® TDA7267A

3W MONO AMPLIFIER

CAN DELIVER 3W THD 10% 14.5V/8Ω

INTERNAL FIXED GAIN 32dB
NO FEEDBACK CAPACITOR
NO BOUCHEROT CELL
THERMAL PROTECTION

( s )
ct
AC SHORT CIRCUIT PROTECTION
SVR CAPACITOR FOR BETTER RIPPLE
REJECTION
LOW TURN-ON/OFF POP u
PowerDIP 8+8

d
STAND-BY MODE
r o
e P
ORDERING NUMBER: TDA7267A

DESCRIPTION
l e t
The device TDA7267A is a new technology Mono
Audio Amplifier in PowerDIP package specifically
s o
designed for TV application.
Thanks to the fully complementary output configu- O b
ration the device delivers a rail to rail voltage

BLOCK DIAGRAM
) - swing without need of boostrap capacitors.

c t (s
d u
r o
e P VS
VS=14.5V

let
C4
1 100µF

s o
Ob IN
C1 0.1µF
IN 4
+ 2
C5 470µF

- OUT
SVR 3
8Ω

C3
47µF 6 9 to 16
S-GND P-GND
D98AU827

June 1998 1/7

TDA7267A

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit
VS Operating Supply Voltage 18 V
IO Output Put Peak Current 1.5 A
Top Operating Temperature Range 0 to 70 °C
Tj Junction Temperature 150 °C
Tstg Storage Temperature Range -40 to 125 °C

PIN CONNECTION (Top view)

( s )
VS 1 16 P-GND
u ct
OUT 2 15 P-GND
o d
SVR 3 14 P-GND
P r
IN 4 13
e
P-GND

e t
N.C. 5 12

o lP-GND

bs
S-GND 6 11 P-GND
N.C. 7 10 P-GND
N.C. 8
- O 9 P-GND

( s ) D98AU829

c t
d u
Rth with "on Board" Square Heat Sink vs. Copper
Area
r o Example of heatsink using PC board copper

e P
let
THERMAL RESISTANCE JUNCTION TO AMBIENT(˚C/W)

D98AU830
54

s o 52

O b 50
48
46
44
42
40
38
36
34
0 2 4 6 8 10 12
ON BOARD HEAT-SINK AREA (sq.cm)

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 TDA7267A

THERMAL DATA
Symbol Parameter Value Unit
Rth j-amb Thermal Resistance Junction to ambient 70 °C/W
Rth j-case Thermal Resistance Junction to case 15 °C/W

ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 14.5V; RL = 8Ω; f = 1KHz; unless otherwise

specified.)
Symbol Parameter Test Condition Min. Typ. Max. Unit
VS Supply Voltage Range 5 18 V

)
IS Quiescent Current 23 35 mA
Isb
VO
Stand-By Current
Quiescent Output Voltage
Pin 3 shorted to GND
7.5
0.3

t ( smA
V
AV Voltage Gain 31
u c 33 dB
RIN Input Impedance 50

o
100
d KΩ
PO
THD
Output Power
Distortion
THD = 10%
PO = 1W
2.7

P r 0.1
3
0.3
W
%
SVR Supply Voltage Rejection Vripple = 150mVrms;
Fripple = 1KHz
e t e 50 dB

ol
EI Input Noise Voltage Rg = 10KΩ; BW = 20Hz to 20KHz 5 10 µV

bs
Vsb Stand-By Enable Voltage 1 V

Figure 1. Application Circuit

- O
( s)
c t
d u VS=14.5V

o VS

Pr
C4
1 100µF

e t e C1 0.1µF
IN 4 2
C5 470µF

l IN

so
OUT
SVR

O b 3
6 9 to 16
8Ω

STAND-BY C3
47µF S-GND P-GND
D98AU828

APPLICATION HINTS: must be equal to: (150 - 70)/1.8 = 44.4°C/W.

For 14.5V supply and 8Ω speaker application, its Junction to pin thermal resistance of the package
maximum power dissipation is about 1.8W. is about 15°C/W. That means external heat sink
of about 30°C/W is required.
Assumming that max ambient temperature is
70°C, the required thermal resistance of the de- Cu ground plane of PCB can be used as heat dis-
vice mounted on the PCB with a dissipating area sipating means.

3/7
 TDA7267A

Figure 2. PCB And Components Layout Of The Application Circuit of Figure 1

( s )
u ct
o d
P r
e t e
Components C2 and C6 must be ignored.

o l
b s
- O
(s )
c t
Figure 3. Distortion vs Output Power

d u Figure 4. Distortion vs Output Power

10
THD+N(%)

r o 10
THD+N(%)

e P
l e t
1

s o 1

O b f = 1KHz
0.1 f = 10KHz
0.1

0.010
0.1 1 5 0.010
0.1 1 5
Pout(W) Pout(W)

Remark: all the characterization curves refer to the electrical test conditions.

4/7
 TDA7267A

Figure 5. Distortion vs Output Power Figure 6. Output Power vs Supply Voltage

THD+N(%) Pout (W)
10 10

f = 1KHz
1 THD=10%

f = 1KHz
1 THD= 1%

f = 15KHz
0.1

( s )
0.010
0.1 1 5
0.1
4.000 6.000 8.000 10.00 12.00

u
14.00
ct
16.00 18.00 20.00
Pout(W) Vs(V)

o d
Figure 7. Distortion vs Frequency
P r
Figure 8. Quiescent current vs Supply Voltage

10
THD(%)
30
Iq(mA)

e t e
o l
25

b s
1
O
)-
20
Pout = 1W
Vs = 14.5V
Rl = 8 Ohm

t ( s 15
0.1

u c
o d 10

0.010
P r 5
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
100

e te 1k
f(Hz)
10k 20k
Vs(V)

o l
s
Figure 9. Power dissipation vs Output Power

b
O
Pd(W)
1.9

1.8

1.7

Vs = 14.5V
1.6
Rl = 8 Ohm
F = 1KHz
1.5

1.4

1.3
0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Pout(W)

5/7
 TDA7267A

POWERDIP 8+8 PACKAGE MECHANICAL DATA

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.

a1 0.51 0.020

B 0.77 1.65 0.030 0.065

b 0.5 0.020

b1 0.25 0.010

( s )
ct
D 20 0.787

E 8.5 0.335

d u
e 2.54
o
0.100
r
e3 17.78

e P 0.700

F 7.1

l e t 0.280

I 5.1
s o 0.201

L 3.3
O b 0.130

)-
Z 1.27 0.050

t ( s
uc
o d
P r
e te
o l
b s
O

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 TDA7267A

( s )
u ct
o d
P r
e t e
o l
b s
- O
(s )
c t
d u
r o
e P
l e t
s o
O b

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1998 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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Mouser Electronics

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