TLP2161
Photocouplers Infrared LED & Photo IC
TLP2161
1. Applications
• Factory Networking
• High-Speed Digital Interfacing for Instrumentation and Control Devices
• I/O Interface Boards
2. General
The Toshiba TLP2161 consists of a high-output infrared LED coupled with a high-speed photo-diode-transistor
chip. It is housed in the SO8 package. It has two circuits built into a single SO8 package, which can reduce the
mounting area.
This photocoupler guarantees operation at up to 125 and on supplies from 2.7 V to 5.5 V. Since TLP2161 has
guaranteed 2 mA low supply current (ICCL/ICCH), and 1.6 mA (Ta = 125 ) low threshold input current(IFHL), it
contributes to energy saving of devices. It can drive directly from a microcomputer for a low input current.
The TLP2161 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of
±20 kV/µs.
3. Features
(1) Inverter logic type (Totem pole output)
(2) Package: SO8
(3) Operating temperature: -40 to 125
(4) Supply voltage: 2.7 to 5.5 V
(5) Data transfer rate: 15 MBd (typ.) (NRZ)
(6) Threshold input current: 1.3 mA (max) (@Ta = 105 )
: 1.6 mA (max) (@Ta = 125 )
(7) Supply current: 2 mA (max)
(8) Common-mode transient immunity: ±20 kV/µs (min)
(9) Isolation voltage: 2500 Vrms (min)
(10) Safety standards
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN 60747-5-5 (Note 1)
Note 1: When a VDE approved type is needed, please designate the Option (V4)
(V4).
Start of commercial production
2013-09
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4. Packaging and Pin Assignment
1: Anode1
2: Cathode1
3: Cathode2
4: Anode2
5: GND
6: VO2 (Output2)
7: VO1 (Output1)
8: VCC
11-5K1S
5. Internal Circuit (Note)
Note: A 0.1-µF bypass capacitor must be connected between pin 8 and pin 5.
6. Principle of Operation
6.1. Truth Table
Input LED1(2) M1(3) M2(4) Output1(2)
H ON OFF ON L
L OFF ON OFF H
6.2. Mechanical Parameters
Characteristics Min Unit
Creepage distances 4.2 mm
Clearance 4.2
Internal isolation thickness
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7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics Symbol Note Rating Unit
LED Input forward current IF (Note 1) 10 mA
Input forward current derating (Ta ≥ 110 ) ∆IF/∆Ta (Note 1) -0.13 mA/
Input forward current (pulsed) IFP (Note 1), 40 mA
(Note 2)
Input forward current derating (Ta ≥ 110 ) ∆IFP/∆Ta (Note 1) -1.0 mA/
(pulsed)
Peak transient input forward IFPT (Note 1), 1 A
current (Note 3)
Peak transient input forward (Ta ≥ 110 ) ∆IFPT/∆Ta (Note 1) -25 mA/
current derating
Input power dissipation PD (Note 1) 20 mW
Input power dissipation (Ta ≥ 110 ) ∆PD/∆Ta (Note 1) -0.5 mW/
derating
Input reverse voltage VR (Note 1) 5 V
Detector Output current IO (Note 1) 10 mA
Output voltage VO (Note 1) 6 V
Supply voltage VCC 6
Output power dissipation PO (Note 1) 20 mW
Output power dissipation (Ta ≥ 110 ) ∆PO/∆Ta (Note 1) -0.5 mW/
derating
Common Operating temperature Topr -40 to 125
Storage temperature Tstg -55 to 150
Lead soldering temperature (10 s) Tsol 260
Isolation voltage (AC, 60 s, R.H. ≤ 60 %) BVS (Note 4) 2500 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Each channel
Note 2: Pulse width (PW) ≤ 1 ms, duty = 50 %
Note 3: Pulse width (PW) ≤ 1 µs, 300 pps
Note 4: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
8. Recommended Operating Conditions (Note)
Characteristics Symbol Note Min Typ. Max Unit
Input on-state current IF(ON) (Note 1), 2 6 mA
(Note 2)
Input off-state voltage VF(OFF) (Note 1) 0 0.8 V
Supply voltage VCC (Note 3) 2.7 3.3 / 5.0 5.5
Operating temperature Topr (Note 3) -40 125
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 8 and pin 5 to stabilize the operation of a high-
gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: Each channel
Note 2: The rise and fall times of the input on-current should be less than 0.5 µs.
Note 3: Denotes the operating range, not the recommended operating condition.
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9. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125 , VCC = 2.7 to 5.5 V)
Test
Characteristics Symbol Note Test Condition Min Typ. Max Unit
Circuit
Input forward voltage VF (Note 1) IF = 2 mA, Ta = 25 1.35 1.50 1.65 V
Input forward voltage ∆VF/∆Ta (Note 1) IF = 2 mA -2.0 mV/
temperature coefficient
Input reverse current IR (Note 1) VR = 5 V, Ta = 25 10 µA
Input capacitance Ct (Note 1) V = 0 V, f = 1 MHz , Ta = 25 20 pF
Low-level output voltage VOL (Note 1) Fig. IF = 2 mA, IO = 20 µA 0.1 V
12.1.1 I = 2 mA, I = 3.2 mA
F O 0.12 0.4
High-level output voltage VOH (Note 1) Fig. VF = 0.8 V, IO = -20 µA, 3.2 3.29
12.1.2 VCC = 3.3 V
VF = 0.8 V, IO = -20 µA, 4.9 4.99
VCC = 5.0 V
VF = 0.8 V, IO = -3.2 mA, 2.3 3.15
VCC = 3.3 V
VF = 0.8 V, IO = -3.2 mA, 4.0 4.87
VCC = 5.0 V
Low-level supply current ICCL Fig. IF1 = IF2 = 2 mA 1.6 2 mA
12.1.3
High-level supply current ICCH Fig. IF1 = IF2 = 0 mA 1.3 2
12.1.4
Threshold input current (H/L) IFHL (Note 1) IO = 3.2 mA, VO < 0.4 V, 0.4 1.3
Ta = -40 to 105
IO = 3.2 mA, VO < 0.4 V, 0.4 1.6
Ta = -40 to 125
Note: All typical values are at VCC = 5.0 V, Ta = 25 .
