0% found this document useful (0 votes)
11 views4 pages

Review Chap 6

The document consists of a series of true/false statements and multiple-choice questions regarding semiconductor memory, including characteristics of RAM, ROM, DRAM, SRAM, and error types. It highlights key concepts such as volatility, memory cell functions, and the distinctions between different memory types. The content serves as a review for understanding memory technologies and their operational principles.

Uploaded by

danglyquan
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
11 views4 pages

Review Chap 6

The document consists of a series of true/false statements and multiple-choice questions regarding semiconductor memory, including characteristics of RAM, ROM, DRAM, SRAM, and error types. It highlights key concepts such as volatility, memory cell functions, and the distinctions between different memory types. The content serves as a review for understanding memory technologies and their operational principles.

Uploaded by

danglyquan
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
You are on page 1/ 4

REViEW C6

True
The basic element of a semiconductor memory is the memory cell.
a. True
b. False

False
A characteristic of ROM is that it is volatile.
a. True
b. False

True
RAM must be provided with a constant power supply.
a. True
b. False

True
The two traditional forms of RAM used in computers are DRAM and SRAM.
a. True
b. False

True
A static RAM will hold its data as long as power is supplied to it.
a. True
b. False

False
Nonvolatile means that power must be continuously supplied to the memory to preserve
the bit values.
a. True
b. False

False
The advantage of RAM is that the data or program is permanently in main memory and
need never be loaded from a secondary storage device.
a. True
b. False

True
Semiconductor memory comes in packaged chips.
a. True
b. False

True
All DRAMs require a refresh operation.
a. True
b. False

True
A number of chips can be grouped together to form a memory bank.
a. True
b. False

True
An error-correcting code enhances the reliability of the memory at the cost of added
complexity.
a. True
b. False

False
DRAM is much costlier than SRAM.
a. True
b. False

False
RDRAM is limited by the fact that it can only send data to the processor once per bus
clock cycle.
a. True
b. False

True
The prefetch buffer is a memory cache located on the RAM chip.
a. True
b. False

False
The SRAM on the CDRAM cannot be used as a buffer to support the serial access of a
block of data.
a. True
b. False

all of the above


Which properties do all semiconductor memory cells share?
a. they exhibit two stable states which can be used to represent binary 1 and 0
b. they are capable of being written into to set the state
c. they are capable of being read to sense the state
d. all of the above

RAM
One distinguishing characteristic of memory that is designated as _________ is that it is
possible to both to read data from the memory and to write new data into the memory
easily and rapidly.
a. RAM
b. ROM
c. EPROM
d. EEPROM

all of the above


Which of the following memory types are nonvolatile?
a. erasable PROM
b. programmable ROM
c. flash memory
d. all of the above
SRAM
In a _________, binary values are stored using traditional flip-flop logic-gate
configurations.
a. ROM
b. SRAM
c. DRAM
d. RAM

ROM
A __________ contains a permanent pattern of data that cannot be changed, is
nonvolatile, and cannot have new data written into it.
a. RAM
b. SRAM
c. ROM
d. flash memory

flash memory
With _________ the microchip is organized so that a section of memory cells are
erased in a single action.
a. flash memory
b. SDRAM
c. DRAM
d. EEPROM

Hard errors
__________ can be caused by harsh environmental abuse, manufacturing defects, and
wear.
a. SEC errors
b. Hard errors
c. Syndrome errors
d. Soft errors

Soft errors
_________ can be caused by power supply problems or alpha particles.
a. Soft errors
b. AGT errors
c. Hard errors
d. SEC errors

SDRAM
The _________ exchanges data with the processor synchronized to an external clock
signal and running at the full speed of the processor/memory bus without imposing wait
states.
a. DDR-DRAM
b. SDRAM
c. CDRAM
d. none of the above

DDR-DRAM
________ can send data to the processor twice per clock cycle.
a. CDRAM
b. SDRAM
c. DDR-DRAM
d. RDRAM

DDR2
__________ increases the data transfer rate by increasing the operational frequency of
the RAM chip and by increasing the prefetch buffer from 2 bits to 4 bits per chip.
a. DDR2
b. RDRAM
c. CDRAM
d. DDR3

buffer
The ________ enables the RAM chip to preposition bits to be placed on the data bus as
rapidly as possible.
a. flash memory
b. Hamming code
c. RamBus
d. buffer

You might also like