1 NDS356P
VTEMP V+ (100k)

0.1 1N4001
5V
5V Fan
MC05J3
Comair-Rotron

Figure 8. Fan High Side Drive

12V

1N4001

Vout
TOYO
HYST OS USTF802512HW
GND LM27 R1
VTEMP V+ (10k) 2N2222

0.1 5V

Figure 9. Fan Low Side Drive

5V
THERMALLY COUPLED

8: +28V HYST IC2 OS

+ GND LM27 NDS356P
- VTEMP V+ 100k
IC1 -28V
LM3886
1N4001
Audio 5V
0.1PF
20k Input
3.3PF
1k 47k

5V Fan
10PF MC05J3
Comair-Rotron

Figure 10. Audio Power Amplifier Thermal Protection

5V

HYST OS
GND LM27 R1 Heater
VTEMP V+ (10k) Supply

0.1 Heater
5V

Figure 11. Simple Thermostat

Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Links: LM27
LM27
SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com

REVISION HISTORY

Changes from Revision B (March 2013) to Revision C Page

• Deleted layout of National Data Sheet to TI format .............................................................................................................. 9

10 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated

Product Folder Links: LM27

 PACKAGE OPTION ADDENDUM

www.ti.com 26-Jul-2016

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LM27-2PL MDA ACTIVE DIESALE Y 0 7000 Green (RoHS Call TI Level-1-NA-UNLIM -40 to 85
& no Sb/Br)
LM27CIM5-1HJ/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM 120 to 150 T1HJ
& no Sb/Br)
LM27CIM5-2HJ/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM 120 to 150 T2HJ
& no Sb/Br)
LM27CIM5-ZHJ/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM 120 to 150 TZHJ
& no Sb/Br)
LM27CIM5X-1HJ/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM T1HJ
& no Sb/Br)
LM27CIM5X-2HJ/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM T2HJ
& no Sb/Br)
LM27CIM5X-ZHJ/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM TZHJ
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 26-Jul-2016

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM27CIM5-1HJ/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM27CIM5-2HJ/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM27CIM5-ZHJ/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM27CIM5X-1HJ/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM27CIM5X-2HJ/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM27CIM5X-ZHJ/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM27CIM5-1HJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM27CIM5-2HJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM27CIM5-ZHJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM27CIM5X-1HJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LM27CIM5X-2HJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LM27CIM5X-ZHJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

Pack Materials-Page 2
 IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated