TDA7266SAN

5 W + 5 W dual bridge amplifier

Datasheet − production data

Features
■ Wide supply voltage range (3.5 - 13 V)
■ Minimum external components
– No SWR capacitor
– No bootstrap
( s )
– No Boucherot cells
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– Internally fixed gain
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CLIPWATT15
■ Standby & mute functions
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■ Short-circuit protection

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■ Thermal overload protection

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Description
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The TDA7266SAN is a dual bridge amplifier
specifically designed for LCD monitors, PC
O bTable 1. Device summary

)-
Part number Package Packing
motherboards, TVs and portable radio

t(s
applications. TDA7266SAN Clipwatt15 Tube

The device is pin-to-pin compatible with the

TDA7266, TDA7266SA, TDA7297SA and
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TDA7297.
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August 2012 Doc ID 023621 Rev 1 1/15

This is information on a product in full production. www.st.com 15
 Contents TDA7266SAN

Contents

1 Block diagram and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

( s )
4
ct
Application suggestions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
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d
Standby and mute functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
o
4.1 r
Microprocessor application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
P
4.2
e
Low-cost application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

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5
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Characterization curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

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6
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PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
-
7
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Heatsink dimensioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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8
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Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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9
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Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
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 TDA7266SAN Block diagram and pin connections

1 Block diagram and pin connections

Figure 1. Block and application diagram

VCC

470µF 100nF
3 13
0.22µF
4
IN1 + 1 OUT1+
-
ST-BY 7

( s )
S-GND
u ct
9
Vref
- 2 OUT1-

o d
IN2
0.22µF
12
+

+ 15 P r
OUT2+
-
e t e
MUTE 6
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O
)-
- 14 OUT2-
PW-GND
8

t ( s +

u c D94AU175B

Figure 2.
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Pin connections (top view)

P r
e
let
15 OUT2+
14 OUT2-

so
13 VCC
12 IN2

b
11 N.C.
10 N.C.

O 9
8
7
S-GND
PW-GND
ST-BY
6 MUTE
5 N.C.
4 IN1
3 VCC
2 OUT1-
1 OUT1+

D03AU1463

Doc ID 023621 Rev 1 3/15

 Electrical specifications TDA7266SAN

2 Electrical specifications

2.1 Absolute maximum ratings

Table 2. Absolute maximum ratings
Symbol Parameter Value Unit

VS Supply voltage 13 V
IO Output peak current (internally limited) 2 A
Ptot Total power dissipation (Tamb = 70 °C) 15 W
Top Operating temperature 0 to 70

( s
°C
)
ct
Tstg, Tj Storage and junction temperature -40 to 150 °C

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2.2 Thermal data
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Table 3. Thermal data
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Symbol Parameter
l e t Value Unit

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bs
Rth j-case Thermal resistance junction-case Typ = 1.8; Max = 2.5 °C/W
Rth j-amb Thermal resistance junction-ambient 48 °C/W

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TDA7266SAN Electrical characteristics

3 Electrical characteristics

Unless otherwise stated, the values in the table below are given for conditions VCC = 9.5 V,
RL = 8 Ω, f = 1 kHz, Tamb = 25 °C.

Table 4. Electrical characteristics

Symbol Parameter Test condition Min. Typ. Max Unit

VCC Supply range 3 9.5 13 V

Iq Total quiescent current 50 65 mA
VOS Output offset voltage 120 mV
PO Output power THD 10% 4.5 5
( s ) W
PO = 1 W 0.05

u ct
0.2 %
THD Total harmonic distortion PO = 0.1 W to 2 W

o d 1 %

SVR Supply voltage rejection

f = 100 Hz to 15 kHz
f = 100 Hz, VR = 0.5 V 40
P r 56 dB

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let
CT Crosstalk 46 60 dB
AMUTE Mute attenuation 60 80 dB
TW Thermal threshold
s o 150 °C
GV Closed loop voltage gain
O b 25 26 27 dB
ΔGV Voltage gain matching
) - 0.5 dB
Ri Input resistance

t ( s 25 30 kΩ

VTMUTE Mute threshold

u c
for VCC > 6.4 V; VO = -30 dB 2.3 2.9 4.1 V

o d for VCC < 6.4 V; VO = -30 dB VCC/2 - 1 VCC/2 - 0.75 VCC/2 - 0.5 V

Pr
VTST-BY St-by threshold 0.8 1.3 1.8 V
IST-BY St-by current V6 = GND 100 µA
eN
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Total output voltage A curve; f = 20 Hz to 20 kHz 150 µV