Note 1: Each channel
10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics Symbol Note Test Condition Min Typ. Max Unit
Total capacitance (input to output) CS (Note 1) V = 0 V, f = 1 MHz 0.8 pF
Isolation resistance RS (Note 1) V = 500 V, R.H. ≤ 60 % 1012 1014 Ω
Isolation voltage BVS (Note 1) AC, 60 s 2500 Vrms
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
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11. Switching Characteristics (Note)
(Unless otherwise specified,Ta = -40 to 125 , VCC = 2.7 to 5.5 V)
Test
Characteristics Symbol Note Test Condition Min Typ. Max Unit
Circuit
Propagation delay time (H/L) tpHL (Note 1), (Note 3) Fig. IF = 0 → 2 mA, RT = 1.68 kΩ, 49 80 ns
12.1.5 CL = 15 pF
Propagation delay time (L/H) tpLH (Note 1), (Note 3) IF = 2 → 0 mA, RT = 1.68 kΩ, 44 80
CL = 15 pF
Pulse width distortion |tpHL- (Note 1), (Note 3) IF = 2 mA, RT = 1.68 kΩ, 5 25
tpLH| CL = 15 pF
Propagation delay skew tpsk (Note 1), (Note 2), IF = 2 mA, RT = 1.68 kΩ, -30 30
(device to device) (Note 3) CL = 15 pF
Fall time tf (Note 1), (Note 3) IF = 0 → 2 mA, RT = 1.68 kΩ, 3
CL = 15 pF
Rise time tr (Note 1), (Note 3) IF = 2 → 0 mA, RT = 1.68 kΩ, 3
CL = 15 pF
High-level common-mode CMH (Note 3) Fig. IF = 0 mA, VCC = 3.3 / 5 V, ±20 ±25 kV/µs
transient immunity 12.1.6 VCM = 1000 Vp-p,
RT = 1.68 kΩ, Ta = 25
Low-level common-mode CML (Note 3) IF = 2 mA, VCC = 3.3 / 5 V, ±20 ±25
transient immunity VCM = 1000 Vp-p,
RT = 1.68 kΩ, Ta = 25
Note: All typical values are at Ta = 25 .
Note: Each channel
Note 1: f = 5 MHz, duty = 50 %, input current tr = tf = less than 5 ns, CL is less than 15 pF which includes probe and
stray wiring capacitance.
Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH
that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc.).
Note 3: RT = R1 + R2 = 1.68 kΩ
Recommendation input resistance conditions : R1 = R2 = 840 Ω
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TLP2161
12. Test Circuits and Characteristics Curves
12.1. Test Circuits
Fig. 12.1.1 VOL Test Circuit Fig. 12.1.2 VOH Test Circuit
Fig. 12.1.3 ICCL Test Circuit Fig. 12.1.4 ICCH Test Circuit
Fig. 12.1.5 Switching Time Test Circuit and Waveform
Fig. 12.1.6 Common-Mode Transient Immunity Test Circuit and Waveform
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12.2. Characteristics Curves (Note)
Fig. 12.2.1 IF - VF Fig. 12.2.2 IF - Ta
Fig. 12.2.3 VOL - Ta Fig. 12.2.4 VOL - Ta
Fig. 12.2.5 VOH - Ta Fig. 12.2.6 VOH - Ta
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Fig. 12.2.7 ICCL - Ta Fig. 12.2.8 ICCH - Ta
Fig. 12.2.9 IFHL - Ta Fig. 12.2.10 tpHL, tpLH, |tpHL - tpLH| - Ta
Fig. 12.2.11 tpHL, tpLH, |tpHL - tpLH| - Ta Fig. 12.2.12 tpHL, tpLH, |tpHL - tpLH| - IF
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Fig. 12.2.13 tpHL, tpLH, |tpHL - tpLH| - IF
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLP2161
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
• When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP2161
14. Land Pattern Dimensions (for reference only)
Unit: mm
15. Marking
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TLP2161
16. EN 60747-5-5 Option (V4) Specification
• Part number: TLP2161 (Note 1)
• The following part naming conventions are used for the devices that have been qualified according to
option (V4) of EN 60747.
Example: TLP2161(V4-TP,F)
V4: EN 60747 option
TP: Tape type
F: [[G]]/RoHS COMPATIBLE (Note 2)
Note 1: Use TOSHIBA standard type number for safety standard application.
e.g., TLP2161(V4-TP,F) → TLP2161
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
Fig. 16.1 EN 60747 Isolation Characteristics
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Fig. 16.2 Insulation Related Specifications (Note)
Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 16.3 Marking on Packing
Fig. 16.4 Marking Example (Note)
Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN 60747.
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Fig. 16.5 Measurement Procedure
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17. Ordering Information
When placing an order, please specify the part number, tape type and quantity as shown in the following example.
Example) TLP2161 (TP,F) 2500 pcs
Part number: TLP2161
Tape type: TP
[[G]]/RoHS COMPATIBLE: F (Note)
Quantity (must be a multiple of 2500)
Note : Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
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Package Dimensions
Unit: mm
Weight: 0.11 g (typ.)
Package Name(s)
TOSHIBA: 11-5K1S
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Hardware, software and systems described in this document are collectively referred to as "Product".
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for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
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AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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