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Application suggestions TDA7266SAN

4 Application suggestions

Standby and mute functions

4.1 Microprocessor application

In order to avoid annoying "pop noise" during turn-on/off transients, the correct sequence of
the st-by and mute signals must be ensured which is quite simple when using a
microprocessor (Figure 3 and 4).
First the st-by signal (from the microprocessor) goes high and the voltage across the st-by
terminal (pin 7) starts to increase exponentially. The external RC network is intended to turn
( s )
ct
on slowly the biasing circuits of the amplifier, in order to avoid "pop" and "click" on the
outputs.

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When this voltage reaches the st-by threshold level, the amplifier is switched on, and the

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external capacitors in series to the input terminals (C3, C53) start to charge.
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P
The mute signal must be held low until the capacitors are fully charged, in order to avoid that

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the device goes in play mode causing a loud "pop noise" on the speakers.
A delay of 100 - 200 ms between the st-by and mute signals is suitable for proper operation.

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Figure 3. Microprocessor application

O b VCC

C1 0.22µF

( s 4 )- 3 13
C5
470µF
C6
100nF
IN1

c t +
-
1 OUT1+

du
ST-BY R1 10K
7

o
C2

P r 10µF

ete
S-GND
µP 9

ol
- 2 OUT1-
Vref
+

bs
C3 0.22µF
12
IN2 + 15 OUT2+

O MUTE R2 10K

C4
6
-

1µF

- 14 OUT2-
PW-GND
8 +
D95AU258A

6/15 Doc ID 023621 Rev 1

 TDA7266SAN Application suggestions

Figure 4. Microprocessor driving signals

+VS(V)

VIN
(mV)

VST-BY
pin 7
1.8

1.3

( s )
0.8

VMUTE
u ct
pin 6

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4.1

2.9
P r
2.3

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Iq
(mA)

- O
(s )
c t
VOUT
(V)
d u
r
OFF
o
e P ST-BY
MUTE
PLAY MUTE ST-BY OFF
D96AU259mod

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 Application suggestions TDA7266SAN

4.2 Low-cost application

In low-cost applications where the microprocessor is not present, the recommended circuit
is shown in Figure 5.
The st-by and mute terminals are tied together and they are connected to the supply line via
an external voltage divider.
The device is switched on/off from the supply line and the external capacitor C4 is used to
delay exceeding the st-by and mute threshold in order to avoid "popping" noise.

Figure 5. Standalone low-cost application

VCC

( s )
ct
C1 C2
C3 0.22µF 3 13 470µF 100nF
4
R1
47K
IN1 + 1 OUT1+

d u
o
-

R2 C4
ST-BY
7

P r
47K 10µF

e t e
o l
S-GND
9
b s
Vref

- O -
+
2 OUT1-

C5 0.22µF
12

(s ) + 15 OUT2+
IN2

c t -

u
od MUTE

Pr
6

e t e
s ol PW-GND
- 14 OUT2-

O b 8 +
D95AU260A

8/15 Doc ID 023621 Rev 1

TDA7266SAN Characterization curves

5 Characterization curves

Figure 6. Distortion vs. frequency Figure 7. Gain vs. frequency

THD(%) Le vel(dB r)
10 5.0000
4.0000
Vcc = 9.5 V
3.0000 Rl = 8 oh m
V cc = 9.5 V
Po ut = 1W
Rl = 8 o h m 2.0000
1
1.0000

0.0

-1.000
P o u t = 100 m W

)
0.1
-2.000

-3.000

( s
ct
P o u t = 2W
-4.000

du
0.0 10
100 1k 10k 20k
-5.000
10 100 1k 10k 100k
fr eq ue nc y (Hz)

o
fr equenc y (Hz)

Figure 8. Mute attenuation vs. Vpin 6 Figure 9.

P r
Quiescent current vs. supply

e t evoltage

ol
Attenua tion (dB) Iq (mA)
10 70
0
-10
b s 65

-20
O 60

)-
-30 55
-40

s
50
-50
-60
-70
c t ( 45

u
40

d
-80
35

o
-90

Pr
-100 30
1 1.5 2 2.5 3 3.5 4 4.5 5 3 4 5 6 7 8 9 10 11 12 13 14 15

Vpin .6(V) Vsupply (V)

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ol
Figure 10. Standby attenutation vs. Vpin 7

bs
Attenuation (dB)
10
0

O -10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4
Vpin.7 (V)

Doc ID 023621 Rev 1 9/15

 PCB layout TDA7266SAN

6 PCB layout

Figure 11. Reference board component layout

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Figure 12. Reference board top layer layout

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s o Figure 13. Reference board bottom layer layout

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 TDA7266SAN Heatsink dimensioning

7 Heatsink dimensioning

In order to avoid triggering the thermal protection which is set approximatively at Tj = 150°C,
it is important to correctly dimension the heat sinker RTh (°C/W).
The parameters that influence the dimensioning are:
● Maximum dissipated power for the device (Pdmax)
● Max. thermal resistance junction to case (RTh j-c)
● Max. ambient temperature Tamb max
● Quiescent current Iq (mA)
Example:
VCC = 9.5 V, Rload = 8 ohm, RTh j-c = 2.5 °C/W , Tamb max = 50 °C
( s )
u ct
o V CC
2
P dmax = ( N channels ) • --------------------------- + I q • V CC
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2 R load
Π • --------------
2
P r
e t e
P dmax = 2 • ( 2.3 ) + 0.47 = 5.07W
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- O
( HeatSinker )R Th c–a

(s )
150 – T amb max
P dmax
- – R Th
= ----------------------------------------- j – c=
⎛ 150 – 50- – 2.5⎞ = 17.2 o C/W
---------------------
⎝ 5.07 ⎠

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Figure 14 shows the power derating curve for the device.
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Figure 14. Power derating curve

e P 25

l e t
so 20

O b 15
(a)
a) Infinite Heatsink
Pd (W)

b) 7 °C/ W
(b)
10 c) 10 °C/ W

(c)
5

0
0 40 80 120 160
Tamb (°C)

Doc ID 023621 Rev 1 11/15

 Package mechanical data TDA7266SAN

8 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

Clipwatt assembly suggestions

The recommended mounting method of the Clipwatt on an external heatsink requires the
use of a clip placed as close as possible to the center of the plastic body, as indicated in the
example of Figure 15.

s
A thermal grease can be used in order to reduce the additional thermal resistance of the
( )
ct
contact between the package and heatsink.

d u
A force of 7 - 10 kg gives a good contact and the clip must be designed in order to withstand
a maximum contact pressure of 15 kg/mm2 between itself and the plastic body case.

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For example, if a 15 kg force is applied by the clip on the package, the clip must have a
contact area of at least 1 mm2.
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Figure 15. Example of right placement of the clip
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 TDA7266SAN Package mechanical data

Figure 16. Clipwatt15 package outline and mechanical data

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX. OUTLINE AND
MECHANICAL DATA
A 3.2 0.126

B 1.05 0.041

C 0.15 0.006 Weight: 1.92gr

D 1.55 0.061

E 0.49 0.55 0.019 0.022

F 0.67 0.73 0.026 0.029

G 1.14 1.27 1.4 0.045 0.050 0.055

( s )
ct
G1 17.57 17.78 17.91 0.692 0.700 0.705

H1 12 0.480

H2 18.6 0.732
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H3 19.85 0.781
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L 17.95 0.707

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L1

L2 10.7
14.45

11 11.2 0.421
0.569

0.433 0.441
l e t
L3 5.5 0.217
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M

M1
2.54

2.54
0.100

0.100
O b Clipwatt15

) -
c t (s
d u
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e P
l e t
s o
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0044538

Doc ID 023621 Rev 1 13/15

 Revision history TDA7266SAN

9 Revision history

Table 5. Document revision history

Date Revision Changes

31-Aug-2012 1 Initial release.

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 TDA7266SAN

Please Read Carefully:

( s )
u ct
d
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the

o
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
P r
t e
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no

e
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

o l
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this

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document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
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) -
(s
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c t
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS

u
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

o d
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b s
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Doc ID 023621 Rev 1 15/15